CN113113339B - Wafer transmission manipulator - Google Patents
Wafer transmission manipulator Download PDFInfo
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- CN113113339B CN113113339B CN202110293343.1A CN202110293343A CN113113339B CN 113113339 B CN113113339 B CN 113113339B CN 202110293343 A CN202110293343 A CN 202110293343A CN 113113339 B CN113113339 B CN 113113339B
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 94
- 238000001035 drying Methods 0.000 claims abstract description 138
- 210000000078 claw Anatomy 0.000 claims abstract description 94
- 238000004140 cleaning Methods 0.000 claims abstract description 61
- 238000012546 transfer Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 31
- 230000033001 locomotion Effects 0.000 claims abstract description 16
- 235000012431 wafers Nutrition 0.000 claims description 232
- 230000007246 mechanism Effects 0.000 claims description 25
- 230000009471 action Effects 0.000 claims description 8
- 230000001680 brushing effect Effects 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 5
- 230000008569 process Effects 0.000 description 11
- 239000000126 substance Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a wafer transmission manipulator and a wafer overturning method thereof, wherein the wafer transmission manipulator comprises the following components: the transverse transmission shaft is positioned on one side of the cleaning unit only; the transverse transmission carriage is arranged on the transverse transmission shaft and can transversely move along the transverse transmission shaft; the first vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage; the rotary table is arranged on the first vertical lifting shaft; and the first claw clamping arm is connected with the rotary table and is driven by the rotary table to do rotary motion. The invention can meet the free conversion of the wafer in two states of horizontal and vertical; the transverse transfer carriage does not run directly above the drying unit, thereby eliminating the possibility of scattering impurity particles on the moving parts of the wafer transfer robot onto the wafer during the drying process.
Description
This application is filed with the application number 2019108427084 and is named as a wafer transfer manipulator and a wafer turning method
Technical Field
The invention relates to the field of equipment for manufacturing semiconductor integrated circuit chips, in particular to a wafer transmission manipulator.
Background
With the rapid development of the semiconductor industry, the feature size of the integrated circuit is continuously miniaturized, and the semiconductor wafer is continuously developed towards small volume, high circuit density, high speed and low power consumption, so that the integrated circuit is now in the submicron technology stage of Ultra-Large-scale integrated circuit (ULSI). With the gradual increase of the diameter of the silicon wafer, the width of the scribing lines in the element is gradually reduced, and the number of metal layers is increased, so that the high planarization of the surface of the semiconductor film has an important influence on the high performance, low cost and high yield of the device, and the requirement on the flatness of the surface of the silicon wafer is becoming stricter.
At present, chemical mechanical polishing (Chemical Mechanical Planarization, CMP), which is the only planarization technology capable of achieving global planarization effect, has been developed into a chemical mechanical polishing technology integrating in-line measurement, in-line endpoint detection, cleaning and other technologies, and is a product of the development of integrated circuits toward miniaturization, multilayering, thinning and planarization processes. After the wafer is subjected to CMP processing, the processed removed objects and polishing liquid remain on the surface of the wafer, and in order to remove contaminants on the surface of the wafer in time, CMP equipment needs to be used together with cleaning equipment. In the process of drying wafers, one essential requirement is to dry the wafer and eliminate the possibility of reattachment of any particles originally attached to the solution to the wafer.
In order to achieve a better cleaning effect of the whole cleaning module, a configuration can be adopted in which the drying unit is horizontally placed and the other cleaning units are vertically placed. In this configuration, in order to convert the wafer from the vertical state to the horizontal state, the wafer transfer robot is required to provide a flipping function to cooperate with the wafer transfer robot. In the existing cleaning mechanical hand, some clamping jaw clamping arms have no rotation function, and only have a single degree of freedom of up-and-down motion of a Z axis, and the overturning of a wafer is realized through the clamping jaw ends of the wafer. However, the implementation method needs to integrally move the manipulator to the upper part of the drying equipment, the clamping claw clamping arm can put the wafer which is turned over by the wafer clamping claw into the drying equipment, and the wafer transmission manipulator is integrally positioned in the process of being arranged above the drying equipment, so that impurity particles are easily introduced into the last drying process, and the cleanliness of the wafer is reduced. And the transverse travel of the wafer transmission manipulator penetrates through the whole cleaning module, and long-travel transmission also has a certain influence on the transmission efficiency.
Disclosure of Invention
The invention aims to provide a wafer conveying manipulator and a wafer overturning method thereof, which can meet the process requirements of chemical mechanical planarization by realizing the conversion of wafers in horizontal and vertical states and eliminate the possibility of scattering impurity particles on a moving part of the wafer conveying manipulator onto the wafers in a drying process.
In order to achieve the above object, the present invention provides a wafer transfer robot for transferring a wafer in a cleaning module of a chemical mechanical planarization apparatus, so as to take out the wafer after cleaning in a vertical state in a cleaning unit of the cleaning module, and put the wafer into a drying unit of the cleaning module in a horizontal state after turning over, comprising:
the transverse transmission shaft is positioned on one side of the cleaning unit only;
the transverse transmission carriage is arranged on the transverse transmission shaft and can transversely move along the transverse transmission shaft;
the first vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage;
the rotary table is arranged on the first vertical lifting shaft;
and the first claw clamping arm is connected with the rotary table and is driven by the rotary table to do rotary motion and is used for taking and placing wafers.
The wafer transmission manipulator is characterized in that the cleaning unit and the drying unit are provided with openable doors, and the openable doors are used for automatically opening or closing the wafer transmission manipulator when the wafer is taken and placed.
The wafer transfer robot described above, wherein the cleaning unit includes: a pre-drying unit and other units of the cleaning module; the drying unit and other units of the cleaning module are positioned at two sides of the unit before drying; the unit before drying adopts vertical operation; the wafer in the pre-drying unit is transmitted to the drying unit by the first claw clamping arm; the other units of the cleaning module are one or more of a wafer transition unit, a megasonic cleaning unit and a brushing unit.
The wafer transfer robot described above, wherein the wafer transfer robot further includes: the at least one second vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage; the first vertical lifting shaft is positioned between the second vertical lifting shaft and the drying unit; and each second vertical lifting shaft is further provided with a second claw clamping arm which is used for being matched with the first claw clamping arm to carry out wafer transmission between other units of the cleaning module and the unit before drying.
The invention also provides a wafer overturning method of the wafer transmission manipulator, which comprises a wafer placing step and a manipulator returning step;
the wafer placement step comprises the following steps: after the first claw clamping arm takes out the wafer from the pre-drying unit of the cleaning unit, the wafer is turned over from a vertical state to a horizontal state through linkage or non-linkage actions of three movement directions of transverse, vertical and rotation, and the wafer is placed into the drying unit;
the manipulator returning step comprises the following steps: and after the wafer is placed in the drying unit by the first claw clamping arm, the wafer is restored to the vertical state from the horizontal state through linkage or non-linkage actions in the transverse, vertical and rotary movement directions, and the wafer is returned to the original position.
The wafer overturning method of the wafer transmission manipulator, wherein the wafer imbedding step specifically comprises the following steps:
after the first claw clamping arm takes out the wafer from the unit before drying, the following three directions of movement are carried out simultaneously: the transverse transmission carriage drives the first claw clamping arm to transversely move in a direction away from the drying unit, the rotary table drives the first claw clamping arm to rotate to one side close to the drying unit until the wafer reaches a horizontal state, and the first vertical lifting shaft drives the first claw clamping arm to vertically move to a certain position;
then, the transverse transmission carriage drives the first claw clamping arm to transversely move to a direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first claw clamping arm to vertically move downwards until the wafer is positioned in the appointed mechanism in the drying unit; the first claw clamping arm releases the wafer to enable the wafer to be positioned on a designated mechanism in the drying unit.
The wafer overturning method of the wafer transmission manipulator, wherein the wafer imbedding step specifically comprises the following steps: after the first claw clamping arm takes out the wafer from the drying front unit, the transverse transmission carriage drives the first claw clamping arm to transversely move in a direction away from the drying unit; then, the rotary table drives the first claw clamping arm to rotate to the side close to the drying unit until the wafer reaches a horizontal state; then the first vertical lifting shaft drives the first claw clamping arm to vertically move to a certain position; then, the transverse transmission carriage drives the first claw clamping arm to transversely move to a direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first claw clamping arm to vertically move downwards until the wafer is positioned in the appointed mechanism in the drying unit; the first claw clamping arm releases the wafer to enable the wafer to be positioned on a designated mechanism in the drying unit.
The wafer overturning method of the wafer transmission manipulator, wherein the wafer imbedding step specifically comprises the following steps: after the first claw clamping arm takes out the wafer from the drying front unit, the transverse transmission carriage drives the first claw clamping arm to transversely move in a direction away from the drying unit; then, the rotary table drives the first claw clamping arm to rotate to the side close to the drying unit until the wafer reaches a horizontal state; then, the transverse transmission carriage drives the first claw clamping arm to transversely move to a direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first claw clamping arm to vertically move downwards until the wafer is positioned in the appointed mechanism in the drying unit; the first claw clamping arm releases the wafer to enable the wafer to be positioned on a designated mechanism in the drying unit.
The wafer overturning method of the wafer transmission manipulator, wherein the wafer imbedding step specifically comprises the following steps: after the first claw clamping arm takes out the wafer from the drying front unit, the rotary table drives the first claw clamping arm to rotate to the side close to the drying unit until the wafer reaches a horizontal state; then the transverse transmission carriage drives the first claw clamping arm to transversely move until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first claw clamping arm to vertically move downwards until the wafer is positioned in the appointed mechanism in the drying unit; the first claw clamping arm releases the wafer to enable the wafer to be positioned on a designated mechanism in the drying unit.
The wafer overturning method of the wafer transmission manipulator, wherein the manipulator returning step specifically comprises the following steps: after the wafer is placed in the drying unit, the following movements in three directions are performed simultaneously: the transverse transmission carriage drives the first claw clamping arm to transversely move in a direction away from the drying unit; the rotary table drives the first claw clamping arm to rotate downwards until the first claw clamping arm is in a vertical state; the first vertical lifting shaft drives the first claw clamping arm to vertically move upwards to a certain position.
The wafer overturning method of the wafer transmission manipulator, wherein the manipulator returning step specifically comprises the following steps: when the wafer is placed in the drying unit, the first vertical lifting shaft drives the first claw clamping arm to vertically upwards move to a certain position; then the transverse transmission carriage drives the first claw clamping arm to transversely move to a certain position in a direction away from the drying unit; then the rotary table drives the first claw clamping arm to rotate downwards until the first claw clamping arm is in a vertical state.
The wafer overturning method of the wafer transmission manipulator, wherein the manipulator returning step specifically comprises the following steps: when the wafer is placed in the drying unit, the transverse transmission carriage drives the first claw clamping arm to transversely move to a certain position in a direction away from the drying unit; then the first vertical lifting shaft drives the first claw clamping arm to vertically move upwards to a certain position; then the rotary table drives the first claw clamping arm to rotate downwards until the first claw clamping arm is in a vertical state.
Compared with the prior art, the invention has the following beneficial effects:
1. the wafer transmission manipulator provided by the invention is arranged in the cleaning module of the chemical mechanical planarization equipment, can effectively meet the conversion of wafers in horizontal and vertical states, meets the actual production requirements, does not need to increase space for overturning in the overturning process of the manipulator, does not interfere other mechanisms, and has high space utilization rate.
2. The wafer transmission manipulator in the invention enables the drying unit to select a wafer placement mode (vertical or horizontal placement) with the best effect as a target, and the wafer placement mode of the drying unit is not required to be consistent with other units of the cleaning module for facilitating wafer transmission.
3. Because the travel of the transverse transmission shaft of the wafer transmission manipulator only reaches the unit before drying, the travel is compact, and the transverse transmission carriage cannot run to one side of the drying unit in the process of placing the wafer into the drying unit after the manipulator is turned over, the possibility that impurity particles on the moving part of the wafer transmission manipulator are scattered onto the wafer in the drying process is eliminated.
Drawings
FIG. 1 is a schematic view of a wafer transfer robot according to a preferred embodiment of the present invention;
FIG. 2 is a flow chart of an embodiment 1 of a wafer loading step in the wafer flipping method of the present invention;
FIG. 3 is a flow chart of an embodiment 2 of a wafer insert step in the wafer flipping method of the present invention;
FIG. 4 is a flow chart of example 3 of the wafer insert step in the wafer flipping method of the present invention;
fig. 5 is a flowchart of an embodiment 4 of a wafer insert step in the wafer flipping method of the present invention.
Detailed Description
The invention is further described by the following examples, which are given by way of illustration only and are not limiting of the scope of the invention.
In the preferred embodiment shown in fig. 1, the wafer transfer robot provided by the present invention is used for transferring the wafer 8 in the cleaning module of the chemical mechanical planarization apparatus, so as to take out the wafer 8 after cleaning in the cleaning unit of the cleaning module in a vertical state, and then put into the drying unit 10 of the cleaning module in a horizontal state after turning over. In some preferred embodiments, the cleaning unit and the drying unit 10 are provided with openable and closable pneumatic doors for automatic opening and closing of the wafer transfer robot when the wafer 8 is taken and placed.
The cleaning unit of the cleaning module includes: a pre-drying unit 9 and other units of the cleaning module; the drying unit 10 and other units of the cleaning module are positioned on both sides of the pre-drying unit 9; in some preferred embodiments, the pre-drying unit 9 may be a brushing unit in which the wafer 8 is operated in a vertical direction; the other units of the cleaning module can be one or more of a wafer transition unit, a megasonic cleaning unit and a brushing unit. The specific arrangement of the cleaning unit can be freely combined according to the actual production requirement, so that the cleaning unit is flexibly applicable to various conditions.
In this embodiment, the wafer transfer robot provided by the present invention includes: the device comprises a transverse transmission shaft 1, a transverse transmission carriage 2, a first vertical lifting shaft 3, a second vertical lifting shaft 5, a first claw clamping arm 7 and a second claw clamping arm 6.
The transverse transmission carriage 2 is arranged on the transverse transmission shaft 1 and can transversely move along the transverse transmission shaft 1; the lateral transfer shaft 1 is located only at the cleaning unit side so that the lateral transfer carriage 2 does not run to the drying unit 10 side, thereby eliminating the possibility of foreign particles on the wafer transfer robot moving part from scattering onto the wafer 8 during the drying process. It should be noted that: the position of the lateral transfer shaft 1 is only required to satisfy that the lateral transfer carriage 2 does not travel to the drying unit side, and the spatial relative position of the lateral transfer shaft 1 and the cleaning unit is not particularly limited. The transverse transmission shaft 1 can be lower than the cleaning unit, and only the requirement that the wafer transmission manipulator can finish taking and placing the wafer 8 is met. More preferably, the transverse transmission shaft 1 is arranged above the washing unit, so as to achieve a more optimal arrangement.
The transverse transmission carriage 2 is provided with a first vertical lifting shaft 3 and a second vertical lifting shaft 5 which are arranged side by side, and can independently vertically move up and down on the transverse transmission carriage 2. The first vertical lifting shaft 3 is further provided with a rotary table 4 for driving the first claw clamping arm 7 connected with the rotary table to rotate. The rotary table 4 is driven pneumatically or electrically. And the second vertical lifting shaft 5 is directly connected with the second jaw clamping arm 6. The first jaw clamping arm 7 is closer to the drying unit 10 than the second jaw clamping arm 6 for transferring the wafer 8 from the pre-drying unit 9 to the drying unit 10.
And the second jaw clamping arm 6 is used to transfer wafers 8 from the other units of the cleaning module to the pre-drying unit 9. The second jaw clamping arm 6 is provided in this embodiment to allow the wafer 8 to be processed to enter the pre-drying unit 9 for operation immediately after the first jaw clamping arm 7 takes out the wafer 8 from the pre-drying unit 9, so as to achieve higher production efficiency. However, in some embodiments, the arrangement of the second claw clamping arms 6 does not affect the technical problems solved by the present invention and the technical effects achieved, so the present invention has no limitation on the number of the second claw clamping arms 6, and can be formulated according to actual production conditions.
The transverse conveyor shaft 1 is arranged on the side of the pre-drying unit 9, and the other units of the washing module are placed under the transverse conveyor shaft 1 in the order shown in fig. 1. The second claw clamping arm 6 can lift in the Z-axis direction through the second vertical lifting shaft 5, the first claw clamping arm 7 can rotate clockwise or anticlockwise through the rotary table 4, the rotary table 4 can lift in the Z-axis direction through the first vertical lifting shaft 3, and the transverse transmission carriage 2 can move in the X-axis direction through the transverse transmission shaft 1. The pre-drying unit 9 and other units of the cleaning module are all previous process units for drying the wafer 8, and the drying unit 10 is used for drying and cleaning the surface of the cleaned wafer 8. The wafer transfer robot functions to transport the wafer 8 into the various units of the cleaning module by lateral, vertical and rotational movement after clamping the wafer 8.
The invention also provides a wafer 8 overturning method of the wafer transmission manipulator, which comprises a wafer 8 placing step and a manipulator returning step.
The wafer 8 placement step includes: after the wafer 8 is taken out from the cleaning unit by the first claw clamping arm 7, the wafer 8 is turned over from the vertical state to the horizontal state through linkage or non-linkage actions of the transverse, vertical and rotary movement directions, and the wafer 8 is placed into the drying unit 10.
The manipulator returning step comprises the following steps: after the wafer 8 is placed in the drying unit 10 by the first claw clamping arm 7, the wafer is restored to the vertical state from the horizontal state through linkage or non-linkage actions in the three movement directions of transverse, vertical and rotation, and is returned to the original position.
Regarding the wafer 8 turning method based on the wafer transfer robot provided by the present invention, the following 7 embodiments will be specifically described. Of course, the specific embodiments capable of implementing the above-described wafer 8 flipping method of the present invention are not limited to the following 7 examples.
Example 1:
after the first claw clamping arm 7 moves along the Z-axis direction to take out the wafer 8 from the pre-drying unit 9 (as shown in part (1) of fig. 2), the transverse transmission carriage 2 moves along the x+ direction as shown in part (2) of fig. 2, the rotary table 4 drives the wafer 8 to rotate clockwise along the a+ direction, the first vertical lifting shaft 3 carries the first claw clamping arm 7 to move downwards along the Z-direction, the first claw clamping arm 7 carries the wafer 8 to move together along the x+, a+ and Z-directions, and the state conversion process of the wafer 8 from the vertical state to the horizontal state is coordinated together, as shown in part (3) of fig. 2, and the wafer 8 reaches the horizontal state. During the wafer 8 flipping, the interior of the drying unit 10 is ready for the wafer 8 to be placed. The transverse transport carriage 2 then moves the first jaw clamping arm 7 in the X-direction to a position above the wafer 8 in the drying unit 10 (as shown in part (4) of fig. 2). The first claw grip arm 7 moves downward in the Z-direction to a position where the wafer 8 is located inside the drying unit 10 by a prescribed mechanism (as shown in part (5) of fig. 2), the first claw grip arm 7 releases the wafer 8, and the wafer 8 is located inside the drying unit 10 by the prescribed mechanism.
Example 2:
after the first jaw clamping arm 7 moves in the Z-axis direction to take out the wafer 8 from the pre-drying unit 9 (as shown in part (1) of fig. 3), the transverse transmission carriage 2 moves a distance in the x+ direction as shown in part (2) of fig. 3, and then the rotary table 4 drives the first jaw clamping arm 7 to rotate clockwise in the a+ direction to a certain angle to enable the wafer 8 to reach a horizontal state (as shown in parts (3) and (4) of fig. 3). The first vertical lifting shaft 3 then carries the first claw grip arm 7 downwards in the Z-direction in a certain position. During the wafer 8 flipping, the interior of the drying unit 10 is ready for the wafer 8 to be placed. The transverse transport carriage 2 then moves the first jaw clamping arm 7 in the X-direction to a position above the wafer 8 in the drying unit 10 (as shown in part (5) of fig. 3). The first claw grip arm 7 moves downward in the Z-direction to a position where the wafer 8 is located inside the drying unit 10 by a prescribed mechanism (as shown in part (6) of fig. 3), the first claw grip arm 7 releases the wafer 8, and the wafer 8 is located inside the drying unit 10 by the prescribed mechanism. The above steps are the result of a combination of individual movements in each direction.
Example 3:
after the first jaw clamping arm 7 moves in the Z-axis direction to take out the wafer 8 from the pre-drying unit 9 (as shown in part (1) of fig. 4), the transverse transmission carriage 2 moves a distance in the x+ direction as shown in part (2) of fig. 4, and then the rotary table 4 drives the first jaw clamping arm 7 to rotate clockwise in the a+ direction to a certain angle to enable the wafer 8 to reach a horizontal state (as shown in parts (3) and (4) of fig. 4). The transverse transfer carriage 2 then moves the first jaw clamping arm 7 in the X-direction (as shown in part (5) of fig. 4), and then the first vertical lift shaft 3 moves the first jaw clamping arm 7 downward in the Z-direction to the wafer 8 in the interior of the drying unit 10 (as shown in part (6) of fig. 4). Finally, the first claw clamping arm 7 releases the wafer 8, and the wafer 8 is positioned on a designated mechanism inside the drying unit 10.
Example 4:
after the first claw clamping arm 7 moves along the Z-axis direction to take out the wafer 8 from the pre-drying unit 9 (as shown in part (1) of fig. 5), the first claw clamping arm 7 is directly rotated clockwise along a+ to a certain angle to enable the wafer 8 to reach a horizontal state (as shown in part (2) of fig. 5), then the transverse transmission carriage 2 is moved (fine-tuned) along the x+ or X-direction according to the actual lengths of different claw clamping arms to enable the wafer 8 to be positioned right above the drying unit 10, and then the first vertical lifting shaft 3 carries the first claw clamping arm 7 to move downwards along the Z-direction to a designated mechanism of the wafer 8 positioned inside the drying unit 10. Finally, the first claw clamping arm 7 releases the wafer 8, and the wafer 8 is positioned on a designated mechanism inside the drying unit 10.
After the wafer 8 is placed in the drying unit 10 with the designated mechanism, the robot arm will then return to the original state, and the following schemes of examples 5-7 can be employed to complete the entire cycle.
Example 5:
the action of placing the wafer 8 can be selected from any one of the embodiments 1 to 4, when the wafer 8 is placed in the designated mechanism inside the drying unit 10, the manipulator will then return to the original state, the transverse transmission carriage 2 moves in the x+ direction, the rotation table 4 drives the wafer 8 to rotate clockwise along the a-, the first vertical lifting shaft 3 carries the first claw clamping arm 7 to lift in the z+ direction, and the first claw clamping arm 7 moves together in the three directions of x+, a and z+ to cooperatively complete the process from the horizontal state to the vertical state.
Example 6:
the action of placing the wafer 8 can be selected from any of the embodiments 1-4, when the wafer 8 is placed in the designated mechanism inside the drying unit 10, the manipulator will then return to the original state, the first clamping jaw arms 7 being horizontally placed will first rise to a certain height in the z+ direction, then move a certain distance in the x+ direction, and then the first clamping jaw arms 7 will rotate in the a-direction until returning to the vertical state, completing the whole cycle.
Example 7:
the action of placing the wafer 8 can be selected from any of the embodiments 1-4, when the wafer 8 is placed in the designated mechanism inside the drying unit 10, the manipulator will then return to the original state, the first horizontally placed jaw clamping arm 7 will move a certain distance in the x+ direction and then rise to a certain height in the z+ direction, and then the first jaw clamping arm 7 will rotate in the a-direction until it returns to the vertical state, thus completing the whole cycle.
In short, the placement of the wafer 8 may be linked or non-linked, the return of the manipulator may be linked or non-linked, and the embodiments 1-4 regarding the placement of the wafer 8 and the embodiments 5-7 regarding the return of the manipulator may be freely combined according to actual needs to adapt to various actual production environments.
In summary, the wafer transfer manipulator provided by the invention is arranged in the cleaning module of the chemical mechanical planarization equipment, can effectively meet the conversion of the wafer in two states of horizontal and vertical, meets the actual production requirement, does not need to increase space for overturning in the overturning process of the manipulator, does not interfere other mechanisms, and has high space utilization rate. The wafer transmission manipulator in the invention enables the drying unit to select a wafer placement mode (vertical or horizontal placement) with the best effect as a target, and the wafer placement mode of the drying unit is not required to be consistent with other units of the cleaning module for facilitating wafer transmission. Because the travel of the transverse transmission shaft of the wafer transmission manipulator only reaches the unit before drying, the travel is compact, and the transverse transmission carriage cannot run to one side of the drying unit in the process of placing the wafer into the drying unit after the manipulator is turned over, the possibility that impurity particles on the moving part of the wafer transmission manipulator scatter onto the wafer in the drying process is eliminated.
While the present invention has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the invention. Many modifications and substitutions of the present invention will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (9)
1. The wafer transmission manipulator is used for taking out the wafer after finishing cleaning in a cleaning unit of the cleaning module in a vertical state, and placing the wafer into a drying unit of the cleaning module in a horizontal state after turning over;
comprises the following steps:
a transverse transmission shaft;
the transverse transmission carriage is arranged on the transverse transmission shaft and can transversely move along the transverse transmission shaft;
the first vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage;
the rotary table is arranged on the first vertical lifting shaft;
the first claw clamping arm is connected with the rotary table and driven by the rotary table to do rotary motion and is used for taking and placing wafers;
the cleaning unit includes: a pre-drying unit and other units of the cleaning module; the drying unit and other units of the cleaning module are positioned at two sides of the unit before drying;
the method is characterized in that:
the transverse transmission shaft is only positioned at one side of the cleaning unit, so that the transverse transmission carriage does not run to one side of the drying unit;
after the first claw clamping arm takes out the wafer from the unit before drying, the first claw clamping arm realizes the overturning of the wafer from the vertical state to the horizontal state through linkage or non-linkage actions of the three movement directions of the first claw clamping arm, wherein the first claw clamping arm moves transversely in the direction away from the drying unit, the first vertical lifting shaft drives the first claw clamping arm to move vertically downwards, and the rotary table drives the first claw clamping arm to rotate to the side close to the drying unit until the wafer reaches the horizontal state.
2. The wafer transfer robot of claim 1, wherein: the second vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage; the first vertical lifting shaft is positioned between the second vertical lifting shaft and the drying unit; and each second vertical lifting shaft is further provided with a second claw clamping arm which is used for being matched with the first claw clamping arm to carry out wafer transmission between other units of the cleaning module and the unit before drying.
3. The wafer transfer robot of claim 2, wherein: the first jaw clamping arm is closer to the drying unit than the second jaw clamping arm.
4. The wafer transfer robot of claim 1, wherein: the transverse transmission shaft is arranged above the cleaning unit.
5. The wafer transfer robot of claim 1, wherein: when the three movement directions act in a linkage mode, the transverse transmission carriage drives the first claw clamping arm to transversely move in the direction away from the drying unit, the rotary table drives the first claw clamping arm to rotate to the side close to the drying unit until the wafer reaches a horizontal state, and the first vertical lifting shaft drives the first claw clamping arm to vertically move downwards to a certain position, so that the wafer is placed into the drying unit.
6. The wafer transfer robot of claim 1, wherein: when the three movement directions do not act in a linkage way, the transverse transmission carriage drives the first claw clamping arm to transversely move in a direction away from the drying unit; then, the rotary table drives the first claw clamping arm to rotate to the side close to the drying unit until the wafer reaches a horizontal state; then the first vertical lifting shaft drives the first claw clamping arm to vertically move to a certain position; then, the transverse transmission carriage drives the first claw clamping arm to transversely move to a direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first claw clamping arm to vertically move downwards until the wafer is positioned in the appointed mechanism in the drying unit; the first claw clamping arm releases the wafer, so that the wafer is positioned on a designated mechanism in the drying unit;
or, when the three movement directions do not act in a linkage way, the transverse transmission carriage drives the first claw clamping arm to transversely move in a direction away from the drying unit; then, the rotary table drives the first claw clamping arm to rotate to the side close to the drying unit until the wafer reaches a horizontal state; then, the transverse transmission carriage drives the first claw clamping arm to transversely move to a direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first claw clamping arm to vertically move downwards until the wafer is positioned in the appointed mechanism in the drying unit; the first claw clamping arm releases the wafer to enable the wafer to be positioned on a designated mechanism in the drying unit.
7. The wafer transfer robot of claim 1, wherein: the other units of the cleaning module are one or more of a wafer transition unit, a megasonic cleaning unit and a brushing unit.
8. The wafer transfer robot of claim 1, wherein: the cleaning unit and the drying unit are provided with openable doors, and the openable doors are used for automatically opening or closing the wafer when the wafer is taken and placed by the wafer transmission manipulator.
9. The wafer transfer robot of claim 1, wherein: the pre-drying unit is a brushing unit, and the wafer in the pre-drying unit adopts a vertical direction for operation.
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| CN202110293343.1A CN113113339B (en) | 2019-09-06 | 2019-09-06 | Wafer transmission manipulator |
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| CN201910842708.4A CN110534472B (en) | 2019-09-06 | 2019-09-06 | Wafer transmission manipulator and wafer overturning method thereof |
| CN202110293343.1A CN113113339B (en) | 2019-09-06 | 2019-09-06 | Wafer transmission manipulator |
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| CN115241103A (en) * | 2020-05-06 | 2022-10-25 | 杭州众硅电子科技有限公司 | Wafer transmission device, transmission method and CMP equipment cleaning module |
| CN111604810B (en) * | 2020-07-24 | 2020-11-03 | 杭州众硅电子科技有限公司 | Wafer transmission equipment, chemical mechanical planarization device and wafer transmission method |
| CN112086394A (en) * | 2020-07-30 | 2020-12-15 | 北京烁科精微电子装备有限公司 | Wafer transfer transmission device and wafer transfer transmission method |
| CN112614802B (en) * | 2021-03-08 | 2021-07-06 | 杭州众硅电子科技有限公司 | Manipulator and method for transporting wafer by CMP (chemical mechanical polishing) cleaning unit |
| CN115706035A (en) * | 2021-08-12 | 2023-02-17 | 北京北方华创微电子装备有限公司 | Semiconductor cleaning equipment and wafer overturning device thereof |
| CN114220748B (en) * | 2022-02-23 | 2022-06-21 | 杭州众硅电子科技有限公司 | Dynamic detection device and chemical mechanical planarization equipment |
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Also Published As
| Publication number | Publication date |
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| CN113113339A (en) | 2021-07-13 |
| CN110534472B (en) | 2021-05-25 |
| TWI773943B (en) | 2022-08-11 |
| TW202111857A (en) | 2021-03-16 |
| CN110534472A (en) | 2019-12-03 |
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