CN108368566B - 散热元件用铜合金板 - Google Patents

散热元件用铜合金板 Download PDF

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Publication number
CN108368566B
CN108368566B CN201680071395.1A CN201680071395A CN108368566B CN 108368566 B CN108368566 B CN 108368566B CN 201680071395 A CN201680071395 A CN 201680071395A CN 108368566 B CN108368566 B CN 108368566B
Authority
CN
China
Prior art keywords
mass
copper alloy
heat
alloy plate
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201680071395.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN108368566A (zh
Inventor
桥本大辅
西村昌泰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority claimed from PCT/JP2016/087840 external-priority patent/WO2017110759A1/ja
Publication of CN108368566A publication Critical patent/CN108368566A/zh
Application granted granted Critical
Publication of CN108368566B publication Critical patent/CN108368566B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201680071395.1A 2015-12-25 2016-12-19 散热元件用铜合金板 Expired - Fee Related CN108368566B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015254645 2015-12-25
JP2015-254645 2015-12-25
JP2016175464A JP6446007B2 (ja) 2015-12-25 2016-09-08 放熱部品用銅合金板
JP2016-175464 2016-09-08
PCT/JP2016/087840 WO2017110759A1 (ja) 2015-12-25 2016-12-19 放熱部品用銅合金板

Publications (2)

Publication Number Publication Date
CN108368566A CN108368566A (zh) 2018-08-03
CN108368566B true CN108368566B (zh) 2021-03-09

Family

ID=59271698

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680071395.1A Expired - Fee Related CN108368566B (zh) 2015-12-25 2016-12-19 散热元件用铜合金板

Country Status (4)

Country Link
JP (2) JP6446007B2 (enExample)
KR (1) KR20180081609A (enExample)
CN (1) CN108368566B (enExample)
TW (2) TW201736611A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018180920A1 (ja) * 2017-03-30 2018-10-04 Ｊｘ金属株式会社 圧延銅箔
JP6907282B2 (ja) 2019-09-25 2021-07-21 Ｊｘ金属株式会社 ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー
JP6878541B2 (ja) 2019-09-25 2021-05-26 Ｊｘ金属株式会社 ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー
CN118910465A (zh) * 2024-07-22 2024-11-08 浙江惟精新材料股份有限公司 一种中强高弹耐腐蚀黄铜合金及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001335864A (ja) * 2000-05-25 2001-12-04 Kobe Steel Ltd 電気・電子部品用銅合金
CN101113499A (zh) * 2006-07-28 2008-01-30 株式会社神户制钢所 具有高强度和高抗软化性的铜合金
JP2015101754A (ja) * 2013-11-25 2015-06-04 株式会社神戸製鋼所 高強度銅合金管

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853057B2 (ja) * 1974-05-20 1983-11-26 株式会社神戸製鋼所 高導電性銅基合金
JPS602638A (ja) * 1983-06-21 1985-01-08 Mitsui Mining & Smelting Co Ltd 耐軟化高伝導性銅合金
JPH06177289A (ja) * 1992-12-10 1994-06-24 Showa Alum Corp プレートフィン型放熱器
JPH093571A (ja) * 1995-06-14 1997-01-07 Mitsubishi Shindoh Co Ltd ヒートシンク
JP2001050682A (ja) * 1999-08-05 2001-02-23 Showa Alum Corp パネル型熱交換器およびその製造方法
JP2003277853A (ja) 2002-03-26 2003-10-02 Dowa Mining Co Ltd ヒートスプレッダ用銅合金
JP2007003164A (ja) * 2005-06-27 2007-01-11 Nakamura Mfg Co Ltd 平板状ヒートパイプまたはベーパーチャンバー、および、その形成方法
JP4112602B2 (ja) 2005-09-01 2008-07-02 株式会社渕上ミクロ ヒートパイプ
JP4878317B2 (ja) 2007-03-22 2012-02-15 株式会社コベルコ マテリアル銅管 銅または銅合金からなる銅管
JP2009246319A (ja) * 2008-04-01 2009-10-22 Fujikura Ltd ヒートスプレッダーおよびその製造方法
JP2013231224A (ja) * 2012-05-01 2013-11-14 Sh Copper Products Co Ltd 曲げ加工性に優れた電気・電子部品用銅合金材
JP6176433B2 (ja) 2013-01-10 2017-08-09 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
JP5467163B1 (ja) 2013-03-26 2014-04-09 Ｊｘ日鉱日石金属株式会社 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法
WO2016152648A1 (ja) * 2015-03-23 2016-09-29 株式会社神戸製鋼所 放熱部品用銅合金板及び放熱部品
JP6081513B2 (ja) * 2015-03-30 2017-02-15 株式会社神戸製鋼所 放熱部品用銅合金板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001335864A (ja) * 2000-05-25 2001-12-04 Kobe Steel Ltd 電気・電子部品用銅合金
CN101113499A (zh) * 2006-07-28 2008-01-30 株式会社神户制钢所 具有高强度和高抗软化性的铜合金
JP2015101754A (ja) * 2013-11-25 2015-06-04 株式会社神戸製鋼所 高強度銅合金管

Also Published As

Publication number Publication date
JP6732840B2 (ja) 2020-07-29
JP2017119909A (ja) 2017-07-06
TWI697652B (zh) 2020-07-01
TW201736611A (zh) 2017-10-16
KR20180081609A (ko) 2018-07-16
CN108368566A (zh) 2018-08-03
JP6446007B2 (ja) 2018-12-26
TW201907134A (zh) 2019-02-16
JP2018168470A (ja) 2018-11-01

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