CN108225072B - 热管及其制造方法 - Google Patents
热管及其制造方法 Download PDFInfo
- Publication number
- CN108225072B CN108225072B CN201711180902.8A CN201711180902A CN108225072B CN 108225072 B CN108225072 B CN 108225072B CN 201711180902 A CN201711180902 A CN 201711180902A CN 108225072 B CN108225072 B CN 108225072B
- Authority
- CN
- China
- Prior art keywords
- metal layer
- recesses
- heat pipe
- surface side
- vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title description 15
- 238000000034 method Methods 0.000 title description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 236
- 239000002184 metal Substances 0.000 abstract description 236
- 239000012530 fluid Substances 0.000 abstract description 38
- 239000007788 liquid Substances 0.000 abstract description 32
- 239000011148 porous material Substances 0.000 abstract description 26
- 230000008016 vaporization Effects 0.000 abstract description 9
- 238000012986 modification Methods 0.000 description 29
- 230000004048 modification Effects 0.000 description 29
- 239000012071 phase Substances 0.000 description 16
- 229920002120 photoresistant polymer Polymers 0.000 description 16
- 238000001704 evaporation Methods 0.000 description 12
- 230000008020 evaporation Effects 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 12
- 238000009833 condensation Methods 0.000 description 10
- 230000005494 condensation Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 9
- 239000007790 solid phase Substances 0.000 description 9
- 238000009423 ventilation Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 229910000861 Mg alloy Inorganic materials 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 230000001151 other effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 freon Chemical compound 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-242730 | 2016-12-14 | ||
JP2016242730 | 2016-12-14 | ||
JP2017112587A JP6799503B2 (ja) | 2016-12-14 | 2017-06-07 | ヒートパイプ及びその製造方法 |
JP2017-112587 | 2017-06-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108225072A CN108225072A (zh) | 2018-06-29 |
CN108225072B true CN108225072B (zh) | 2020-10-30 |
Family
ID=62632783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711180902.8A Active CN108225072B (zh) | 2016-12-14 | 2017-11-23 | 热管及其制造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6799503B2 (enrdf_load_stackoverflow) |
CN (1) | CN108225072B (enrdf_load_stackoverflow) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7137783B2 (ja) * | 2017-08-24 | 2022-09-15 | 大日本印刷株式会社 | ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法 |
JP6943786B2 (ja) * | 2018-02-05 | 2021-10-06 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP6400240B1 (ja) | 2018-02-05 | 2018-10-03 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP7236825B2 (ja) | 2018-07-11 | 2023-03-10 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP7146524B2 (ja) | 2018-08-13 | 2022-10-04 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP7197346B2 (ja) * | 2018-12-19 | 2022-12-27 | 新光電気工業株式会社 | ループ型ヒートパイプ |
CN119812143A (zh) * | 2019-03-11 | 2025-04-11 | 大日本印刷株式会社 | 蒸发室、电子设备以及蒸发室用片 |
JP2021032539A (ja) * | 2019-08-28 | 2021-03-01 | 京セラ株式会社 | 熱輸送プレートおよび熱輸送プレートの製造方法 |
KR102447793B1 (ko) * | 2019-11-11 | 2022-09-27 | 주식회사 아모그린텍 | 시트형 히트 파이프 및 그 제조방법 |
WO2021208070A1 (zh) * | 2020-04-17 | 2021-10-21 | 李克勤 | 层叠式薄型散热装置及其制造方法 |
JP7422600B2 (ja) * | 2020-04-17 | 2024-01-26 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP7535237B2 (ja) * | 2020-05-27 | 2024-08-16 | 大日本印刷株式会社 | ベーパーチャンバおよび電子機器 |
JP7525438B2 (ja) * | 2021-04-26 | 2024-07-30 | 新光電気工業株式会社 | ループ型ヒートパイプ |
CN218483131U (zh) * | 2022-01-25 | 2023-02-14 | 株式会社村田制作所 | 热扩散器件和电子设备 |
CN218483134U (zh) * | 2022-01-25 | 2023-02-14 | 株式会社村田制作所 | 热扩散器件以及电子设备 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001336888A (ja) * | 2000-05-29 | 2001-12-07 | Fujikura Ltd | 積層式平板型ヒートパイプ |
US6843308B1 (en) * | 2000-12-01 | 2005-01-18 | Atmostat Etudes Et Recherches | Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device |
JP2007093033A (ja) * | 2005-09-27 | 2007-04-12 | Matsushita Electric Ind Co Ltd | シート状ヒートパイプおよびその製造方法 |
CN201715908U (zh) * | 2010-06-07 | 2011-01-19 | 锘威科技(深圳)有限公司 | 一体式烧结型平板热管 |
CN102175088A (zh) * | 2011-03-16 | 2011-09-07 | 大连理工大学 | 硅基不等宽微槽道平板热管及制备方法 |
CN102683305A (zh) * | 2012-05-14 | 2012-09-19 | 西安交通大学 | 一种多孔微柱变曲率型面的芯片强化沸腾换热结构 |
CN103123236A (zh) * | 2012-10-21 | 2013-05-29 | 大连三维传热技术有限公司 | 金属纤维毡吸液芯的热板 |
CN104183690A (zh) * | 2013-05-21 | 2014-12-03 | 旭德科技股份有限公司 | 散热板 |
CN204651303U (zh) * | 2015-05-25 | 2015-09-16 | 新乡市特美特换热设备有限公司 | 一种电子元件散热冷板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7044201B2 (en) * | 2002-08-21 | 2006-05-16 | Samsung Electronics Co., Ltd. | Flat heat transferring device and method of fabricating the same |
JP4557055B2 (ja) * | 2008-06-25 | 2010-10-06 | ソニー株式会社 | 熱輸送デバイス及び電子機器 |
JP2011080679A (ja) * | 2009-10-07 | 2011-04-21 | Sony Corp | 熱輸送装置及び電子機器 |
JP5413735B2 (ja) * | 2010-01-18 | 2014-02-12 | 日本モレックス株式会社 | 熱輸送ユニット、電子機器 |
JP6311279B2 (ja) * | 2013-11-11 | 2018-04-18 | 大日本印刷株式会社 | 放熱部材とその製造方法および放熱部材を用いた構造体 |
US9488418B2 (en) * | 2014-07-08 | 2016-11-08 | Chaun-Choung Technology Corp. | Heat plate structure |
-
2017
- 2017-06-07 JP JP2017112587A patent/JP6799503B2/ja active Active
- 2017-11-23 CN CN201711180902.8A patent/CN108225072B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001336888A (ja) * | 2000-05-29 | 2001-12-07 | Fujikura Ltd | 積層式平板型ヒートパイプ |
US6843308B1 (en) * | 2000-12-01 | 2005-01-18 | Atmostat Etudes Et Recherches | Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device |
JP2007093033A (ja) * | 2005-09-27 | 2007-04-12 | Matsushita Electric Ind Co Ltd | シート状ヒートパイプおよびその製造方法 |
CN201715908U (zh) * | 2010-06-07 | 2011-01-19 | 锘威科技(深圳)有限公司 | 一体式烧结型平板热管 |
CN102175088A (zh) * | 2011-03-16 | 2011-09-07 | 大连理工大学 | 硅基不等宽微槽道平板热管及制备方法 |
CN102683305A (zh) * | 2012-05-14 | 2012-09-19 | 西安交通大学 | 一种多孔微柱变曲率型面的芯片强化沸腾换热结构 |
CN103123236A (zh) * | 2012-10-21 | 2013-05-29 | 大连三维传热技术有限公司 | 金属纤维毡吸液芯的热板 |
CN104183690A (zh) * | 2013-05-21 | 2014-12-03 | 旭德科技股份有限公司 | 散热板 |
CN204651303U (zh) * | 2015-05-25 | 2015-09-16 | 新乡市特美特换热设备有限公司 | 一种电子元件散热冷板 |
Also Published As
Publication number | Publication date |
---|---|
JP2018096669A (ja) | 2018-06-21 |
JP6799503B2 (ja) | 2020-12-16 |
CN108225072A (zh) | 2018-06-29 |
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