CN108084913A - 超薄聚酯双面胶带 - Google Patents

超薄聚酯双面胶带 Download PDF

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CN108084913A
CN108084913A CN201711293569.1A CN201711293569A CN108084913A CN 108084913 A CN108084913 A CN 108084913A CN 201711293569 A CN201711293569 A CN 201711293569A CN 108084913 A CN108084913 A CN 108084913A
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武玉洁
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Jiangsu Yi Nuoer Novel Material Science And Technology Ltd
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Abstract

本发明揭示了超薄聚酯双面胶带，包括基层、该基层的上下表面分别附有胶粘层，所述胶粘层的外表面设有离型纸，胶粘层的组份以及重量份数比为：高分子聚合物21‑34份、纳米陶瓷导热填料5‑10份、纳米金属导热填料6‑9份、偶联剂0.2‑0.4份、流平剂0.3‑0.5份、消泡剂0.3‑0.4份、促进剂0.6‑0.9份、软化剂1‑10份。本发明实现胶带高温持粘性能。

Description

超薄聚酯双面胶带
技术领域
本发明属于胶带制造技术领域，尤其涉及一种超薄聚酯双面胶带。
背景技术
双面胶带是由基材两面具有压敏粘性的胶层以及离型材料组成，是电子产品中常用的粘接材料。随着电子消费产品的迅猛发展，智能手机、IPAD等电子消费产品逐渐向薄型化发展，给作为电子产品不可缺少的粘接材料，双面胶带带来了巨大的挑战，即要求材料既薄又能满足高效能要求。
双面胶带在电子产品中的应用的挑战举例如下：①柔性线路板的固定：柔性线路板(简称FPC)应用可大幅缩小电子产品的体积和质量，随着电子产品的超薄化，FPC在产品所占的体积比例小之又小，双面胶带是固定FPC的重要材料，对其厚度的要求越来越严苛；②电子产品超薄化的同时，产品的散热也成为一大难题，双面胶带作为散热材料之间粘接的必要材料，其材料的薄厚直接影响产品的导热性能，同时也要求胶带的耐高温性能优异；③电子产品中的一些低表面能的精密零件需要特殊的固定和保护，对于双面胶带的粘接强度有极高的要求。以上例子可以看出，市场对于超薄高效能的双面胶的需求带越来越迫切。
传统双面胶带之厚度多为0.05-0.250mm,对于0.05mm以下的厚度双面胶带属于超薄双面胶带，但随着市场的不断发展，客户对厚度的要求越来越超薄化，目前市场上的厚度，都很难再低于0.015mm且剥离强度较弱、高温持粘力差。
发明内容
本发明的目的是为了解决上述技术问题，而提供一种超薄聚酯双面胶带，从而实现胶带高温持粘性能。为了达到上述目的，本发明技术方案如下：
超薄聚酯双面胶带，包括基层、该基层的上下表面分别附有胶粘层，所述胶粘层的外表面设有离型纸，胶粘层的组份以及重量份数比为：高分子聚合物21-34份、纳米陶瓷导热填料5-10份、纳米金属导热填料6-9份、偶联剂0.2-0.4份、流平剂0.3-0.5份、消泡剂0.3-0.4份、促进剂0.6-0.9份、软化剂1-10份。
具体的，所述高分子聚合物为聚乙烯、聚丙乙烯、环氧树脂、丁基橡胶混合物。
具体的，所述高分子聚合物中各组份的质量百分比为：聚乙烯15-22％、聚丙乙烯18-32％、环氧树脂25-40％、丁基橡胶10-33％。
具体的，所述基层为PET薄膜或聚氯乙烯薄膜。
具体的，所述纳米陶瓷导热填料为纳米氧化锆、纳米氧化铝、纳米氧化硅中一种或混合物。
具体的，所述纳米金属导热填料为纳米金属颗粒、纳米金属片中一种或混合物。
具体的，所述软化剂为环烷油。
与现有技术相比，本发明超薄聚酯双面胶带的有益效果主要体现在：制得的超薄聚酯双面胶带带的厚度为0.005-0.01mm，基层的厚度为0.001-0.002mm；胶带的可在70-80℃高温下长期使用，持粘性能优异，对于表面难粘材料同样具有良好粘贴性；采用一定比例的聚乙烯、聚丙乙烯、环氧树脂、丁基橡胶混合，增加纳米材质，使得胶粘层具有更好的耐热性能；纳米陶瓷和纳米金属的比例配置，使得胶粘层具有一定的抗剪能力和耐热能力；该胶带在此厚度下仍具有22W/(m·k)的导热系数，机械性能更好。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。
实施例1：
本实施例是超薄聚酯双面胶带，包括基层、该基层的上下表面分别附有胶粘层，所述胶粘层的外表面设有离型纸，胶粘层的组份以及重量份数比为：高分子聚合物21份、纳米陶瓷导热填料10份、纳米金属导热填料6份、偶联剂0.4份、流平剂0.3份、消泡剂0.4份、促进剂0.6份、软化剂10份。
其中，高分子聚合物为聚乙烯、聚丙乙烯、环氧树脂、丁基橡胶混合物。高分子聚合物中各组份的质量百分比为：聚乙烯15％、聚丙乙烯32％、环氧树脂25％、丁基橡胶28％。
基层为PET薄膜或聚氯乙烯薄膜。纳米陶瓷导热填料为纳米氧化锆、纳米氧化铝、纳米氧化硅中一种或混合物。纳米金属导热填料为纳米金属颗粒、纳米金属片中一种或混合物。软化剂为环烷油。使用环烷油在原料进行熔融反应时，软化效果显著。
实施例2：
本实施例是超薄聚酯双面胶带，包括基层、该基层的上下表面分别附有胶粘层，所述胶粘层的外表面设有离型纸，胶粘层的组份以及重量份数比为：高分子聚合物34份、纳米陶瓷导热填料5份、纳米金属导热填料9份、偶联剂0.2份、流平剂0.5份、消泡剂0.3份、促进剂0.9份、软化剂1份。
其中，高分子聚合物为聚乙烯、聚丙乙烯、环氧树脂、丁基橡胶混合物。高分子聚合物中各组份的质量百分比为：聚乙烯22％、聚丙乙烯18％、环氧树脂40％、丁基橡胶20％。
基层为PET薄膜或聚氯乙烯薄膜。纳米陶瓷导热填料为纳米氧化锆、纳米氧化铝、纳米氧化硅中一种或混合物。纳米金属导热填料为纳米金属颗粒、纳米金属片中一种或混合物。软化剂为环烷油。
实施例3：
本实施例是超薄聚酯双面胶带，包括基层、该基层的上下表面分别附有胶粘层，所述胶粘层的外表面设有离型纸，胶粘层的组份以及重量份数比为：高分子聚合物27份、纳米陶瓷导热填料7份、纳米金属导热填料7份、偶联剂0.3份、流平剂0.4份、消泡剂0.35份、促进剂0.7份、软化剂5份。
其中，高分子聚合物为聚乙烯、聚丙乙烯、环氧树脂、丁基橡胶混合物。高分子聚合物中各组份的质量百分比为：聚乙烯20％、聚丙乙烯22％、环氧树脂25％、丁基橡胶33％。
基层为PET薄膜或聚氯乙烯薄膜。纳米陶瓷导热填料为纳米氧化锆、纳米氧化铝、纳米氧化硅中一种或混合物。纳米金属导热填料为纳米金属颗粒、纳米金属片中一种或混合物。软化剂为环烷油。
以上实施例制得的超薄聚酯双面胶带带的厚度为0.005-0.01mm，基层的厚度为0.001-0.002mm；胶带的可在70-80℃高温下长期使用，持粘性能优异，对于表面难粘材料同样具有良好粘贴性；采用一定比例的聚乙烯、聚丙乙烯、环氧树脂、丁基橡胶混合，增加纳米材质，使得胶粘层具有更好的耐热性能；纳米陶瓷和纳米金属的比例配置，使得胶粘层具有一定的抗剪能力和耐热能力；该胶带在此厚度下仍具有22W/(m·k)的导热系数，机械性能更好。
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (7)

1.超薄聚酯双面胶带，其特征在于：包括基层、该基层的上下表面分别附有胶粘层，所述胶粘层的外表面设有离型纸，胶粘层的组份以及重量份数比为：高分子聚合物21-34份、纳米陶瓷导热填料5-10份、纳米金属导热填料6-9份、偶联剂0.2-0.4份、流平剂0.3-0.5份、消泡剂0.3-0.4份、促进剂0.6-0.9份、软化剂1-10份。
2.根据权利要求1所述的超薄聚酯双面胶带，其特征在于：所述高分子聚合物为聚乙烯、聚丙乙烯、环氧树脂、丁基橡胶混合物。
3.根据权利要求2所述的超薄聚酯双面胶带，其特征在于：所述高分子聚合物中各组份的质量百分比为：聚乙烯15-22％、聚丙乙烯18-32％、环氧树脂25-40％、丁基橡胶10-33％。
4.根据权利要求1所述的超薄聚酯双面胶带，其特征在于：所述基层为PET薄膜或聚氯乙烯薄膜。
5.根据权利要求1所述的超薄聚酯双面胶带，其特征在于：所述纳米陶瓷导热填料为纳米氧化锆、纳米氧化铝、纳米氧化硅中一种或混合物。
6.根据权利要求1所述的超薄聚酯双面胶带，其特征在于：所述纳米金属导热填料为纳米金属颗粒、纳米金属片中一种或混合物。
7.根据权利要求1所述的超薄聚酯双面胶带，其特征在于：所述软化剂为环烷油。
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