CN113113339A - Wafer transmission manipulator - Google Patents
Wafer transmission manipulator Download PDFInfo
- Publication number
- CN113113339A CN113113339A CN202110293343.1A CN202110293343A CN113113339A CN 113113339 A CN113113339 A CN 113113339A CN 202110293343 A CN202110293343 A CN 202110293343A CN 113113339 A CN113113339 A CN 113113339A
- Authority
- CN
- China
- Prior art keywords
- wafer
- drying unit
- clamping arm
- transverse transmission
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 105
- 238000001035 drying Methods 0.000 claims abstract description 141
- 238000004140 cleaning Methods 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 31
- 230000033001 locomotion Effects 0.000 claims abstract description 24
- 210000000078 claw Anatomy 0.000 claims description 59
- 230000007246 mechanism Effects 0.000 claims description 30
- 238000012546 transfer Methods 0.000 claims description 23
- 230000009471 action Effects 0.000 claims description 10
- 230000001680 brushing effect Effects 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 7
- 239000012535 impurity Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 198
- 230000008569 process Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a wafer transmission manipulator and a wafer overturning method thereof, wherein the wafer transmission manipulator comprises: a transverse transmission shaft located only on one side of the cleaning unit; the transverse transmission carriage is arranged on the transverse transmission shaft and can do transverse motion along the transverse transmission shaft; the first vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage; the rotating platform is arranged on the first vertical lifting shaft; and the first clamping jaw clamping arm is connected with the rotating platform and is driven by the rotating platform to rotate. The invention can meet the free conversion of the wafer in the horizontal state and the vertical state; the transverse transmission dragging plate can not run right above the drying unit, so that the possibility that impurity particles on the moving part of the wafer transmission mechanical arm are scattered on the wafer in the drying process is eliminated.
Description
This application is a divisional application entitled "wafer transfer robot and wafer flipping method therefor" with application number 2019108427084
Technical Field
The invention relates to the field of equipment for manufacturing semiconductor integrated circuit chips, in particular to a wafer transmission manipulator.
Background
With the rapid development of the semiconductor industry, the feature size of the integrated circuit is continuously becoming finer, the semiconductor wafer is continuously developing in the direction of small volume, high circuit density, high speed and low power consumption, and the integrated circuit has now entered the Ultra-Large-scale integration (ULSI) submicron technology stage. As the diameter of silicon wafers is gradually increased, the width of scribe lines in devices is gradually reduced, and the number of metal layers is increased, so that high planarization of the surface of a semiconductor thin film has an important influence on high performance, low cost, and high yield of devices, and the requirement for flatness of the surface of a silicon wafer is becoming stricter.
Currently, as the only Planarization technology capable of obtaining global Planarization effect, Chemical Mechanical Planarization (CMP) has been developed into a CMP technology integrating on-line measurement, on-line endpoint detection, cleaning, etc., which is the product of the development of integrated circuits toward miniaturization, multi-layer, thinning, and Planarization processes. After the wafer is processed by CMP, the processed removed material and polishing solution remain on the surface of the wafer, and in order to remove the contaminants on the surface of the wafer in time, the CMP equipment needs to be used in combination with a cleaning device. In the process of drying wafers, one basic requirement is to dry the wafer and to eliminate the possibility of any particles originally attached in the solution re-attaching to the wafer.
In order to achieve a better cleaning effect of the whole cleaning module, a configuration that the drying unit is horizontally arranged and other cleaning units are vertically arranged can be adopted. In this configuration, in order to convert the wafer from the vertical state to the horizontal state, the wafer transfer robot needs to provide a flipping function to complete the work. In the existing cleaning manipulator, some clamping claw clamping arms do not have a rotating function and only have a single degree of freedom of up-and-down movement of a Z axis, and the wafer is turned over through a wafer clamping claw end. However, in the implementation method, the manipulator is required to be integrally moved above the drying equipment, the claw clamping arm can place the wafer which is turned over by the wafer claw into the drying equipment, and the whole placing process of the wafer transmission manipulator above the drying equipment is easy to introduce impurity particles into the final drying process, so that the cleanliness of the wafer is reduced. And the transverse stroke of the wafer transmission manipulator penetrates through the whole cleaning module, and long-stroke transmission also has certain influence on the transmission efficiency.
Disclosure of Invention
The invention aims to provide a wafer transmission manipulator and a wafer overturning method thereof, which are used for meeting the process requirement of chemical mechanical planarization by realizing the conversion of a wafer in a horizontal state and a vertical state and eliminating the possibility of scattering impurity particles on a moving part of the wafer transmission manipulator onto the wafer in a drying process.
In order to achieve the above object, the present invention provides a wafer transfer robot for transferring a wafer in a cleaning module of a chemical mechanical planarization apparatus, so that the wafer is taken out after being cleaned in the cleaning unit of the cleaning module in a vertical state, and then is placed in a drying unit of the cleaning module in a horizontal state after being turned over, the robot comprising:
a transverse transmission shaft located only on one side of the cleaning unit;
the transverse transmission carriage is arranged on the transverse transmission shaft and can do transverse motion along the transverse transmission shaft;
the first vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage;
the rotating platform is arranged on the first vertical lifting shaft;
and the first clamping claw clamping arm is connected with the rotating platform and is driven by the rotating platform to do rotating motion so as to take and place the wafer.
The cleaning unit and the drying unit are provided with openable doors, and the openable doors are used for automatically opening or closing when the wafer transmission manipulator takes and places the wafer.
The above wafer transfer robot, wherein the cleaning unit comprises: a pre-drying unit and other units of a cleaning module; the drying unit and other units of the cleaning module are positioned on two sides of the unit before drying; the unit before drying adopts vertical operation; the wafer in the pre-drying unit is transmitted to the drying unit by the first clamping claw clamping arm; and the other units of the cleaning module are one or more of a wafer transition unit, a megasonic cleaning unit and a brushing unit.
The above wafer transmission manipulator, wherein the wafer transmission manipulator further comprises: at least one second vertical lifting shaft which is arranged on the transverse transmission carriage and can do vertical motion on the transverse transmission carriage; the first vertical lifting shaft is positioned between the second vertical lifting shaft and the drying unit; and each second vertical lifting shaft is also provided with a second claw clamping arm which is used for being matched with the first claw clamping arm to carry out wafer transmission from other units of the cleaning module to the unit before drying.
The invention also provides a wafer turning method of the wafer transmission manipulator, which comprises a wafer placing step and a manipulator returning step;
the wafer embedding step comprises: after the first claw clamping arm takes out the wafer from the pre-drying unit of the cleaning unit, the wafer is turned from the vertical state to the horizontal state through the linkage or non-linkage actions in the transverse, vertical and rotary motion directions, and the wafer is placed into the drying unit;
the manipulator returning step includes: after the first claw clamping arm places the wafer in the drying unit, the wafer is restored to a vertical state from a horizontal state through linkage or non-linkage actions in the transverse, vertical and rotary motion directions, and the wafer returns to the original position.
The wafer turning method of the wafer transmission manipulator, wherein the wafer placing step specifically comprises:
after the first claw clamping arm takes out the wafer from the pre-drying unit, the first claw clamping arm simultaneously moves in the following three directions: the transverse transmission planker drives the first clamping jaw clamping arm to transversely move towards the direction far away from the drying unit, the rotary table drives the first clamping jaw clamping arm to rotate towards the side close to the drying unit until the wafer reaches a horizontal state, and the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move to a certain position;
then the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move towards the direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards until the wafer is positioned in the designated mechanism in the drying unit; the first claw clamping arm loosens the wafer, so that the wafer is positioned on the designated mechanism in the drying unit.
The wafer turning method of the wafer transmission manipulator, wherein the wafer placing step specifically comprises: after the first claw clamping arm takes the wafer out of the pre-drying unit, the transverse transmission carriage drives the first claw clamping arm to transversely move towards the direction far away from the drying unit; then the rotating table drives the first clamping claw clamping arm to rotate towards one side close to the drying unit until the wafer reaches a horizontal state; then the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move to a certain position; then the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move towards the direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards until the wafer is positioned in the designated mechanism in the drying unit; the first claw clamping arm loosens the wafer, so that the wafer is positioned on the designated mechanism in the drying unit.
The wafer turning method of the wafer transmission manipulator, wherein the wafer placing step specifically comprises: after the first claw clamping arm takes the wafer out of the pre-drying unit, the transverse transmission carriage drives the first claw clamping arm to transversely move towards the direction far away from the drying unit; then the rotating table drives the first clamping claw clamping arm to rotate towards one side close to the drying unit until the wafer reaches a horizontal state; then the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move towards the direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards until the wafer is positioned in the designated mechanism in the drying unit; the first claw clamping arm loosens the wafer, so that the wafer is positioned on the designated mechanism in the drying unit.
The wafer turning method of the wafer transmission manipulator, wherein the wafer placing step specifically comprises: after the first claw clamping arm takes the wafer out of the pre-drying unit, the rotating table drives the first claw clamping arm to rotate towards one side close to the drying unit until the wafer reaches a horizontal state; then the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards until the wafer is positioned in the designated mechanism in the drying unit; the first claw clamping arm loosens the wafer, so that the wafer is positioned on the designated mechanism in the drying unit.
The wafer turning method of the wafer transmission manipulator, wherein the manipulator returning step specifically includes: after the wafer is placed in the drying unit, the following three directions of movement are performed simultaneously: the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move towards the direction far away from the drying unit; the rotating table drives the first clamping jaw clamping arm to rotate downwards until the first clamping jaw clamping arm is in a vertical state; the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move upwards to a certain position.
The wafer turning method of the wafer transmission manipulator, wherein the manipulator returning step specifically includes: after the wafer is placed in the drying unit, the first vertical lifting shaft drives the first clamping claw clamping arm to vertically move upwards to a certain position; then the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move to a certain position in the direction far away from the drying unit; then the rotating table drives the first clamping jaw clamping arm to rotate downwards until the first clamping jaw clamping arm is in a vertical state.
The wafer turning method of the wafer transmission manipulator, wherein the manipulator returning step specifically includes: after the wafer is placed in the drying unit, the transverse transmission dragging plate drives the first clamping claw clamping arm to transversely move to a certain position in the direction far away from the drying unit; then the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move upwards to a certain position; then the rotating table drives the first clamping jaw clamping arm to rotate downwards until the first clamping jaw clamping arm is in a vertical state.
Compared with the prior art, the invention has the following beneficial effects:
1. the wafer transmission manipulator provided by the invention is arranged in the cleaning module of the chemical mechanical planarization equipment, can effectively meet the conversion of the wafer in the horizontal state and the vertical state, meets the actual production requirement, does not need to increase the space for overturning in the manipulator overturning process, does not interfere other mechanisms, and has high space utilization rate.
2. The wafer transmission manipulator of the invention enables the drying unit to select the wafer placing mode (vertical or horizontal placement) by taking the best action effect as the target, and the wafer placing mode of the drying unit is not required to be consistent with the rest units of the cleaning module for facilitating the wafer transmission.
3. Because the transverse transmission shaft stroke of the wafer transmission manipulator is only up to the unit before drying, the stroke is compact, and the transverse transmission dragging plate can not run to one side of the drying unit in the process of placing the wafer into the drying unit after the manipulator is turned over, thereby eliminating the possibility that impurity particles on the moving part of the wafer transmission manipulator are scattered on the wafer in the drying process.
Drawings
FIG. 1 is a schematic diagram of a wafer transfer robot according to a preferred embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a wafer loading step in the wafer flipping method according to embodiment 1 of the present invention;
FIG. 3 is a schematic flowchart of an embodiment 2 of a wafer loading step in the wafer flipping method according to the present invention;
FIG. 4 is a schematic flow chart illustrating a wafer placing step in the wafer flipping method according to embodiment 3 of the present invention;
fig. 5 is a flowchart illustrating a wafer placing step in the wafer flipping method according to embodiment 4 of the present invention.
Detailed Description
The invention will be further described by the following specific examples in conjunction with the drawings, which are provided for illustration only and are not intended to limit the scope of the invention.
In the preferred embodiment shown in fig. 1, the wafer transfer robot of the present invention is used for transferring the wafer 8 in the cleaning module of the chemical mechanical planarization apparatus, so that the wafer 8 can be taken out after being cleaned in the cleaning unit of the cleaning module in a vertical state, and then be placed in the drying unit 10 of the cleaning module in a horizontal state after being turned over. In some preferred embodiments, the cleaning unit and the drying unit 10 are equipped with openable and closable pneumatic doors for automatically opening and closing when the wafer transfer robot takes and places the wafer 8.
The cleaning unit of the cleaning module includes: a pre-drying unit 9 and other units of a cleaning module; the drying unit 10 and other units of the cleaning module are positioned at two sides of the pre-drying unit 9; in some preferred embodiments, the pre-drying unit 9 may be selected from a brush unit in which the wafer 8 is operated in a vertical direction; the other units of the cleaning module can be one or more of a wafer transition unit, a megasonic cleaning unit and a brushing unit. The specific arrangement of the cleaning units can be freely combined according to the actual production requirements so as to be flexibly suitable for various conditions.
In this embodiment, the wafer transfer robot provided by the present invention includes: the device comprises a transverse transmission shaft 1, a transverse transmission carriage 2, a first vertical lifting shaft 3, a second vertical lifting shaft 5, a first clamping jaw clamping arm 7 and a second clamping jaw clamping arm 6.
The transverse transmission carriage 2 is arranged on the transverse transmission shaft 1 and can do transverse motion along the transverse transmission shaft 1; the transverse transmission shaft 1 is only positioned at one side of the cleaning unit, so that the transverse transmission carriage 2 does not run to one side of the drying unit 10, thereby eliminating the possibility that impurity particles on the moving parts of the wafer transmission manipulator are scattered on the wafer 8 in the drying process. It should be noted that: the position of the transverse transmission shaft 1 only needs to meet the requirement that the transverse transmission carriage 2 does not run to one side of the drying unit, and the relative spatial position of the transverse transmission shaft 1 and the cleaning unit is not particularly limited. The transverse transmission shaft 1 can be lower than the cleaning unit, and the wafer 8 can be taken and placed only by the wafer transmission manipulator. More preferably, the transverse transmission shaft 1 is arranged above the washing unit to achieve a more optimal arrangement.
The transverse transmission carriage 2 is provided with a first vertical lifting shaft 3 and a second vertical lifting shaft 5 in parallel, and the transverse transmission carriage 2 can independently move vertically and vertically. The first vertical lifting shaft 3 is also provided with a rotating platform 4 for driving a first claw clamping arm 7 connected with the rotating platform to rotate. The driving form of the rotating platform 4 is pneumatic or electric. And the second vertical lifting shaft 5 is directly connected to the second jaw holding arm 6. The first gripper arm 7 is closer to the drying unit 10 than the second gripper arm 6 for transferring wafers 8 from the pre-drying unit 9 to the drying unit 10.
And the second gripper arm 6 is used to transfer the wafer 8 from the other units of the cleaning module to the pre-drying unit 9. The second gripper arm 6 is provided in this embodiment to allow the wafer 8 to be processed to enter the pre-drying unit 9 for operation immediately after the first gripper arm 7 takes the wafer 8 out of the pre-drying unit 9, thereby achieving higher production efficiency. However, in some embodiments, the second claw holding arms 6 are not provided, which does not affect the technical problem solved by the present invention and the achieved technical effect, so the present invention has no limitation on the number of the second claw holding arms 6, and can be configured according to the actual production situation.
The transverse transfer shaft 1 is disposed at one side of the pre-drying unit 9, and the other units of the washing module are disposed below the transverse transfer shaft 1 in the order shown in fig. 1. The second claw clamping arm 6 can lift in the Z-axis direction through the second vertical lifting shaft 5, the first claw clamping arm 7 can rotate clockwise or anticlockwise through the rotating platform 4, the rotating platform 4 can lift in the Z-axis direction through the first vertical lifting shaft 3, and the transverse transmission carriage 2 can move in the X-axis direction through the transverse transmission shaft 1. The pre-drying unit 9 and other units of the cleaning module are all previous process units for drying the wafer 8, and the drying unit 10 is used for drying and cleaning the surface of the cleaned wafer 8. The wafer transfer robot functions to transfer the wafer 8 to each unit of the cleaning module by lateral movement, vertical movement, and rotational movement after holding the wafer 8.
The invention also provides a wafer 8 overturning method of the wafer transmission manipulator, which comprises a wafer 8 placing step and a manipulator returning step.
The step of placing the wafer 8 includes: after the first claw clamping arm 7 takes the wafer 8 out of the cleaning unit, the wafer 8 is turned over from the vertical state to the horizontal state through linkage or non-linkage actions in the transverse, vertical and rotary motion directions, and the wafer 8 is placed into the drying unit 10.
The manipulator returning step includes: after the first claw clamping arm 7 places the wafer 8 in the drying unit 10, the horizontal state is restored to the vertical state through linkage or non-linkage actions in the transverse, vertical and rotary motion directions, and the wafer returns to the original position.
The wafer 8 turning method based on the wafer transfer robot according to the present invention will be specifically described in the following 7 embodiments. Of course, the embodiment of the wafer 8 turning method according to the present invention is not limited to the following 7 examples.
Example 1:
after the first chuck holding arm 7 moves along the Z-axis direction to take out the wafer 8 from the pre-drying unit 9 (as shown in part i of fig. 2), as shown in part ii of fig. 2, the transverse transmission carriage 2 moves towards the X + direction, meanwhile, the rotary table 4 drives the wafer 8 to rotate clockwise along the a +, and the first vertical lifting shaft 3 drives the first chuck holding arm 7 to move downwards towards the Z-direction, the first chuck holding arm 7 carries the wafer 8 to move together in the X +, a +, and Z-directions, so that the conversion process of the wafer 8 from the vertical state to the horizontal state is completed cooperatively, and as shown in part iii of fig. 2, the wafer 8 has reached the horizontal state. During the inversion of the wafer 8, the designated mechanism inside the drying unit 10 is ready for the wafer 8 to be placed in. Then the transverse transport carriage 2 drives the first claw holding arm 7 to move in the X-direction until the wafer 8 is located above the drying unit 10 (as shown in the part (r) of fig. 2). The first gripper arm 7 moves downward in the Z-direction until the wafer 8 is located inside the drying unit 10 at the designated mechanism (shown in part (v) of fig. 2), the first gripper arm 7 releases the wafer 8, and the wafer 8 is located inside the drying unit 10 at the designated mechanism.
Example 2:
after the first chuck holding arm 7 moves in the Z-axis direction to take out the wafer 8 from the pre-drying unit 9 (as shown in part (i) of fig. 3), as shown in part (ii) of fig. 3, the transverse transport carriage 2 moves a distance in the X + direction, and then the rotary table 4 drives the first chuck holding arm 7 to rotate clockwise in the a + direction to a certain angle to make the wafer 8 reach a horizontal state (as shown in part (iii) and part (iv) of fig. 3). The first vertical lifting shaft 3 then carries the first gripper arm 7 to a certain position in the downward Z-direction. During the inversion of the wafer 8, the designated mechanism inside the drying unit 10 is ready for the wafer 8 to be placed in. The traverse transport carriage 2 then drives the first gripper arm 7 to move in the X-direction until the wafer 8 is above the drying unit 10 (see part (v) of fig. 3). The first claw holding arm 7 moves downward in the Z-direction until the wafer 8 is located at a designated mechanism inside the drying unit 10 (as shown in part c of fig. 3), the first claw holding arm 7 releases the wafer 8, and the wafer 8 is located at the designated mechanism inside the drying unit 10. The above steps are the result of a combination of separate movements in each direction.
Example 3:
after the first chuck holding arm 7 moves in the Z-axis direction to take out the wafer 8 from the pre-drying unit 9 (as shown in part (i) of fig. 4), as shown in part (ii) of fig. 4, the transverse transport carriage 2 moves a distance in the X + direction, and then the rotary table 4 drives the first chuck holding arm 7 to rotate clockwise in the a + direction to a certain angle to make the wafer 8 reach a horizontal state (as shown in part (iii) and part (iv) of fig. 4). Then the transverse transmission carriage 2 drives the first claw clamping arm 7 to move towards the X-direction (as shown in part fifthly of figure 4), and then the first vertical lifting shaft 3 drives the first claw clamping arm 7 to move downwards towards the Z-direction until the wafer 8 is positioned at a designated mechanism inside the drying unit 10 (as shown in part sixthly of figure 4). Finally the first gripper arm 7 releases the wafer 8, the wafer 8 being located on a designated mechanism inside the drying unit 10.
Example 4:
after the first claw clamping arm 7 moves along the Z-axis direction and takes out the wafer 8 from the pre-drying unit 9 (as shown in part I of figure 5), the first claw clamping arm 7 directly rotates clockwise along A + to a certain angle to enable the wafer 8 to reach a horizontal state (as shown in part II of figure 5), then the transverse transmission carriage 2 is moved (fine-tuned) in the X + direction or the X-direction according to the actual length of different claw clamping arms, so that the wafer 8 is positioned right above the drying unit 10, and then the first vertical lifting shaft 3 drives the first claw clamping arm 7 to move downwards along the Z-direction until the wafer 8 is positioned in a designated mechanism in the drying unit 10. Finally the first gripper arm 7 releases the wafer 8, the wafer 8 being located on a designated mechanism inside the drying unit 10.
After the wafer 8 is placed inside the drying unit 10 by the designated mechanism, the robot will then return to the original state, and the following protocol of examples 5-7 may be used to complete the cycle.
Example 5:
the operation of placing the wafer 8 can be selected from any one of the embodiments 1 to 4, when the wafer 8 is placed in the designated mechanism inside the drying unit 10, the manipulator returns to the original state, the transverse transmission carriage 2 moves in the X + direction, the rotary table 4 drives the wafer 8 to rotate clockwise along the direction a-, the first vertical lifting shaft 3 drives the first claw clamping arm 7 to ascend in the direction Z +, the first claw clamping arm 7 moves in the directions X +, a-, and Z +, and the processes from the horizontal state to the vertical state are completed in a coordinated manner.
Example 6:
the operation of placing the wafer 8 may be performed by any of the embodiments 1 to 4, and after the wafer 8 is placed in the designated mechanism inside the drying unit 10, the robot arm returns to the original state, and after the first horizontal claw clamping arm 7 first ascends to a certain height in the Z + direction and then moves a certain distance in the X + direction, the first claw clamping arm 7 rotates in the a-direction until the wafer returns to the vertical state, thereby completing the whole cycle.
Example 7:
the operation of placing the wafer 8 may be performed by any of the embodiments 1 to 4, and after the wafer 8 is placed in the designated mechanism inside the drying unit 10, the robot arm returns to the original state, and after the first horizontal claw clamping arm 7 moves a certain distance in the X + direction, the first horizontal claw clamping arm rises to a certain height in the Z + direction, and then the first claw clamping arm 7 rotates in the a-direction until the wafer returns to the vertical state, thereby completing the whole cycle.
In summary, the wafer 8 insertion can be linked or not, the robot return can be linked or not, and the embodiments 1 to 4 related to the wafer 8 insertion and the embodiments 5 to 7 related to the robot return can be freely combined according to actual needs to be used to adapt to various actual production environments.
In summary, the wafer conveying manipulator provided by the invention is arranged in the cleaning module of the chemical mechanical planarization equipment, can effectively meet the conversion of the wafer in the horizontal state and the vertical state, meets the actual production requirement, does not need to increase the space for overturning in the manipulator overturning process, does not interfere other mechanisms, and has high space utilization rate. The wafer transmission manipulator of the invention enables the drying unit to select the wafer placing mode (vertical or horizontal placement) by taking the best action effect as the target, and the wafer placing mode of the drying unit is not required to be consistent with the rest units of the cleaning module for facilitating the wafer transmission. Because the transverse transmission shaft stroke of the wafer transmission manipulator is only up to the unit before drying, the stroke is compact, and the transverse transmission dragging plate can not run to one side of the drying unit in the process of placing the wafer into the drying unit after the manipulator is turned over, thereby eliminating the possibility that impurity particles on the moving part of the wafer transmission manipulator are scattered on the wafer in the drying process.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (10)
1. A wafer transmission manipulator is used for taking out a wafer after the wafer is cleaned in a cleaning unit of a cleaning module in a vertical state and then putting the wafer into a drying unit of the cleaning module in a horizontal state after being turned over;
comprises the following steps:
a transverse transmission shaft;
the transverse transmission carriage is arranged on the transverse transmission shaft and can do transverse motion along the transverse transmission shaft;
the first vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage;
the rotating platform is arranged on the first vertical lifting shaft;
the first clamping claw clamping arm is connected with the rotating platform, is driven by the rotating platform to do rotating motion and is used for taking and placing the wafer;
the cleaning unit includes: a pre-drying unit and other units of a cleaning module; the drying unit and other units of the cleaning module are positioned on two sides of the unit before drying;
the method is characterized in that:
the first clamping jaw clamping arm transversely moves in the direction far away from the drying unit, the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards, the rotating table drives the first clamping jaw clamping arm to approach the drying unit, and the wafer is turned over from the vertical state to the horizontal state through linkage or non-linkage action of the three movement directions of the wafer rotating to the horizontal state on one side of the drying unit.
2. The wafer transfer robot of claim 1, wherein: the second vertical lifting shaft is arranged on the transverse transmission carriage and can vertically move on the transverse transmission carriage; the first vertical lifting shaft is positioned between the second vertical lifting shaft and the drying unit; and each second vertical lifting shaft is also provided with a second claw clamping arm which is used for being matched with the first claw clamping arm to carry out wafer transmission from other units of the cleaning module to the unit before drying.
3. The wafer transfer robot of claim 2, wherein: the first jaw holding arm is closer to the drying unit than the second jaw holding arm.
4. The wafer transfer robot of claim 1, wherein: the transverse transmission shaft is only positioned on one side of the cleaning unit, so that the transverse transmission carriage cannot run to one side of the drying unit.
5. The wafer transfer robot of claim 1 or 4, wherein: the transverse transmission shaft is arranged above the cleaning unit.
6. The wafer transfer robot of claim 1, wherein: when the three movement directions are in linkage action, the transverse transmission dragging plate drives the first clamping jaw clamping arm to move transversely in the direction away from the drying unit, the rotary table drives the first clamping jaw clamping arm to rotate to the side close to the drying unit until the wafer reaches a horizontal state, and the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards to a certain position to place the wafer into the drying unit.
7. The wafer transfer robot of claim 1, wherein: when the three movement directions do non-linkage action, the transverse transmission planker drives the first clamping jaw clamping arm to do transverse movement towards the direction far away from the drying unit; then the rotating table drives the first clamping claw clamping arm to rotate towards one side close to the drying unit until the wafer reaches a horizontal state; then the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move to a certain position; then the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move towards the direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards until the wafer is positioned in the designated mechanism in the drying unit; the first clamping claw clamping arm loosens the wafer, so that the wafer is positioned on the designated mechanism in the drying unit;
or when the three movement directions do non-linkage action, the transverse transmission carriage drives the first claw clamping arm to do transverse movement towards the direction far away from the drying unit; then the rotating table drives the first clamping claw clamping arm to rotate towards one side close to the drying unit until the wafer reaches a horizontal state; then the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move towards the direction close to the drying unit until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards until the wafer is positioned in the designated mechanism in the drying unit; the first clamping claw clamping arm loosens the wafer, so that the wafer is positioned on the designated mechanism in the drying unit;
or when the three motion directions do not act in a linkage manner, the rotating table drives the first clamping claw clamping arm to rotate towards one side close to the drying unit until the wafer reaches a horizontal state; then the transverse transmission carriage drives the first clamping jaw clamping arm to transversely move until the wafer is positioned above the drying unit; the first vertical lifting shaft drives the first clamping jaw clamping arm to vertically move downwards until the wafer is positioned in the designated mechanism in the drying unit; the first claw clamping arm loosens the wafer, so that the wafer is positioned on the designated mechanism in the drying unit.
8. The wafer transfer robot of claim 1, wherein: and the other units of the cleaning module are one or more of a wafer transition unit, a megasonic cleaning unit and a brushing unit.
9. The wafer transfer robot of claim 1, wherein: the cleaning unit and the drying unit are provided with switchable doors, and the switchable doors are used for automatically opening or closing when the wafer transmission manipulator takes and places the wafer.
10. The wafer transfer robot of claim 1, wherein: the pre-drying unit is a brushing unit, and the wafer works in the vertical direction in the unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110293343.1A CN113113339B (en) | 2019-09-06 | 2019-09-06 | Wafer transmission manipulator |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910842708.4A CN110534472B (en) | 2019-09-06 | 2019-09-06 | Wafer transmission manipulator and wafer overturning method thereof |
| CN202110293343.1A CN113113339B (en) | 2019-09-06 | 2019-09-06 | Wafer transmission manipulator |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910842708.4A Division CN110534472B (en) | 2018-10-15 | 2019-09-06 | Wafer transmission manipulator and wafer overturning method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113113339A true CN113113339A (en) | 2021-07-13 |
| CN113113339B CN113113339B (en) | 2024-04-05 |
Family
ID=68667563
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910842708.4A Active CN110534472B (en) | 2018-10-15 | 2019-09-06 | Wafer transmission manipulator and wafer overturning method thereof |
| CN202110293343.1A Active CN113113339B (en) | 2019-09-06 | 2019-09-06 | Wafer transmission manipulator |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910842708.4A Active CN110534472B (en) | 2018-10-15 | 2019-09-06 | Wafer transmission manipulator and wafer overturning method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN110534472B (en) |
| TW (1) | TWI773943B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241103A (en) * | 2020-05-06 | 2022-10-25 | 杭州众硅电子科技有限公司 | Wafer transmission device, transmission method and CMP equipment cleaning module |
| CN111604810B (en) * | 2020-07-24 | 2020-11-03 | 杭州众硅电子科技有限公司 | Wafer transmission equipment, chemical mechanical planarization device and wafer transmission method |
| CN112086394A (en) * | 2020-07-30 | 2020-12-15 | 北京烁科精微电子装备有限公司 | Wafer transfer transmission device and wafer transfer transmission method |
| CN112614802B (en) * | 2021-03-08 | 2021-07-06 | 杭州众硅电子科技有限公司 | Manipulator and method for transporting wafer by CMP (chemical mechanical polishing) cleaning unit |
| CN115706035A (en) * | 2021-08-12 | 2023-02-17 | 北京北方华创微电子装备有限公司 | Semiconductor cleaning equipment and wafer overturning device thereof |
| CN114220748B (en) * | 2022-02-23 | 2022-06-21 | 杭州众硅电子科技有限公司 | Dynamic detection device and chemical mechanical planarization equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030159528A1 (en) * | 2002-02-25 | 2003-08-28 | Samsung Electronics | Apparatus and method for wafer backside inspection |
| CN108155126A (en) * | 2017-12-26 | 2018-06-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer transfer device and wafer cleaning device |
| CN108198770A (en) * | 2017-12-27 | 2018-06-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Transmit wafer method and device |
| US20180282893A1 (en) * | 2017-03-28 | 2018-10-04 | Ebara Corporation | Substrate transporting apparatus, control apparatus for substrate transporting apparatus, displacement compensation method for substrate transporting apparatus, program for implementing method and recording medium that records program |
| CN109524330A (en) * | 2018-10-15 | 2019-03-26 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
| CN209133483U (en) * | 2019-01-15 | 2019-07-19 | 上海福赛特机器人有限公司 | A kind of overturning of wafer class product and horizontal handling device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6457199B1 (en) * | 2000-10-12 | 2002-10-01 | Lam Research Corporation | Substrate processing in an immersion, scrub and dry system |
| US7408615B2 (en) * | 2004-06-21 | 2008-08-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE102008010401A1 (en) * | 2008-02-21 | 2009-10-01 | Eisenmann Anlagenbau Gmbh & Co. Kg | Monorail system and dip treatment plant with such |
| JP6700149B2 (en) * | 2016-09-29 | 2020-05-27 | 株式会社Ｓｃｒｅｅｎホールディングス | Posture change device |
-
2019
- 2019-09-06 CN CN201910842708.4A patent/CN110534472B/en active Active
- 2019-09-06 CN CN202110293343.1A patent/CN113113339B/en active Active
- 2019-11-25 TW TW108142780A patent/TWI773943B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030159528A1 (en) * | 2002-02-25 | 2003-08-28 | Samsung Electronics | Apparatus and method for wafer backside inspection |
| US20180282893A1 (en) * | 2017-03-28 | 2018-10-04 | Ebara Corporation | Substrate transporting apparatus, control apparatus for substrate transporting apparatus, displacement compensation method for substrate transporting apparatus, program for implementing method and recording medium that records program |
| CN108155126A (en) * | 2017-12-26 | 2018-06-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer transfer device and wafer cleaning device |
| CN108198770A (en) * | 2017-12-27 | 2018-06-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Transmit wafer method and device |
| CN109524330A (en) * | 2018-10-15 | 2019-03-26 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
| CN209133483U (en) * | 2019-01-15 | 2019-07-19 | 上海福赛特机器人有限公司 | A kind of overturning of wafer class product and horizontal handling device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110534472B (en) | 2021-05-25 |
| CN113113339B (en) | 2024-04-05 |
| TW202111857A (en) | 2021-03-16 |
| TWI773943B (en) | 2022-08-11 |
| CN110534472A (en) | 2019-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110534472B (en) | Wafer transmission manipulator and wafer overturning method thereof | |
| US11908720B2 (en) | CMP wafer cleaning equipment, wafer transfer robot and wafer flipping method | |
| TWI806931B (en) | chemical mechanical grinding equipment | |
| KR100963361B1 (en) | Substrate processing apparatus | |
| KR20080061289A (en) | Substrate processing apparatus and substrate processing method | |
| KR100957912B1 (en) | Substrate processing apparatus | |
| TWI222154B (en) | Integrated system for processing semiconductor wafers | |
| US20090025749A1 (en) | Method for vertical transfer of semiconductor substrates in a cleaning module | |
| JP2007318134A (en) | Semiconductor material handling system | |
| WO2020077649A1 (en) | Cmp wafer cleaning apparatus | |
| US11682567B2 (en) | Cleaning system with in-line SPM processing | |
| CN111524847A (en) | Wafer transmission device, transmission method and CMP equipment cleaning module | |
| WO2020056818A1 (en) | Polishing loading and unloading component module containing movable loading and unloading module | |
| CN110310911A (en) | Semiconductor equipment, wafer transfer mechanism and operational method | |
| TWI729653B (en) | Substrate treating apparatus and substrate transporting method | |
| US20150221536A1 (en) | Substrate processing apparatus, substrate transfer method and substrate transfer device | |
| WO2020057330A1 (en) | Polishing and loading/unloading component module | |
| TW202109718A (en) | Substrate treating system and substrate transporting method | |
| TW202135225A (en) | Apparatus and method for delivering wafers | |
| US20240100713A1 (en) | Method and apparatus for processing a substrate in cleaning modules | |
| CN218677072U (en) | Bottom surface cleaning device | |
| KR20040103935A (en) | Integrated system for processing semiconductor wafers | |
| KR101527898B1 (en) | Supporting unit, substrate treating apparatus, substrate treating equipment, and substrate treating method | |
| CN217860706U (en) | Chemical mechanical polishing system | |
| TWM651204U (en) | Wafer cleaning system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |