CN108040436A - A kind of asymmetric IC pads steel mesh of PCBA and its design method - Google Patents
A kind of asymmetric IC pads steel mesh of PCBA and its design method Download PDFInfo
- Publication number
- CN108040436A CN108040436A CN201711299505.2A CN201711299505A CN108040436A CN 108040436 A CN108040436 A CN 108040436A CN 201711299505 A CN201711299505 A CN 201711299505A CN 108040436 A CN108040436 A CN 108040436A
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- Prior art keywords
- steel mesh
- steel
- asymmetric
- pcba
- pads
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of asymmetric IC pads steel meshes of PCBA and its design method, steel mesh plate is chosen, according to Gerber file element minimum spacings, choose the stainless steel steel mesh of suitable thickness, according to the asymmetric pad specific locations of Gerber file, steel mesh scheme, the upper and lower area equation of steel mesh windowing are designed, left and right area is equal, steel mesh scheme according to design is programmed cutting, to be processed by shot blasting after cutting, after steel mesh print solder paste, mount components, final high temperature reflux.By designing special steel mesh windowing method, the pulling force produced when tin cream melts to component pin is symmetrical, element stress balance, it is bad so as to solve the floating high-quality of element off normal inclination, the yield of production circuit board is increased substantially, production cost is reduced, improves circuit board competitiveness.
Description
Technical field
The present invention relates to the technical field of circuit board processing, and in particular to a kind of asymmetric IC pads steel mesh of PCBA and
Its design method.
Background technology
In the high speed development of current electronics industry, almost all of electronic equipment is required for the support of PCBA.And PCBA
On electrical equipment it is again fast-developing towards Highgrade integration, miniaturization.Electrical equipment pin asymmetric distribution is caused, is caused
PCB corresponds to pad distribution also to be asymmetric.This asymmetric pad first passes through paste solder printing, and in mount components, final high temperature returns
Stream.Tin cream produces pulling force when melting, and because pad is asymmetric, component pin under tension is asymmetric, and force unbalance, causes member
It is bad that part off normal tilts floating high-quality.
The content of the invention
Based on the above problem, the present invention proposes a kind of asymmetric IC pads steel meshes of PCBA and its design method, by setting
Special steel mesh windowing method is counted, the pulling force produced when tin cream melts to component pin is symmetrical, element stress balance, so as to solve
Certainly it is bad to tilt floating high-quality for element off normal.
The present invention provides following technical solution：
On the one hand, the present invention provides a kind of asymmetric IC pads steel meshes of PCBA, including：
Steel mesh, the steel mesh thickness are 0.08mm-0.15mm；Area equation above and below the steel mesh windowing, left and right area phase
Deng.
Wherein, the steel mesh passes through print solder paste, then mount components, final high temperature reflux.
In addition, present invention also offers a kind of asymmetric IC pads steel mesh design methods of PCBA, the described method includes：
Step 101, steel mesh plate is chosen, according to Gerber file element minimum spacings, chooses the stainless steel of suitable thickness
Steel mesh；
Step 102, according to the asymmetric pad specific locations of Gerber file, steel mesh scheme, the upper and lower area phase of steel mesh windowing are designed
Deng left and right area is equal；
Step 103, the steel mesh scheme according to design is programmed cutting, to be processed by shot blasting after cutting, steel mesh print solder paste
Afterwards, mount components, final high temperature reflux.
Wherein, the steel mesh thickness range is 0.08mm-0.15mm.
Wherein, cutting accuracy 0.01mm.
The present invention provides a kind of asymmetric IC pads steel meshes of PCBA and its design method, chooses steel mesh plate, according to
Gerber file element minimum spacings, choose the stainless steel steel mesh of suitable thickness, are had according to the asymmetric pads of Gerber file
Body position, design steel mesh scheme, steel mesh windowing up and down area equation, left and right area is equal, according to design steel mesh scheme carry out
Programming cutting, will be processed by shot blasting after cutting, after steel mesh print solder paste, mount components, and final high temperature reflux.It is special by designing
Different steel mesh windowing method, the pulling force produced when tin cream melts to component pin is symmetrical, element stress balance, so as to solve member
The floating high-quality of part off normal inclination is bad, increases substantially the yield of production circuit board, reduces production cost, it is competing to improve circuit board
Strive power.
Brief description of the drawings
Fig. 1 is flow chart of the method for the present invention；
Embodiment
To describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
On the one hand, embodiments of the present invention provide a kind of asymmetric IC pads steel meshes of PCBA, and attached drawing 1 is of the invention
Method flow diagram, the asymmetric IC pads steel meshes of PCBA include：
Steel mesh, the steel mesh thickness are 0.08mm-0.15mm；Area equation above and below the steel mesh windowing, left and right area phase
Deng.
Wherein, the steel mesh passes through print solder paste, then mount components, final high temperature reflux.
The present invention provides a kind of asymmetric IC pads steel meshes of PCBA, the design of the steel mesh by choosing steel mesh plate,
According to Gerber file element minimum spacings, the stainless steel steel mesh of suitable thickness is chosen, according to the asymmetric welderings of Gerber file
Disk specific location, design steel mesh scheme, steel mesh windowing up and down area equation, left and right area is equal, according to design steel mesh scheme
Cutting is programmed, to be processed by shot blasting after cutting, after steel mesh print solder paste, mount components, final high temperature reflux.By setting
Special steel mesh windowing method is counted, the pulling force produced when tin cream melts to component pin is symmetrical, element stress balance, so as to solve
Certainly the floating high-quality of element off normal inclination is bad, increases substantially the yield of production circuit board, reduces production cost, improve circuit
Plate competitiveness.
On the other hand, embodiments of the present invention provide a kind of asymmetric IC pads steel mesh design methods of PCBA, described
Method includes：
Step 101, steel mesh plate is chosen, according to Gerber file element minimum spacings, chooses the stainless steel of suitable thickness
Steel mesh；
Choose steel mesh plate.According to Gerber file element minimum spacings, the stainless steel of suitable thickness is chosen, steel mesh is thick
Spend general range：0.08mm-0.15mm.
Step 102, according to the asymmetric pad specific locations of Gerber file, steel mesh scheme, steel mesh windowing top and bottom are designed
Product is equal, and left and right area is equal；
According to the asymmetric pad specific locations of Gerber file, steel mesh scheme is designed.Designing points:Steel mesh windowing is up and down
Area equation, left and right area are equal.
Step 103, the steel mesh scheme according to design is programmed cutting, to be processed by shot blasting after cutting, steel mesh printing
After tin cream, mount components, final high temperature reflux.
Steel mesh scheme according to design is programmed cutting.Cutting accuracy requirement is in 0.01mm.To be polished after cutting
Handle, after steel mesh print solder paste, beneficial to the demoulding.
The present invention provides a kind of asymmetric IC pads steel mesh design methods of PCBA, steel mesh plate are chosen, according to Gerber
File element minimum spacings, choose the stainless steel steel mesh of suitable thickness, according to the asymmetric pad specific locations of Gerber file,
Design steel mesh scheme, steel mesh windowing area equation up and down, left and right area is equal, and the steel mesh scheme according to design is programmed and cuts
Cut, to be processed by shot blasting after cutting, after steel mesh print solder paste, mount components, final high temperature reflux.By designing special steel mesh
Windowing method, the pulling force produced when tin cream melts to component pin is symmetrical, element stress balance, so as to solve element off normal
It is bad to tilt floating high-quality, increases substantially the yield of production circuit board, reduces production cost, improve circuit board competitiveness.
The foregoing description of the disclosed embodiments, enables those skilled in the art to realize or use the present invention.To this
A variety of modifications of a little embodiments will be apparent for a person skilled in the art, and the general principles defined herein can
Without departing from the spirit or scope of the present invention, to realize in other embodiments.Therefore, the present invention will not be limited
The embodiments shown herein is formed on, but meets the most wide model consistent with the principles and novel features disclosed herein
Enclose.
Claims (5)
- A kind of 1. asymmetric IC pads steel meshes of PCBA, it is characterised in that：It includes：Steel mesh, the steel mesh thickness are 0.08mm-0.15mm；Area equation, left and right area are equal up and down for the steel mesh windowing.
- 2. the asymmetric IC pads steel meshes of PCBA according to claim 1, it is characterised in that：The steel mesh is by printing tin Cream, then mount components, final high temperature reflux.
- A kind of 3. asymmetric IC pads steel mesh design methods of PCBA, it is characterised in that：The described method includes：Step 101, steel mesh plate is chosen, according to Gerber file element minimum spacings, chooses the stainless steel steel of suitable thickness Net；Step 102, according to the asymmetric pad specific locations of Gerber file, steel mesh scheme, the upper and lower area phase of steel mesh windowing are designed Deng left and right area is equal；Step 103, the steel mesh scheme according to design is programmed cutting, to be processed by shot blasting after cutting, steel mesh print solder paste Afterwards, mount components, final high temperature reflux.
- 4. according to the method described in claim 3, it is characterized in that：The steel mesh thickness range is 0.08mm-0.15mm.
- 5. according to the method described in claim 3, it is characterized in that：Cutting accuracy is 0.01mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711299505.2A CN108040436A (en) | 2017-12-08 | 2017-12-08 | A kind of asymmetric IC pads steel mesh of PCBA and its design method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711299505.2A CN108040436A (en) | 2017-12-08 | 2017-12-08 | A kind of asymmetric IC pads steel mesh of PCBA and its design method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108040436A true CN108040436A (en) | 2018-05-15 |
Family
ID=62101771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711299505.2A Pending CN108040436A (en) | 2017-12-08 | 2017-12-08 | A kind of asymmetric IC pads steel mesh of PCBA and its design method |
Country Status (1)
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| CN (1) | CN108040436A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110600402A (en) * | 2019-08-27 | 2019-12-20 | 上海望友信息科技有限公司 | Design method of steel mesh opening, design device of steel mesh opening and electronic equipment |
| CN114423180A (en) * | 2022-02-18 | 2022-04-29 | 北京柏瑞安电子技术有限公司 | QFN lead-free low-voidage welding method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01209736A (en) * | 1988-02-17 | 1989-08-23 | Nec Corp | Method of replacing semiconductor element |
| CN1852638A (en) * | 2006-01-24 | 2006-10-25 | 华为技术有限公司 | Printing welding-paste method and printing tin steel-screen |
| CN201550359U (en) * | 2009-08-17 | 2010-08-11 | 华为终端有限公司 | Circuit board and steel mesh for manufacturing pad |
| CN107278050A (en) * | 2017-08-07 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of asymmetric pad steel mesh windowing methods of PCBA and system |
-
2017
- 2017-12-08 CN CN201711299505.2A patent/CN108040436A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01209736A (en) * | 1988-02-17 | 1989-08-23 | Nec Corp | Method of replacing semiconductor element |
| CN1852638A (en) * | 2006-01-24 | 2006-10-25 | 华为技术有限公司 | Printing welding-paste method and printing tin steel-screen |
| CN201550359U (en) * | 2009-08-17 | 2010-08-11 | 华为终端有限公司 | Circuit board and steel mesh for manufacturing pad |
| CN107278050A (en) * | 2017-08-07 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of asymmetric pad steel mesh windowing methods of PCBA and system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110600402A (en) * | 2019-08-27 | 2019-12-20 | 上海望友信息科技有限公司 | Design method of steel mesh opening, design device of steel mesh opening and electronic equipment |
| CN114423180A (en) * | 2022-02-18 | 2022-04-29 | 北京柏瑞安电子技术有限公司 | QFN lead-free low-voidage welding method |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180515 |
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| RJ01 | Rejection of invention patent application after publication |