CN108141979A - 电子控制装置以及电子控制装置的制造方法 - Google Patents

电子控制装置以及电子控制装置的制造方法 Download PDF

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Publication number
CN108141979A
CN108141979A CN201680058831.1A CN201680058831A CN108141979A CN 108141979 A CN108141979 A CN 108141979A CN 201680058831 A CN201680058831 A CN 201680058831A CN 108141979 A CN108141979 A CN 108141979A
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CN
China
Prior art keywords
molded body
resin molded
control unit
electronic control
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201680058831.1A
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English (en)
Other versions
CN108141979B (zh
Inventor
荒井聪
崎川幸夫
角田重晴
鸭志田胜
大内四郎
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of CN108141979A publication Critical patent/CN108141979A/zh
Application granted granted Critical
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Active legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/065Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • B29C65/1654Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B29C65/1661Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined scanning repeatedly, e.g. quasi-simultaneous laser welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/44Joining a heated non plastics element to a plastics element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/82Testing the joint
    • B29C65/8207Testing the joint by mechanical methods
    • B29C65/8223Peel tests
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/02Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024Thermal pre-treatments
    • B29C66/0246Cutting or perforating, e.g. burning away by using a laser or using hot air
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/02Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/026Chemical pre-treatments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/02Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114Single butt joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124Tongue and groove joints
    • B29C66/1246Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12469Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being asymmetric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124Tongue and groove joints
    • B29C66/1248Interpenetrating groove joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/128Stepped joint cross-sections
    • B29C66/1282Stepped joint cross-sections comprising at least one overlap joint-segment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
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    • B29C66/128Stepped joint cross-sections
    • B29C66/1282Stepped joint cross-sections comprising at least one overlap joint-segment
    • B29C66/12821Stepped joint cross-sections comprising at least one overlap joint-segment comprising at least two overlap joint-segments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/128Stepped joint cross-sections
    • B29C66/1282Stepped joint cross-sections comprising at least one overlap joint-segment
    • B29C66/12821Stepped joint cross-sections comprising at least one overlap joint-segment comprising at least two overlap joint-segments
    • B29C66/12822Stepped joint cross-sections comprising at least one overlap joint-segment comprising at least two overlap joint-segments comprising at least three overlap joint-segments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/128Stepped joint cross-sections
    • B29C66/1284Stepped joint cross-sections comprising at least one butt joint-segment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/128Stepped joint cross-sections
    • B29C66/1284Stepped joint cross-sections comprising at least one butt joint-segment
    • B29C66/12841Stepped joint cross-sections comprising at least one butt joint-segment comprising at least two butt joint-segments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/20Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/23Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being multiple and parallel or being in the form of tessellations
    • B29C66/232Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being multiple and parallel or being in the form of tessellations said joint lines being multiple and parallel, i.e. the joint being formed by several parallel joint lines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/20Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/242Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
    • B29C66/2424Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
    • B29C66/24243Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
    • B29C66/24244Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/20Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/244Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being non-straight, e.g. forming non-closed contours
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/302Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/303Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/32Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/322Providing cavities in the joined article to collect the burr
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/32Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/326Shaping the burr, e.g. by the joining tool
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/345Progressively making the joint, e.g. starting from the middle
    • B29C66/3452Making complete joints by combining partial joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43Joining a relatively small portion of the surface of said articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/50General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534Joining single elements to open ends of tubular or hollow articles or to the ends of bars
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0017Casings, cabinets or drawers for electric apparatus with operator interface units
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
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    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/00Constructional details common to different types of electric apparatus
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    • B29C66/81General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8122General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/81General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81265Surface properties, e.g. surface roughness or rugosity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/81General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266Optical properties, e.g. transparency, reflectivity
    • B29C66/81267Transparent to electromagnetic radiation, e.g. to visible light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91941Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
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    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
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    • B29C66/91921Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91941Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined
    • B29C66/91943Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined higher than said glass transition temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B29K2701/00Use of unspecified macromolecular compounds for preformed parts, e.g. for inserts
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    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481Housings or casings incorporating or embedding electric or electronic elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K5/0247Electrical details of casings, e.g. terminals, passages for cables or wiring

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Abstract

电子控制装置是具备树脂成形体、金属体以及电子构件的电子控制装置,其中,树脂成形体与金属体的主面接合,与金属体的主面连续的侧面中的至少一部分与设置于树脂成形体的侧方接触部接触。

Description

电子控制装置以及电子控制装置的制造方法
技术领域
本发明涉及电子控制装置以及电子控制装置的制造方法。
背景技术
已知如下树脂成形体与金属体的复合体的制造方法:将树脂成形体与金属体重叠,从金属体侧照射激光,使树脂成形体中的至少一部分软化以及/或者熔融从而接合(参照专利文献1)。
现有技术文献
专利文献
专利文献1:日本特开2010-76437号公报
发明内容
本发明者们进行了专心研究,结果发现了以下的课题。
在将树脂成形体与金属体在一个面重叠地接合而成的接合构造体被放置在盐害环境下的情况下,金属体因盐害而腐蚀,在树脂成形体与金属体的接合部形成间隙,在该部分生成间隙腐蚀所致的腐蚀物。在间隙生成的腐蚀物随着时间的经过而生长,树脂成形体与金属体的间隙扩大,并且产生要使树脂成形体从金属体剥离的力(剥离力),从而树脂成形体与金属体有可能会分离。
根据本发明的第1方案,在具备树脂成形体、金属体以及电子构件的电子控制装置中,树脂成形体与金属体的主面接合,与金属体的主面连续的侧面的至少一部分与设置于树脂成形体的侧方接触部接触。
根据本发明的第2方案,在具备树脂成形体、金属体以及电子构件的电子控制装置的制造方法中,将电子构件配置于由树脂成形体和金属体划分成的收容空间,在使树脂成形体与金属体的主面相互按压接触的状态下,对与主面相反一侧的面照射激光,利用由激光产生的热使树脂成形体变形,使树脂成形体的变形部接触于与金属体的主面连续的侧面的一部分。
根据本发明,在树脂成形体与金属体接合而成的接合构造体放置在盐害环境下的情况下,能够抑制树脂成形体与金属体分离。
附图说明
图1是示出电子控制装置的概略的立体图。
图2是示出电子控制装置的概略的分解立体图。
图3是电子控制装置的功能框图。
图4是说明将树脂片与金属片进行激光接合的情形的图。
图5是示出树脂片从金属片剥离的过程的示意图。
图6是用于说明制造电子控制装置的工序的流程图。
图7是说明结晶性树脂和非结晶性树脂的选定方法的图。
图8是示意地示出在由按压工具将金属基体按压到树脂成形体的状态下使激光扫描的顺序的立体图。
图9是说明第1实施方式的接合方法的剖视示意图。
图10的(a)以及(b)是说明第2实施方式的接合方法的剖视示意图,(c)是说明第2实施方式的变形例的接合方法的剖视示意图。
图11是说明第3实施方式的接合方法的剖视示意图。
图12是说明第3实施方式的变形例1以及变形例2的接合方法的剖视示意图。
图13的(a)是说明第3实施方式的变形例3的接合方法的剖视示意图,(b)是第3实施方式的变形例3的金属基体4的俯视示意图,(c)是说明第3实施方式的变形例4的接合方法的剖视示意图。
图14是说明第4实施方式的接合方法的剖视示意图。
图15的(a)是说明第5实施方式的接合方法的剖视示意图,(b)是说明第5实施方式的变形例的接合方法的剖视示意图。
(附图标记说明)
1:树脂成形体;1a:罩;1b:连接器;1c:凹部;1d:树脂接合面;4:金属基体;4a:连接部;4d:金属接合面;5:电路基板;6:电子构件;7:冷却翅片;10:激光;11:激光照射面;11a:激光接合部;21c:外侧毛边;22c:内侧毛边;31:夹具;31s:侧方限制部;31u:上方限制部;100:电子控制装置;101:主面;101a:顶部主面;101b:外侧主面;101c:内侧主面;111:外侧侧面;112:内侧侧面;140:激光照射痕;190:按压工具;204:输入输出端口;205:输入电路;206:点火输出电路;207:喷射阀驱动电路;208:火花塞;209:燃料喷射阀;221:突起部;231:封闭部;311:外侧侧面;312:内侧侧面;331:第1突出部;332:第2突出部;341:延伸部;390:按压工具;421:突起部;423c:中间毛边;441:突起部;442:槽;521c:外侧毛边;522c:内侧毛边;551:第3突出部;558:外周面;561:槽;561S:空间部。
具体实施方式
以下,参照附图,说明本发明的实施方式。
-第1实施方式-
图1是示出本发明的一个实施方式的电子控制装置100的概略的立体图,图2是示出电子控制装置100的概略的分解立体图。本实施方式的电子控制装置100搭载于汽车,是对引擎进行电子控制的引擎控制器单元(ECU)。如图2所示,电子控制装置100具备引擎控制用的电路基板5、树脂成形体1以及金属基体4。
树脂成形体1具备覆盖配置于金属基体4上的电路基板5的罩1a、以及用于进行电路基板5与外部的设备(各种传感器、致动器等)的信号的交换的连接器1b。树脂成形体1由含有热可塑性的结晶性树脂以及热可塑性的非结晶性树脂并被合金化的热可塑性树脂组成物即聚合物合金构成,该树脂成形体1是通过注射成型将罩1a与连接器1b一体成形的一体成形体。
与电路基板5电连接的端子销(未图示)被嵌入成型到连接器1b,端子销(未图示)由连接器1b保持。电路基板5被配置的凹部1c设置于罩1a。罩1a的凹部1c的开口边缘部为与金属基体4的缘部(外周部)相接的接合面(以下,记载为树脂接合面1d),形成为平坦的面。
金属基体4以封堵罩1a的凹部1c的方式与树脂成形体1激光接合,从而凹部1c的开口被金属基体4封堵,由凹部1c和金属基体4划分出收容电路基板5的收容空间。引擎控制用的多个电子构件6安装于电路基板5,形成预定的布线图案,从而构成电路部。
金属基体4具有作为将由电路基板5的电子构件6产生的热散热到外部气体的散热体的功能。金属基体4由压铸铝构成,形成为矩形平板状,多个冷却翅片7相互平行地形成。作为金属基体4的材料,例如优选采用普遍使用且能够以低成本购入的JISADC12。
金属基体4的缘部(外周部)为通过后述激光接合工序而接合的连接部4a。金属基体4的连接部4a的一个面被作为与树脂成形体1的树脂接合面1d相接的接合面(以下,记载为金属接合面4d(参照图9)),形成为平坦的面。金属基体4的连接部4a的另一个面、即与金属接合面4d相反一侧的面被作为被照射激光的激光照射面11。为了均匀地进行激光照射,激光照射面11被做成平坦的面。
关于通过后述激光接合而形成的激光接合部11a(参照图1的虚线)的宽度,根据激光接合部11a中的封闭性的观点,优选确保成至少1mm以上。因此,激光照射面11的宽度被设定为如能够将激光接合部11a的宽度确保成至少1mm以上那样的大小。
关于金属基体4的连接部4a的厚度,考虑耐盐害性,优选为2~4mm左右。激光照射面11的表面粗糙度考虑制造成本来决定。通常,相比于表面粗糙度小的情况,当表面粗糙度变大时,由于基于散射的效果而反射率变小,能够减小接合所需的激光能量,所以能够实现通过在激光接合时将激光输出设定得低而实现的制造成本的低成本化、通过将激光的扫描速度设定得高而实现的制造工序的缩短化。此外,通过实施喷砂处理、基于药液的处理,能够增大金属基体4的表面粗糙度。另外,在吸收率增大的观点中,也可以不仅增大粗糙度,还实施防蚀铝处理。
优选不仅对激光照射面11,还包括金属基体4的侧面,对金属接合面4d也实施喷砂处理等。由此,能够提高与利用热熔融的树脂的紧贴性,即增加接触面积。作为金属接合面4d的平均的表面粗糙度Ra,如果仅考虑接合强度的提高,则0.1~7.0μm左右为合适范围。当金属接合面4d处的表面粗糙度Ra小于0.1μm时,接合强度的提高效果小,有可能会发生剥离,所以金属接合面4d处的表面粗糙度Ra优选为0.1μm以上。此外,即使表面粗糙度Ra小于0.1μm,通过在激光接合前实施等离子体处理,从而也能够使树脂成形体1与金属基体4接合。另外,当金属接合面4d处的表面粗糙度Ra超过7.0μm时,树脂未充分地填充于金属接合面4d的微细凹凸而接合强度下降,所以金属接合面4d处的表面粗糙度Ra优选为7.0μm以下,根据气密性的观点,更优选为5.0μm以下。
图3是电子控制装置100的功能框图。如图3所示,电路基板5具备相互总线连接的CPU201、ROM202、RAM203及输入输出端口204、输入电路205以及控制各种致动器的动作的驱动电路。
来自曲轴角传感器、水温传感器等各种传感器的检测信号经由连接器1b的端子输入到输入电路205。在驱动电路中包括在预定的定时经由连接器1b的端子将驱动控制信号输出到火花塞208的点火输出电路206、以及在预定的定时经由连接器1b的端子将驱动控制信号输出到燃料喷射阀209的喷射阀驱动电路207。
然而,在如搭载于汽车的电子控制装置100那样作用振动、冲击的电子控制装置中,重要的是长期地维持树脂成形体1与金属基体4的一定的接合强度。本发明者们对使树脂成形体1与金属基体4接合的接合构造体进行了盐害试验。
图4是说明将树脂片TPp与金属片TPm进行激光接合的情形的图。如图4所示,在盐害试验中,采用了将树脂片TPp以及金属片TPm进行了激光接合的激光接合构造体。树脂片TPp以及金属片TPm分别被做成长度为70mm、宽度为10mm、厚度为2mm的矩形平板状。
在激光接合时,将树脂片TPp与金属片TPm在20mm见方的区域进行重叠,从外侧施加压力以使相互按压接触。在树脂片TPp与金属片TPm相互按压接触的状态下,将激光10照射到金属片TPm,将树脂片TPp与金属片TPm进行激光接合。树脂片TPp与金属片TPm在一个平面上接合。作为激光器装置,使用了半导体激光器装置。
在盐害试验中,重复进行将盐水喷雾到试验片的工序、使试验片干燥的干燥工序以及湿润工序等。当观察树脂片TPp与金属片TPm的接合部的剖面时,可知以下内容。
图5是示出树脂片TPp从金属片TPm剥离的过程的示意图。此外,在图5中,为了便于说明,夸大地图示出树脂片TPp与金属片TPm之间的间隙、树脂片TPp的变形量。如图5(a)所示,盐害试验前的激光接合构造体在接合部没有间隙,树脂片TPp与金属片TPm紧贴。也就是说,在树脂片TPp与金属片TPm之间没有间隙。当进行盐害试验时,如图5(b)所示,金属片TPm的外周部发生腐蚀,在树脂片TPp与金属片TPm之间形成间隙,在间隙中生成了腐蚀物C。当进一步进行盐害试验时,如图5(c)所示,确认了由于间隙腐蚀而腐蚀物C生长。当腐蚀物C生长、堆积时,以使树脂片TPp从金属片TPm离开的方式对树脂片TPp作用按压力(以下,还记载为剥离力F),从外周部朝向内侧,树脂片TPp与金属片TPm的分离逐渐进展。其结果,树脂片TPp以产生翘曲的方式变形,要使树脂片TPp与金属片TPm分离的力还作用于中央的接合部分。当腐蚀进一步加深时,在树脂片TPp与金属片TPm的激光接合构造体的接合区域充满腐蚀物,树脂片TPp与金属片TPm完全分离。即,通过盐害试验,树脂片TPp从金属片TPm剥离。
本发明者们发现这样将树脂片TPp与金属片TPm在一个平面进行了接合的情况下的剥离原理,发现了为了防止腐蚀物的生长所引起的剥离,重要的是控制剥离力产生的方向。以下,具体地说明用于控制剥离力的方向而长期地维持高的接合强度的接合构造体的结构以及制造方法。
图6是用于说明制造电子控制装置100的工序的流程图。电子控制装置100的制造方法包括树脂选定工序S110、注射成型工序S120、组装准备工序S130、组装工序S140、表面改性处理工序S145以及激光接合工序S150。
-树脂选定工序-
在树脂选定工序S110中,选定结晶性树脂和合金化的非结晶性树脂。在选定时,以满足以下的选定条件的方式,分别选定结晶性树脂以及非结晶性树脂。使选定出的结晶性树脂以及非结晶性树脂合金化,形成颗粒状的聚合物合金。
<选定条件>非结晶性树脂的玻璃转移温度Tg<结晶性树脂的熔融开始温度Ti
图7是说明结晶性树脂与非结晶性树脂的选定方法的图。在图7中,用实线描绘的曲线是表示结晶性树脂的示差扫描热量测定(DSC)的测定结果的DSC曲线。在图7中,用二点划线描绘的曲线是表示结晶性树脂以非结晶性树脂为合金材料被合金化而成的聚合物合金的DSC测定结果的DSC曲线,示出了结晶化温度Tca附近的曲线。另外,在图7中,用点划线描绘的直线表示非结晶性树脂的玻璃转移温度Tg,纵轴表示由储能弹性率与损耗弹性率之比形成的tanδ(损耗弹性率/储能弹性率)的变化。
如图7所示,结晶性树脂的熔融开始温度Ti、融点Tm、结晶化温度Tc、Tca能够使用公知的示差扫描热量计来测定。此外,熔融开始温度Ti在加热时的DSC曲线中是指开始基于熔融的吸热的温度,例如,能够遵循JISK7121而定义为从通过示差扫描热量测定得到的DSC曲线作为外推熔融开始温度而得到的值。另外,结晶化温度是指冷却时的DSC曲线中的放热峰值下的温度。
作为结晶性树脂,当考虑将电子控制装置100搭载于汽车的引擎室时,根据耐热性、耐药性等观点,优选选定聚对苯二甲酸丁二醇酯(PBT)、聚酰胺6(PA6)、聚酰胺66(PA66)、聚酰胺6T(PA6T)、聚酰胺9T(PA9T)、聚苯硫(PPS)中的任意。
作为非结晶性树脂,优选选定聚苯乙烯(PS)、丙烯腈苯乙烯(AS)、聚碳酸酯(PC)、丙烯腈丁二烯苯乙烯共聚物(ABS)、聚甲基丙烯酸甲酯(PMMA)、环烯烃聚合物(COP)中的任意。此外,在聚苯乙烯(PS)中还包含高抗冲聚苯乙烯(HIPS)。作为成为合金材料的非结晶性树脂的比率,最好设为5~40重量%。
优选在聚合物合金中添加玻璃纤维。通过添加无机材料,从而耐热性、刚性、尺寸稳定性提高,进而还能够减小与金属的线膨胀系数差。当添加于聚合物合金的玻璃纤维小于20重量%时,刚性的提高效果小,所以添加的玻璃纤维优选为20重量%以上。另外,当添加于聚合物合金的玻璃纤维超过40重量%时,有时成形性恶化,所以添加的玻璃纤维优选为40重量%以下。
-注射成型工序-
在图6所示的注射成型工序S120中,对在树脂选定工序S110中得到的颗粒状的聚合物合金进行加热熔融,利用注射成型机(未图示)进行注射成型,从而形成树脂成形体1。例如,注射成型机的喷嘴配置于与罩1a的中央部对应的位置。从喷嘴的射出口射出的聚合物合金从中央部扩展到周围,罩1a以及连接器1b一体地成形。
-组装准备工序-
在组装准备工序S130中,准备树脂成形体1、安装有电子构件6的电路基板5以及金属基体4。
-组装工序-
在组装工序S140中,将安装有电子构件6的电路基板5配置于树脂成形体1的凹部1c,将连接器1b的端子销与电路基板5通过点焊(局部焊接)等进行焊料接合,电连接两者。通过粘接剂、热铆接、螺钉拧紧等将电路基板5固定于树脂成形体1。在使用粘接剂来固定的情况下,使用紫外线硬化粘接剂或者在室温下硬化的双液粘接剂来固定,从而能够实现工序时间的缩短化(缩短生产节拍),所以是优选的。
为了从金属基体4效率良好地散热,也可以涂敷散热材料以使散热材料介于金属基体4与电路基板5之间。散热材料例如能够采用环氧树脂系列、硅系列的热硬化性树脂。在该情况下,能够利用在后述激光接合时产生的热来使散热材料硬化。
-表面改性处理工序-
在表面改性处理工序S145中,对树脂成形体1以及金属基体4的接合面实施大气压等离子体处理。在表面改性处理工序S145中,在大气压下产生等离子体,朝向树脂成形体1的树脂接合面1d以及金属基体4的金属接合面4d照射等离子体。由此,氧官能团在树脂接合面1d生成并增大,表面能量增大。另外,当对金属接合面4d实施大气压等离子体处理时,由于表面的清洗、牢固的氧化膜的形成而表面能量增大。此外,关于表面改性工序,只要在注射工序后以后以及接合前,则在任意部分进行都可以。另外,对金属基体4的金属接合面4d还实施三嗪处理、化学合成处理也是有效的,优选形成至少1μm以上的氧化膜。ADC12容易腐蚀,所以在化学合成处理中防蚀铝处理也是有效的。在防蚀铝处理进行至激光照射部的情况下,不仅耐盐害性提高,还能够增大激光的吸收率,所以对于设备的低成本化、高速接合也是有效的。另外,在使成本优先的情况下,虽然比防蚀铝处理的腐蚀耐性低,但三价铬处理也是有效的。在该情况下,与防蚀铝处理同样地,能够期待设备的低成本化、高速接合的效果。
-激光接合工序-
在激光接合工序S150中,在照射激光10时,当在金属基体4的表面反射的反射光被照射到激光光源时,激光光源有可能会劣化。因此,斜着照射激光10,以避免使激光10的反射光照射到激光光源。以下示出在两个工序中进行激光照射的情况。
激光接合工序S150包括第1加压工序S152、第1激光照射工序S154、第2加压工序S156以及第2激光照射工序S158。图8是示意地示出在利用按压工具190将金属基体4按压到树脂成形体1的状态下使激光10扫描的顺序的立体图。在图8中,用虚线示意地示出了激光10的轨迹。
图9是说明第1实施方式的接合方法的剖视示意图。为了便于说明,如图所示定义X轴、Y轴以及Z轴。X轴、Y轴以及Z轴相互正交。与X轴平行的X方向相当于电子控制装置100的长度方向,与Y轴平行的Y方向相当于电子控制装置100的宽度方向。与Z轴平行的Z方向相当于电子控制装置100的厚度方向(高度方向)。在图9中,示出了配置于金属基体4以及罩1a的+X侧端部以及金属基体4的+X侧侧方的夹具31。
在激光接合工序S150中,首先,以使树脂接合面1d成为上侧的方式将树脂成形体1载置于载置台(未图示),将树脂成形体1固定于载置台。以使金属基体4的金属接合面4d抵接于树脂成形体1的树脂接合面1d的方式将金属基体4配置于树脂成形体1之上。树脂成形体1的X方向尺寸以及Y方向尺寸比金属基体4大一圈(例如,大1~3mm左右)。准备按压面平坦的按压工具190。
如图9(a)所示,金属基体4形成为外周部的厚度比中央部薄,在外周部与中央部之间有台阶。换言之,在金属基体4的外周部设置有台阶部,该台阶部是厚度比内侧的厚部薄的薄部形成于外侧而成的。薄部形成有主面101,该主面101是与树脂接合面1d对置地配置并按压到树脂接合面1d的面。
在树脂成形体1的凹部1c的侧面与金属基体4的内侧侧面112之间形成有预定的间隙。通过将金属基体4定位到树脂成形体1上,树脂成形体1的凹部1c被金属基体4覆盖,由树脂成形体1的凹部1c和金属基体4划分出安装有电子构件6的电路基板5被配置的收容空间S。
当进行后述激光接合工序时,如图9(c)所示,金属基体4与树脂成形体1接合,收容空间S为气密性高的密闭空间。金属基体4的外周侧面具有位于主面101与电子控制装置100的外侧之间的作为薄部的侧面的外侧侧面111、以及位于主面101与收容空间S之间的作为厚部的侧面的内侧侧面112。外侧侧面111以及内侧侧面112分别构成从主面101连续的金属基体4的侧面,与主面101所成的角被做成大致90度。
如图9(a)所示,在第1实施方式中,使用剖面为L字状的金属制的夹具31。夹具31例如在俯视的情况下为コ字状,被配置成包围金属基体4以及罩1a的侧方。夹具31具有从金属基体4的外侧侧面111隔开预定的间隔(例如,1mm左右)而配置的侧方限制部31s、以及从侧方限制部31s的上端部朝向金属基体4的中心突出的上方限制部31u。侧方限制部31s以及上方限制部31u为限制树脂成形体1的变形方向以及变形量的部分。如后所述,树脂成形体1的熔融变形部21m、22m附着于夹具31。因此,考虑从树脂的拆卸性,优选以预先使与树脂的紧贴性变低的方式对夹具31的表面施加例如施加陶瓷等耐热涂层、疏水性高的特氟龙(注册商标)等的表面处理。
-第1加压工序-
在第1加压工序S152中,如图8(a)以及图9(a)所示,以使按压工具190的缘部位于沿着矩形形状的金属基体4的一边的激光照射面11的附近的方式对按压工具190进行定位,将按压工具190从上方碰到金属基体4,朝向下方按压金属基体4。由此,构成金属基体4的金属接合面4d的主面101与树脂成形体1的树脂接合面1d相互按压接触。此外,在金属接合面4d以及树脂接合面1d分别形成有微小的凹凸,所以“金属接合面4d与树脂接合面1d相互按压接触”不意味着树脂接合面1d与金属接合面4d在整个区域按压接触,还是包括在一部分形成间隙的情形。越增大按压工具190相对于金属基体4的接触面积,越能够抑制金属基体4的翘曲、金属基体4与树脂成形体1的紧贴性的下降。此外,在本实施方式中,以使树脂成形体1与金属基体4的最大间隙量成为20μm左右的方式对按压工具190进行了按压。
-第1激光照射工序-
在利用按压工具190使树脂成形体1与金属基体4相互按压接触的状态下进行第1激光照射工序S154。在第1激光照射工序S154中,如图8(a)以及图9(a)、图9(b)所示,将激光10照射到沿着矩形形状的金属基体4的一边的激光照射面11、即与构成金属接合面4d的主面101相反一侧的面,如在图8(a)中用虚线示意地示出那样,从起点(A点)至终点(B点)为止以一条直线状使激光10扫描,将金属接合面4d与树脂接合面1d接合。
当激光10被照射到激光照射面11时,隔着金属基体4使树脂成形体1加热,树脂成形体1的温度上升。由于温度的上升,树脂成形体1膨胀并熔融,如图9(b)所示,金属基体4的外周部埋入于树脂成形体1,并且熔融变形部21m、22m向外方移动。熔融变形后的树脂填充于金属基体4的表面的微细凹凸并固化,从而金属基体4与树脂成形体1接合。此外,金属基体4的温度也上升,但金属基体4不会熔融。
在本实施方式中,熔融变形部21m形成于由夹具31和金属基体4的外侧侧面111包围的空间内,熔融变形部22m形成于金属基体4的内侧侧面112与树脂成形体1的凹部1c的侧面之间。熔融变形部21m与金属基体4的外侧侧面111和夹具31接触,熔融变形部22与内侧侧面112接触。此外,在图9中,为了便于说明,示意地对熔融变形部21m、22m分别施加了阴影。
熔融变形部21m由于夹具31的侧方限制部31s而向侧方的移动被限制,沿着外侧侧面111向上方(+Z方向)移动。也就是说,熔融变形部21m向上方扩展。扩展到上方的熔融变形部21m由于夹具31的上方限制部31u而向上方的移动被限制,沿着金属基体4的上表面向朝向金属基体4的中心的方向(图中-X方向)移动。此外,如图9(c)所示,被照射激光10的部分与其周围相比形成稍微凹下的激光照射痕(凹陷)140。熔融变形部21m、22m通过温度下降而固化,成为紧贴于金属基体4的侧面的毛边。也就是说,毛边为在金属基体4的侧面熔敷树脂成形体1的熔融变形部而成的部分。将紧贴于金属基体4的外侧侧面111的毛边称为外侧毛边21c,将紧贴于金属基体4的内侧侧面112的毛边称为内侧毛边22c。外侧毛边21c还紧贴于金属基体4的上表面的外边缘部。此外,外侧毛边21c的玻璃纤维的取向状态以及内侧毛边22c的玻璃纤维的取向状态分别与位于激光10的正下方的树脂材料的玻璃纤维的取向状态不同。
-第2加压工序-
在第2加压工序S156中,如图8(b)以及图9(a)所示,以使按压工具190的缘部位于沿着矩形形状的金属基体4的三边的激光照射面11的附近的方式对按压工具190进行定位,将按压工具190从上方碰到金属基体4,朝向下方按压金属基体4。由此,金属基体4的金属接合面4d与树脂成形体1的树脂接合面1d相互按压接触。树脂成形体1与金属基体4的最大间隙量为20μm左右。
-第2激光照射工序-
在利用按压工具190使树脂成形体1与金属基体4相互按压接触的状态下进行第2激光照射工序S158。在第2激光照射工序S158中,如图8(b)以及图9(a)、图9(b)所示,将激光10照射到沿着矩形形状的金属基体4的三边的激光照射面11,如在图8(b)中用虚线示意地示出那样,从起点(A点)至终点(B点)为止以大致コ字状使激光10扫描,将金属接合面4d与树脂接合面1d接合。与第1激光照射工序S154同样地,在被照射激光10的部分形成有激光照射痕140,外侧毛边21c紧贴于金属基体4的外侧侧面111,内侧毛边22c紧贴于金属基体4的内侧侧面112。
由此,树脂成形体1与金属基体4接合,电子控制装置100完成。通过在沿着金属基体4的四边的ロ字状的激光照射面11的整个周扫描激光10,从而如在图1中用虚线示意地示出那样形成激光接合部11a。其结果,收容电路基板5的收容空间S由激光接合部11a封闭。
此外,起点(A点)和终点(B点)在第1激光照射工序S154和第2激光照射工序S158这两个工序中被照射,所以激光10的输入热量有变多的趋势。因而,为了实现入热量的均匀化,也可以在第1激光照射工序S154以及第2激光照射工序S158的每一个工序中使起点(A点)和终点(B点)的位置稍微偏移。
在激光接合工序S150中,第1加压工序S152→第1激光照射工序S154→第2加压工序S156→第2激光照射工序S158这一连串的工序也可以重复进行多次。
在本实施方式中,如图9(c)所示,与XY平面平行的金属基体4的主面101牢固地接合于树脂成形体1。主面101处的接合部位于激光照射面11的正下方,所以接合强度最高。另外,与YZ平面平行的金属基体4的外侧侧面111紧贴于外侧毛边21c,与YZ平面平行的金属基体4的内侧侧面112紧贴于内侧毛边22c。
在本实施方式中,在金属基体4的主面101与电子控制装置100的外侧之间设置有紧贴于金属基体4的侧面的外侧毛边21c,所以能够长期地防止罩1a的剥离。在本实施方式中,腐蚀物的生成从外侧毛边21c与激光照射面11的界面起进行。因此,即使在外侧毛边21c与激光照射面11的界面处腐蚀物的生成进展,由于此时的剥离力F产生为使外侧毛边21c向上方(图示+Z方向)剥离,所以也能够防止在主面101处的接合部产生大的应力。进而,即使在腐蚀物的生成进展至外侧毛边21c与外侧侧面111的界面,剥离力F产生为使外侧毛边21c朝向外方(图示+X方向)剥离的状态下,也能够防止在主面101处的接合部产生大的应力。其结果,能够在主面101长期地维持高的接合强度。
根据上述第1实施方式,能够得到下面的作用效果。
(1)树脂成形体1与金属基体4的主面101接合,与金属基体4的主面101连续的侧面(外侧侧面111以及内侧侧面112)中的至少一部分与设置于树脂成形体1的侧方接触部(外侧毛边21c以及内侧毛边22c)接触。由此,在树脂成形体1与金属基体4接合而成的电子控制装置100放置在盐害环境下的情况下,能够在主面101处的接合部长期地维持高的接合强度,所以能够抑制树脂成形体1与金属基体4分离。即,根据本实施方式,能够提供在盐害环境下也能够长期地确保气密性的、针对盐害的寿命提高的电子控制装置100。
(2)在本实施方式的电子控制装置100的制造方法中,将安装有电子构件6的电路基板5配置于由树脂成形体1和金属基体4划分出的收容空间S,在使树脂成形体1与金属基体4的主面101相互按压接触的状态下,将激光照射到与主面101相反一侧的面(激光照射面11),利用由激光产生的热使树脂成形体1熔融变形,使树脂成形体1的熔融变形部21m、22m接触于与金属基体4的主面101连续的侧面的一部分。由此,树脂成形体1与金属基体4的主面101牢固地接合,并且能够使熔融变形部21m、22m固化而成的毛边21c、22c与金属基体4的侧面的一部分接触,能够实现生产率的提高。
(3)利用从金属基体4的外侧侧面111隔开预定的间隔而配置的夹具31来限制树脂成形体1的变形。由此,在激光接合工序S150中,能够使熔融变形部21m以沿着金属基体4的外周面的方式变形,使熔融变形部21m容易地紧贴于金属基体4的外侧侧面111。在本实施方式中,通过使用剖面为L字状的夹具31,从而以使熔融变形部21m沿着金属基体4的外侧侧面111上升、进而沿着金属基体4的上表面移动的方式限制了其变形方向以及变形量。由此,通过使用夹具31,能够容易地形成紧贴于金属基体4的侧面、上表面的外侧毛边21c,所以能够实现生产率的提高。
(4)由树脂成形体1和金属基体4划分出收容电子构件6的收容空间S。在金属基体4的外周部设置有相对于内侧的厚部而厚度薄的薄部形成于外侧而成的台阶部。金属基体4的主面101形成于薄部。金属基体4的侧面具有作为薄部的侧面的外侧侧面111以及作为厚部的侧面的内侧侧面112。树脂成形体1的侧方接触部具有与外侧侧面111的至少一部分接触的外侧毛边21c以及与内侧侧面112的至少一部分接触的内侧毛边22c。由此,不仅设置外侧毛边21c,还设置内侧毛边22c,从而能够进一步提高寿命,能够提高电子控制装置100的可靠性。
(5)本实施方式的电子控制装置100为将树脂成形体1与金属基体4激光接合而成的激光接合构造体,通过将激光10照射到与主面101相反一侧的激光照射面11,从而形成有激光照射痕140。在用柔软性高的粘接剂接合金属基体4和罩1a的情况下,由于腐蚀物的生成而产生的剥离力被柔软性高的粘接剂吸收。相对于此,在进行了激光接合的情况下,由于腐蚀物的生成而产生的剥离力对接合部造成的影响比用柔软性高的粘接剂接合的情况大。因此,在本实施方式中,通过设置与金属基体4的侧面接触的毛边而起到的剥离的抑制效果比用粘接剂接合的情况大。
(6)将由含有结晶性树脂以及非结晶性树脂并被合金化而成的聚合物合金构成的树脂成形体1与由金属构成的金属基体4进行激光接合,形成有电子控制装置100。选定结晶性树脂以及非结晶性树脂,以使得非结晶性树脂的玻璃转移温度Tg比结晶性树脂的熔融开始温度Ti低。因此,即使在激光器扫描区域的整个区域中的树脂接合面1d与金属接合面4d的间隙量有偏差的情况下,由于激光照射时的树脂成形体1的温度上升所致的软化(弹性率的下降),树脂接合面1d与金属接合面4d的间隙量被有效地降低,所以能够确保足够的接合强度。这样,根据本实施方式,相比于由未合金化的结晶性树脂形成树脂成形体1的情况,能够提高激光接合强度。其结果,能够提高电子控制装置100的耐振动性以及耐冲击性。
(7)以聚合物合金的结晶化速度比成为聚合物合金的母材的均聚的结晶性树脂的结晶化速度低的方式选定母材(结晶性树脂)和合金材料(非结晶性树脂),形成含有两者的聚合物合金,从而能够使从激光照射后至熔融状态的树脂结晶化为止的时间比未合金化的结晶性树脂长。由此,相比于由未合金化的结晶性树脂构成的树脂成形体与金属体的激光接合体,能够提高激光接合强度。
(8)以聚合物合金的结晶化温度Tca比成为聚合物合金的母材的均聚的结晶性树脂的结晶化温度Tc低的方式选定母材和合金材料,形成含有两者的聚合物合金,从而能够使从激光照射后至熔融状态的树脂结晶化为止的时间比未合金化的结晶性树脂长。由此,根据本实施方式,相比于由未合金化的结晶性树脂形成树脂成形体1的情况,能够提高激光接合强度。
(9)通过对树脂成形体1中的与金属基体4的接合面(树脂接合面1d)实施增大氧官能团的处理(表面改性处理),能够大幅提高激光接合强度。
(10)在金属基体4的主面101形成有至少1μm以上的氧化膜。由此,能够提高耐盐害性。
(11)当将玻璃纤维添加到聚合物合金时,树脂成形体1的刚性提高,而且还能够实现长期的尺寸稳定性的提高。
(12)电子控制装置100具备收容于由金属基体4和树脂成形体1划分出的收容空间S的电路部(电路基板5)。树脂成形体1与金属基体4激光接合,从而收容空间S被封闭,所以能够确保防水性、防尘性,防锈性。也就是说,根据本实施方式,无需使用液体状的粘接剂等进行密封。
在将粘接剂用作密封材料的情况下,密封材料水密性良好,但具有容易使水蒸气通过而吸水的特性,所以金属基体4有可能会腐蚀。另外,在使用密封材料的情况下,还有可能由于密封材料所包含的空隙而密封性恶化。进而,如果为了防止该密封性的恶化而大量地使用密封材料,还存在成本变高的问题。
对于汽车构件,主要将热硬化型粘接剂用作密封材料。然而,在使用热硬化型粘接剂的情况下,为了加热硬化需要10分钟以上的时间,所以存在生产率差这样的问题。而且,还存在由于在加热时产生的气体等而产生空隙,成品率差这样的问题。另外,需要通过粘接剂的超出的控制等来确保用于涂敷粘接剂的面积,所以还存在设计的自由度被约束这样的问题。
相对于此,根据本实施方式,无需使用密封材料,所以不会产生如上所述的问题,能够防止制造工时的增加、成本的增加,并且相比于密封材料,能够长期地确保防水性、防尘性、防锈性。
(13)树脂成形体1是覆盖电路部(电路基板5)的罩1a和保持与电路部(电路基板5)电连接的端子销的连接器1b通过注射成型而一体成形的一体成形体。通过将树脂成形体1做成一体成形体,能够实现低成本化。另外,在将树脂构件组合多个而形成电子控制装置的情况下,由于组装公差的影响,有可能会无法确保树脂接合面1d处的平面度,相对于此,在本实施方式中,将树脂成形体1做成一体成形体,所以能够容易地确保为了将金属接合面4d与树脂接合面1d进行激光接合所需的平面度。
(14)除了金属基体4的下陷量之外,还将熔敷于金属基体4的侧面的外侧毛边21c以及内侧毛边22c的高度尺寸(Z方向尺寸)作为检查中的指标。
-第2实施方式-
参照图10,说明第2实施方式的电子控制装置。图10(a)以及图10(b)是说明第2实施方式的接合方法的剖视示意图。在图中,对与第1实施方式相同或相当的部分附加相同的附图标记,省略说明。以下,详细地说明与第1实施方式的区别点。
在第1实施方式中,说明了当照射激光10而树脂成形体1熔融变形时,使用夹具31来限制树脂成形体1的熔融变形,形成外侧毛边21c的例子。相对于此,在第2实施方式中,使用在树脂成形体1中从树脂接合面1d向上方突出设置的突起部221来限制激光照射时的树脂成形体1的熔融变形,在突起部221与外侧侧面111之间形成外侧毛边21c。突起部221从金属基体4的外侧侧面111隔开预定的间隔(例如,1mm左右)而配置。如图10(b)所示,熔融变形部固化而成的外侧毛边21c由金属基体4的外侧侧面111和突起部221夹持。
此外,对本实施方式的接合构造体进行了剖视观察的结果是,在预先设置的突起部221与熔融变形部固化而成的外侧毛边21c中,树脂所含有的玻璃纤维的取向状态不同。同样地,在突起部221与熔融变形部固化而成的内侧毛边22c中,树脂所含有的玻璃纤维的取向状态不同。
根据这样的第2实施方式,除了起到与第1实施方式同样的作用效果之外,还起到下面的作用效果。
(15)使突起部221位于从外侧侧面111离开预定的距离的位置,将激光10照射到金属基体4,使树脂成形体1熔融变形,从而能够以由突起部221和外侧侧面111夹持的方式在突起部221与外侧侧面111之间形成外侧毛边21c。在使用夹具31的情况下,需要精密的位置调整、定期的清理,但根据本实施方式,不需要精密的位置调整、定期的清理,所以能够进一步提高生产率。
(16)能够不用另外的构件而用作为相同的构件的树脂成形体1的突起部221进行树脂成形体1的熔融变形部的限制,所以能够提高外侧毛边21c的位置精度。
(17)突起部221的导热率比金属制的夹具31低。因此,相比于第1实施方式,易于保持热,在冷却过程中缓慢地固化,所以树脂成形体1与金属基体4的紧贴强度提高。
-第2实施方式的变形例-
图10(c)是说明第2实施方式的变形例的接合方法的剖视示意图。如图10(c)所示,在本变形例中,形成有对树脂成形体1的外侧毛边21c与金属基体4的接触界面的外缘进行封闭的封闭部231。能够通过在激光接合工序S150之后将粘接剂涂敷于树脂成形体1的外侧毛边21c与金属基体4的接触界面的外缘而形成封闭部231。
由此,能够进一步提高电子控制装置100的气密性。此外,作为粘接剂,能够使用利用湿气来硬化的类型,还能够减少使用量,所以可靠性大幅提高,相对于此,能够减小成本上升、生产率的下降的影响。
-第3实施方式-
参照图11,说明第3实施方式的电子控制装置。图11是说明第3实施方式的接合方法的剖视示意图。在图中,对与第2实施方式相同或相当的部分附加相同的附图标记,省略说明。以下,详细地说明与第2实施方式的区别点。
如图11(a)所示,在金属基体4的外周部设置有从薄部朝向树脂成形体1突出的第1突出部331。第1突出部331的突出高度H1(从薄部至顶面为止的-Z方向长度)为1mm~3mm左右。第1突出部331沿着金属基体4的外周部而形成,在俯视的情况下呈矩形环状。如图11(a)所示,在本实施方式中,与树脂接合面1d对置的主面101由构成第1突出部331的顶面的顶部主面101a、第1突出部331的外侧的外侧主面101b、以及第1突出部331的内侧的内侧主面101c构成。
在第3实施方式中,在激光接合工序S150中,如图11(a)所示,在将第1突出部331的顶部主面101a压到树脂成形体1的状态下,将激光10照射到金属基体4。照射了激光10的正下方的接触面的接合强度变得最高,所以最好将激光10照射到与顶部主面101a相反一侧的激光照射面11中的第1突出部331的投影面上。在本实施方式中,以使第1突出部331位于激光10的中心轴(光轴)CL上的方式照射激光10。
如图11(b)所示,以使第1突出部331的整体埋入于树脂成形体1的方式进行激光接合工序S150。激光照射痕140形成于在激光照射面11中被照射激光10的部分。激光照射痕140在沿第1突出部331的突出方向(-Z方向)投影时与第1突出部331重叠。第1突出部331埋设于树脂成形体1,树脂成形体1熔敷于第1突出部331的顶面、侧面。
在本实施方式中,金属基体4的侧面与树脂成形体1的接触面积As比金属基体4的主面101与树脂成形体1的接触面积Am大。金属基体4的侧面与树脂成形体1的接触面积As由式(1)表示。
As=As1+As2+As3+As4…(1)
As1:金属基体4的内侧侧面112与树脂成形体1的接触面积
As2:金属基体4的第1突出部331的内侧侧面312与树脂成形体1的接触面积
As3:金属基体4的第1突出部331的外侧侧面311与树脂成形体1的接触面积
As4:金属基体4的外侧侧面111与树脂成形体1的接触面积
金属基体4的主面101与树脂成形体1的接触面积Am由式(2)表示。
Am=Am1+Am2+Am3…(2)
Am1:金属基体4的第1突出部331的顶部主面101a与树脂成形体1的接触面积
Am2:金属基体4的外侧主面101b与树脂成形体1的接触面积
Am3:金属基体4的内侧主面101c与树脂成形体1的接触面积
根据这样的第3实施方式,除了起到与第2实施方式同样的作用效果之外,还起到下面的作用效果。
(18)将朝向树脂成形体1突出的第1突出部331设置于金属基体4的外周部,将第1突出部331的顶部主面101a压到树脂成形体1。由此,能够降低按压工具190所需的加压力。
(19)在激光10的中心轴CL上设置第1突出部331,所以能够使第1突出部331的温度容易地上升,如图11(b)所示,能够容易地确保所需的埋入量。此外,通过被照射激光10而形成的激光照射痕140在沿第1突出部331的突出方向投影时与第1突出部331重叠。
(20)通过使第1突出部331埋设于树脂成形体1,能够更有效地抑制树脂成形体1从金属基体4剥离。另外,通过调整第1突出部331的突出高度,能够容易地调整埋入深度。因此,能够抑制成本,并期待高的剥离防止效果。
(21)金属基体4的侧面与树脂成形体1的接触面积As比金属基体4的主面与树脂成形体1的接触面积Am大。由此,能够有效地抑制由于腐蚀物的生成而产生的剥离力F所致的负荷。
-第3实施方式的变形例1-
图12是说明第3实施方式的变形例1的接合方法的剖视示意图。如图12(a)所示,在第3实施方式的变形例1中,在第1突出部331的外方以包围第1突出部331的方式设置有第2突出部332。第2突出部332与第1突出部331同样地朝向树脂成形体1突出,在俯视的情况下呈矩形环状。第2突出部332的突出高度H2(从薄部至顶面为止的-Z方向长度)比第1突出部331的突出高度H1低。
通过这样设置多个突出部,能够增加金属基体4的侧面与树脂成形体1的接触面积,所以寿命更加提高。
优选以使突出高度高的第1突出部331位于激光10的中心轴(光轴)CL上的方式照射激光10。在金属基体4的外周部,对厚度厚的部分照射激光10,所以能够防止金属基体4的外周部由于激光10而贯通等不好的情况。在本变形例中,如图12(b)所示,仅在第1突出部331的投影面上形成激光照射痕140。也就是说,在将激光照射痕140沿第2突出部332的突出方向(-Z方向)投影时,激光照射痕140的投影面与第2突出部332不重叠。
此外,在本变形例中,需要确保在第1突出部331的外周侧设置第2突出部332的空间,所以第1突出部331与外侧侧面111的距离比第3实施方式远。其结果,仅向与第1突出部331对应的区域照射激光10,有可能会无法充分地使树脂成形体1熔融变形而形成外侧毛边21c。在该情况下,例如,在第1突出部331的投影面上进行第1次激光10的照射,在第2突出部332的投影面上进行第2次激光10的照射,从而能够使金属基体4的外缘附近的树脂成形体1的温度上升,形成足够的大小的外侧毛边21c。在该情况下,通过第2次激光10的照射而形成的激光照射痕(未图示)在沿第2突出部332的突出方向投影时与第2突出部332重叠。此外,在本变形例中,说明了设置两个种类的突出部的例子,但也可以将3个种类以上的突出部设置于金属基体4。
-第3实施方式的变形例2-
在上述中,说明了在金属基体4的中央部配置按压工具190并进行加压的例子,但本发明不限定于此。例如,也可以在图13(a)中如二点划线所示,在金属基体4的外侧端部、即比激光照射面11靠外侧的位置配置按压工具390并进行加压。
-第3实施方式的变形例3-
图13(a)是说明第3实施方式的变形例3的接合方法的剖视示意图,图13(b)是第3实施方式的变形例3的金属基体4的俯视示意图。此外,在图13(a)以及图13(b)中,为了便于说明,夸大地图示出凹陷331p、332p的大小。
如图13(a)所示,在第3实施方式的变形例3中,在第1突出部331的顶部形成有多个几十μm左右的微小的凹陷331p,在第2突出部332的顶部形成有多个几十μm左右的微小的凹陷332p。如图13(b)所示,各凹陷331p沿着第1突出部331而形成,在俯视的情况下呈矩形环状。同样地,各凹陷332p沿着第2突出部332而形成,在俯视的情况下呈矩形环状。各凹陷331p、332p预先通过激光加工形成。在此,矩形环状既可以是各边为直线状,也可以平滑地蜿蜒。
此外,各凹陷331p彼此也可以一部分连接。然而,当各凹陷331p彼此连接时,经由连接部分而腐蚀进展。另外,根据气密性的观点也是不优选的。因此,相对于形成于第1突出部331的所有的凹陷331p的总面积,连接部分的总面积例如优选抑制到20%以下。关于凹陷332p也同样地,优选抑制连接部分的面积。
-第3实施方式的变形例4-
图13(c)是说明第3实施方式的变形例4的接合方法的剖视示意图。也可以如图13(c)所示,形成使金属基体4的外周部比第3实施方式的变形例1(参照图12)靠侧方延伸的延伸部341。延伸部341与在树脂成形体1的外周部中向上方突出的突起部421接近地对置配置。
根据这样的变形例,能够使外侧毛边21c不显眼,所以能够提高外观性。
-第4实施方式-
参照图14,说明第4实施方式的电子控制装置。图14是说明第4实施方式的接合方法的剖视示意图。在图中,对与第3实施方式相同或相当的部分附加相同的附图标记,省略说明。以下,详细地说明与第3实施方式的区别点。
如图14所示,在第4实施方式中,沿着收容空间S,在朝向树脂成形体1突出设置的矩形环状的第1突出部331的内侧,设置有以向上方(+Z方向)凹陷的方式凹设的俯视矩形环状的槽442。在树脂成形体1中,在与槽442对置的位置设置有朝向树脂成形体1突出的突起部441。突起部441的大小比槽442的大小稍小。在激光接合工序S150中,当将金属基体4压到树脂成形体1时,突起部441有间隙地嵌合到槽442,在突起部441与槽442之间形成间隙。
当被照射激光10,热施加于树脂成形体1时,树脂成形体1熔融变形,突起部441与槽442之间的间隙被熔融变形部充满,当该熔融变形部固化时,形成紧贴于槽442的中间毛边423c。
根据这样的第4实施方式,除了与第3实施方式同样的作用效果之外,还能够增加金属基体4的侧面与树脂成形体1的接触面积,所以寿命更加提高。在比金属基体4的激光照射痕140靠内侧的位置设置槽442。由此,能够在照射激光10时抑制热向内方(-X方向)的逃逸。也就是说,能够以低的激光输出将由于激光10而产生的热效率良好地传递给第1突出部331。因此,能够以低的激光输出将金属基体4埋入于树脂成形体1。
此外,在本实施方式中,说明了将一个槽442设置于金属基体4的例子,但也可以将两个以上的槽设置于金属基体4。
-第5实施方式-
参照图15(a),说明第5实施方式的电子控制装置。图15是说明第5实施方式的接合方法的剖视示意图。在图中,对与第3实施方式相同或相当的部分附加相同的附图标记,省略说明。以下,详细地说明与第3实施方式的区别点。
如图15(a)所示,在第5实施方式中,在第1突出部331的外方以包围第1突出部331的方式设置有第3突出部551。第3突出部551为与树脂成形体1的外周面558夹持外侧毛边521c的部分。第3突出部551配置于金属基体4的外周端部,在俯视的情况下呈矩形环状。第3突出部551沿着树脂成形体1的外周面558向下方(-Z方向)突出。在照射激光10之前的位置对准阶段,在第3突出部551与树脂成形体1的外周面558之间形成间隙。在激光接合工序S150中,树脂成形体1的外周面558与第3突出部551之间的间隙被熔融变形部充满,该熔融变形部固化而成的外侧毛边521c紧贴于金属基体4的第3突出部551。
根据这样的第5实施方式,除了起到与第3实施方式同样的作用效果,还起到下面的作用效果。
(22)通过不使金属基体4的厚度变厚而使第3突出部551的长度变长,能够增加金属基体4的侧面与树脂成形体1的接触面积,提高接合强度,所以设计自由度高。
(23)金属基体4的外周部超过树脂成形体1而向侧方延伸,所以如图15(a)的二点划线所示,在将按压工具390配置于比激光照射面11靠外侧的位置并进行加压时,易于确保按压工具390的配置空间。
(24)在从侧方观察时,外侧毛边21c被第3突出部551隐藏,所以能够提高外观性。
(25)通过使内侧毛边522c不仅紧贴于金属基体4的厚部的侧面,还紧贴于厚部的内表面(收容空间S侧的面)的一部分,能够更加提高寿命。
-第5实施方式的变形例-
图15(b)是说明第5实施方式的变形例的接合方法的剖视示意图。如图15(b)所示,在第5实施方式的变形例中,在第3突出部551的基端部形成有槽561。在激光接合工序S150中,熔融变形部未填充于槽561的整体,在槽561的底部形成空间部561S。
这样,在第5实施方式的变形例中,在金属基体4与树脂成形体1的接合界面、即盐害试验时的盐水的侵入路径的中途有意地设置有积存盐水的空间部561S。由此,能够更加提高寿命。此外,当空间部561S的尺寸小时,成为产生间隙腐蚀的主要原因,所以从槽561的底部至外侧毛边521c为止的距离优选确保成0.5mm以上。
下面的变形也在本发明的范围内,以下所示的变形例、上述各实施方式及其变形例还能够相互组合。
(变形例1)
在上述实施方式中,说明了罩1a与连接器1b通过注射成型而一体成形的例子,但本发明不限定于此。也可以使覆盖电路基板5的罩1a与保持端子销(未图示)的连接器1b成为分离体。在该情况下,连接器1b与罩1a既可以通过激光熔敷、超声波熔敷、热板熔敷等各种熔敷方法结合,也可以使用粘接剂、扣合来结合。
根据变形例1,罩1a与连接器1b为分离体(分离构件),所以能够使罩1a与连接器1b的材料不同。例如,关于难燃性的要求(等级、环境限制)高的连接器1b,能够采用难燃剂比罩1a多地配合的材料。由此,相比于使罩1a与连接器1b一体成形并满足难燃性的要求的情况,能够降低材料费。
此外,在使连接器1b的难燃性比罩1a提高的情况下,也可以使构成罩1a的聚合物合金所含有的合金材料与构成连接器1b的聚合物合金所含有的合金材料的种类不同。可知在通过熔敷将罩1a与连接器1b进行了接合的情况下,在作为罩1a以及连接器1b各自的母材而采用了PBT树脂的情况下,即使对连接器1b配合大量的难燃剂,也不会对两者的熔敷性造成大的影响。
(变形例2)
在变形例1中,说明了将罩1a与连接器1b通过熔敷等进行结合的例子,但本发明不限定于此。罩1a与连接器1b也可以不结合。在该情况下,将罩1a以及连接器1b分别与金属基体4激光接合。此外,也可以使罩1a以及连接器1b的任意一方与金属基体4激光接合,用粘接剂等使另一方与金属基体4结合。即使在并用激光接合和粘接剂的情况下,相比于用粘接剂将各构件全部进行结合的情况,仍能够降低粘接剂的使用量。
(变形例3)
在上述实施方式中,在第1激光照射工序S154中以一条直线状扫描激光10,在第2激光照射工序S158中以コ字状扫描激光10,从而将金属基体4的外缘扫描1周(参照图8)。即,说明了将遍及整个周长地对金属基体4的激光照射面11进行扫描的工序分为两个步骤的例子,但本发明不限定于此。也可以在1个步骤中对激光10进行整个周长扫描。
例如,如图12(a)所示,采用将按压工具390碰到与金属基体4的四个边对应的外侧端部,将金属基体4按压到树脂成形体1,从具备流电(Galvano)扫描仪的激光器装置照射激光10的方法,从而无需将步骤分开就能够遍及整个周长地扫描激光10。只要将流电扫描仪的反射镜配置于金属基体4的中央的正上方,就能够以ロ字状扫描激光10。具备流电扫描仪的激光器装置适于尺寸比较小的电子控制装置的制作。
(变形例4)
也可以在加压工序(S152、S156)中,用加热器等对按压工具190、390进行加热,在加热后的状态下对金属基体4进行加压。在该情况下,通过将树脂成形体1加热至合金材料的玻璃转移温度Tg以上的温度(例如,100℃左右),从而相比于不加热的情况,能够增加埋入量。此外,如果考虑搭载于电路基板5的电子构件6的耐热性,则150℃为上限。另外,优选在将树脂成形体1加热到聚合物合金的结晶化温度以上且聚合物合金的熔融开始温度以下的温度的状态下进行激光接合。由此,在激光接合后结晶化也缓慢进展,还能够抑制接合后的骤冷,所以还能够降低热应力。另外,在用加热器等进行了加热的状态下进行激光接合的情况下,还具有能够大幅降低激光接合所需的激光能量的优点。
(变形例5)
也可以将透射激光10的耐热性以及透射率高的玻璃板设置于按压工具190、390,将激光10经由玻璃板照射到激光照射面11。
(变形例6)
在上述实施方式中,说明了将激光照射面11设置于金属基体4,对金属基体4照射激光10的例子,但本发明不限定于此。在树脂成形体1的透射率高的情况下,也可以对树脂成形体1照射激光10,进行激光接合。
(变形例7)
在上述实施方式中,说明了设置外侧毛边21c和内侧毛边22c这双方的例子,但本发明不限定于此。也可以在如上述实施方式那样收容空间S被做成密闭空间的情况等、盐水不会从收容空间S侧侵入到接合部的情况下,省略内侧毛边22c。此外,通过即使在如上所述收容空间S被做成密闭空间的情况下也设置内侧毛边22c,从而能够增加树脂成形体1与金属基体4的接触面积,所以能够提高可靠性。
(变形例8)
在上述实施方式中,说明了作为金属基体4的材料而采用压铸铝(例如,JISADC12)的例子,但本发明不限定于此。只要能够确保散热性,就还能够由电镀钢板、不锈钢等各种金属形成金属基体4。
(变形例9)
在上述实施方式中,作为进行使树脂侧的氧官能团生成、增大的处理以及金属侧的表面清洗、牢固的氧化膜形成的处理,说明了大气压等离子体处理的例子,但本发明不限定于此。也可以不实施大气压等离子体处理,而实施减压等离子体处理。此外,大气压等离子体处理在生产率这点上比减压等离子体处理有效,减压等离子体处理在能够赋予各种气体这点上有效。除此之外,也可以不实施等离子体处理,而实施例如UV臭氧、准分子激光、短脉冲照射等干处理。
(变形例10)
表面改性处理优选至少对树脂成形体1的树脂接合面1d实施,更优选还对金属基体4的金属接合面4d实施。即使仅对树脂侧或金属侧的一方实施,其效果也很大。
(变形例11)
在上述实施方式中说明的突起部221、421、441、突出部331、332、槽442的角度、形状能够任意地设定。
(变形例12)
在上述实施方式中,说明了将玻璃纤维添加于聚合物合金的例子,但本发明不限定于此。为了提高聚合物合金的刚性,能够添加由无机物构成的各种无机填料。例如,也可以不添加玻璃纤维,而添加玻璃片、特殊形状的玻璃等。另外,还能够不添加玻璃纤维,而添加碳纤维。由此,除了能够提高刚性之外,还能够提高电磁波防护性。作为能够提高电磁波防护性的无机填料,还能够采用导电碳(例如,科琴黑、乙炔黑、碳珠、石墨等)。此外,在不将无机填料添加于聚合物合金的情况也在本发明的范围内。
(变形例13)
也可以将各种添加剂、例如氧化防止剂、紫外线吸收剂、热稳定剂、带电防止剂等稳定剂、结晶核剂、可塑剂、润滑剂等添加于作为树脂成形体1的材料的聚合物合金。添加剂的含有量优选设定为不阻碍接合强度的提高效果的程度。
另外,PBT树脂具有易于水解的性质。因此,在作为聚合物合金的母材而使用PBT树脂的情况下,优选添加抑制水解的添加剂(例如,环氧树脂)。特别在做成包含酯的PC合金、PET合金的情况下,水解性为与PBT相同的程度,所以优选添加抑制水解的添加剂。另外,在做成包含酯的PC合金、PET合金的情况下,酯交换反应过度进展,从而有可能会生产率下降,或者成形体的物性下降。因此,在做成包含酯的PC合金、PET合金的情况下,添加酯交换反应停止剂(例如,磷化合物)也是有效的。进而,也可以根据难燃性的要求,添加难燃剂(例如,磷系、溴系等)、难燃辅助材料(三氧化锑等)。
(变形例14)
在上述实施方式中,说明了金属基体4形成为矩形平板状,树脂成形体1形成有凹部1c的例子,但本发明不限定于此。例如,也可以将收容电路基板5的凹部设置于金属基体4,将树脂成形体1做成平板状。
(变形例15)
在上述实施方式中,说明了将本发明应用于作为搭载于汽车的引擎控制器的电子控制装置100的例子,但本发明不限定于此。能够将本发明应用于具备树脂成形体与金属体接合而成的接合构造体的各种电子控制装置。
(变形例16)
在上述实施方式中,说明了由聚合物合金形成树脂成形体1的例子,但本发明不限定于此。例如,也可以由PBT树脂(非合金)形成树脂成形体1。
(变形例17)
上述电子控制装置100的制造方法仅仅是一个例子,能够通过各种制造方法来制造电子控制装置100。例如,在上述实施方式中,在组装工序S140中,说明了在将电路基板5配置、固定于树脂成形体1的凹部1c之后将金属基体4与树脂成形体1接合的例子,但本发明不限定于此。也可以在将电路基板5配置、固定于金属基体4之后,将树脂成形体1与金属基体4接合。
(变形例18)
在上述实施方式中,说明了树脂成形体1与金属基体4的最大间隙量为20μm左右的例子,但本发明不限定于此。此外,树脂成形体1与金属基体4的间隙量越大则接合强度越下降,所以间隙量最好尽可能降低。当间隙量超过100μm时,无法将树脂成形体1与金属基体4激光接合。因此,间隙量需要设为100μm以下。但是,在间隙量比50μm大且为100μm以下的情况下,由于树脂成形体1的热分解,空隙大量残存于激光接合部11a,所以难以长期地维持接合强度。因此,优选在对树脂成形体1和金属基体4进行了加压的状态下,尽量减小间隙量,优选为50μm以下。
(变形例19)
在上述实施方式中,说明了利用激光10将树脂成形体1与金属基体4进行接合的例子,但本发明不限定于此。本发明还能够应用于通过加压热接合、振动接合、超声波接合将树脂成形体1与金属基体4接合的情况。利用耐湿以及耐盐害性良好的粘接剂也能够同样地发挥效果。特别在采用耐湿良好的粘接剂的情况下,能够成为架设密度高也就是说弹性率高的粘接剂。在利用粘接剂将树脂成形体1与金属基体4进行接合的情况下,越是弹性率高即不易变形的粘接剂,越能够显著地得到本发明的效果。在用粘接剂将树脂成形体1与金属基体4进行接合的情况下,代替外侧毛边21c、内侧毛边22c,使具有同样的功能的侧方接触部预先成形,利用粘接剂使侧方接触部粘接于金属基体4的侧面。或者,也可以将金属基体4压入到沿着树脂成形体1的外周以矩形框状形成的侧方接触部。此外,通过进行激光接合,能够降低电子控制装置100所使用的粘接剂的总量,能够实现低成本化、生产率的提高,所以优选为树脂成形体1与金属基体4激光接合。另外,能够在激光接合工序时形成具有作为与金属基体4的侧面接触的侧方接触部的功能的外侧毛边21c、内侧毛边22c,熔敷于金属基体4的侧面,所以根据生产率、紧贴性的观点也优选通过激光接合将树脂成形体1与金属基体4进行接合。
(变形例20)
在增大金属基体4的表面粗糙度的情况下,与将PC树脂、PET树脂等与PBT树脂同样的包含酯的树脂作为合金材料而成的树脂成形体1的接合强度的提高效果变大。这被认为是因为结晶化速度越慢则紧贴性提高的效果越大。因此,通过在不使成形性恶化的程度下并用PBT共聚物,从而使结晶化速度变慢,实现接合强度的提高也是有效的。但是,在使非结晶性树脂仅与PBT共聚物单体合金化的情况下,成形性大幅恶化,所以有效的是至少要并用。
只要不损害本发明的特征,本发明就不限定于上述实施方式,在本发明的技术的思想的范围内考虑的其它方式也包含于本发明的范围内。
下面的优先权基础申请的公开内容作为引用文而编入于此。
日本专利申请2015年第233565号(2015年11月30日申请)

Claims (15)

1.一种电子控制装置,具备树脂成形体、金属体以及电子构件,在所述电子控制装置中,
树脂成形体与金属体的主面接合,
与所述金属体的主面连续的侧面的至少一部分与设置于所述树脂成形体的侧方接触部接触。
2.根据权利要求1所述的电子控制装置,其中,
在所述树脂成形体以及所述金属体的任意一方设置有突起部,由所述树脂成形体以及所述金属体中的任意另一方与所述突起部夹持所述侧方接触部。
3.根据权利要求1所述的电子控制装置,其中,
在所述树脂成形体设置有突起部,由所述金属体的侧面与所述突起部夹持所述侧方接触部,
所述侧方接触部的取向与所述突起部的取向不同。
4.根据权利要求1所述的电子控制装置,其中,
由所述树脂成形体和所述金属体划分出收容所述电子构件的收容空间,
在所述金属体的外周部设置有台阶部,该台阶部是厚度比内侧的厚部薄的薄部形成于外侧而成的,
所述金属体的主面形成于所述薄部,
所述金属体的侧面具有所述薄部的侧面和所述厚部的侧面,
所述树脂成形体的侧方接触部具有与所述薄部的侧面的至少一部分接触的外侧接触部以及与所述厚部的侧面的至少一部分接触的内侧接触部。
5.根据权利要求1所述的电子控制装置,其中,
在所述金属体设置有朝向所述树脂成形体突出的至少1个以上的突出部,
所述突出部埋设于所述树脂成形体。
6.根据权利要求1所述的电子控制装置,其中,
所述金属体的侧面与所述树脂成形体的接触面积比所述金属体的主面与所述树脂成形体的接触面积大。
7.根据权利要求4所述的电子控制装置,其中,
所述金属体沿着所述收容空间具有朝向所述树脂成形体突出设置的环状的突出部和凹设在所述突出部的内侧的环状的槽。
8.根据权利要求1所述的电子控制装置,其中,
所述树脂成形体是含有结晶性树脂以及非结晶性树脂并被合金化而成的聚合物合金,
所述非结晶性树脂的玻璃转移温度比所述结晶性树脂的熔融开始温度低。
9.根据权利要求8所述的电子控制装置,其中,
所述聚合物合金的结晶化速度比均聚的结晶性树脂的结晶化速度低,或者所述聚合物合金的结晶化温度比均聚的结晶性树脂的结晶化温度低。
10.根据权利要求1所述的电子控制装置,其中,
在所述金属体的主面形成有至少1μm以上的氧化膜。
11.根据权利要求1所述的电子控制装置,其中,
所述电子控制装置形成有对所述树脂成形体的所述侧方接触部与所述金属体的接触界面的外缘进行封闭的封闭部。
12.一种电子控制装置的制造方法,所述电子控制装置具备树脂成形体、金属体以及电子构件,在所述电子控制装置的制造方法中,将电子构件配置于由所述树脂成形体和所述金属体划分出的收容空间,
在使所述树脂成形体与所述金属体的主面相互按压接触的状态下,对与所述主面相反一侧的面照射激光,
利用由所述激光产生的热使所述树脂成形体变形,使所述树脂成形体的变形部接触于与所述金属体的主面连续的侧面的一部分。
13.根据权利要求12所述的电子控制装置的制造方法,其中,
利用从所述金属体的侧面隔开预定的间隔而配置的所述树脂成形体的突起部或者夹具来限制所述树脂成形体的变形。
14.根据权利要求12所述的电子控制装置的制造方法,其中,
在所述金属体设置有朝向所述树脂成形体突出的第1突出部,
在与所述主面相反一侧的面,通过被照射所述激光而形成激光照射痕,
所述激光照射痕在沿所述第1突出部的突出方向投影时与所述第1突出部重叠。
15.根据权利要求14所述的电子控制装置的制造方法,其中,
所述金属体设置有朝向所述树脂成形体突出的第2突出部,
所述激光照射痕在沿所述第2突出部的突出方向投影时与所述第2突出部不重叠。
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