CN108067993B - 一种硅片双面处理装置 - Google Patents
一种硅片双面处理装置 Download PDFInfo
- Publication number
- CN108067993B CN108067993B CN201810021356.1A CN201810021356A CN108067993B CN 108067993 B CN108067993 B CN 108067993B CN 201810021356 A CN201810021356 A CN 201810021356A CN 108067993 B CN108067993 B CN 108067993B
- Authority
- CN
- China
- Prior art keywords
- guide rod
- base
- plate
- upper die
- servo motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning In General (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021356.1A CN108067993B (zh) | 2018-01-10 | 2018-01-10 | 一种硅片双面处理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021356.1A CN108067993B (zh) | 2018-01-10 | 2018-01-10 | 一种硅片双面处理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108067993A CN108067993A (zh) | 2018-05-25 |
| CN108067993B true CN108067993B (zh) | 2023-08-18 |
Family
ID=62156684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810021356.1A Active CN108067993B (zh) | 2018-01-10 | 2018-01-10 | 一种硅片双面处理装置 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108067993B (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110948239A (zh) * | 2019-12-26 | 2020-04-03 | 东莞市恩慈自动化设备有限公司 | 金属条自动上料磨洗一体机 |
| CN111941188A (zh) * | 2020-08-13 | 2020-11-17 | 谢祥松 | 一种卫浴管路接头成型精加工处理工艺 |
| CN112757536A (zh) * | 2021-01-20 | 2021-05-07 | 苏州华合家具配件有限公司 | 一种自动摇模系统 |
| CN113352189A (zh) * | 2021-07-12 | 2021-09-07 | 张国华 | 一种智能制造用烧结磨平设备 |
| CN113263399B (zh) * | 2021-07-20 | 2021-09-21 | 长沙瑞楚精密机械有限公司 | 一种铝制件用调节式夹紧打磨装置 |
| CN114131445A (zh) * | 2021-12-09 | 2022-03-04 | 衢州学院 | 一种用于硅片的研磨清洗装置 |
| CN115157056A (zh) * | 2022-09-07 | 2022-10-11 | 江苏浩纳光电股份有限公司 | 玻璃非球面光学镜片形状测定装置 |
| CN117340761B (zh) * | 2023-12-06 | 2024-02-23 | 潍坊昌大建设集团有限公司 | 一种全自动钢筋除锈机 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001091970A1 (en) * | 2000-05-31 | 2001-12-06 | Sumitomo Mitsubishi Silicon Corporation | Method of polishing semiconductor wafers by using double-sided polisher |
| CN101352828A (zh) * | 2008-08-01 | 2009-01-28 | 无锡开源机床集团有限公司 | 一种半导体晶片与吸盘表面清洗打磨装置 |
| CN105479313A (zh) * | 2016-01-13 | 2016-04-13 | 湖南宇晶机器股份有限公司 | 一种立式双面磨床 |
| CN106111607A (zh) * | 2016-08-30 | 2016-11-16 | 苏州市相城区姑苏线路板厂 | 一种旋转式pcb板自动清洗装置 |
-
2018
- 2018-01-10 CN CN201810021356.1A patent/CN108067993B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001091970A1 (en) * | 2000-05-31 | 2001-12-06 | Sumitomo Mitsubishi Silicon Corporation | Method of polishing semiconductor wafers by using double-sided polisher |
| CN101352828A (zh) * | 2008-08-01 | 2009-01-28 | 无锡开源机床集团有限公司 | 一种半导体晶片与吸盘表面清洗打磨装置 |
| CN105479313A (zh) * | 2016-01-13 | 2016-04-13 | 湖南宇晶机器股份有限公司 | 一种立式双面磨床 |
| CN106111607A (zh) * | 2016-08-30 | 2016-11-16 | 苏州市相城区姑苏线路板厂 | 一种旋转式pcb板自动清洗装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108067993A (zh) | 2018-05-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230725 Address after: 89 Tonggang Avenue, Jiangkou street, Guichi District, Chizhou City, Anhui Province Applicant after: Chizhou Xingju Information Technology Service Co.,Ltd. Address before: 215000 Shunle Road, Jujin Industrial Park, Taiping Street, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20250717 Address after: 518100 Guangdong Province Shenzhen City Bao'an District Fuhai Street Rentai Community Industrial Park No. 68 3rd Floor Patentee after: Shenzhen Zhengke Hongda Technology Co.,Ltd. Country or region after: China Address before: 89 Tonggang Avenue, Jiangkou street, Guichi District, Chizhou City, Anhui Province Patentee before: Chizhou Xingju Information Technology Service Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |