CN108337815A - The production method that the production method and wiring board of gold goal are planted in plating - Google Patents
The production method that the production method and wiring board of gold goal are planted in plating Download PDFInfo
- Publication number
- CN108337815A CN108337815A CN201810037112.2A CN201810037112A CN108337815A CN 108337815 A CN108337815 A CN 108337815A CN 201810037112 A CN201810037112 A CN 201810037112A CN 108337815 A CN108337815 A CN 108337815A
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- China
- Prior art keywords
- copper
- layers
- production method
- bump
- photoresist layer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Abstract
The invention discloses the production methods that the production method and wiring board of gold goal are planted in a kind of plating, it is desirable to provide and a kind of production cost is low, efficient, plants the production method of the good plating plant gold goal of gold goal uniformity, its key points of the technical solution are that, step includes：S1 covers photoresist layer on the substrate with layers of copper；S2, exposure obtain bump part；S3 develops to expose the layers of copper of bump part；S4 carries out electro-coppering to obtain copper bump to the layers of copper of bump part；S5, the photoresist layer of removal S1 coverings, covers unexposed photoresist layer again later；S6, exposure acquisition include the exposed portion of copper bump and its peripheral portion；S7, development is with the layers of copper of the exposure exposed portion；S8 carries out electronickelling to the layers of copper of the exposed portion, then carries out electroplating gold, first to obtain plating gold goal.
Description
Technical field
The present invention relates to wiring board technology fields, and the production method and circuit of gold goal are planted more particularly to a kind of plating
The production method of plate.
Background technology
Have at present using wide plant ball mode：Ball attachment machine plants ball, and ball is planted in plating, and vapor deposition plants ball.From production efficiency with
And production cost, salient point uniformity etc. are seen, ball is planted in most widely used on the market at present or plating.
Plating is planted the maximum shortcoming and defect of ball and is：Sphere size directly influences production efficiency and production cost, especially
It is on production cost, common PCB industries golden finger height at 0.05 micron, and it is as small as possible go management and control cost, but if
It needs to plant 10 to 20 microns high gold goal formation golden finger, i.e., the quality of same flake products consumption gold salt can be made to increase to 200 to 400
Times, production cost is significantly increased, in addition 10 to 20 microns high gold goal forms golden finger and is also difficult to directly produce, and causes to produce
Efficiency is low, and is also difficult to control in gold goal uniformity.
Invention content
The technical problem to be solved by the present invention is to it is low to provide a kind of production cost, efficient, plants the good electricity of gold goal uniformity
The production method that gold goal is planted in plating.
Technical solution of the invention is to provide a kind of production method of plating plant gold goal, and step includes：
S1 covers photoresist layer on the substrate with layers of copper；
S2, exposure obtain bump part；
S3 develops to expose the layers of copper of bump part；
S4 carries out electro-coppering to obtain copper bump to the layers of copper of bump part；
S5, the photoresist layer of removal S1 coverings, covers unexposed photoresist layer again later；
S6, exposure acquisition include the exposed portion of copper bump and its peripheral portion；
S7, development is with the layers of copper of the exposure exposed portion；
S8 carries out electronickelling to the layers of copper of the exposed portion, then carries out electroplating gold, first to obtain plating gold goal.
After above scheme, the production method for planting gold goal is electroplated in the present invention, compared with prior art, has following excellent
Point：By plating copper bump, then nickel layer and layer gold are electroplate on copper bump, and nickel layer and layer gold cover all copper bump,
To form the shape of a similar gold goal, can there is higher height, avoid produced under single high height it is uneven,
Meanwhile production procedure is shortened, and improves production efficiency, and can meet the needs of in performance, in addition only needs one layer of thin layer gold, phase
Compare an entire gold goal, greatly reduce the usage amount of gold, production cost greatly reduces, further, since first electro-coppering is convex
Point re-plating nickel layer, layer gold, uniformity are preferable.
Preferably, in S5, the photoresist layer of removal S1 coverings, and unexposed photoresist layer is covered after cleaning, drying again, in this way,
Control base board harmomegathus is more advantageous to and obtains the higher salient point of positional precision, and the position for being unlikely to salient point does not meet design position
And cause to scrap.
Preferably, the copper bump height is 10 μm -20 μm.
Preferably, the nickel layer height is 2 μm -5 μm.
Preferably, the layer gold height is 0.01 μm -0.4 μm.
Preferably, the layer gold height and copper bump height ratio are 1:100-1:200.
Another technical solution of the present invention is to provide a kind of production method of wiring board, including：
S1 covers the first photoresist layer on the substrate with layers of copper；
S2, for the first time exposure obtain circuit pack；
S3, development is with the layers of copper of exposed line part for the first time, and then electro-coppering is to obtain the copper wire thickened；
S4 removes the first photoresist layer, covers the second photoresist layer later；
S5, second of exposure obtain bump part；
S6, for second development to expose the layers of copper of bump part, which is a part for copper wire；
S7 carries out electro-coppering to the layers of copper of bump part and obtains copper bump；
S8 removes the second photoresist layer, covers third photoresist layer later；
S9, third time exposure acquisition include the exposed portion of copper bump and its peripheral portion；
S10, third time development is with the layers of copper of the exposure exposed portion；
S11 carries out electronickelling to the layers of copper of the exposed portion, then carries out electroplating gold first；
S12 removes third photoresist layer, and etching later obtains wiring board.
After using the above structure, the production method of wiring board of the present invention has the following advantages compared with prior art：It is logical
It crosses the above process and obtains a kind of wiring board of plating plant gold goal, flow is simple, and stability is high, substantially increases production efficiency,
The usage amount for greatly reducing gold, greatly reduces production cost.
Preferably, further comprising the steps of in S7：First, electroplating bath carries out first time plating to substrate in time T1
Copper then takes out substrate and converts up and down, and upper end originally becomes lower end, and lower end originally becomes upper end, and immerses electroplating bath
Second of electro-coppering is carried out, after the completion, takes out substrate, during electro-coppering, substrate is vertically arranged or approaches and is vertically arranged, this
The uniformity of sample, copper bump thickness is preferable.
Preferably, S4, S8, S12 go after removing photoresistance layer after carrying out cleaning, drying to execute next process again, in this way,
Control base board harmomegathus is more advantageous to and obtains the higher salient point of positional precision and the preferable circuit of precision.
Description of the drawings
Fig. 1 is that the schematic cross-sectional view after gold goal is planted in the plating of the present invention.
Fig. 2 is the flow diagram that the production method of gold goal is planted in the plating of the present invention.
Fig. 3 is the flow diagram of the production method of the wiring board of the present invention.
As shown in the figure：1, layers of copper；2, copper bump；3, nickel layer；4, layer gold.
Specific implementation mode
The invention will be further described in the following with reference to the drawings and specific embodiments.
It please refers to Fig.1, shown in Fig. 2 and Fig. 3, the production method that gold goal is planted in a kind of plating of the invention, step includes：
S1 covers photoresist layer on the substrate with layers of copper；
S2, exposure obtain bump part；
S3 develops to expose the layers of copper of bump part；
S4 carries out electro-coppering to obtain copper bump to the layers of copper of bump part；
S5, the photoresist layer of removal S1 coverings, covers unexposed photoresist layer again later；
S6, exposure acquisition include the exposed portion of copper bump and its peripheral portion；
S7, development is with the layers of copper of the exposure exposed portion；
S8 carries out electronickelling to the layers of copper of the exposed portion, then carries out electroplating gold, first to obtain plating gold goal.
By plating copper bump, then nickel layer and layer gold are electroplate on copper bump, and nickel layer and layer gold cover all copper
Salient point can have higher height, avoid and produced not under single high height to form the shape of a similar gold goal
Uniformly, meanwhile, production procedure is shortened, and improves production efficiency, and can meet the needs of in performance, in addition only needs one layer of thin gold
Layer, compare an entire gold goal, greatly reduces the usage amount of gold, production cost greatly reduces, further, since being first electroplated
Copper bump re-plating nickel layer, layer gold, uniformity are preferable.
Common PCB industry golden finger height at 0.05 micron, and it is as small as possible go management and control cost, if necessary to value 10 to 20
The high gold goal of micron, a same flake products increase to 200 to 400 times by gold salt is consumed, and copper bump re-plating nickel layer, layer gold is first electroplated
10 to 20 microns of height can also be reached, it is even higher, but the consumption of gold salt and the consumption of common golden finger are closer to,
And it is that production efficiency greatly improves due to being convenient for control in uniformity.
In S5, the photoresist layer of removal S1 coverings, and unexposed photoresist layer is covered after cleaning, drying again, in this way, control base
Plate harmomegathus is more advantageous to and obtains the higher salient point of positional precision, and the position for being unlikely to salient point does not meet design position and causes
It scraps.
The copper bump height is 10 μm -20 μm.The nickel layer height is 2 μm -5 μm.The layer gold height is
0.01μm-0.4μm.The layer gold height is 1 with copper bump height ratio:100-1:200.Can reach required performance and at
This is low.
Another technical solution of the present invention is to provide a kind of production method of wiring board, including：
S1 covers the first photoresist layer on the substrate with layers of copper；
S2, for the first time exposure obtain circuit pack；
S3, development is with the layers of copper of exposed line part for the first time, and then electro-coppering is to obtain the copper wire thickened；
S4 removes the first photoresist layer, covers the second photoresist layer later；
S5, second of exposure obtain bump part；
S6, for second development to expose the layers of copper of bump part, which is a part for copper wire；
S7 carries out electro-coppering to the layers of copper of bump part and obtains copper bump；
S8 removes the second photoresist layer, covers third photoresist layer later；
S9, third time exposure acquisition include the exposed portion of copper bump and its peripheral portion；
S10, third time development is with the layers of copper of the exposure exposed portion；
S11 carries out electronickelling to the layers of copper of the exposed portion, then carries out electroplating gold first；
S12 removes third photoresist layer, and etching later obtains wiring board.
A kind of wiring board of plating plant gold goal is obtained by the above process, and flow is simple, and stability is high, substantially increases life
Efficiency is produced, the usage amount of gold is also greatly reduced, production cost greatly reduces.And this be widely used it is general, can be in IC
Support plate, wafer electroplating bumps are used widely on other pcb board electroplating bumps, and entreprise cost is substantially reduced, and improve production effect
Rate, production capacity are promoted nearly a hundred times.
It is further comprising the steps of in S7：First, electroplating bath carries out first time electro-coppering to substrate in time T1, then
It takes out substrate and converts up and down, upper end originally becomes lower end, and lower end originally becomes upper end, and immerses electroplating bath and carry out second
Secondary electro-coppering takes out substrate after the completion, and during electro-coppering, substrate is vertically arranged or close to being vertically arranged, in this way, copper bump
The uniformity of thickness is preferable.
S4, S8, S12 go after removing photoresistance layer after carrying out cleaning, drying to execute next process again, in this way, control base board
Harmomegathus is more advantageous to and obtains the higher salient point of positional precision and the preferable circuit of precision.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (9)
1. the production method that gold goal is planted in a kind of plating, which is characterized in that include the following steps：
S1 covers photoresist layer on the substrate with layers of copper；
S2, exposure obtain bump part；
S3 develops to expose the layers of copper of bump part；
S4 carries out electro-coppering to obtain copper bump to the layers of copper of bump part；
S5, the photoresist layer of removal S1 coverings, covers unexposed photoresist layer again later；
S6, exposure acquisition include the exposed portion of copper bump and its peripheral portion；
S7, development is with the layers of copper of the exposure exposed portion；
S8 carries out electronickelling to the layers of copper of the exposed portion, then carries out electroplating gold, first to obtain plating gold goal.
2. the production method that gold goal is planted in plating according to claim 1, it is characterised in that：The copper bump height is 10
μm -20μm。
3. the production method that gold goal is planted in plating according to claim 1, it is characterised in that：The layer gold height is 0.01
μm-0.4μm。
4. the production method that gold goal is planted in plating according to claim 1, it is characterised in that：The nickel layer height be 2 μm-
5μmμm。
5. the production method that gold goal is planted in plating according to claim 1, it is characterised in that：The layer gold height and copper is convex
Point height ratio is 1:100-1:200.
6. the production method that gold goal is planted in plating according to claim 1, it is characterised in that：In S5, the light of removal S1 coverings
Resistance layer, and unexposed photoresist layer is covered after cleaning, drying again.
7. a kind of production method of wiring board, it is characterised in that：Include the following steps：
S1 covers the first photoresist layer on the substrate with layers of copper；
S2, for the first time exposure obtain circuit pack；
S3, development is with the layers of copper of exposed line part for the first time, and then electro-coppering is to obtain the copper wire thickened；
S4 removes the first photoresist layer, covers the second photoresist layer later；
S5, second of exposure obtain bump part；
S6, for second development to expose the layers of copper of bump part, which is a part for copper wire；
S7 carries out electro-coppering to the layers of copper of bump part and obtains copper bump；
S8 removes the second photoresist layer, covers third photoresist layer later；
S9, third time exposure acquisition include the exposed portion of copper bump and its peripheral portion；
S10, third time development is with the layers of copper of the exposure exposed portion；
S11 carries out electronickelling to the layers of copper of the exposed portion, then carries out electroplating gold first；
S12 removes third photoresist layer, and etching later obtains wiring board.
8. the production method of wiring board according to claim 7, it is characterised in that：It is further comprising the steps of in S7：It is first
First, electroplating bath carries out first time electro-coppering to substrate in time T1, then takes out substrate and converts up and down, original upper end at
For lower end, lower end originally becomes upper end, and immerses electroplating bath and carry out second of electro-coppering.
9. the production method of wiring board according to claim 7, it is characterised in that：Photoresist is removed in S4, S8, S12 step
Following step is executed again after equal cleaning, drying after layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810037112.2A CN108337815A (en) | 2018-01-15 | 2018-01-15 | The production method that the production method and wiring board of gold goal are planted in plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810037112.2A CN108337815A (en) | 2018-01-15 | 2018-01-15 | The production method that the production method and wiring board of gold goal are planted in plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108337815A true CN108337815A (en) | 2018-07-27 |
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ID=62924273
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810037112.2A Pending CN108337815A (en) | 2018-01-15 | 2018-01-15 | The production method that the production method and wiring board of gold goal are planted in plating |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1899002A (en) * | 2003-12-26 | 2007-01-17 | 三井金属矿业株式会社 | Printed-circuit board, its manufacturing method and circuit device |
| US20080179190A1 (en) * | 2005-03-09 | 2008-07-31 | Phoenix Precision Technology Corporation | Method for fabrication of a conductive bump structure of a circuit board |
| US20100221414A1 (en) * | 2009-02-27 | 2010-09-02 | Ibiden Co., Ltd | Method for manufacturing printed wiring board |
| CN103096629A (en) * | 2013-01-05 | 2013-05-08 | 上海卓凯电子科技有限公司 | Circuit board distressing method and circuit board destressing equipment |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
-
2018
- 2018-01-15 CN CN201810037112.2A patent/CN108337815A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1899002A (en) * | 2003-12-26 | 2007-01-17 | 三井金属矿业株式会社 | Printed-circuit board, its manufacturing method and circuit device |
| US20080179190A1 (en) * | 2005-03-09 | 2008-07-31 | Phoenix Precision Technology Corporation | Method for fabrication of a conductive bump structure of a circuit board |
| US20100221414A1 (en) * | 2009-02-27 | 2010-09-02 | Ibiden Co., Ltd | Method for manufacturing printed wiring board |
| CN103096629A (en) * | 2013-01-05 | 2013-05-08 | 上海卓凯电子科技有限公司 | Circuit board distressing method and circuit board destressing equipment |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180727 |
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| RJ01 | Rejection of invention patent application after publication |