CN108198770B - Method and device for transmitting wafer - Google Patents
Method and device for transmitting wafer Download PDFInfo
- Publication number
- CN108198770B CN108198770B CN201711444773.9A CN201711444773A CN108198770B CN 108198770 B CN108198770 B CN 108198770B CN 201711444773 A CN201711444773 A CN 201711444773A CN 108198770 B CN108198770 B CN 108198770B
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- guide rail
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- clamping jaw
- groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
Abstract
The invention relates to the field of single-wafer cleaning equipment, in particular to a wafer conveying method and a wafer conveying device. The method has high transmission productivity to the wafer.
Description
Technical Field
The invention relates to the field of single-wafer cleaning equipment, in particular to a wafer transmission method and device.
Background
The wafer cleaning equipment consists of a plurality of process tank bodies, and each tank body is responsible for a cleaning process, such as an ultrasonic/megasonic cleaning tank, a brushing tank, a drying tank and the like. In order to achieve a predetermined process effect, the installation direction and angle of each tank body are different, for example, the tank body is horizontally arranged, the tank body is vertically arranged, and the processing process of each wafer may be processed by the process tanks with different directions and angles. However, placing the wafers in process slots in different orientations presents a technical challenge.
The existing wafer conveying device clamps wafers through the opening and closing of the pickup arm and the gas claw, the opening and closing of the gas claw are realized through a cylinder connected with the gas claw, and the clamped wafers are rotated in position and then conveyed to a process groove. However, the conventional wafer transferring apparatus and wafer transferring method have low transferring throughput.
Disclosure of Invention
The present invention is directed to a method and apparatus for transferring a wafer, which solves the above problems in the prior art.
The embodiment of the invention provides a method for transmitting wafers, which comprises the following steps: grabbing the wafer through the grabbing structure, and transmitting the wafer to a preset position; clamping the wafer from the grabbing structure through the overturning structure, and adjusting the angle of the wafer to enable the angle of the wafer to be consistent with that of the process groove; the flip structure places the wafer in a process tank.
As a further step, the step of grabbing the wafer by the grabbing structure and transferring the wafer to the preset position comprises: the second guide rail slides on the first guide rail so as to drive the claw structure connected with the second guide rail to move in the horizontal direction; when the distance between the claw structure and the wafer reaches a set distance, the connecting arm slides along the second guide rail so as to drive the claw structure to move in the vertical direction; when the center of the claw part and the center of the wafer are on the same horizontal line, the connecting arm stops moving in the vertical direction, and the wafer is located at the center of the claw part by sliding a set distance towards the horizontal direction close to the wafer on the first guide rail through the second guide rail; the connecting arm slides along the second guide rail so as to drive the clamping claw structure to ascend in the vertical direction, and the wafer falls into the clamping groove; the wafer is clamped by the clamping groove clamping claw and moves in the vertical direction along with the sliding of the connecting arm on the second guide rail, and moves in the horizontal direction along with the sliding of the second guide rail on the first guide rail, so that the wafer is transmitted to a preset position.
As a further step, the wafer is clamped out from the grabbing structure through the overturning structure, and the angle of the wafer is adjusted to make the angle of the wafer consistent with the angle of the process groove, which comprises the following steps: the fourth guide rail slides on the third guide rail so as to drive the clamping jaw structure to move in the horizontal direction to reach a set position; the power part slides on the fourth guide rail so as to drive the clamping jaw structure to move in the vertical direction to reach the preset position; the angle and the length of the clamping jaw structure are adjusted through the power part, so that the clamping jaw structure can clamp a wafer from the clamping groove; the power part slides on the fourth guide rail so as to drive the clamping jaw structure and the wafer to move to a set position in the vertical direction; the fourth guide rail slides on the third guide rail so as to drive the clamping jaw structure and the wafer to move above the process groove in the horizontal direction; the angle of the clamping jaw structure is adjusted through the power part, so that the angle of the wafer on the clamping jaw structure is consistent with the angle of the process groove.
As a further step, the step of placing the wafer into the process tank by the turnover structure comprises: the power part adjusts the included angle of the clamping jaw structure, and loosens the wafer, so that the wafer falls into the process groove.
The embodiment of the invention also provides a wafer conveying device, which comprises a grabbing structure and a turning structure; the grabbing structure and the overturning structure are arranged oppositely, the grabbing structure and the overturning structure are arranged on the same plane, and the distance between the grabbing structure and the overturning structure is within a set range, so that the grabbing structure and the overturning structure can be matched with each other to transmit wafers.
As a further step, the grabbing structure comprises a first guide rail, a second guide rail, a connecting arm and a claw structure; the first guide rail is horizontally arranged; the second guide rail is connected with the first guide rail, is vertical to the first guide rail and can axially move along the first guide rail; one end of the connecting arm is connected with the second guide rail and can move along the axial direction of the second guide rail; and one end of the connecting arm, which is far away from the second guide rail, is connected with the claw structure.
Furthermore, a first sliding clamping groove is formed in the first guide rail along the axial direction of the first guide rail; a first bump corresponding to the first sliding clamping groove is arranged on the second guide rail; the first bump is clamped into the first sliding clamping groove, so that the sliding connection between the second guide rail and the first guide rail is realized; a first convex rail is arranged on one side, away from the first guide rail, of the second guide rail; one end of the connecting arm is provided with a first groove corresponding to the first convex rail; the first groove is sleeved outside the first convex rail, so that the connecting arm is connected with the second guide rail in a sliding manner; the clamping jaw structure comprises a connecting part, a clamping jaw part and a clamping groove; the clamping claw part is of an arc-shaped structure, the clamping groove is arranged at the opening position of the clamping claw part, and the clamping groove is used for clamping a wafer to prevent the wafer from falling off; one side of the clamping claw part, which is far away from the clamping groove, is connected with the connecting part; the connecting part is connected with one end, far away from the second guide rail, of the connecting arm.
As a further step, the turnover structure comprises a third guide rail, a fourth guide rail, a power part and a clamping jaw structure; the third guide rail is horizontally arranged, is parallel to and opposite to the first guide rail, and has a distance within a set range; the fourth guide rail is connected with the third guide rail, is perpendicular to the third guide rail and can move along the axial direction of the third guide rail; one side of the power part is connected with the fourth guide rail and can move along the axial direction of the fourth guide rail; one side of the power part, which is far away from the fourth guide rail, is connected with the clamping jaw structure and used for adjusting the angle of the clamping jaw structure, so that the clamping jaw structure can clamp a wafer.
Further, a second sliding clamping groove is formed in the third guide rail along the axial direction of the third guide rail; a second bump corresponding to the second sliding clamping groove is arranged on the fourth guide rail; the second bump is clamped into the second sliding clamping groove, so that the sliding connection between the fourth guide rail and the third guide rail is realized; a second convex rail is arranged on one side, away from the third guide rail, of the fourth guide rail; a second groove corresponding to the second convex rail is formed in one side of the power part; the second groove is sleeved outside the second convex rail, so that the power part is connected with the fourth guide rail in a sliding manner; one side of the power part, which is far away from the fourth guide rail, is connected with the clamping jaw structure.
Further, the power part comprises a first power part, a rotating structure and a second power part; a second groove corresponding to the second convex rail is formed in one side of the first power part, and the second groove is sleeved outside the second convex rail; one side, far away from the fourth guide rail, of the first power part is movably connected with the rotating structure, a power structure is arranged in the first power part, and the power structure is movably connected with one side of the rotating structure and can control the rotating structure to rotate; one side of the second power part is connected with one side of the rotating structure far away from the first power part, and can rotate along with the rotation of the rotating structure to adjust the angle of the rotating structure on a plane vertical to the rotating structure; the clamping jaw structure comprises a first clamping arm and a second clamping arm; one ends of the first clamping arm and the second clamping arm are arranged on one side of the second power part far away from the rotating structure, and can rotate along with the rotation of the second power part so as to adjust the angle of the first clamping arm and the second clamping arm on a plane perpendicular to the rotating structure; the second power structure is used for adjusting the opening and closing angles of the first clamping arm and the second clamping arm so as to control the clamping jaw structure to clamp or put down the wafer.
According to the method and the device for transmitting the wafer, the wafer is grabbed by the grabbing structure, the wafer is transmitted to the preset position, the wafer is clamped from the grabbing structure by the overturning structure, the angle of the wafer is adjusted to be consistent with that of the process groove, and the wafer is placed into the process groove by the overturning structure, so that the wafer is transmitted in the process grooves in different directions and angles. The method has high transmission productivity to the wafer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a wafer transferring apparatus 100 according to an embodiment of the present invention.
Fig. 2 shows a schematic diagram of a process tank 400.
Fig. 3 shows a schematic structural view of the grasping configuration in fig. 1.
Fig. 4 shows a schematic structural view of the jaw structure.
Fig. 5 shows a schematic structural view of the flip structure.
Fig. 6 is a flowchart illustrating a method for transferring a wafer according to an embodiment of the invention.
Fig. 7 shows a flowchart of step S100.
Fig. 8 shows a flowchart of step S200.
Icon: 100-a transfer wafer device; 200-a grasping configuration; 210-a first guide rail; 220-a second guide rail; 230-a connecting arm; 240-jaw configuration; 241-a connecting part; 242-a jaw portion; 243-card slot 243; 300-a flip structure; 310-a third guide rail; 320-a fourth guide rail; 330-a power section; 331-a first power section; 332-a rotating structure; 333-a second power section; 340-a jaw configuration; 341-first clamp arm; 342-a second clip arm; 400-a process tank; 410-first process tank 410; 420-a second process tank; 500-wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention conventionally put into use, or the orientations or positional relationships that the persons skilled in the art conventionally understand, are only used for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the equipment or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an apparatus 100 for transferring a wafer 500 according to an embodiment of the present invention. In an embodiment of the present invention, the apparatus 100 for transferring a wafer 500 includes a grabbing structure 200 and a flipping structure 300. The grabbing structure 200 and the overturning structure 300 are oppositely arranged, the grabbing structure 200 and the overturning structure 300 are on the same plane, and the distance between the grabbing structure 200 and the overturning structure 300 is within a set range, so that the grabbing structure 200 and the overturning structure 300 can be matched with each other to transmit the wafer 500. Specifically, the turnover structure 300 can extend into the grabbing structure 200 to clamp the wafer 500 in the grabbing structure 200, so as to realize the matching transmission.
As an embodiment, the catching structure 200 and the flipping structure 300 are respectively disposed above both sides of the process tank 400, and the catching structure 200 is parallel to the flipping structure 300. The distance between the grasping configuration 200 and the flipping configuration 300 may be the width of the process tank 400.
Referring to fig. 2, fig. 2 shows a schematic diagram of a process tank 400. A process tank 400 includes a first process tank 400 in a horizontal direction and a second process tank 420 in a vertical direction.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating the grabbing structure 200 shown in fig. 1. In the embodiment of the present invention, the grasping structure 200 includes a first rail 210, a second rail 220, a connecting arm 230, and a claw structure 240, the first rail 210 is horizontally disposed, the second rail 220 is connected to the first rail 210 and is perpendicular to the first rail 10, and the second rail 220 is capable of moving axially along the first rail 210. The connecting arm 230 is connected at one end to the second rail 220 and is capable of moving in the axial direction of the second rail 220. The end of the connecting arm 230 remote from the second rail 220 is connected to a catch formation 240.
As a further step, a first sliding slot is formed in the first guide rail 210 along the axial direction of the first guide rail 210, a first protruding block corresponding to the first sliding slot is arranged on the second guide rail 220, and the first protruding block is clamped into the first sliding slot, so that the sliding connection between the second guide rail 220 and the first guide rail 210 is realized.
As a further step, a first convex rail is disposed on one side of the second guide rail 220 away from the first guide rail 210, and a first groove corresponding to the first convex rail is disposed at one end of the connecting arm 230, and the first groove is sleeved outside the first convex rail, so that the connecting arm 230 and the second guide rail 220 are slidably connected.
Referring to fig. 4, fig. 4 is a schematic structural diagram of the latch structure 240. In the present embodiment, the jaw structure 240 includes a connection portion 241, a jaw portion 242, and a catch 243. The claw portion 242 has an arc-shaped structure, and the notch is provided at an opening position of the claw portion 242 and is used for clamping the wafer 500 to prevent the wafer 500 from falling. The side of the claw 242 away from the card slot is connected to the connecting portion 241, and the connecting portion 241 is connected to the end of the connecting arm 230 away from the second rail 220.
Referring to fig. 5, fig. 5 is a schematic structural diagram of the flip structure 300. In an embodiment of the present invention, the flipping structure 300 includes a third rail 310, a fourth rail 320, a power portion 330, and a jaw structure 340. The third guide rail 310 is horizontally disposed, is parallel to and opposite to the first guide rail 210, has a distance between the third guide rail 310 and the first guide rail 210 within a predetermined range, and the fourth guide rail 320 is connected to the third guide rail 310, is perpendicular to the third guide rail 310, and is movable along the axial direction of the third guide rail 310.
In the embodiment of the present invention, the power unit 330 is connected to the fourth guide rail 320 at one side and can move along the axial direction of the fourth guide rail 320. The side of the power portion 330 remote from the fourth guide rail 320 is connected to the jaw structure 340 for adjusting the angle of the jaw structure 340 to enable the jaw structure 340 to grip the wafer 500.
As an embodiment, the distance between the third guide rail 310 and the first guide rail 210 may be the width of the process tank 400. The third guide rail 310 and the first guide rail 210 may have a length greater than or equal to the length of the process tank 400.
The third guide rail 310 and the first guide rail 210 are arranged at a height higher than that of the process tank 400, and the top ends of the second guide rail 220 and the fourth guide rail 320 are not lower than the tank surface of the process tank 400.
Furthermore, a second sliding slot is formed in the third guide rail 310 along the axial direction of the third guide rail 310, a second protrusion corresponding to the second sliding slot is arranged on the fourth guide rail 320, and the second protrusion is clamped into the second sliding slot, so that the sliding connection between the fourth guide rail 320 and the third guide rail 310 is realized.
Furthermore, a second convex rail is disposed on a side of the fourth guide rail 320 far from the third guide rail 310, a second groove corresponding to the second convex rail is disposed on a side of the power portion 330, the second groove is sleeved outside the second convex rail, so that the power portion 330 is slidably connected to the fourth guide rail 320, and a side of the power portion 330 far from the fourth guide rail 320 is connected to the clamping jaw structure 340.
In an embodiment of the present invention, the length of the first slide card slot may be less than or equal to the length of the first guide rail 210, and the length of the second slide card slot may be less than or equal to the length of the third guide rail 310. The first rail may have a length less than or equal to the length of the second rail 220 and the second rail may have a length less than or equal to the length of the fourth rail 320.
Further, the power part 330 includes a first power part 331, a rotating structure 332 and a second power part 333, wherein one side of the first power part 331 is provided with a second groove corresponding to the second protruding rail, and the second groove is sleeved outside the second protruding rail. One side of the first power portion 331, which is away from the fourth rail 320, is movably connected to the rotating structure 332, and a power structure is disposed in the first power portion 331, and the power structure is movably connected to one side of the rotating structure 332 and can control the rotating structure 332 to rotate. The second power part 333 is connected to a side of the rotating structure 332 far from the first power part 331 at a side thereof, and is rotatable with the rotation of the rotating structure 332 to adjust an angle thereof on a plane perpendicular to the rotating structure 332.
As an embodiment, the jaw structure 340 includes a first clamping arm 341 and a second clamping arm 342, one end of the first clamping arm 341 and the second clamping arm 342 is disposed on a side of the second power portion 333 away from the rotating structure 332, and can rotate with the rotation of the second power portion 333 to adjust an angle of the first clamping arm 341 and the second clamping arm 342 on a plane perpendicular to the rotating structure 332. The second power mechanism is used for adjusting the opening and closing angles of the first clamping arm 341 and the second clamping arm 342 to control the clamping of the clamping jaw structure 340 or the dropping of the wafer 500.
In the embodiment of the present invention, the first and second power parts 331 and 333 may be cylinders or motors.
Referring to fig. 6, fig. 6 is a flowchart illustrating a method for transferring a wafer 500 according to an embodiment of the invention. In the embodiment of the present invention, the method for transferring the wafer 500 may be applied to the apparatus for transferring the wafer 500 described in fig. 1. A method for transferring a wafer 500 according to an embodiment of the invention is described in detail below with reference to fig. 6. The method of transferring the wafer 500 includes the following steps.
Step S100: the wafer 500 is grabbed by the grabbing structure 200, and the wafer 500 is transferred to a predetermined position.
Step S200: the wafer 500 is picked up from the grabbing structure 200 by the overturning structure 300, and the angle of the wafer 500 is adjusted to make the angle of the wafer 500 consistent with the angle of the process tank 400.
Step S300: the flip structure 300 places the wafer 500 into the process tank 400.
As an embodiment, step S100 includes five substeps, step S110 to step S150. Referring to fig. 7, fig. 7 shows a flowchart of step S100. The following describes steps S110 to S150 in detail with reference to fig. 7.
Step S110: the second rail 220 slides on the first rail 210 to move the jaw structure 240 connected to the second rail 220 in a horizontal direction.
Step S120: when the finger 240 moves to a predetermined distance from the wafer 500, the connecting arm 230 slides along the second rail 220 to move the finger 240 in a vertical direction.
Step S130: when the center of the claw portion 242 and the center of the wafer 500 are on the same horizontal line, the connecting arm 230 stops moving in the vertical direction, and the wafer 500 is located at the center of the claw portion 242 by sliding the second guide rail 220 on the first guide rail 210 toward the horizontal direction close to the wafer 500 by a set distance.
Step S140: the connecting arm 230 slides along the second rail 220 to lift the latch structure 240 in a vertical direction, so that the wafer 500 falls into the slot.
Step S150: the wafer 500 is chucked by the chuck and moved in a vertical direction as the connecting arm 230 slides along the second guide rail 220, and moved in a horizontal direction as the second guide rail 220 slides on the first guide rail 210, so that the wafer 500 is transferred to a predetermined position.
In the embodiment of the present invention, the step S100 may be, but is not limited to, clamping and transporting the wafer 500 in the vertical direction.
In the embodiment of the present invention, step S200 includes six substeps, step S210 to step S260. Referring to fig. 8, fig. 8 shows a flowchart of step S200. The following describes steps S210 to S260 in detail with reference to fig. 8.
Step S210: the fourth rail 320 slides on the third rail 310 to move the clamping jaw structure 340 in the horizontal direction to the set position.
Step S220: the power part 330 slides on the fourth guide rail 320 to drive the clamping jaw structure 340 to move in the vertical direction to reach the preset position.
In the embodiment of the present invention, the sequence of step S210, step S220 and step S100 may be that the operation of step S210 and step S220 is performed first, and then the operation of step S100 is performed, or that the operation of step S100 is performed first, then the operation of step S210 and step S220 is performed, or that the operation of step S100, step S210 and step S220 is performed simultaneously. Specifically, step S210, step S220, step S100; step S100, step S210, step S220; or step S110, step S120, step S210, step S220, step S130, step S140, step S150; and so on.
Step S230: the angle and the length of the clamping jaw structure 340 are adjusted by the power part 330, so that the clamping jaw structure 340 can clamp the wafer 500 from the clamping groove.
Step S240: the power unit 330 slides on the fourth guide rail 320 to drive the clamping jaw structure 340 and the wafer 500 to move to a predetermined position in the vertical direction.
Step S250: the fourth rail 320 slides on the third rail 310 to move the clamping jaw structure 340 and the wafer 500 in the horizontal direction above the process tank 400.
Step S260: the angle of the jaw structure 340 is adjusted by the power portion 330 so that the angle of the wafer 500 on the jaw structure 340 coincides with the angle of the process tank 400.
In the embodiment of the present invention, as an implementation manner, the step S300 may specifically be: the power portion 330 adjusts the angle of the clamping jaw structure 340 to release the wafer 500, so that the wafer 500 falls into the process tank 400.
In summary, the method and the device for transmitting the wafer according to the embodiments of the present invention provided in the embodiments of the present invention grab the wafer through the grabbing structure, transmit the wafer to the preset position, grab the wafer from the grabbing structure through the turning structure, and adjust the angle of the wafer, so that the angle of the wafer is the same as the angle of the process groove, and the turning structure puts the wafer into the process groove, thereby realizing transmission of the wafer in the process grooves with different directions and angles. The method has high transmission productivity to the wafer. Through will snatching structure and flip structure and set up respectively in the top of technology groove both sides, the distance of third guide rail and first guide rail can be the width in technology groove, jack catch structure and clamping jaw structure can stretch to the technology inslot and snatch and place the wafer, avoided transmitting the impurity granule that the wafer device produced in the course of the work to drop on the wafer on the one hand, the protection wafer does not receive the pollution, on the other hand snatchs structure and flip structure and can slide, and can be greater than or equal to the length in technology groove along the length of gliding third guide rail and first guide rail, the length of first slide clamping groove can be less than or equal to the length of first guide rail, the length of second slide clamping groove can be less than or equal to the length of third guide rail. The length of the first raised rail may be less than or equal to the length of the second guide rail, and the length of the second raised rail may be less than or equal to the length of the fourth guide rail. The grabbing structure and the overturning structure are not exposed above the cleaning tank for a long time and are not corroded by corrosive chemical liquid in the cleaning tank, the structure of the wafer transmission device is protected, and the wafer transmission device is durable and high in reliability. When the clamping jaw structure or/and the angle and the direction of the wafer are adjusted in the process of transmitting the wafer, the method and the device for transmitting the wafer reduce the overturning diameter, save the internal space of equipment and improve the efficiency by only adjusting the angle and the direction of the clamping jaw structure compared with the reversal process in the prior art by taking the top end of the gas jaw as a rotation center.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A method for transferring a wafer, the method comprising:
grabbing the wafer through the grabbing structure, and transmitting the wafer to a preset position;
clamping the wafer from the grabbing structure through the overturning structure, and adjusting the angle of the wafer to enable the angle of the wafer to be consistent with that of the process groove;
the overturning structure places the wafer into a process tank;
the overturning structure comprises a third guide rail, a fourth guide rail, a power part and a clamping jaw structure; the third guide rail is horizontally arranged, is parallel to and opposite to the grabbing structure, and has a distance within a set range; the fourth guide rail is connected with the third guide rail, is perpendicular to the third guide rail and can move along the axial direction of the third guide rail; one side of the power part is connected with the fourth guide rail and can move along the axial direction of the fourth guide rail; one side of the power part, which is far away from the fourth guide rail, is connected with the clamping jaw structure and used for adjusting the angle of the clamping jaw structure, so that the clamping jaw structure can clamp a wafer.
2. The method of claim 1, wherein the grasping mechanism comprises a first rail, a second rail, a connecting arm, and a pawl mechanism; the first guide rail is horizontally arranged; the second guide rail is connected with the first guide rail, is vertical to the first guide rail and can axially move along the first guide rail; one end of the connecting arm is connected with the second guide rail and can move along the axial direction of the second guide rail; one end, far away from the second guide rail, of the connecting arm is connected with the claw structure; the clamping jaw structure comprises a clamping jaw part and a clamping groove, the clamping jaw part is of an arc-shaped structure, and the clamping groove is arranged at the opening position of the clamping jaw part;
snatch the wafer through snatching the structure, transmit the wafer to the step of preset position, include:
the second guide rail slides on the first guide rail so as to drive the claw structure connected with the second guide rail to move in the horizontal direction;
when the distance between the claw structure and the wafer reaches a set distance, the connecting arm slides along the second guide rail so as to drive the claw structure to move in the vertical direction;
when the center of the claw part and the center of the wafer are on the same horizontal line, the connecting arm stops moving in the vertical direction, and the wafer is located at the center of the claw part by sliding a set distance towards the horizontal direction close to the wafer on the first guide rail through the second guide rail;
the connecting arm slides along the second guide rail so as to drive the clamping claw structure to ascend in the vertical direction, and the wafer falls into the clamping groove;
the wafer is clamped by the clamping groove clamping claw and moves in the vertical direction along with the sliding of the connecting arm on the second guide rail, and moves in the horizontal direction along with the sliding of the second guide rail on the first guide rail, so that the wafer is transmitted to a preset position.
3. The method of claim 2, wherein the wafer is transferred from the wafer transfer apparatus,
through flip structure from grabbing structural clamp and getting out the wafer to the angle of adjustment wafer makes the angle of wafer and the unanimous step of the angle in technology groove, includes:
the fourth guide rail slides on the third guide rail so as to drive the clamping jaw structure to move in the horizontal direction to reach a set position;
the power part slides on the fourth guide rail so as to drive the clamping jaw structure to move in the vertical direction to reach the preset position;
the angle and the length of the clamping jaw structure are adjusted through the power part, so that the clamping jaw structure can clamp a wafer from the clamping groove;
the power part slides on the fourth guide rail so as to drive the clamping jaw structure and the wafer to move to a set position in the vertical direction;
the fourth guide rail slides on the third guide rail so as to drive the clamping jaw structure and the wafer to move above the process groove in the horizontal direction;
the angle of the clamping jaw structure is adjusted through the power part, so that the angle of the wafer on the clamping jaw structure is consistent with the angle of the process groove.
4. The method as claimed in claim 3, wherein the step of placing the wafer into the process tank by the flip structure comprises:
the power part adjusts the included angle of the clamping jaw structure, and loosens the wafer, so that the wafer falls into the process groove.
5. The wafer conveying device is characterized by comprising a grabbing structure and a turning structure;
the grabbing structure and the overturning structure are oppositely arranged, the grabbing structure and the overturning structure are on the same plane, and the distance between the grabbing structure and the overturning structure is within a set range, so that the grabbing structure and the overturning structure can be matched with each other to transmit wafers;
the overturning structure comprises a third guide rail, a fourth guide rail, a power part and a clamping jaw structure;
the third guide rail is horizontally arranged, is parallel to and opposite to the grabbing structure, and has a distance within a set range;
the fourth guide rail is connected with the third guide rail, is perpendicular to the third guide rail and can move along the axial direction of the third guide rail;
one side of the power part is connected with the fourth guide rail and can move along the axial direction of the fourth guide rail;
one side of the power part, which is far away from the fourth guide rail, is connected with the clamping jaw structure and used for adjusting the angle of the clamping jaw structure, so that the clamping jaw structure can clamp a wafer.
6. The wafer conveying device as claimed in claim 5, wherein the grabbing structure comprises a first guide rail, a second guide rail, a connecting arm and a claw structure;
the first guide rail is horizontally arranged;
the second guide rail is connected with the first guide rail, is vertical to the first guide rail and can axially move along the first guide rail;
one end of the connecting arm is connected with the second guide rail and can move along the axial direction of the second guide rail;
and one end of the connecting arm, which is far away from the second guide rail, is connected with the claw structure.
7. The wafer conveying device as claimed in claim 6, wherein the first guide rail is provided with a first sliding slot along an axial direction of the first guide rail;
a first bump corresponding to the first sliding clamping groove is arranged on the second guide rail;
the first bump is clamped into the first sliding clamping groove, so that the sliding connection between the second guide rail and the first guide rail is realized;
a first convex rail is arranged on one side, away from the first guide rail, of the second guide rail;
one end of the connecting arm is provided with a first groove corresponding to the first convex rail;
the first groove is sleeved outside the first convex rail, so that the connecting arm is connected with the second guide rail in a sliding manner;
the clamping jaw structure comprises a connecting part, a clamping jaw part and a clamping groove;
the clamping claw part is of an arc-shaped structure, the clamping groove is arranged at the opening position of the clamping claw part, and the clamping groove is used for clamping a wafer to prevent the wafer from falling off;
one side of the clamping claw part, which is far away from the clamping groove, is connected with the connecting part;
the connecting part is connected with one end, far away from the second guide rail, of the connecting arm.
8. The wafer conveying device of claim 7, wherein the third guide rail is provided with a second sliding slot along an axial direction of the third guide rail;
a second bump corresponding to the second sliding clamping groove is arranged on the fourth guide rail;
the second bump is clamped into the second sliding clamping groove, so that the sliding connection between the fourth guide rail and the third guide rail is realized;
a second convex rail is arranged on one side, away from the third guide rail, of the fourth guide rail;
a second groove corresponding to the second convex rail is formed in one side of the power part;
the second groove is sleeved outside the second convex rail, so that the power part is connected with the fourth guide rail in a sliding manner;
one side of the power part, which is far away from the fourth guide rail, is connected with the clamping jaw structure.
9. The wafer transfer device of claim 8, wherein the power portion comprises a first power portion, a rotating structure and a second power portion;
a second groove corresponding to the second convex rail is formed in one side of the first power part, and the second groove is sleeved outside the second convex rail;
one side of the first power part far away from the fourth guide rail is movably connected with the rotating structure,
a power structure is arranged in the first power part, and the power structure is movably connected with one side of the rotating structure and can control the rotating structure to rotate;
one side of the second power part is connected with one side of the rotating structure far away from the first power part, and can rotate along with the rotation of the rotating structure to adjust the angle of the rotating structure on a plane vertical to the rotating structure;
the clamping jaw structure comprises a first clamping arm and a second clamping arm;
one ends of the first clamping arm and the second clamping arm are arranged on one side of the second power part far away from the rotating structure, and can rotate along with the rotation of the second power part so as to adjust the angle of the first clamping arm and the second clamping arm on a plane perpendicular to the rotating structure;
the second power structure is used for adjusting the opening and closing angles of the first clamping arm and the second clamping arm so as to control the clamping jaw structure to clamp or put down the wafer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711444773.9A CN108198770B (en) | 2017-12-27 | 2017-12-27 | Method and device for transmitting wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711444773.9A CN108198770B (en) | 2017-12-27 | 2017-12-27 | Method and device for transmitting wafer |
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| CN108198770A CN108198770A (en) | 2018-06-22 |
| CN108198770B true CN108198770B (en) | 2020-04-28 |
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| CN201711444773.9A Active CN108198770B (en) | 2017-12-27 | 2017-12-27 | Method and device for transmitting wafer |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020078190A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus, and wafer transfer manipulator and wafer overturn method for same |
| CN113113339B (en) * | 2019-09-06 | 2024-04-05 | 杭州众硅电子科技有限公司 | Wafer transmission manipulator |
| CN111403322B (en) * | 2020-04-24 | 2022-04-15 | 江苏芯梦半导体设备有限公司 | Wafer stripping device |
| CN112614802B (en) * | 2021-03-08 | 2021-07-06 | 杭州众硅电子科技有限公司 | Manipulator and method for transporting wafer by CMP (chemical mechanical polishing) cleaning unit |
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| EP0700075A2 (en) * | 1994-08-31 | 1996-03-06 | JENOPTIK Technologie GmbH | Device for transferring a transport object between two end positions |
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| CN108198770A (en) | 2018-06-22 |
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