CN108140445B - 可焊接的聚合物厚膜铜导体组合物的光子烧结 - Google Patents

可焊接的聚合物厚膜铜导体组合物的光子烧结 Download PDF

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Publication number
CN108140445B
CN108140445B CN201680058281.3A CN201680058281A CN108140445B CN 108140445 B CN108140445 B CN 108140445B CN 201680058281 A CN201680058281 A CN 201680058281A CN 108140445 B CN108140445 B CN 108140445B
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China
Prior art keywords
thick film
polymer thick
composition
copper conductor
film copper
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Expired - Fee Related
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CN201680058281.3A
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English (en)
Chinese (zh)
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CN108140445A (zh
Inventor
徐世起
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DuPont Electronics Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/68—Particle size between 100-1000 nm
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/69—Particle size larger than 1000 nm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inorganic Insulating Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201680058281.3A 2015-08-13 2016-08-09 可焊接的聚合物厚膜铜导体组合物的光子烧结 Expired - Fee Related CN108140445B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562204583P 2015-08-13 2015-08-13
US62/204,583 2015-08-13
US14/862,259 US9637648B2 (en) 2015-08-13 2015-09-23 Photonic sintering of a solderable polymer thick film copper conductor composition
US14/862,259 2015-09-23
PCT/US2016/046121 WO2017027496A2 (en) 2015-08-13 2016-08-09 Photonic sintering of a solderable polymer thick film copper conductor composition

Publications (2)

Publication Number Publication Date
CN108140445A CN108140445A (zh) 2018-06-08
CN108140445B true CN108140445B (zh) 2020-04-14

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CN201680058281.3A Expired - Fee Related CN108140445B (zh) 2015-08-13 2016-08-09 可焊接的聚合物厚膜铜导体组合物的光子烧结

Country Status (5)

Country Link
US (1) US9637648B2 (https=)
EP (1) EP3335226B1 (https=)
JP (1) JP6737871B2 (https=)
CN (1) CN108140445B (https=)
WO (1) WO2017027496A2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019018613A1 (en) * 2017-07-20 2019-01-24 Molex, Llc DRY PROCESS FOR METALLIZING POLYMER THICK LAYER SURFACES

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1065280A (zh) * 1990-02-23 1992-10-14 旭化成工业株式会社 铜合金系组合物

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Publication number Priority date Publication date Assignee Title
EP0170063B1 (en) 1984-07-31 1988-08-24 Mitsubishi Petrochemical Co., Ltd. Copper-type conductive coating composition
JPH064791B2 (ja) 1985-09-30 1994-01-19 タツタ電線株式会社 導電塗料
JPS62230869A (ja) 1986-03-31 1987-10-09 Tatsuta Electric Wire & Cable Co Ltd 半田付可能な導電塗料
EP0239901B1 (en) 1986-03-31 1992-11-11 Tatsuta Electric Wire & Cable Co., Ltd Conductive copper paste composition
JPS6420276A (en) 1987-07-15 1989-01-24 Mitsubishi Petrochemical Co Copper-containing electroconductive coating composition
US5064469A (en) 1989-10-03 1991-11-12 Akzo N.V. Preparation of oxidation resistant metal powder
JPH0412595A (ja) 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
JPH0565456A (ja) * 1991-09-09 1993-03-19 Sumitomo Bakelite Co Ltd 気密封止用樹脂ペースト
US6344157B1 (en) * 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices
US7348373B2 (en) * 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
US7169330B2 (en) * 2004-02-25 2007-01-30 E. I. Du Pont De Nemours And Company Composition of conductive paste
JP5408878B2 (ja) 2004-11-24 2014-02-05 エヌシーシー ナノ， エルエルシー ナノ材料組成物の電気的使用、めっき的使用および触媒的使用
CN1835129B (zh) * 2005-03-16 2010-04-28 E.I.内穆尔杜邦公司 导电性浆状组合物
US8945686B2 (en) 2007-05-24 2015-02-03 Ncc Method for reducing thin films on low temperature substrates
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US20110180137A1 (en) 2010-01-25 2011-07-28 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
US10046418B2 (en) 2010-03-18 2018-08-14 Furukawa Electric Co., Ltd. Electrically conductive paste, and electrically conducive connection member produced using the paste
US8419981B2 (en) 2010-11-15 2013-04-16 Cheil Industries, Inc. Conductive paste composition and electrode prepared using the same
JP6028727B2 (ja) * 2011-05-18 2016-11-16 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
EP2785792B1 (en) 2011-12-02 2015-08-12 E. I. du Pont de Nemours and Company Conductive metal composition
US8551367B2 (en) * 2012-01-19 2013-10-08 E I Du Pont De Nemours And Company Polymer thick film solder alloy conductor composition
US20140018482A1 (en) * 2012-03-26 2014-01-16 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions
JP5700864B2 (ja) * 2013-05-15 2015-04-15 石原ケミカル株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions
JP2015032493A (ja) * 2013-08-05 2015-02-16 富士フイルム株式会社 導電膜形成用組成物およびそれを用いる導電膜の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1065280A (zh) * 1990-02-23 1992-10-14 旭化成工业株式会社 铜合金系组合物

Also Published As

Publication number Publication date
EP3335226A2 (en) 2018-06-20
EP3335226B1 (en) 2020-03-11
JP6737871B2 (ja) 2020-08-12
WO2017027496A2 (en) 2017-02-16
JP2018529001A (ja) 2018-10-04
WO2017027496A3 (en) 2017-07-20
US20170044384A1 (en) 2017-02-16
US9637648B2 (en) 2017-05-02
CN108140445A (zh) 2018-06-08

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