CN108330448B - 减压容器、处理装置、处理系统、以及制造平板显示器的方法 - Google Patents

减压容器、处理装置、处理系统、以及制造平板显示器的方法 Download PDF

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Publication number
CN108330448B
CN108330448B CN201810051045.XA CN201810051045A CN108330448B CN 108330448 B CN108330448 B CN 108330448B CN 201810051045 A CN201810051045 A CN 201810051045A CN 108330448 B CN108330448 B CN 108330448B
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China
Prior art keywords
rib
ribs
container
pressure
reduced
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CN201810051045.XA
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English (en)
Chinese (zh)
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CN108330448A (zh
Inventor
森纯平
太田明
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Canon Inc
Canon Tokki Corp
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Canon Inc
Canon Tokki Corp
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Publication of CN108330448A publication Critical patent/CN108330448A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/068—Hermetically-sealed casings having a pressure compensation device, e.g. membrane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Packaging Frangible Articles (AREA)
CN201810051045.XA 2017-01-20 2018-01-19 减压容器、处理装置、处理系统、以及制造平板显示器的方法 Active CN108330448B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-009001 2017-01-20
JP2017009001 2017-01-20

Publications (2)

Publication Number Publication Date
CN108330448A CN108330448A (zh) 2018-07-27
CN108330448B true CN108330448B (zh) 2020-08-11

Family

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CN201810051045.XA Active CN108330448B (zh) 2017-01-20 2018-01-19 减压容器、处理装置、处理系统、以及制造平板显示器的方法
CN201820090183.4U Active CN208055449U (zh) 2017-01-20 2018-01-19 减压容器、处理装置、以及处理系统

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Country Status (4)

Country Link
US (1) US20180213656A1 (enExample)
JP (1) JP7133928B2 (enExample)
KR (1) KR102082039B1 (enExample)
CN (2) CN108330448B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180213656A1 (en) * 2017-01-20 2018-07-26 Canon Kabushiki Kaisha Decompression container, processing apparatus, processing system, and method of producing flat panel display
JP7567850B2 (ja) * 2021-12-15 2024-10-16 カシオ計算機株式会社 電子機器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101190723A (zh) * 2006-11-30 2008-06-04 信越化学工业株式会社 防护薄膜组件收纳容器
CN101896634A (zh) * 2007-12-14 2010-11-24 株式会社爱发科 腔以及成膜装置
CN208055449U (zh) * 2017-01-20 2018-11-06 佳能株式会社 减压容器、处理装置、以及处理系统

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6486444B1 (en) * 1999-06-03 2002-11-26 Applied Materials, Inc. Load-lock with external staging area
JP2010243015A (ja) * 2009-04-03 2010-10-28 Hitachi Appliances Inc 減圧貯蔵容器及びこれを備えた冷蔵庫
KR101274130B1 (ko) * 2011-08-22 2013-06-13 주식회사 테라세미콘 Ｃｉｇｓ층 형성장치
KR101396603B1 (ko) * 2013-02-26 2014-05-20 주식회사 테라세미콘 기판 처리 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101190723A (zh) * 2006-11-30 2008-06-04 信越化学工业株式会社 防护薄膜组件收纳容器
CN101896634A (zh) * 2007-12-14 2010-11-24 株式会社爱发科 腔以及成膜装置
CN208055449U (zh) * 2017-01-20 2018-11-06 佳能株式会社 减压容器、处理装置、以及处理系统

Also Published As

Publication number Publication date
JP7133928B2 (ja) 2022-09-09
US20180213656A1 (en) 2018-07-26
KR20180086142A (ko) 2018-07-30
CN108330448A (zh) 2018-07-27
CN208055449U (zh) 2018-11-06
KR102082039B1 (ko) 2020-02-26
JP2018119210A (ja) 2018-08-02

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