CN108176670B - Ultrasonic treatment equipment in DMOS wafer processing process - Google Patents
Ultrasonic treatment equipment in DMOS wafer processing process Download PDFInfo
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- CN108176670B CN108176670B CN201711452668.XA CN201711452668A CN108176670B CN 108176670 B CN108176670 B CN 108176670B CN 201711452668 A CN201711452668 A CN 201711452668A CN 108176670 B CN108176670 B CN 108176670B
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- connecting rod
- filter screen
- wafer
- rod pieces
- ultrasonic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Abstract
The invention discloses ultrasonic treatment equipment in a DMOS wafer processing process, which comprises an ultrasonic cavity for ultrasonic treatment and a transmission rail, wherein a plurality of first connecting rod pieces extending along the radial direction of the transmission rail are arranged in the transmission rail, and a placement device is arranged on each first connecting rod piece; the mounting device comprises two second connecting rod pieces which extend perpendicular to the first connecting rod pieces, supporting rod pieces are arranged at the end parts of the second connecting rod pieces, and a filter screen is arranged between every two adjacent supporting rod pieces; by adopting the technical scheme, the wafer is arranged through the filter screen, so that the contact area between the wafer and the cleaning solution in the ultrasonic cavity can be obviously increased, and meanwhile, the wafer is further prevented from falling through the flexible support of the filter screen; in addition, the moving direction of the first transmission rail can improve the cleaning time of the wafer in the cleaning liquid, thereby improving the cleaning effect.
Description
Technical Field
The invention relates to semiconductor production equipment, in particular to ultrasonic treatment equipment in a DMOS wafer processing process.
Background
After the DMOS wafer is processed by the etching solution, the DMOS wafer needs to be cleaned to remove the residual etching solution on the wafer surface. The existing DMOS wafer cleaning process mostly adopts the mode that DMOS wafers are placed into an ultrasonic cavity in batches to be subjected to ultrasonic cleaning; the process requires personnel to place and take out the DMOS wafer, thereby reducing the work efficiency.
Disclosure of Invention
The invention aims to provide ultrasonic treatment equipment in a DMOS wafer processing process, which can obviously improve the cleaning effect of a wafer.
In order to solve the technical problem, the invention relates to ultrasonic treatment equipment in a DMOS wafer processing process, which comprises an ultrasonic cavity for ultrasonic treatment and a transmission rail extending into the ultrasonic cavity, wherein an ultrasonic generator and an ultrasonic transducer are arranged in the ultrasonic cavity; the conveying track comprises a first conveying track extending along the vertical direction, a plurality of first connecting rod pieces extending along the radial direction of the first conveying track are arranged in the first conveying track, and an accommodating device is arranged on each first connecting rod piece; the mounting device comprises two second connecting rod pieces which extend perpendicular to the first connecting rod pieces, connecting holes are formed in the end parts, on the side of the first connecting rod pieces, of the second connecting rod pieces, and the first connecting rod pieces extend inside the connecting holes; the end part of the second connecting rod piece, which deviates from the side of the first connecting rod piece, is provided with a supporting rod piece which extends perpendicular to the second connecting rod piece, a filter screen is arranged between the supporting rod pieces at the end parts of the two adjacent second connecting rod pieces, and the width of the filter screen is greater than the distance between the two supporting rod pieces.
As an improvement of the present invention, the conveying track includes a second conveying track, which is disposed at a side end portion of the first conveying track and extends toward a direction of the first conveying track; the height of the second transfer rail is gradually reduced along the moving direction thereof. By adopting the design, the ultrasonic cavity and the rest process cavities can be connected through the second transmission rail, and the wafer can slide down after being transmitted by the second transmission rail in the moving direction; meanwhile, the synchronous control of the first transmission rail and the second transmission rail can enable the wafers moving from the first transmission rail to fall into the placing device on the second transmission rail, so that the whole equipment can automatically move, and the efficiency of the equipment is obviously improved.
As an improvement of the present invention, in the installing device, an auxiliary support rod is arranged at the midpoint of each second connecting rod, and auxiliary filter screens are arranged on the auxiliary support rod supports on two adjacent second support rods. Adopt above-mentioned design, the setting of its accessible auxiliary stay member and supplementary filter screen for the disk is located between filter screen and the supplementary filter screen, thereby makes the disk add man-hour in the ultrasonic cavity, and the accessible is assisted the filter screen and is pushed down its and handle, in order to avoid the disk to drop because of buoyancy and settle the device.
According to the ultrasonic treatment equipment in the DMOS wafer processing process, the wafer can be placed on the filter screen of the placement device, and the first transmission rail extending in the vertical direction drives the placement device and the wafer to enter the ultrasonic cavity for ultrasonic cleaning; in the transmission process of the first transmission rail, the second connecting rod piece and the filter screen are kept to extend in the vertical direction all the time under the action of gravity, so that the wafer is prevented from falling off, meanwhile, the contact area between the wafer and the cleaning solution in the ultrasonic cavity can be obviously increased by arranging the wafer through the filter screen, and meanwhile, the wafer is further prevented from falling off through flexible support of the filter screen; in addition, the moving direction of the first transmission rail can improve the cleaning time of the wafer in the cleaning liquid, thereby improving the cleaning effect.
Drawings
FIG. 1 is a schematic view of the present invention (the placement device is not shown);
FIG. 2 is a schematic view of a mounting device according to the present invention;
list of reference numerals:
1-ultrasonic cavity, 2-ultrasonic generator, 3-ultrasonic transducer, 4-first transmission orbit, 5-first connecting rod piece, 6-second connecting rod piece, 7-connecting hole, 8-supporting rod piece, 9-filter screen, 10-second transmission orbit, 11-auxiliary supporting rod piece, 12-auxiliary filter screen.
Detailed Description
The present invention will be further illustrated below with reference to specific embodiments, which are to be understood as merely illustrative and not limitative of the scope of the present invention.
Example 1
Fig. 1 and 2 show an ultrasonic treatment apparatus in a DMOS wafer processing process, which includes an ultrasonic chamber 1 for ultrasonic treatment, and a transmission rail extending into the ultrasonic chamber 1, wherein an ultrasonic generator 2 and an ultrasonic transducer 3 are disposed in the ultrasonic chamber 1; the conveying track comprises a first conveying track 4 extending along the vertical direction, a plurality of first connecting rod pieces 5 extending along the radial direction of the first conveying track 4 are arranged in the first conveying track 4, and an arranging device is arranged on each first connecting rod piece 5; the mounting device comprises two second connecting rod pieces 6 which extend perpendicular to the first connecting rod pieces 5, connecting holes 7 are formed in the end parts, on the side of the first connecting rod pieces 5, of the second connecting rod pieces 6, and the first connecting rod pieces 5 extend inside the connecting holes 7; the tip that the member 6 deviates from the first connecting rod 5 side is connected to the second is provided with the perpendicular to second and connects member 6 and carry out the support member 8 that extends, is provided with filter screen 9 between 6 tip support members 8 of two adjacent second connecting rods, and the width of filter screen 9 is greater than the distance between two spinal branch vaulting pole 8.
As a modification of the present invention, the transfer rail includes a second transfer rail 10 which is provided at a side end portion of the first transfer rail 4 and extends toward the first transfer rail 4; the height of the second transfer rail 10 is gradually reduced along the moving direction thereof. By adopting the design, the ultrasonic cavity and the rest process cavities can be connected through the second transmission rail, and the wafer can slide down after being transmitted by the second transmission rail in the moving direction; meanwhile, the synchronous control of the first transmission rail and the second transmission rail can enable the wafers moving from the first transmission rail to fall into the placing device on the second transmission rail, so that the whole equipment can automatically move, and the efficiency of the equipment is obviously improved.
According to the ultrasonic treatment equipment in the DMOS wafer processing process, the wafer can be placed on the filter screen of the placement device, and the first transmission rail extending in the vertical direction drives the placement device and the wafer to enter the ultrasonic cavity for ultrasonic cleaning; in the transmission process of the first transmission rail, the second connecting rod piece and the filter screen are kept to extend in the vertical direction all the time under the action of gravity, so that the wafer is prevented from falling off, meanwhile, the contact area between the wafer and the cleaning solution in the ultrasonic cavity can be obviously increased by arranging the wafer through the filter screen, and meanwhile, the wafer is further prevented from falling off through flexible support of the filter screen; in addition, the moving direction of the first transmission rail can improve the cleaning time of the wafer in the cleaning liquid, thereby improving the cleaning effect.
Example 2
As a modification of the present invention, in the installation device, an auxiliary support rod 11 is disposed at a midpoint position of each second connection rod 6, and an auxiliary filter screen 12 is disposed at a support of the auxiliary support rods 11 on two adjacent second support rods 6. Adopt above-mentioned design, the setting of its accessible auxiliary stay member and supplementary filter screen for the disk is located between filter screen and the supplementary filter screen, thereby makes the disk add man-hour in the ultrasonic cavity, and the accessible is assisted the filter screen and is pushed down its and handle, in order to avoid the disk to drop because of buoyancy and settle the device.
The remaining features and advantages of this embodiment are the same as those of embodiment 1.
Claims (1)
1. An ultrasonic treatment device in a DMOS wafer processing process comprises an ultrasonic cavity and a transmission rail; an ultrasonic generator and an ultrasonic transducer are arranged in the ultrasonic cavity;
the device is characterized in that the transmission track also comprises a first transmission track, a first connecting rod piece extending along the radial direction of the first transmission track is arranged in the first transmission track, and a placement device is arranged on the first connecting rod piece;
the mounting device comprises two second connecting rod pieces which extend perpendicular to the first connecting rod pieces, connecting holes are formed in the end parts, on the side of the first connecting rod pieces, of the second connecting rod pieces, and the first connecting rod pieces extend inside the connecting holes;
the end part of the second connecting rod piece, which is far away from the side of the first connecting rod piece, is provided with a supporting rod piece which extends perpendicular to the second connecting rod piece, and a filter screen is arranged between the supporting rod pieces at the end parts of two adjacent second connecting rod pieces;
the conveying track also comprises a second conveying track which is arranged at the side end part of the first conveying track and extends towards the direction of the first conveying track; the height of the second transmission track is gradually reduced along the movement direction of the second transmission track;
in the arranging device, an auxiliary support rod piece is arranged at the midpoint of each second connecting rod piece, and auxiliary filter screens are arranged on the auxiliary support rod piece supports on two adjacent second connecting rod pieces;
through the arrangement of the auxiliary support rod piece and the auxiliary filter screen, a wafer is positioned between the filter screen and the auxiliary filter screen, so that when the wafer is processed in the ultrasonic cavity, the wafer is pressed down through the auxiliary filter screen, and the wafer is prevented from falling off the placement device due to buoyancy;
the filter screen is flexible filter screen, in the transmission of first transmission track, the member is connected to the second and the filter screen remains throughout to extend in vertical direction under the action of gravity to avoid dropping of disk, meanwhile, through the filter screen is settled the disk and is made the disk with the area of contact of cleaning solution in the ultrasonic cavity can show the increase, passes through simultaneously the flexible support of filter screen further avoids dropping of disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711452668.XA CN108176670B (en) | 2015-11-20 | 2015-11-20 | Ultrasonic treatment equipment in DMOS wafer processing process |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711452668.XA CN108176670B (en) | 2015-11-20 | 2015-11-20 | Ultrasonic treatment equipment in DMOS wafer processing process |
| CN201510806223.1A CN105312276B (en) | 2015-11-20 | 2015-11-20 | Ultrasonic processing equipment in DMOS disk process |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510806223.1A Division CN105312276B (en) | 2015-11-20 | 2015-11-20 | Ultrasonic processing equipment in DMOS disk process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108176670A CN108176670A (en) | 2018-06-19 |
| CN108176670B true CN108176670B (en) | 2021-05-25 |
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| CN201711452668.XA Active CN108176670B (en) | 2015-11-20 | 2015-11-20 | Ultrasonic treatment equipment in DMOS wafer processing process |
| CN201510806223.1A Active CN105312276B (en) | 2015-11-20 | 2015-11-20 | Ultrasonic processing equipment in DMOS disk process |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510806223.1A Active CN105312276B (en) | 2015-11-20 | 2015-11-20 | Ultrasonic processing equipment in DMOS disk process |
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| CN (2) | CN108176670B (en) |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW348162B (en) * | 1996-09-30 | 1998-12-21 | Murada Kikai Kk | Work carrying system |
| JPH10323635A (en) * | 1997-05-26 | 1998-12-08 | Sony Corp | Ultrasonic cleaning device |
| US6287387B1 (en) * | 1999-06-02 | 2001-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd | Apparatus and method for locking a basket in a cleaning bath |
| US6314974B1 (en) * | 1999-06-28 | 2001-11-13 | Fairchild Semiconductor Corporation | Potted transducer array with matching network in a multiple pass configuration |
| JP2005081163A (en) * | 2003-09-04 | 2005-03-31 | Arai Pump Mfg Co Ltd | Production method of carrier plate |
| CN201516431U (en) * | 2009-07-31 | 2010-06-30 | 河南固诚实业有限公司 | A card cleaning machine |
| CN201543634U (en) * | 2009-09-11 | 2010-08-11 | 常州捷佳创精密机械有限公司 | Dehydrating and lifting device of workpiece cleaning device |
| CN101700520B (en) * | 2009-12-03 | 2011-04-06 | 杭州海纳半导体有限公司 | Washing method of monocrystalline/polycrystalline silicon chips |
| CN201702135U (en) * | 2010-04-19 | 2011-01-12 | 锦州日鑫硅材料有限公司 | Ultrasonic circulation wafer washer |
| CN202346308U (en) * | 2011-10-21 | 2012-07-25 | 四川海底捞餐饮股份有限公司 | Circulating elevator |
| CN102785881B (en) * | 2011-12-26 | 2014-10-29 | 王合祥 | Automatic medicine dispensing device |
| CN202860903U (en) * | 2012-10-17 | 2013-04-10 | 如皋市大昌电子有限公司 | Automatic cleaning device for diode |
| CN203875062U (en) * | 2014-04-22 | 2014-10-15 | 苏州金牛精密机械有限公司 | Moving device for cleaning silicon wafer |
| CN203781243U (en) * | 2014-04-29 | 2014-08-20 | 马健 | Automatic football transporting and positioning machine |
| CN204294566U (en) * | 2014-12-08 | 2015-04-29 | 无锡海古德新技术有限公司 | Ceramic substrate ultrasonic cleaning rack |
| CN204657017U (en) * | 2015-05-18 | 2015-09-23 | 绍兴文理学院 | A kind of ultrasonic wave vibration Chinese torreya cleaning machine |
| CN204746973U (en) * | 2015-07-21 | 2015-11-11 | 浙江昊能光电有限公司 | Novel full -automatic ultrasonic cleaner |
| CN205236543U (en) * | 2015-11-20 | 2016-05-18 | 苏州赛森电子科技有限公司 | Ultrasonic treatment equipment of DMOS wafer process in -process |
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2015
- 2015-11-20 CN CN201711452668.XA patent/CN108176670B/en active Active
- 2015-11-20 CN CN201510806223.1A patent/CN105312276B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108176670A (en) | 2018-06-19 |
| CN105312276B (en) | 2018-01-16 |
| CN105312276A (en) | 2016-02-10 |
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