CN108063095A - 一种智能融合传感器芯片的封装方法 - Google Patents
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Abstract
本发明涉及一种智能融合传感器芯片的封装,属于系统级封装技术。封装由处理器、多种功能芯片、电源管理芯片、基板、粘接剂、焊接材料、邦定线、管脚、封装体组成,其中处理器芯片、多种功能芯片、电源管理芯片均为裸片;封装分两次,首先将电源管理芯片用粘接剂固定于底层基板并进行邦定,单独封装一次,管脚分布于电源层基板周边;其次将处理器芯片、多种功能芯片按面积从大到小从下至上纵向叠放于顶层基板,芯片与芯片之间及芯片与基板之间用粘接剂固定并进行邦定;然后将顶层和电源层用焊接材料进行连接固定,最后用封装体对连接好的顶层和电源层进行封装形成智能融合传感器芯片:封装过程中每次邦定和焊接完成均要进行检测和清洗,保证良率。
Description
技术领域
本发明公开一种智能融合传感器芯片的封装方法,具体涉及智能融合传感器芯片的系统级封装(system in package,SIP)技术。
背景技术
数十年来,集成电路封装技术一直追随芯片的发展而进展,封装密度不断提高,从单芯片封装向多芯片封装拓展,市场化对接芯片与应用需求,兼容芯片的数量集成和功能集成,为封装领域提供出又一种不同的创新方法。
系统级封装是将多种功能芯片,包括处理器、传感器、存储器等功能芯片集成在一个封装内,从而实现一个基本完整的功能。近年来,SIP产品的市场需求迅猛增长。以前,SIP的产品通常主要应用相对较小的PCB设计及低功耗产品应用中,如:手机,数码摄像机,汽车电子等。当前智能融合芯片开发不断遇到成本,散热设计,研发时间不够等严重影响项目开发的风险问题。因此,大部分开发者便在针对应用产品设计时,也主要考虑使用SIP的设计方式,从而进一步降低系统的成本及提高可靠性。
SIP封装综合运用现有的芯片资源及多种先进封装技术的优势,有机结合起来由几个芯片组成的系统构筑而成的封装,开拓了一种低成本系统集成的可行思路与方法,较好地解决了SOC中诸如工艺兼容、信号混合、电磁干扰EMI、芯片体积、开发成本等问题,在移动通信、蓝牙模块、网络设备、计算机及外设、数码产品、传感器等方面有很大的市场需求量。
发明内容
本发明的目的是提供一种体积更小、成本更低、效率更高、可靠性更好的智能融合传感器芯片的系统级封装方法。
本发明解决上述问题所采用的技术方案是:
一种智能融合传感器芯片的封装方法,其特征在于:
所述智能融合传感器芯片封装由处理器芯片、多种功能芯片、电源管理芯片、基板、粘接剂、焊接材料、邦定线、管脚、封装体组合而成;
所述处理器芯片、多种功能芯片、电源管理芯片均为裸片,即集成电路晶圆经过切割测试后没有经过封装的芯片;
所述基板为印刷电路板,分为两层,底层用于承载电源管理芯片,用粘接剂固定,进行单独封装,形成电源层;顶层用于承载处理器芯片、多种功能芯片,各芯片按面积从大到小由下至上纵向叠放,芯片与芯片之间及芯片与基板之间用粘接剂固定,两层基板之间通过焊接材料进行连接;
所述粘接剂是一种导热聚烯化合物,用于芯片和基板之间及芯片和芯片之间的连接固定,同时将芯片的热量扩散到外部;
所述焊接材料为锡合金,用于两层基板之间的连接固定,同时实现电气和信号连接;
所述邦定线为金属线,用于分别将处理器芯片、多种功能芯片和顶层基板连接,将电源管理芯片和底层基板连接;
所述管脚为金属丝或金属压焊点,焊接或涂敷在底层基板周边,通过印刷电路、焊接材料和邦定线与处理器芯片、多种功能芯片、电源管理芯片等裸片连接;
所述封装体为高分子材料、金属材料或陶瓷材料,分为电源封装和整体封装,用于包裹处理器芯片、多种功能芯片、电源管理芯片、基板、邦定线等元件。
封装过程包括如下步骤;
(1)预清洗,将准备好的处理器芯片、多种功能芯片、电源管理芯片等裸片和两块基板,使用等离子清洗机通过物理或化学作用对表面进行处理,实现分子水平的污染物去除;
(2)点胶,将准备好的处理器芯片、多种功能芯片、电源管理芯片等裸片背面用点胶机涂上适量粘接剂,同时将适量的粘接剂涂在基板对应芯片放置的位置上;
(3)粘芯片,用防静电真空吸嘴将电源管理芯片裸片正确放在底层基板上,然后将处理器芯片、多种功能芯片等裸片按面积从大到小从下至上依次正确纵向叠放在顶层基板上;
(4)固化,将粘好裸片的带件基板放入热循环烘箱中放在大平面加热板上恒温静置一段时间,或自然固化;
(5)邦定,用焊线机焊接邦定线,将处理器芯片、多种功能芯片、电源管理芯片等裸片与基板上对应的焊盘进行桥接,形成COB板;
(6)前测,使用专用检测工具检测邦定好的两层COB板,返修检测不良品;
(7)中清洗,使用等离子清洗机对COB板通过物理或化学作用对工件表面进行处理,实现分子水平的污染物去除,从而提高工件表面活性;
(8)电源层封装,将检测好的底层COB板放入预置模具,使用封装体将其按预设封装形式进行封装成型;
(9)电源层固化,将封装成型的电源层放入热循环烘箱中恒温静置,使封装体固化;
(10)板连接,将顶层COB板和固化好的电源层用焊接材料将两块基板上设计好的对应焊盘进行连接,并放入回流焊炉进行焊接固化;
(11)中测,使用专用检测工具检测连接好的两层COB板,返修检测不良品;
(12)后清洗,使用超声波清洗机和超声波清洗剂,利用超声波的高频振荡产生的清洗效果来完成清洗,使焊接点上及细缝中的助焊剂和污物脱离下来,并溶解这些污物;
(13)整体封装,将连接好的顶层COB板和电源层放入预置模具,使用封装体将其按预设封装形式进行封装成型;
(14)整体固化,将封装成型的智能融合传感器芯片放入热循环烘箱中恒温静置,使封装体固化;
(15)后测,将封装固化好的智能融合传感器芯片再用专用的检测工具进行电气性能测试,剔除不良品;
(16)打标,使用打标设备对检测合格的智能融合传感器芯片顶部进行标识印刻。
本发明的有益效果在于:
(1)缩小了融合传感器的体积
本发明的封装方法使用不同功能的裸片纵向堆叠,缩小了基板的使用面积,实现了一个系统的功能,比传统融合传感器基于系统电路的制造方法体积大大缩小。
(2)降低了智能融合传感器的成本
本发明的封装方法使用了经过切割与检测的裸片,通过邦定与基板连接,相比单晶片的系统级芯片,研发成本和研发周期及制造成本均大为下降。
(3)提高了智能融合传感器的可靠性
本发明的封装方法设计了独立电源层,使得功能芯片和电源芯片之间进行了良好的隔离,处理器芯片和多种功能芯片之间的粘接剂同时起到隔离作用,这样大大降低了融合传感器芯片之间的信号干扰,提高了整体的电磁兼容性。
附图说明
图1是本发明一种智能融合传感器芯片封装方法剖面图
图2是本发明一种智能融合传感器芯片封装方法流程图
具体实施方式
如图1所示,为本发明设计的智能融合传感器芯片封装方法剖面图。整个封装结构分为两层,电源层和顶层。下层为电源层,电源管理芯片裸片通过红胶固定在基板上,通过金线与基板上的印刷电路相连;管脚分布在电源层基板周边,并有部分露出在封装体外;电源层的封装将电源管理芯片、红胶和金线都包裹在封装黑胶内,留出部分基板的焊盘用于板连接。上层由多种功能芯片、处理器芯片按面积从大到小由下至上纵向叠放于基板上,芯片与基板之间、芯片与芯片之间用红胶连接固定;金线将各种芯片和基板印刷电路连接起来。电源层和顶层则通过锡球进行板连接,形成一体结构,整体封装的封装黑胶则包裹在该一体结构外部及板间空隙,以保证封装致密性。
如图2所示,为本发明设计的智能融合传感器芯片封装方法流程图。对准备好的各种芯片和基板用等离子机进行预清洗;用点胶机将粘接剂涂在清洗好的各种芯片底部和基板对应放芯片的位置;使用真空吸嘴将各种芯片正确放置于基板对应位置上;粘好芯片的基板放入热循环烘箱中静置固化;用焊线机将邦定线按设计要求焊接在各种芯片和基板的对应焊盘上形成桥接;使用专用检测工具对邦定完成后的COB板进行检测,不合格的返回邦定步骤维修,合格的进入中清洗;使用等离子机对检测合格的COB板进行清洗;清洗好的电源层COB板放入专用模具,使用封装体按预定形状进行封装成型;封装成型的电源层放入热循环烘箱中静置固化;用焊接材料将封装固化好的电源层和经过中清洗的顶层COB板进行连接,放入回流焊炉进行焊接固化;使用专用检测工具对焊接好的顶层COB板和电源层进行电气性能检测,不合格的返回板接连步骤维修,合格的进入后清洗;使用超声波清洗机和清洗剂对检测合格的双层连接板进行清洗,去除助焊剂和污物;清洗好的双层连接板放入专用模具,使用封装体按预定形状进行封装成型;封装成型的智能融合传感器芯片放入热循环烘箱中静置固化;使用专用检测工具对封装固化好的智能融合传感器芯片进行电气性能检测,剔除不良品;检测合格的智能融合传感器芯片进行标识印刻。
Claims (2)
1.一种智能融合传感器芯片的封装方法,其特征在于:
所述智能融合传感器芯片封装由处理器芯片、多种功能芯片、电源管理芯片、基板、粘接剂、焊接材料、邦定线、管脚、封装体组合而成;
所述处理器芯片、多种功能芯片、电源管理芯片均为裸片,即集成电路晶圆经过切割测试后没有经过封装的芯片;
所述基板为印刷电路板,分为两层,底层用于承载电源管理芯片,用粘接剂固定,进行单独封装,形成电源层;顶层用于承载处理器芯片、多种功能芯片,各芯片按面积从大到小由下至上纵向叠放,芯片与芯片之间及芯片与基板之间用粘接剂固定,两层基板之间通过焊接材料进行连接;
所述粘接剂是一种导热聚烯化合物,用于芯片和基板之间及芯片和芯片之间的连接固定,同时将芯片的热量扩散到外部;
所述焊接材料为锡合金,用于两层基板之间的连接固定,同时实现电气和信号连接;
所述邦定线为金属线,用于分别将处理器芯片、多种功能芯片和顶层基板连接,将电源管理芯片和底层基板连接;
所述管脚为金属丝或金属压焊点,焊接或涂敷在底层基板周边,通过印刷电路、焊接材料和邦定线与处理器芯片、多种功能芯片、电源管理芯片等裸片连接;
所述封装体为高分子材料、金属材料或陶瓷材料,分为电源封装和整体封装,用于包裹处理器芯片、多种功能芯片、电源管理芯片、基板、邦定线等元件。
2.根据权利要求1所述的智能融合传感器芯片的封装方法,其特征在于:包括如下步骤;
(1)预清洗,将准备好的处理器芯片、多种功能芯片、电源管理芯片等裸片和两块基板,使用等离子清洗机通过物理或化学作用对表面进行处理,实现分子水平的污染物去除;
(2)点胶,将准备好的处理器芯片、多种功能芯片、电源管理芯片等裸片背面用点胶机涂上适量粘接剂,同时将适量的粘接剂涂在基板对应芯片放置的位置上;
(3)粘芯片,用防静电真空吸嘴将电源管理芯片裸片正确放在底层基板上,然后将处理器芯片、多种功能芯片等裸片按面积从大到小从下至上依次正确纵向叠放在顶层基板上;
(4)固化,将粘好裸片的带件基板放入热循环烘箱中放在大平面加热板上恒温静置一段时间,或自然固化;
(5)邦定,用焊线机焊接邦定线,将处理器芯片、多种功能芯片、电源管理芯片等裸片与基板上对应的焊盘进行桥接,形成COB板;
(6)前测,使用专用检测工具检测邦定好的两层COB板,返修检测不良品;
(7)中清洗,使用等离子清洗机对COB板通过物理或化学作用对工件表面进行处理,实现分子水平的污染物去除,从而提高工件表面活性;
(8)电源层封装,将检测好的底层COB板放入预置模具,使用封装体将其按预设封装形式进行封装成型;
(9)电源层固化,将封装成型的电源层放入热循环烘箱中恒温静置,使封装体固化;
(10)板连接,将顶层COB板和固化好的电源层用焊接材料将两块基板上设计好的对应焊盘进行连接,并放入回流焊炉进行焊接固化;
(11)中测,使用专用检测工具检测连接好的两层COB板,返修检测不良品;
(12)后清洗,使用超声波清洗机和超声波清洗剂,利用超声波的高频振荡产生的清洗效果来完成清洗,使焊接点上及细缝中的助焊剂和污物脱离下来,并溶解这些污物;
(13)整体封装,将连接好的顶层COB板和电源层放入预置模具,使用封装体将其按预设封装形式进行封装成型;
(14)整体固化,将封装成型的智能融合传感器芯片放入热循环烘箱中恒温静置,使封装体固化;
(15)后测,将封装固化好的智能融合传感器芯片再用专用的检测工具进行电气性能测试,剔除不良品;
(16)打标,使用打标设备对检测合格的智能融合传感器芯片顶部进行标识印刻。
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