CN108198770A - Transmit wafer method and device - Google Patents
Transmit wafer method and device Download PDFInfo
- Publication number
- CN108198770A CN108198770A CN201711444773.9A CN201711444773A CN108198770A CN 108198770 A CN108198770 A CN 108198770A CN 201711444773 A CN201711444773 A CN 201711444773A CN 108198770 A CN108198770 A CN 108198770A
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- guide rail
- wafer
- power part
- clamping jaw
- angle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to Single-Wafer Cleaning apparatus fields, specifically, it is related to a kind of transmission wafer method and device, the method, by wafer transfer to predeterminated position, wafer is gripped out by overturning structure by capturing structure grasping silicon wafer from crawl structure, and adjust the angle of wafer, the angle for making wafer is consistent with the angle of technology groove, and wafer is put into technology groove by overturning structure, realizes and wafer is transmitted in different directions and the technology groove of angle.This method is high to the transmission production capacity of wafer.
Description
Technical field
The present invention relates to Single-Wafer Cleaning apparatus field, in particular to a kind of transmission wafer method and device.
Background technology
Wafer cleaning equipment is made of multiple technique groove bodies, and each groove body is responsible for one of cleaning, such as ultrasound/mega sonic wave
Rinse bath, scrub slot, dry slot etc..In order to reach set technological effect, setting direction and angle to each groove body are not to the utmost
It is identical, such as have horizontally disposed, have what is be vertically arranged, the process of each wafer be likely to by these directions and
The processing for the technology groove that angle is not quite similar.However, technology groove wafer being placed on different directions is into a technology
Problem.
Existing transmission wafer device grips wafer by the folding of pick-up arm and pneumatic clamper, the folding of pneumatic clamper by with pneumatic clamper
The cylinder of connection is realized, and passes through the wafer of gripping carrying out position rotation, and then be transferred in technology groove.However existing biography
The transmission production capacity of defeated wafer device and wafer transfer method is low.
Invention content
The purpose of the present invention is to provide a kind of transmission wafer method and devices, aim to solve the problem that in the prior art
The above problem.
Wafer method is transmitted an embodiment of the present invention provides a kind of, the method includes：By capturing structure grasping silicon wafer,
By wafer transfer to predeterminated position；Wafer is gripped out, and adjust the angle of wafer from crawl structure by overturning structure, make crystalline substance
Round angle is consistent with the angle of technology groove；Wafer is put into technology groove by overturning structure.
As further, by capturing structure grasping silicon wafer, the step of by wafer transfer to predeterminated position, including：It is logical
Second guide rail is crossed to slide that the claw structure connecting with second guide rail is driven to exist on first guide rail
Horizontal direction moves；When the claw structure, which is moved to, reaches setpoint distance with the distance of wafer, the linking arm is along institute
It states and slides that the claw structure is driven to move in vertical direction on the second guide rail；When the center in the claw portion and wafer
Center in the same horizontal line when, the linking arm stops at the movement of vertical direction, by second guide rail described
Setpoint distance is slided towards the horizontal direction close to wafer so that wafer is in the center in the claw portion on one guide rail；The company
It connects arm to slide so as to which the claw structure be driven to rise in the vertical direction along on second guide rail so that wafer falls into described
On card slot；Wafer is lived and as linking arm slides to move in vertical direction on second guide rail by the card slot claw
It is dynamic, it is moved in the horizontal direction as the second guide rail slides on the first guide rail so that by wafer transfer to predeterminated position.
As further, wafer gripped out, and adjust the angle of wafer from crawl structure by overturning structure, make crystalline substance
The round angle step consistent with the angle of technology groove, including：Slided on the third guide rail by the 4th guide rail from
And the clamping jaw structure is driven to move in the horizontal direction and reaches setting position；It is sliding on the 4th guide rail by the power part
It moves so as to which the clamping jaw structure be driven to move to reach the predeterminated position in vertical direction；The folder is adjusted by the power part
The angle and length of pawl structure enable the clamping jaw structure to grip wafer from the card slot；By the power part in institute
It states and is slided on the 4th guide rail so as to which the clamping jaw structure and wafer be driven to be moved to commitment positions in vertical direction；By described
4th guide rail is slided on the third guide rail so as to which the clamping jaw structure and wafer be driven to move in the horizontal direction technique
Above slot；Pass through the angle that the power part adjusts the clamping jaw structure so that the angle of the wafer on the clamping jaw structure with
The angle of technology groove is consistent.
As further, wafer is put into the step in technology groove by the overturning structure, including：The power part is adjusted
The angle of the clamping jaw structure unclamps wafer so that wafer is fallen into technology groove.
The embodiment of the present invention additionally provides a kind of transmission wafer device, and described device includes crawl structure and overturning structure；
The crawl structure and the overturning structure are oppositely arranged, described to capture structure and the overturning structure in the same plane, institute
Crawl structure and the distance for overturning structure are stated within setting range so that the crawl structure and the overturning structure energy
Enough cooperation transmission wafers.
As further, the crawl structure includes the first guide rail, the second guide rail, linking arm and claw structure；It is described
First guide rail is horizontally disposed with；Second guide rail is connect with first guide rail, and vertical with first guide rail and described
Two guide rails can be moved axially along first guide rail；Described linking arm one end is connect with second guide rail, and being capable of edge
The axial movement of second guide rail；The one end of the linking arm far from second guide rail is connect with the claw structure.
As further, the first slip card is offered along the axial direction of first guide rail on first guide rail
Slot；The first convex block corresponding with first slip draw-in groove is provided on second guide rail；First convex block sticks into described
In first slip draw-in groove, so as to fulfill being slidably connected for second guide rail and first guide rail；Second guide rail is separate
The side of first guide rail is equipped with the first protruding rail；It is recessed that described linking arm one end is equipped with corresponding with first protruding rail first
Slot；First groove is set in outside first protruding rail, is connected so as to fulfill the slip of the linking arm and second guide rail
It connects；The claw structure includes connecting portion, claw portion and card slot；The claw portion is a convex structure, and the card slot is set
The aperture position in the claw portion is put, the card slot is used for claw wafer, prevents wafer from falling；The claw portion is far from described
The side of card slot is connect with the connecting portion；The connecting portion is connect with the one end of the linking arm far from second guide rail.
As further, the overturning structure includes third guide rail, the 4th guide rail, power part and clamping jaw structure；It is described
Third guide rail is horizontally disposed with, and the distance of opposite with first guide rail parallel and described third guide rail and first guide rail is being set
Determine in range；4th guide rail is connect with the third guide rail, and vertical with the third guide rail and can be along described
The axial direction movement of three guide rails；The power part side is connect with the 4th guide rail, and can be along the 4th guide rail
Axial movement；Side of the power part far from the 4th guide rail is connect with the clamping jaw structure, for adjusting the folder
The angle of pawl structure, so that the clamping jaw structure being capable of clamping jaw wafer.
As further, the second slip card is offered along the axial direction of the third guide rail on the third guide rail
Slot；The second convex block corresponding with second slip draw-in groove is provided on 4th guide rail；Second convex block sticks into described
In second slip draw-in groove, so as to fulfill being slidably connected for the 4th guide rail and the third guide rail；4th guide rail is separate
The side of the third guide rail is equipped with the second protruding rail；It is recessed that the power part side is equipped with corresponding with second protruding rail second
Slot；Second groove is set in outside second protruding rail, is connected so as to fulfill the slip of the power part and the 4th guide rail
It connects；Side of the power part far from the 4th guide rail is connect with the clamping jaw structure.
As further, the power part includes the first power part, rotational structure and the second power part；Described first is dynamic
Power portion side is equipped with the second groove corresponding with second protruding rail, and second groove is set in outside second protruding rail；Institute
It states side of first power part far from the 4th guide rail to be flexibly connected with the rotational structure, be set in first power part
Dynamic structure, the dynamic structure are flexibly connected with the side of the rotational structure and the rotational structure can be controlled to revolve
Turn；The second power part side is connect with side of the rotational structure far from first power part, can be with described
The rotation of rotational structure and rotate to adjust its angle in the plane perpendicular to rotational structure；The clamping jaw structure includes the
One clamp arm and the second clamp arm；One end of first clamp arm and second clamp arm is arranged on second power part far from described
On the side of rotational structure, and it can be rotated with the rotation of second power part and then adjust first clamp arm and institute
State angle of second clamp arm in the plane perpendicular to rotational structure；Second dynamic structure is used to adjust first clamp arm
With the folding angle of second clamp arm to control the gripping of the clamping jaw structure or put down wafer.
A kind of transmission wafer method and device provided in an embodiment of the present invention, by capturing structure grasping silicon wafer, by wafer
Predeterminated position is transferred to, wafer is gripped out, and adjust the angle of wafer from crawl structure by overturning structure, makes the angle of wafer
Degree is consistent with the angle of technology groove, overturns structure and wafer is put into technology groove, realize to wafer in different directions and angle
It is transmitted in technology groove.This method is high to the transmission production capacity of wafer.
Description of the drawings
It in order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is a kind of structure diagram for transmitting wafer device 100 provided in an embodiment of the present invention.
Fig. 2 shows a kind of structure diagrams of technology groove 400.
Fig. 3 shows the structure diagram that structure is captured in Fig. 1.
Fig. 4 shows the structure diagram of claw structure.
Fig. 5 shows the structure diagram of overturning structure.
Fig. 6 shows a kind of transmission wafer method flow diagram provided in an embodiment of the present invention.
Fig. 7 shows the flow chart of step S100.
Fig. 8 shows the flow chart of step S200.
Icon：100- transmits wafer device；200- captures structure；The first guide rails of 210-；The second guide rails of 220-；230- connections
Arm；240- claw structures；241- connecting portions；242- claws portion；243- card slots 243；300- overturns structure；310- third guide rails；
The 4th guide rails of 320-；330- power parts；The first power parts of 331-；332- rotational structures；The second power parts of 333-；340- clamping jaw knots
Structure；The first clamp arm of 341-；The second clamp arm of 342-；400- technology grooves；The first technology grooves of 410- 410；The second technology grooves of 420-；500-
Wafer.
Specific embodiment
Purpose, technical scheme and advantage to make the embodiment of the present invention are clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be configured to arrange and design with a variety of different.
Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiments obtained without creative efforts belong to the model that the present invention protects
It encloses.
It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need to that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it is to be understood that term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instructions such as " level ", " interior ", " outer " are based on orientation shown in the drawings or position relationship or are somebody's turn to do
Invention product using when the orientation usually put or position relationship or those skilled in the art orientation or position that usually understand
Relationship is put, be for only for ease of the description present invention and simplifies description rather than instruction or implies that signified equipment or element are necessary
With specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and it is not intended that instruction or hint
Relative importance.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or one
Connect to body；Can be mechanical connection or electrical connection；It can be directly connected, it can also be indirect by intermediary
It is connected, can is the connection inside two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
Referring to Fig. 1, Fig. 1 is a kind of structure diagram for transmitting 500 device 100 of wafer provided in an embodiment of the present invention.
In embodiments of the present invention, 500 device 100 of transmission wafer includes crawl structure 200 and overturning structure 300.Capture 200 He of structure
Overturning structure 300 is oppositely arranged, and in the same plane, crawl structure 200 is tied with overturning for crawl structure 200 and overturning structure 300
The distance of structure 300 is within setting range so that crawl structure 200 and overturning structure 300 can coordinate transmission wafer 500.Tool
Body, overturning structure 300 can extend into the wafer 500 in gripping crawl structure 200 in crawl structure 200, and then realize cooperation
Transmission.
As a kind of embodiment, crawl structure 200 and overturning structure 300 are separately positioned on the upper of 400 both sides of technology groove
Side, crawl structure 200 are parallel with overturning structure 300.It can be technology groove 400 that structure 200, which is captured, with the distance for overturning structure 300
Width.
Referring to Fig. 2, Fig. 2 shows a kind of structure diagrams of technology groove 400.A kind of technology groove 400 includes level side
To the first technology groove 400 and vertical direction the second technology groove 420.
Referring to Fig. 3, Fig. 3 shows the structure diagram that structure 200 is captured in Fig. 1.In embodiments of the present invention, it captures
Structure 200 includes the first guide rail 210, the second guide rail 220, linking arm 230 and claw structure 240, and 210 level of the first guide rail is set
It puts, the second guide rail 220 is connect with the first guide rail 210, and vertical with the first guide rail 10 and the second guide rail 220 can be led along first
Rail 210 moves axially.230 one end of linking arm is connect with the second guide rail 220, and can be along the axial movement of the second guide rail 220.
The one end of linking arm 230 far from the second guide rail 220 is connect with claw structure 240.
As further, the first slip card is offered along the axial direction of the first guide rail 210 on the first guide rail 210
Slot is provided with the first convex block corresponding with the first slip draw-in groove on the second guide rail 220, and the first convex block sticks into the first slip draw-in groove
It is interior, so as to fulfill being slidably connected for the second guide rail 220 and the first guide rail 210.
As further, side of second guide rail 220 far from the first guide rail 210 is equipped with the first protruding rail, linking arm 230 1
End is equipped with the first groove corresponding with the first protruding rail, and the first groove is set in outside the first protruding rail, so as to fulfill linking arm 230 and institute
State being slidably connected for the second guide rail 220.
Fig. 4 is please referred to, Fig. 4 shows the structure diagram of claw structure 240.In embodiments of the present invention, claw
Structure 240 includes connecting portion 241, claw portion 242 and card slot 243.Claw portion 242 is a convex structure, and card slot is arranged on
The aperture position in claw portion 242, card slot are used for claw wafer 500, prevent wafer 500 from falling.Claw portion 242 far from card slot one
Side is connect with connecting portion 241, and connecting portion 241 is connect with the one end of linking arm 230 far from the second guide rail 220.
Fig. 5 is please referred to, Fig. 5 shows the structure diagram of overturning structure 300.In embodiments of the present invention, it overturns
Structure 300 includes third guide rail 310, the 4th guide rail 320, power part 330 and clamping jaw structure 340.310 level of third guide rail is set
It puts, with 210 parallel opposite and 310 and first guide rail 210 of third guide rail distance of the first guide rail in setting range, the 4th guide rail
320 connect with third guide rail 310, and vertical with third guide rail 310 and can be moved along the axial direction of third guide rail 310.
In embodiments of the present invention, 330 side of power part is connect with the 4th guide rail 320, and can be led along the described 4th
The axial movement of rail 320.Side of the power part 330 far from the 4th guide rail 320 is connect with clamping jaw structure 340, for adjusting clamping jaw
The angle of structure 340, so that clamping jaw structure 340 being capable of clamping jaw wafer 500.
As a kind of embodiment, the distance between 310 and first guide rail 210 of third guide rail can be technology groove 400
Width.310 and first guide rail of third guide rail, 210 length can be more than or equal to the length of technology groove 400.
The setting height of 310 and first guide rail 210 of third guide rail is higher than the height of technology groove 400, the second guide rail 220 and the 4th
The top of guide rail 320 is not less than 400 groove face of technology groove.
As further, the second slip card is offered along the axial direction of third guide rail 310 on third guide rail 310
Slot is provided with the second convex block corresponding with second slip draw-in groove on the 4th guide rail 320, and the second convex block sticks into the second slip card
In slot, so as to fulfill being slidably connected for the 4th guide rail 320 and third guide rail 310.
As further, the 4th side of the guide rail 320 far from third guide rail 310 is equipped with the second protruding rail, power part 330 1
Side is equipped with the second groove corresponding with the second protruding rail, and the second groove is set in outside the second protruding rail, so as to fulfill power part 330 and the
Four guide rails 320 are slidably connected, and side of the power part 330 far from the 4th guide rail 320 is connect with clamping jaw structure 340.
In embodiments of the present invention, the length of the first slip draw-in groove can be less than or equal to the length of the first guide rail 210,
The length of second slip draw-in groove can be less than or equal to the length of third guide rail 310.The length of first protruding rail be smaller than or
Equal to the length of the second guide rail 220, the second protruding rail can be less than or equal to the length of the 4th guide rail 320.
As further, power part 330 includes the first power part 331,332 and second power part 333 of rotational structure, the
One power part, 331 side is equipped with the second groove corresponding with the second protruding rail, and the second groove is set in outside the second protruding rail.First power
Side of the portion 331 far from the 4th guide rail 320 is flexibly connected with rotational structure 332, the dynamic knot of setting in the first power part 331
Structure, dynamic structure are flexibly connected with the side of rotational structure 332 and rotational structure 332 can be controlled to rotate.Second power part 333
Side is connect with side of the rotational structure 332 far from the first power part 331, can be rotated with the rotation of rotational structure 332
To adjust its angle in the plane perpendicular to rotational structure 332.
As a kind of embodiment, clamping jaw structure 340 includes the first clamp arm 341 and the second clamp arm 342, the first clamp arm 341
It is arranged on the second side of the power part 333 far from rotational structure 332 with one end of the second clamp arm 342, and can be with second
The rotation of power part 333 and rotate and then adjust the first clamp arm 341 and the second clamp arm 342 is perpendicular to the flat of rotational structure 332
Angle on face.Second dynamic structure is used to adjust the folding angle of the first clamp arm 341 and the second clamp arm 342 to control clamping jaw knot
Wafer 500 is put down in the gripping of structure 340.
In embodiments of the present invention, the first power part 331 and the second power part 333 can be cylinder or motor.
Referring to Fig. 6, Fig. 6 shows a kind of transmission 500 method flow diagram of wafer provided in an embodiment of the present invention.In this hair
In bright embodiment, transmission 500 method of wafer can be applied to 500 square law device of transmission wafer described in Fig. 1.Below by way of combination
A kind of transmission 500 method of wafer provided in an embodiment of the present invention is described in detail in Fig. 6.Transmit wafer 500 method include with
Lower step.
Step S100：By capturing 200 grasping silicon wafer 500 of structure, wafer 500 is transferred to predeterminated position.
Step S200：Wafer 500 is gripped out, and adjust wafer 500 from crawl structure 200 by overturning structure 300
Angle, the angle for making wafer 500 are consistent with the angle of technology groove 400.
Step S300：Wafer 500 is put into technology groove 400 by overturning structure 300.
As a kind of embodiment, step S100 includes step S110~five sub-steps of step S150.Referring to Fig. 7,
Fig. 7 shows the flow chart of step S100.Step S110~step S150 is described in detail below in conjunction with Fig. 7.
Step S110：It is slided on the first guide rail 210 by the second guide rail 220 and is connect so as to drive with the second guide rail 220
Claw structure 240 move in the horizontal direction.
Step S120：When claw structure 240, which is moved to, reaches setpoint distance with the distance of wafer 500,230 edge of linking arm
It and slides that claw structure 240 is driven to move in vertical direction on the second guide rail 220.
Step S130：When the center of the center in claw portion 242 and wafer 500 in the same horizontal line when, linking arm 230 stops
Only in the movement of vertical direction, slided on the first guide rail 210 towards the horizontal direction close to wafer 500 by the second guide rail 220
Setpoint distance so that wafer 500 is in the center in claw portion 242.
Step S140：Linking arm 230 is slided along on the second guide rail 220 so as to drive claw structure 240 in vertical direction
Rise so that wafer 500 is fallen on card slot.
Step S150：By card slot claw live wafer 500 and with linking arm 230 slided on the second guide rail 220 and
It moves, is moved in the horizontal direction as the second guide rail 220 slides on the first guide rail 210 so that by wafer in vertical direction
500 are transferred to predeterminated position.
In embodiments of the present invention, step S100 can be but not limited to grip and transmit in vertical wafer 500.
In embodiments of the present invention, step S200 includes step S210~six sub-steps of step S260.Referring to Fig. 8,
Fig. 8 shows the flow chart of step S200.Step S210~step S260 is described in detail below in conjunction with Fig. 8.
Step S210：It slides on third guide rail 310 to drive clamping jaw structure 340 in level by the 4th guide rail 320
Direction moves to reach setting position.
Step S220：It slides on the 4th guide rail 320 to drive clamping jaw structure 340 in vertical side by power part 330
To moving to reach the predeterminated position.
In embodiments of the present invention, step S210, step S220 and step S100 sequencings can first carry out step
The operation of S210, step S220, then carry out step S100 operation or, the operation for first carrying out step S100 carries out again
Step S210, the operation of step S220 or, step S100 and step S210, step S220 are carried out at the same time.Specifically,
Can be step S210, step S220, step S100；Step S100, step S210, step S220；Alternatively, step S110, step
Rapid S120, step S210, step S220, step S130, step S140, step S150；Etc..
Step S230：The angle of clamping jaw structure 340 is adjusted by power part 330 and length clamping jaw structure 340 can
Wafer 500 is gripped from the card slot.
Step S240：It is slided on the 4th guide rail 320 so as to drive clamping jaw structure 340 and wafer by power part 330
500 are moved to commitment positions in vertical direction.
Step S250：It slides on third guide rail 310 to drive clamping jaw structure 340 and crystalline substance by the 4th guide rail 320
Circle 500 moves in the horizontal direction 400 top of technology groove.
Step S260：The angle of clamping jaw structure 340 is adjusted by power part 330 so that the wafer on clamping jaw structure 340
500 angle is consistent with the angle of technology groove 400.
In embodiments of the present invention, as a kind of embodiment, step S300's the specific can be that：Power part 330 is adjusted
The angle of clamping jaw structure 340 is saved, unclamps wafer 500 so that wafer 500 is fallen into technology groove 400.
In conclusion a kind of transmission wafer method and device provided in an embodiment of the present invention,
By capturing structure grasping silicon wafer, by wafer transfer to predeterminated position, wafer is gripped out from crawl structure by overturning structure,
And the angle of wafer is adjusted, the angle for making wafer is consistent with the angle of technology groove, and wafer is put into technology groove by overturning structure, real
Now wafer is transmitted in different directions and the technology groove of angle.This method is high to the transmission production capacity of wafer.By the way that knot will be captured
Structure and overturning structure are separately positioned on the tops of technology groove both sides, and the distance of third guide rail and the first guide rail can be technology groove
Width, claw structure and clamping jaw structure, which can extend to, captures and places wafer in technology groove, on the one hand avoid transmission wafer dress
Put the impurity particle generated during the work time to fall on wafer, protect wafer not contaminated, on the other hand capture structure and
Overturning structure can be slided, and can be more than or equal to technology groove along the third guide rail of slip and the length of the first guide rail
Length, the length of the first slip draw-in groove can be less than or equal to the length of the first guide rail, and the length of the second slip draw-in groove can be with
Less than or equal to the length of third guide rail.The length of first protruding rail is smaller than or the length equal to the second guide rail, and second is convex
Rail can be less than or equal to the length of the 4th guide rail.So that crawl structure and overturning structure will not be chronically exposed on rinse bath
Fang Yin is without by the aggressive chemistry liquid corrosion in rinse bath, protecting the structure of transmission wafer device, transmitting wafer device
Durable, reliability is high.The adjusting clamping jaw structure during transmitting wafer or and wafer angle and during direction, need to only pass through
Adjust clamping jaw structure angle and direction, compared with the prior art in Umklapp process using pneumatic clamper top as rotation center for,
The transmission wafer method and device that inventive embodiments provide reduces overturning diameter, has saved equipment inner space, has improved effect
Rate.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, that is made any repaiies
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
- A kind of 1. transmission wafer method, which is characterized in that the method includes：By capturing structure grasping silicon wafer, by wafer transfer to predeterminated position；Wafer is gripped out, and adjust the angle of wafer from crawl structure by overturning structure, make the angle and technology groove of wafer Angle it is consistent；Wafer is put into technology groove by overturning structure.
- 2. transmission wafer method according to claim 1, which is characterized in that the crawl structure includes the first guide rail, the Two guide rails, linking arm and claw structure；First guide rail is horizontally disposed with；Second guide rail is connect with first guide rail, And and second guide rail vertical with first guide rail can be moved axially along first guide rail；Described linking arm one end It is connect with second guide rail, and can be along the axial movement of second guide rail；The linking arm is led far from described second One end of rail is connect with the claw structure；The claw structure includes claw portion and card slot, and the claw portion is a circular arc Shape structure, the card slot are arranged on the aperture position in the claw portion；By capturing structure grasping silicon wafer, the step of by wafer transfer to predeterminated position, including：It slides on first guide rail to drive the claw connecting with second guide rail by second guide rail Structure moves in the horizontal direction；When the claw structure, which is moved to, reaches setpoint distance with the distance of wafer, the linking arm is along second guide rail Upper slip is so as to drive the claw structure to be moved in vertical direction；When the center in the claw portion and the center of wafer in the same horizontal line when, the linking arm stops at vertical direction Movement slides setpoint distance so that brilliant on first guide rail by second guide rail towards the horizontal direction close to wafer Circle is in the center in the claw portion；The linking arm is slided along on second guide rail so as to which the claw structure be driven to rise in the vertical direction so that brilliant Circle is fallen on the card slot；Wafer is lived and as linking arm slides to move in vertical direction on second guide rail by the card slot claw, It is moved in the horizontal direction as the second guide rail slides on the first guide rail so that by wafer transfer to predeterminated position.
- 3. transmission wafer method according to claim 2, which is characterized in that the overturning structure includes third guide rail, the Four guide rails, power part and clamping jaw structure；The third guide rail is horizontally disposed with, opposite with first guide rail parallel and described third The distance of guide rail and first guide rail is in setting range；4th guide rail is connect with the third guide rail, and with it is described Third guide rail is vertical and can be moved along the axial direction of the third guide rail；The power part side and the 4th guide rail Connection, and can be along the axial movement of the 4th guide rail；Side of the power part far from the 4th guide rail with it is described Clamping jaw structure connects, for adjusting the angle of the clamping jaw structure, so that the clamping jaw structure being capable of clamping jaw wafer；Wafer is gripped out, and adjust the angle of wafer from crawl structure by overturning structure, make the angle and technology groove of wafer The consistent step of angle, including：It is slided on the third guide rail so as to which the clamping jaw structure be driven to move in the horizontal direction by the 4th guide rail Up to setting position；It is slided on the 4th guide rail so as to which the clamping jaw structure be driven to be moved to reach in vertical direction by the power part The predeterminated position；The angle of the clamping jaw structure is adjusted by the power part and the length clamping jaw structure can be from the card slot Upper gripping wafer；It is slided on the 4th guide rail so as to drive the clamping jaw structure and wafer in vertical direction by the power part It is moved to commitment positions；It slides on the third guide rail to drive the clamping jaw structure and wafer in level side by the 4th guide rail To being moved to above technology groove；The angle of the clamping jaw structure is adjusted by the power part so that the angle and technique of the wafer on the clamping jaw structure The angle of slot is consistent.
- 4. transmission wafer method according to claim 3, which is characterized in that wafer is put into technology groove by the overturning structure In step, including：The power part adjusts the angle of the clamping jaw structure, unclamps wafer so that wafer is fallen into technology groove.
- 5. a kind of transmission wafer device, which is characterized in that described device includes crawl structure and overturning structure；The crawl structure and the overturning structure are oppositely arranged, and the crawl structure and the overturning structure are in same plane On, the crawl structure is with the distance for overturning structure within setting range so that the crawl structure and the overturning Structure can coordinate transmission wafer.
- 6. transmission wafer device according to claim 5, which is characterized in that the crawl structure includes the first guide rail, the Two guide rails, linking arm and claw structure；First guide rail is horizontally disposed with；Second guide rail is connect with first guide rail, and vertical with first guide rail and described second guide rail can be along The first guide rail axial movement；Described linking arm one end is connect with second guide rail, and can be along the axial movement of second guide rail；The one end of the linking arm far from second guide rail is connect with the claw structure.
- 7. transmission wafer device according to claim 6, which is characterized in that led on first guide rail along described first The axial direction of rail offers the first slip draw-in groove；The first convex block corresponding with first slip draw-in groove is provided on second guide rail；First convex block is sticked into first slip draw-in groove, so as to fulfill the cunning of second guide rail and first guide rail Dynamic connection；Side of second guide rail far from first guide rail is equipped with the first protruding rail；Described linking arm one end is equipped with the first groove corresponding with first protruding rail；First groove is set in outside first protruding rail, is connected so as to fulfill the slip of the linking arm and second guide rail It connects；The claw structure includes connecting portion, claw portion and card slot；The claw portion is a convex structure, and the card slot is arranged on the aperture position in the claw portion, and the card slot is used In claw wafer, prevent wafer from falling；Side of the claw portion far from the card slot is connect with the connecting portion；The connecting portion is connect with the one end of the linking arm far from second guide rail.
- 8. transmission wafer device according to claim 7, which is characterized in that the overturning structure includes third guide rail, the Four guide rails, power part and clamping jaw structure；The third guide rail is horizontally disposed with, opposite with first guide rail parallel and described third guide rail and first guide rail Distance is in setting range；4th guide rail is connect with the third guide rail, and vertical with the third guide rail and can be along the third guide rail Axial direction movement；The power part side is connect with the 4th guide rail, and can be along the axial movement of the 4th guide rail；Side of the power part far from the 4th guide rail is connect with the clamping jaw structure, for adjusting the clamping jaw structure Angle, so that the clamping jaw structure being capable of clamping jaw wafer.
- 9. transmission wafer device according to claim 8, which is characterized in that led on the third guide rail along the third The axial direction of rail offers the second slip draw-in groove；The second convex block corresponding with second slip draw-in groove is provided on 4th guide rail；Second convex block is sticked into second slip draw-in groove, so as to fulfill the cunning of the 4th guide rail and the third guide rail Dynamic connection；The side of 4th guide rail far from the third guide rail is equipped with the second protruding rail；The power part side is equipped with the second groove corresponding with second protruding rail；Second groove is set in outside second protruding rail, is connected so as to fulfill the slip of the power part and the 4th guide rail It connects；Side of the power part far from the 4th guide rail is connect with the clamping jaw structure.
- 10. transmission wafer device according to claim 9, which is characterized in that the power part includes the first power part, rotation Rotation structure and the second power part；The first power part side is equipped with the second groove corresponding with second protruding rail, and second groove is set in described Outside second protruding rail；Side of first power part far from the 4th guide rail is flexibly connected with the rotational structure,Dynamic structure is provided in first power part, the dynamic structure is flexibly connected simultaneously with the side of the rotational structure The rotational structure can be controlled to rotate；The second power part side is connect with side of the rotational structure far from first power part, can be with described The rotation of rotational structure and rotate to adjust its angle in the plane perpendicular to rotational structure；The clamping jaw structure includes the first clamp arm and the second clamp arm；One end of first clamp arm and second clamp arm is arranged on one of second power part far from the rotational structure On side, and it can be rotated with the rotation of second power part and then adjust first clamp arm and second clamp arm exists Angle in the plane of rotational structure；Second dynamic structure is used to adjust the folding angle of first clamp arm and second clamp arm to control the folder Wafer is put down in the gripping of pawl structure.
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| CN201711444773.9A CN108198770B (en) | 2017-12-27 | 2017-12-27 | Method and device for transmitting wafer |
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| CN201711444773.9A CN108198770B (en) | 2017-12-27 | 2017-12-27 | Method and device for transmitting wafer |
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| CN108198770B CN108198770B (en) | 2020-04-28 |
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| CN112614802A (en) * | 2021-03-08 | 2021-04-06 | 杭州众硅电子科技有限公司 | Manipulator and method for transporting wafer by CMP (chemical mechanical polishing) cleaning unit |
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Effective date of registration: 20230410 Address after: 100176 101, floor 2, building 2, No. 1, Taihe Third Street, economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi Precision Technology Co.,Ltd. Address before: 1 Taihe 3rd Street, Beijing Economic and Technological Development Zone, Beijing Patentee before: BEIJING SEMICONDUCTOR EQUIPMENT INSTITUTE (THE 45TH Research Institute OF CETC) |