CN108067746B - 基板的加工方法 - Google Patents

基板的加工方法 Download PDF

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Publication number
CN108067746B
CN108067746B CN201711120517.4A CN201711120517A CN108067746B CN 108067746 B CN108067746 B CN 108067746B CN 201711120517 A CN201711120517 A CN 201711120517A CN 108067746 B CN108067746 B CN 108067746B
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China
Prior art keywords
substrate
layer
mark
processing
glass substrate
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Chinese (zh)
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CN108067746A (zh
Inventor
市川健一
立石薰
伊藤靖
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Via Mechanics Ltd
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Via Mechanics Ltd
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/389Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/102Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035Aligning the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25HWORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H7/00Marking-out or setting-out work
    • B25H7/04Devices, e.g. scribers, for marking
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced
    • B23K2103/166Multilayered materials
    • B23K2103/172Multilayered materials wherein at least one of the layers is non-metallic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074Glass products comprising an outer layer or surface coating of non-glass material
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00Methods for coating glass
    • C03C2218/30Aspects of methods for coating glass not covered above
    • C03C2218/32After-treatment
    • C03C2218/328Partly or completely removing a coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201711120517.4A 2016-11-15 2017-11-13 基板的加工方法 Active CN108067746B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016221994 2016-11-15
JP2016-221994 2016-11-15
JP2017-171782 2017-09-07
JP2017171782A JP6986393B2 (ja) 2016-11-15 2017-09-07 基板の加工方法

Publications (2)

Publication Number Publication Date
CN108067746A CN108067746A (zh) 2018-05-25
CN108067746B true CN108067746B (zh) 2022-06-03

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CN201711120517.4A Active CN108067746B (zh) 2016-11-15 2017-11-13 基板的加工方法

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JP (1) JP6986393B2 (ja)
KR (1) KR102345170B1 (ja)
CN (1) CN108067746B (ja)
TW (1) TWI794192B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110202538B (zh) * 2019-06-24 2023-07-21 南京万物生长孵化器管理有限公司 一种夹层玻璃生产用标记工具
WO2021025052A1 (ja) * 2019-08-07 2021-02-11 株式会社カネカ 大判成膜基板およびその製造方法、分割成膜基板およびその製造方法、分割成膜基板の生産管理方法および生産管理システム
CN110482851A (zh) * 2019-09-03 2019-11-22 拓米(成都)应用技术研究院有限公司 网格掩墨喷涂治具及基于网格掩墨喷涂治具的切割加工方法
CN114425655A (zh) * 2020-10-29 2022-05-03 大族激光科技产业集团股份有限公司 一种脆性材料的激光标记方法及激光标记系统
CN113620585B (zh) * 2021-08-26 2023-03-14 宁波舜宇奥来技术有限公司 皮秒激光切割玻璃的方法

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JP2008140130A (ja) * 2006-12-01 2008-06-19 Alps Electric Co Ltd 入力装置及びその製造方法
JP2013109460A (ja) * 2011-11-18 2013-06-06 Shin Etsu Polymer Co Ltd 透明配線シート

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JP4048873B2 (ja) * 2002-08-08 2008-02-20 松下電器産業株式会社 位置決め加工方法
JP2007007776A (ja) 2005-06-30 2007-01-18 Alps Engineering Co Ltd アライメントマークの形成方法
JP5332238B2 (ja) * 2007-03-29 2013-11-06 三星ダイヤモンド工業株式会社 レーザー加工装置
JP2009063692A (ja) * 2007-09-05 2009-03-26 Seiko Epson Corp 電気光学装置の製造方法及び製造装置
JP2011098381A (ja) * 2009-11-06 2011-05-19 Sumitomo Bakelite Co Ltd ガラス繊維強化樹脂フィルムおよびその切断方法、ならびにガラス繊維強化樹脂パネルおよびその製造方法
US8048778B1 (en) * 2010-12-10 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of dicing a semiconductor structure
KR20120096699A (ko) * 2011-02-23 2012-08-31 스템코 주식회사 연성금속적층판에 비아홀을 형성하기 위한 자외선 레이저를 이용한 드릴링 방법
US20130005139A1 (en) * 2011-06-30 2013-01-03 Guardian Industries Corp. Techniques for manufacturing planar patterned transparent contact and/or electronic devices including same
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JP2013109460A (ja) * 2011-11-18 2013-06-06 Shin Etsu Polymer Co Ltd 透明配線シート

Also Published As

Publication number Publication date
TW201819086A (zh) 2018-06-01
KR102345170B1 (ko) 2021-12-30
JP2018083228A (ja) 2018-05-31
KR20180054442A (ko) 2018-05-24
CN108067746A (zh) 2018-05-25
TWI794192B (zh) 2023-03-01
JP6986393B2 (ja) 2021-12-22

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