CN108063123A - The structure design of cracking is prevented during plastic packaging electronic device Reflow Soldering - Google Patents
The structure design of cracking is prevented during plastic packaging electronic device Reflow Soldering Download PDFInfo
- Publication number
- CN108063123A CN108063123A CN201711029788.9A CN201711029788A CN108063123A CN 108063123 A CN108063123 A CN 108063123A CN 201711029788 A CN201711029788 A CN 201711029788A CN 108063123 A CN108063123 A CN 108063123A
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- CN
- China
- Prior art keywords
- electronic device
- plastic packaging
- packaging electronic
- reflow soldering
- cracking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The title of the present invention is " structure design that cracking is prevented during plastic packaging electronic device Reflow Soldering ", prevents from cracking and obtaining the technical field of high reliability when belonging to plastic packaging electronic device Reflow Soldering.When the undesirable electronic device of reliability is finally soldered on a printed-wiring board by infrared reflow soldering oven, the critical defects such as crackle, delamination, bulging will occur.Holder of the present invention thinks that the real primary factor for determining plastic packaging electronic device Reflow Soldering reliability is its " structural strength ".It designs reasonable, as perfect as possible and with high intensity plastic packaging electronic device structure in structure and can be achieved with the technical barrier without cracking during its Reflow Soldering.Attached drawing 1 is the shape and sectional view of a typical plastic packaging electronic device, and the thickness of plastic-sealed body determines its structural strength.The present invention can fundamentally solve problem of Cracking, and provide condition for the application of Pb-free solder.
Description
Technical field：
It prevents from cracking and obtaining the technical field of high reliability during plastic packaging electronic device Reflow Soldering.
Background technology：
Reliability of the plastic packaging electronic device in Reflow Soldering is one of most concerned problem in electronics industry.When reliability not
When good electronic device is finally soldered on a printed-wiring board by infrared reflow soldering oven, such as crackle will occur, take off
The critical defects such as layer, bulging." steam effect " theory prevailing thinks about since half a century, and device during Reflow Soldering is caused to lose
The reason for effect is：As plastic packaging electronics after the polymer of capsulation material, such as epoxy resin mould produced compounds etc. namely plastic packaging
Plastic-sealed body on device, with the strong performance that steam is absorbed from air when in wet environment, and absorb
Steam can inwardly be spread along plastic-sealed body inside and the interface of plastic-sealed body and pin.Cause when Reflow Soldering in quick heating
Thermal stress under the action of steam can expand and cause device plastic-sealed body crack.Then the prebake before Reflow Soldering becomes naturally
Prevent the important means of component failure.
However, the long-term practice in device production shows that, for some plastic packaging electronic devices, the prebake before Reflow Soldering has
Certain effect, it appears that can prevent from cracking；And for some plastic packaging electronic devices, prebake when small (general 8 to 16), very
It can not avoid cracking to long-term prebake more than when small (extend to 24).Then, someone give a strained interpretation plastic packaging electronics device
Part is divided into two classes：Insensitive to steam and sensitive.
The purpose of innovation and creation：
Holder of the patent right of the present invention was once an encapsulation engineer, was run into work experience for many years a lot of long-term
" prebake " can not avoid some the production cases to fail during plastic packaging electronic device Reflow Soldering.Holder of the patent right of the present invention determines
Surely change thinking, observation problem is removed with the viewpoint of " structural strength " and go to handle them using the method for improved structure, exceed to anticipate
Material, problem of Cracking are but all smoothly solved.Then it is that the mankind recognize plastic packaging electronic reliability to think " steam is theoretical "
On one " mistaken ideas ", and determine that the real primary factor of plastic packaging electronic device Reflow Soldering reliability is its " structural strength ".
" structural strength " theory that holder of the patent right of the present invention proposes is to the negative of " steam effect " theory and overturns, energy
Enough integrity problems for thoroughly solving plastic packaging electronic device in Reflow Soldering and need not any prebake.Moreover it is possible to it is energy saving,
It saves heating equipment and production site investment and shortens production cycle etc..It is the original of Chinese, is that western countries should
The electronic technology field for learning to us and integrating with China.As long as it is done according to the cognition and method of this patent, centainly
The plastic packaging electronic device of perfect cracking resistance can be designed, is finally reached without cracking China Electronics or even without cracking world electricity
The target of son.
The content of the invention：
General plastic packaging electronic device is as shown in Figure 1.It includes electronic component, binding agent, pin, wiring board and plastic-sealed body
Deng.This patent (see Fig. 2) likens plastic-sealed body to one building, it plays storage and protective effect to the element in it, and
It is contacted by pin and the external world, realizes the electrical attributes of device.If it is subject to breakage, entire device also just fails.
Therefore its structural strength plays conclusive effect to the reliability of entire device.When plastic packaging electronic device in temperature drastically
When being brazed in the reflow soldering of variation, the thermal stress that inside is formed will be very huge, just as building experienced once by force
Strong earthquake is the same, and only those can be just survived with sufficiently solid structure person just with excellent reliability without falling
It collapses.
Therefore, every structure design that can increase plastic-sealed body intensity, it becomes possible to improve the reliability of plastic packaging electronic device；
Conversely, those every weakening structure designs of plastic-sealed body intensity or other factors (such as bad process), just necessarily reduce
The reliability of plastic packaging electronic device causes the failure phenomenon of most serious -- cracking.
The thickness of plastic-sealed body plays decisive role to its structural strength, and thickness is bigger, and intensity is higher.But electronics industry
More Bao Yuehao is wished in requirement to device miniaturization again.Therefore, reasonably select thickness particularly significant.Moreover plastic packaging body thickness
The defects of being also easy to cause dimple or shrinkage cavity during excessive device plastic packaging.In addition, Rational Thickness and the size of device have
It closes, size is bigger, and Rational Thickness also should be bigger.In general, when device full-size changes between 10mm to 25mm
When, the excursion of Rational Thickness is 0.3mm to 1mm.
It names several since mistake design or bad technique are thinned thickness to form weakness so as to reducing reliability
Example：
Description of the drawings：
Fig. 1 is the shape and sectional view of a typical plastic packaging electronic device.
Fig. 2 is the package body structure sectional view of a typical plastic packaging electronic device.
It is that the excessively thin weakness of thickness is formed at the top of plastic-sealed body since binding agent is excessive shown in Fig. 3, is easy to crack herein.
It is the mistake design that pin root is widened shown in Fig. 4.Pin bores are the door and windows of building.The pin widened reduces
The area of section of plastic-sealed body die joint makes natively weak die joint more fragile, is easy to generate under rugged environment
Plastic-sealed body is to dividing.
Be shown in Fig. 5 designer in order to which internal element is easy to assembly and a box is scheduled in element surrounding, so will
Reduce plastic-sealed body upper thickness, plastic-sealed body lower part (thickness general goal) strong contraction during Reflow Soldering causes huge pulling force on top
And cause flexural deformation or even cracking.
It is the long pin design in end shown in Fig. 6, they are deeply inserted into plastic-sealed body top, stress concentration formed here
Be easy to cracking weakness.
Plastic-sealed body intensity can be increased so as to improve the example of the excellent configuration of reliability design by naming two：
Fig. 7 is that a height is small and the example of the length and width dimensions plastic packaging electronic device good design with wiring board greatly.Line
The suitable through hole for not influencing configuration again of several diameters is provided on the plate of road.It is moulded in plastic packaging by through hole on top
Attachment as forming the pull rod in similar building is sealed between body and lower part plastic-sealed body, upper and lower plastic-sealed body is linked to be entirety.
This structure design can greatly improve its reliability and anti-crack ability.Meanwhile the setting of through hole plastic packaging material when also helping plastic packaging
Expect the balanced flowing of polymer, avoid generating surface defect.
Fig. 8 is the example of the bigger plastic packaging electronic device good design with wiring board of a height and length and width dimensions
Son.His the advantages of, is similar with Fig. 7.
All plastic packaging electronic devices in Current electronic industry can be scientifically divided into two with " structural strength " is theoretical
Class：Rational in infrastructure and unreasonable (if Fig. 3 is to shown in Fig. 6).This give a strained interpretation with " steam effect " theory them
Two classes (insensitive to steam and sensitive) of division are perfectly in harmony, however, they have the difference of essence again.At present,
It can produce in enormous quantities in electronics industry and the plastic packaging electronic device with good reliability is all with rational structure, nothing
Palpus prebake can just pass through reflow soldering, and therefore, the prebake of " steam effect " theory provision is extra, is one
Kind time, the waste of the energy and facility.Unlike, the device of unreasonable structure can be improved by structure, become reasonable
, make it that also there is good reliability.And (to water vapor sensitive) device of unreasonable structure using long-term prebake not yet
Its reliability can be improved.
At present, global electronics industry (particularly European Union member countries) all makees the small lead-free solder of popularization environmental pollution
It is grabbed for top priority.Using lead-free solder plastic packaging electronic device Reflow Soldering when peak temperature with using there is lead solder weldering
The plastic packaging electronic device of material, which will be compared, to be increased to 260 DEG C or so by 230 DEG C or so.This will be to the reliability of plastic packaging electronic device
It is proposed more stern challenge.Very much " steam effect " it is theoretical be regarded to survive reluctantly originally to " steam is insensitive "
Device " will be difficult to pass through ".And economical it can will establish heavily fortified point for it with " structural strength " theory that is thoroughly solving integrity problem
Real basis.
Claims (5)
1. the present invention is set using " structural strength " theory with existing " steam effect " theoretical oneself completely different proposition
Meter or the structure for improving plastic packaging electronic device are asked with looking forward to thoroughly solving reliability cracking of the plastic packaging electronic device in Reflow Soldering
Topic.
2. the meeting according to claim 1, listed in this patent reduces example and the improvement of the Poor structure design of reliability
Method.
3. the plastic packaging electronic device structure globality that can increase according to claim 1, listed in this patent improves reliably
The excellent design of property.
4. after according to claim 1, being improved using correct structure design or to poor design, reliability greatly improves,
Not according still further to " steam effect " theoretical cognition for carrying out prebake and method.
5. according to claim 1, since device architecture is reasonable, reliability greatly improves, the popularization and application to Pb-free solder
Cognition and the method for primary condition are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711029788.9A CN108063123A (en) | 2017-10-30 | 2017-10-30 | The structure design of cracking is prevented during plastic packaging electronic device Reflow Soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711029788.9A CN108063123A (en) | 2017-10-30 | 2017-10-30 | The structure design of cracking is prevented during plastic packaging electronic device Reflow Soldering |
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|---|---|
| CN108063123A true CN108063123A (en) | 2018-05-22 |
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|---|---|---|---|
| CN201711029788.9A Pending CN108063123A (en) | 2017-10-30 | 2017-10-30 | The structure design of cracking is prevented during plastic packaging electronic device Reflow Soldering |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06204272A (en) * | 1993-01-07 | 1994-07-22 | Matsushita Electron Corp | Manufacture of semiconductor device |
| JPH06224237A (en) * | 1993-01-26 | 1994-08-12 | Matsushita Electric Works Ltd | Semiconductor device |
| JP2006165592A (en) * | 2006-01-23 | 2006-06-22 | Hitachi Chem Co Ltd | Method for manufacturing component having etching bump group |
| CN102347304A (en) * | 2010-07-29 | 2012-02-08 | Nxp股份有限公司 | Leadless chip carrier with improved installability |
| CN102820288A (en) * | 2011-06-10 | 2012-12-12 | 三菱电机株式会社 | Power module and manufacturing method thereof |
| CN203013708U (en) * | 2012-09-17 | 2013-06-19 | 比亚迪股份有限公司 | Semiconductor die package |
-
2017
- 2017-10-30 CN CN201711029788.9A patent/CN108063123A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06204272A (en) * | 1993-01-07 | 1994-07-22 | Matsushita Electron Corp | Manufacture of semiconductor device |
| JPH06224237A (en) * | 1993-01-26 | 1994-08-12 | Matsushita Electric Works Ltd | Semiconductor device |
| JP2006165592A (en) * | 2006-01-23 | 2006-06-22 | Hitachi Chem Co Ltd | Method for manufacturing component having etching bump group |
| CN102347304A (en) * | 2010-07-29 | 2012-02-08 | Nxp股份有限公司 | Leadless chip carrier with improved installability |
| CN102820288A (en) * | 2011-06-10 | 2012-12-12 | 三菱电机株式会社 | Power module and manufacturing method thereof |
| CN203013708U (en) * | 2012-09-17 | 2013-06-19 | 比亚迪股份有限公司 | Semiconductor die package |
Non-Patent Citations (3)
| Title |
|---|
| 张延赤: """水汽"或"结构"对塑封微电子器件可靠性的影响研究"", 《现代表面贴装资讯》 * |
| 张延赤: "水汽或结构对塑封电子器件可靠性的影响研究", 《电子产品可靠性与环境试验》 * |
| 王晓珍: "军用塑封电路分层及可靠性方法研究", 《电子工艺技术》 * |
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Application publication date: 20180522 |