CN108067746B - 基板的加工方法 - Google Patents
基板的加工方法 Download PDFInfo
- Publication number
- CN108067746B CN108067746B CN201711120517.4A CN201711120517A CN108067746B CN 108067746 B CN108067746 B CN 108067746B CN 201711120517 A CN201711120517 A CN 201711120517A CN 108067746 B CN108067746 B CN 108067746B
- Authority
- CN
- China
- Prior art keywords
- substrate
- layer
- mark
- processing
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H7/00—Marking-out or setting-out work
- B25H7/04—Devices, e.g. scribers, for marking
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016221994 | 2016-11-15 | ||
JP2016-221994 | 2016-11-15 | ||
JP2017-171782 | 2017-09-07 | ||
JP2017171782A JP6986393B2 (ja) | 2016-11-15 | 2017-09-07 | 基板の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108067746A CN108067746A (zh) | 2018-05-25 |
CN108067746B true CN108067746B (zh) | 2022-06-03 |
Family
ID=62236780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711120517.4A Active CN108067746B (zh) | 2016-11-15 | 2017-11-13 | 基板的加工方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6986393B2 (ja) |
KR (1) | KR102345170B1 (ja) |
CN (1) | CN108067746B (ja) |
TW (1) | TWI794192B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110202538B (zh) * | 2019-06-24 | 2023-07-21 | 南京万物生长孵化器管理有限公司 | 一种夹层玻璃生产用标记工具 |
WO2021025052A1 (ja) * | 2019-08-07 | 2021-02-11 | 株式会社カネカ | 大判成膜基板およびその製造方法、分割成膜基板およびその製造方法、分割成膜基板の生産管理方法および生産管理システム |
CN110482851A (zh) * | 2019-09-03 | 2019-11-22 | 拓米(成都)应用技术研究院有限公司 | 网格掩墨喷涂治具及基于网格掩墨喷涂治具的切割加工方法 |
CN114425655A (zh) * | 2020-10-29 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | 一种脆性材料的激光标记方法及激光标记系统 |
CN113620585B (zh) * | 2021-08-26 | 2023-03-14 | 宁波舜宇奥来技术有限公司 | 皮秒激光切割玻璃的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008140130A (ja) * | 2006-12-01 | 2008-06-19 | Alps Electric Co Ltd | 入力装置及びその製造方法 |
JP2013109460A (ja) * | 2011-11-18 | 2013-06-06 | Shin Etsu Polymer Co Ltd | 透明配線シート |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE362653T1 (de) * | 2002-03-12 | 2007-06-15 | Hamamatsu Photonics Kk | Methode zur trennung von substraten |
JP4048873B2 (ja) * | 2002-08-08 | 2008-02-20 | 松下電器産業株式会社 | 位置決め加工方法 |
JP2007007776A (ja) | 2005-06-30 | 2007-01-18 | Alps Engineering Co Ltd | アライメントマークの形成方法 |
JP5332238B2 (ja) * | 2007-03-29 | 2013-11-06 | 三星ダイヤモンド工業株式会社 | レーザー加工装置 |
JP2009063692A (ja) * | 2007-09-05 | 2009-03-26 | Seiko Epson Corp | 電気光学装置の製造方法及び製造装置 |
JP2011098381A (ja) * | 2009-11-06 | 2011-05-19 | Sumitomo Bakelite Co Ltd | ガラス繊維強化樹脂フィルムおよびその切断方法、ならびにガラス繊維強化樹脂パネルおよびその製造方法 |
US8048778B1 (en) * | 2010-12-10 | 2011-11-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of dicing a semiconductor structure |
KR20120096699A (ko) * | 2011-02-23 | 2012-08-31 | 스템코 주식회사 | 연성금속적층판에 비아홀을 형성하기 위한 자외선 레이저를 이용한 드릴링 방법 |
US20130005139A1 (en) * | 2011-06-30 | 2013-01-03 | Guardian Industries Corp. | Techniques for manufacturing planar patterned transparent contact and/or electronic devices including same |
US9911550B2 (en) * | 2012-03-05 | 2018-03-06 | Apple Inc. | Touch sensitive device with multiple ablation fluence values |
TW201339111A (zh) * | 2012-03-29 | 2013-10-01 | Global Display Co Ltd | 強化玻璃的切割方法 |
CN103567642B (zh) * | 2012-08-08 | 2017-07-11 | 赛恩倍吉科技顾问(深圳)有限公司 | 蓝宝石切割装置 |
CN102815863A (zh) * | 2012-10-17 | 2012-12-12 | 黄石瑞视光电技术股份有限公司 | 触摸屏ito玻璃带膜切割方法 |
CN102955201B (zh) * | 2012-11-28 | 2015-04-15 | 索尔思光电(成都)有限公司 | 具有扩大光束缓冲区域的光隔离器及其制作方法 |
GB2509985A (en) * | 2013-01-22 | 2014-07-23 | M Solv Ltd | Method of forming patterns on coatings on opposite sides of a transparent substrate |
KR102107766B1 (ko) * | 2013-07-09 | 2020-05-27 | 삼성디스플레이 주식회사 | 밀봉장치 및 그를 이용한 표시장치의 제조방법 |
TWM479450U (zh) * | 2013-11-21 | 2014-06-01 | Emerging Display Tech Corp | 抗雷射蝕刻損傷的雙層單板式觸控面板 |
US20150305166A1 (en) * | 2014-04-22 | 2015-10-22 | Carestream Health, Inc. | Laser patterning of dual sided transparent conductive films |
KR20160126175A (ko) * | 2015-04-22 | 2016-11-02 | 삼성디스플레이 주식회사 | 기판 절단 방법 및 표시 장치 제조 방법 |
US11904410B2 (en) * | 2015-10-07 | 2024-02-20 | Corning Incorporated | Laser surface preparation of coated substrate |
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2017
- 2017-09-07 JP JP2017171782A patent/JP6986393B2/ja active Active
- 2017-11-01 KR KR1020170144718A patent/KR102345170B1/ko active IP Right Grant
- 2017-11-13 CN CN201711120517.4A patent/CN108067746B/zh active Active
- 2017-11-14 TW TW106139374A patent/TWI794192B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008140130A (ja) * | 2006-12-01 | 2008-06-19 | Alps Electric Co Ltd | 入力装置及びその製造方法 |
JP2013109460A (ja) * | 2011-11-18 | 2013-06-06 | Shin Etsu Polymer Co Ltd | 透明配線シート |
Also Published As
Publication number | Publication date |
---|---|
TW201819086A (zh) | 2018-06-01 |
KR102345170B1 (ko) | 2021-12-30 |
JP2018083228A (ja) | 2018-05-31 |
KR20180054442A (ko) | 2018-05-24 |
CN108067746A (zh) | 2018-05-25 |
TWI794192B (zh) | 2023-03-01 |
JP6986393B2 (ja) | 2021-12-22 |
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