CN102076171B - Printed circuit board packaging method and crystal oscillator - Google Patents
Printed circuit board packaging method and crystal oscillator Download PDFInfo
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- CN102076171B CN102076171B CN 201010600073 CN201010600073A CN102076171B CN 102076171 B CN102076171 B CN 102076171B CN 201010600073 CN201010600073 CN 201010600073 CN 201010600073 A CN201010600073 A CN 201010600073A CN 102076171 B CN102076171 B CN 102076171B
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Abstract
The invention discloses a printed circuit board packaging method. The method comprises the following steps of: providing a printed circuit board, wherein the printed circuit board comprises a substrate, a component and a plurality of bonding pad seat; the substrate comprises a top surface on which the component is arranged and a bottom surface on which a welding pad is arranged; and the welding pad seat is electrically connected with the component through the circuit; providing a metal frame, wherein the metal frame comprises a plurality of metal rods and a frame body; the first end parts of the metal rods are arranged corresponding to the welding pad seat and are welded on the bonding pad seat; and the metal rods are extended outwards from the side face of the printed circuit board; encapsulating the printed circuit board and the metal frame together by using a packaging adhesive and curing the packaging adhesive, wherein the entire printed circuit board and a part of metal rods are surrounded by the packaging adhesive, and the metal rods penetrate through the packaging adhesive; cutting off the frame body of the metal frame and forming welding pins by using the metal rods; and the welding pins forms the welding pad after the welding pins are bent downwards along the packaging adhesive on the bottom. The invention also discloses a crystal oscillator with the printed circuit board.
Description
Technical field
The present invention relates to the printed circuit board field, relate more specifically to a kind of method for packing of printed circuit board, and the crystal oscillator with this printed circuit board.
Background technology
In electronic product and related industry (for example crystal oscillator industry) thereof, need to be electrical connected between each electronic component, with transmission power supply signal, data-signal etc., so be used for realizing that the manufacturing of circuit board of each electronic component conducting is most important with encapsulation.Usually the manufacturer of Related product can come the circuit of specific function on the printed circuit board (pcb board), through debugging, detect and be packaged into individual devices after qualified and sell.Along with the design of modern electronic product is day by day complicated, increase dramatically Electronics Engineer's design difficulty.In order to accelerate the development progress of product, the circuit of general utility functions is made on the pcb board by specialized factory, through debugging, detect and to be packaged into a device after qualified and to sell.Present main flow production technology is all take surface mount as main, so the device after the moulding is also take surface mounting component as main.The surface mount device that utilizes pcb board to make in order to improve device reliability, can encapsulate product usually.
Usually manufacturer pieces together several products on a pcb board, after production testing is qualified, to there be the one side of element to water with epoxy resin, after the epoxy resin adhesive curing, with machine PCB is cut into several unit, finished the encapsulation of device, and general other processing method can realize the sealing to pcb board.Because traditional manufacturing technique is directly welded usefulness as device with the pad of PCB, the adhesive force of its pad on pcb board has relatively little, for the larger device of quality, after being subject to strong vibration or process multiple welding, therefore its pad may come off, cause the product safety hidden danger such as circuit breaker, and therefore shorten the useful life of product.
Therefore, demand a kind of method for packing of new printed circuit board urgently, come traditional handicraft is improved, to improve the quality of products, prolong product useful life, and overcome defects.
Summary of the invention
The object of the present invention is to provide and a kind ofly can improve the quality of products, prolong the product printed circuit method for packing in useful life, and the crystal oscillator with this printed circuit board.
In order to achieve the above object, the invention provides a kind of method for packing of printed circuit board, described method for packing comprises following concrete steps: (1) provides a printed circuit board, described printed circuit board comprises that layout has substrate, components and parts and several pad seats of circuit, described substrate comprises end face and bottom surface, described components and parts are arranged on the described end face, and described pad seat is arranged on the described bottom surface, and described pad seat is electrically connected with described components and parts by described circuit; (2) provide a metal frame, described metal frame comprise several metal bars and with the integrated support body of described metal bar, described printed circuit board is arranged on the described metal frame, and the first end of described metal bar and the corresponding setting of described pad seat, and the first end of described metal bar is welded on the described pad seat, described metal bar stretches out from the side of described printed circuit board; (3) with packaging plastic described printed circuit board and metal frame are potted in together, and solidify described packaging plastic, described packaging plastic surrounds whole described printed circuit board and part metals rod, and described metal bar passes described packaging plastic; (4) support body of the described metal frame of excision, described metal bar forms leg.
Preferably, in the method for packing of described printed circuit board, the described support body of described excision, also comprise after the step of described metal bar formation leg: after described leg is bent downwards along the packaging plastic on the side of printed circuit board, packaging plastic on described bottom surface bends, and the leg that is positioned at described bottom surface forms pad.Packaging plastic is to the reinforcement effect of leg, and the bending technique of leg, so that the pad that finally obtains can be fixedly mounted on the printed circuit board more securely.
Preferably, in the method for packing of described printed circuit board, described metal bar has the welding resistance zone, and described welding resistance zone is in abutting connection with described first end setting.
Preferably, in the method for packing of described printed circuit board, the described bottom surface of described substrate is provided with components and parts.The two sides arranges respectively components and parts, takes full advantage of space limited on the printed circuit board, is conducive to the miniaturization production of product.
Preferably, in the method for packing of described printed circuit board, when first end and the corresponding setting of described pad seat of described metal bar, described printed circuit board and metal frame form a short-circuited conducting sleeve.The electrostatic damage of printed circuit board in encapsulation process eliminated in the design of short-circuited conducting sleeve.
Preferably, in the method for packing of described printed circuit board, the first end of described metal bar is welded on the described pad seat by solder reflow process.
In order to achieve the above object, the present invention also provides a kind of crystal oscillator, and this crystal oscillator is made by the method for packing of above-mentioned printed circuit board.Described crystal oscillator comprises printed circuit board, packaging plastic and leg, described printed circuit board comprises that layout has the substrate of circuit, components and parts and several pad seats, described substrate comprises end face and bottom surface, described components and parts are arranged on the described end face, described pad seat is arranged on the described bottom surface, described pad seat is electrically connected with described components and parts by described circuit, the upper end of described leg is welded on the described pad seat, described packaging plastic surrounds the upper end of described printed circuit board and described leg, the lower end of described leg passes packaging plastic, and stretches out from the side of described printed circuit board.
Preferably, after the lower end of the described leg in the described crystal oscillator bent downwards along the packaging plastic on the side of printed circuit board, the packaging plastic on described bottom surface bent, and the lower end that is positioned at the leg of described bottom surface forms pad.
Preferably, the described bottom surface of the described substrate in the described crystal oscillator is provided with components and parts.
Preferably, the described crystal oscillator in the described crystal oscillator is surface-mounting type crystal oscillator.
Compared with prior art, in printed circuit board packaging technology provided by the present invention, the pad seat is installed first on the substrate of printed circuit board, end with leg is welded on the pad seat again, the other end passes packaging plastic and stretches out from the side of printed circuit board, thereby finishes the packaging technology of printed circuit board.Printed circuit board by this packaging technology making, because leg directly is welded on the location first time of realizing leg on the pad seat, and then realized fixing for the second time by the packaging plastic that solidifies, avoided leg in the conventional package technique to break away from easily the defective of printed circuit board, thus improve printed circuit board quality, prolong useful life of the electronic product with this printed circuit board.
By following description also by reference to the accompanying drawings, it is more clear that the present invention will become, and these accompanying drawings are used for explaining embodiments of the invention.
Description of drawings
Fig. 1 is the flow chart of the method for packing of printed circuit board of the present invention.
Fig. 2 is the process chart in the printed circuit board encapsulation of the present invention.
Fig. 3 is the process chart in the printed circuit board encapsulation of the present invention.
Fig. 4 is that printed circuit board of the present invention is through the profile after the packaging technology
Fig. 5 a is the first view of welding foot manufacture craft in the printed circuit board encapsulation of the present invention.
Fig. 5 b is the second view of welding foot manufacture craft in the printed circuit board encapsulation of the present invention.
Fig. 5 c is the third state schematic diagram of welding foot manufacture craft in the printed circuit board encapsulation of the present invention.
Fig. 6 is the cutaway view of crystal oscillator of the present invention.
Embodiment
With reference now to accompanying drawing, describe embodiments of the invention, similar element numbers represents similar element in the accompanying drawing.The invention provides and a kind ofly improve the quality of products, prolong the product printed circuit method for packing in useful life, and the crystal oscillator with this printed circuit board.
Be illustrated in figure 1 as the flow chart of printed circuit board method for packing of the present invention, the roughly step of described method for packing is as follows: step S11, a printed circuit board is provided, described printed circuit board comprises that layout has substrate, components and parts and several pad seats of circuit, described substrate comprises end face and bottom surface, described components and parts are arranged on the described end face, and described pad seat is arranged on the described bottom surface, and described pad seat is electrically connected with described components and parts by described circuit; Step S12, a metal frame is provided, described metal frame comprise several metal bars and with the integrated support body of described metal bar, described printed circuit board is arranged on the described metal frame, and the first end of described metal bar and the corresponding setting of described pad seat, and the first end of described metal bar is welded on the described pad seat, described metal bar stretches out from the side of described printed circuit board; Step S13 is potted in described printed circuit board and metal frame together with packaging plastic, and solidifies described packaging plastic, and described packaging plastic surrounds whole described printed circuit board and part metals rod, and described metal bar passes described packaging plastic; Step S14 excises the support body of described metal frame, and described metal bar forms leg.
With reference to figure 1-5c, in an embodiment of printed circuit board method for packing of the present invention, its detailed implementation step is carried out in the following order.
Step S11, with reference to Fig. 1-2, the upper figure of Fig. 2 is depicted as the upward view of printed circuit board 10.Step S11 specifically comprises: a printed circuit board 10 is provided, and described printed circuit board 10 comprises substrate 11, components and parts (not shown) and six pad seats 12.Described substrate 11 comprises end face (not shown) and bottom surface 111.Be laid with circuit on the described substrate 11, in the present embodiment, bottom surface 111 and the end face of substrate 11 are provided with components and parts, and described components and parts are electrically connected with circuit on the substrate 11.In other embodiments, can be only at the end face of substrate components and parts be set, perhaps only in the bottom surface of substrate components and parts be set.In the present embodiment, printed circuit board 10 comprises six described pad seats 12, and pad seat 12 all is welded on the described bottom surface 111, and described pad seat 12 is electrically connected with described components and parts by described circuit; In other embodiments, the quantity of pad seat can be other quantity, is determined on a case-by-case basis.
Step S12 with reference to Fig. 1-2, at first, provides a bulk metal frame, and in order to be applicable to batch production, described bulk metal frame comprises several metal frames 20, and wherein, each described metal frame 20 comprises support body 22 and six roots of sensation metal bar 21.Described support body 22 is one-body molded with metal bar 21, and six roots of sensation metal bar 21 is distinguished corresponding settings with six the pad seats 12 on the printed circuit board 10.Then, printed circuit board 10 is arranged on the described metal frame 20, and the first end 211 of every metal bar 21 and each pad seat 12 corresponding setting, and the first end 211 of metal bar 21 is welded on the described pad seat 12.At this moment, described metal bar 21 stretches out from the side 112 of described printed circuit board 10.When printed circuit board 10 adopted surface-adhered type technique to make, the first end 211 of described metal bar 21 can be directly welded on the described pad seat 12 by solder reflow process.In the present embodiment, described metal bar 21 has welding resistance zone 212, and described welding resistance zone 212 arranges in abutting connection with described first end 211.The setting in welding resistance zone 212 can prevent overflowing of tin cream in the welding process, guarantees the welding quality of metal bar 21 and pad seat 12, and has guaranteed the attractive in appearance of printed circuit board 10 integral body.In addition, when first end 211 and the described pad seat 12 corresponding settings of described metal bar 21, described printed circuit board 10 and metal frame 20 form a short-circuited conducting sleeve, and the electrostatic damage of printed circuit board in encapsulation process eliminated in the design of short-circuited conducting sleeve.In other embodiments, the quantity of pad seat can be other quantity, correspondingly, and the corresponding setting with the pad seat of the quantity of metal bar.
Step S13 with reference to figure 1-4, is potted in described printed circuit board 10 and metal frame 20 together with packaging plastic 30, and solidifies described packaging plastic 30.Particularly, after metal bar 21 is complete with 12 welding of pad seat, check whether each solder joint is qualified, as qualified, printed circuit board 10 and metal frame 20 are put into the encapsulating mould (not shown), described printed circuit board 10 and metal frame 20 are potted in together, and solidify described packaging plastic 30.Packaging plastic 30 surrounds whole described printed circuit board 10 and part metals rod 21, and remaining metal bar 21 parts pass packaging plastic 30.
Step S14 with reference to figure 1-4, excises the support body 22 of described metal frame 20, and metal bar 21 forms leg 23, and as shown in Figure 4, the second end 231 of leg 23 passes packaging plastic 30.So far, the packaging process of printed circuit board 10 is finished.
Need to prove that printed circuit board method for packing of the present invention is not limited to the step order in the above-mentioned execution mode.
Printed circuit board by this packaging technology making, because leg directly is welded on the location first time of realizing leg on the pad seat, and then realized fixing for the second time by the packaging plastic that solidifies, avoided leg in the conventional package technique to break away from easily the defective of printed circuit board, thus improve printed circuit board quality, prolong useful life of the electronic product with this printed circuit board.
Preferably, continuation is in conjunction with Fig. 5 a-5c, at the described support body of excision, and also comprise after the step of described metal bar formation leg: after leg 23 is bent downwards along the packaging plastic 30 on the side 112 of printed circuit board 10, then the second end 231 of described leg 23 bends along the packaging plastic 30 on the bottom surface 111 of printed circuit board 10, and the second end 231 that is positioned at described bottom surface 111 forms pads 232.The reinforcement effect of 30 pairs of legs 23 of packaging plastic, and the bending technique of leg 23 are so that the pad 232 that finally makes can be installed on the printed circuit board 10 more securely.
With reference to figure 6, the invention also discloses a kind of crystal oscillator 40, it comprises printed circuit board 41, packaging plastic 42 and leg 43.Described crystal oscillator 40 is to adopt above-mentioned printed circuit board method for packing to be made, and printed circuit board 41 is identical with printed circuit board 10 shown in Figure 2.Described printed circuit board comprises that layout has substrate 411, components and parts 412 and six pad seat (not shown) of circuit.Described substrate 411 comprises end face 4111 and bottom surface 4112, and described components and parts 412 are arranged on the described end face 4111, and described pad seat is arranged on the bottom surface 4112, and the pad seat is electrically connected with described components and parts 412 by described circuit.The upper end 431 of leg 43 is welded on the pad seat, and described packaging plastic 42 surrounds the upper end 431 of described printed circuit board 41 and described leg 43, and the lower end 432 of described leg 43 passes packaging plastic 42, and stretches out from the side 413 of printed circuit board 41.In the present embodiment, after the lower end 431 of leg 43 bends downwards along the packaging plastic 42 on the side 413 of printed circuit board 41, again 42 bendings of the packaging plastic on the bottom surface 4112 of printed circuit board 41, the lower end 432 that is positioned at the leg 43 of described bottom surface 4112 forms pads 44.In the present embodiment, crystal oscillator 40 is surface-mounting type crystal oscillator.The method for packing of printed circuit board of the present invention is not limited to the crystal oscillator of making in the present embodiment, applicable to other electronic product or electric product that comprises printed circuit board and implemented packaged type of the present invention.
Above invention has been described in conjunction with most preferred embodiment, but the present invention is not limited to the embodiment of above announcement, and should contain various modification, equivalent combinations of carrying out according to essence of the present invention.
Claims (8)
1. the method for packing of a printed circuit board is characterized in that, comprises step:
A printed circuit board is provided, described printed circuit board comprises that layout has substrate, components and parts and several pad seats of circuit, described substrate comprises end face and bottom surface, described components and parts are arranged on the described end face, described pad seat is arranged on the described bottom surface, and described pad seat is electrically connected with described components and parts by described circuit;
A metal frame is provided, described metal frame comprise several metal bars and with the integrated support body of described metal bar, described printed circuit board is arranged on the described metal frame, and the first end of described metal bar and the corresponding setting of described pad seat, and the first end of described metal bar is welded on the described pad seat, described metal bar stretches out from the side of described printed circuit board;
With packaging plastic described printed circuit board and metal frame are potted in together, and solidify described packaging plastic, described packaging plastic surrounds whole described printed circuit board and part metals rod, and described metal bar passes described packaging plastic; And
Excise the support body of described metal frame, described metal bar forms leg;
After the downward bending of the packaging plastic on the side of printed circuit board, the packaging plastic on described bottom surface bends with described leg, and the leg that is positioned at described bottom surface forms pad.
2. the method for packing of printed circuit board as claimed in claim 1 is characterized in that, described metal bar has the welding resistance zone, and described welding resistance zone is in abutting connection with described first end setting.
3. the method for packing of printed circuit board as claimed in claim 1 or 2 is characterized in that, the described bottom surface of described substrate is provided with components and parts.
4. the method for packing of printed circuit board as claimed in claim 1 is characterized in that, when first end and the corresponding setting of described pad seat of described metal bar, described printed circuit board and metal frame form a short-circuited conducting sleeve.
5. the method for packing of printed circuit board as claimed in claim 1 is characterized in that, the first end of described metal bar is welded on the described pad seat by solder reflow process.
6. crystal oscillator, it is characterized in that, comprise printed circuit board, packaging plastic and leg, described printed circuit board comprises that layout has the substrate of circuit, components and parts and several pad seats, described substrate comprises end face and bottom surface, described components and parts are arranged on the described end face, described pad seat is arranged on the described bottom surface, described pad seat is electrically connected with described components and parts by described circuit, the upper end of described leg is welded on the described pad seat, described packaging plastic surrounds the upper end of described printed circuit board and described leg, the lower end of described leg passes packaging plastic, and stretches out from the side of described printed circuit board, after the lower end of described leg bends downwards along the packaging plastic on the side of printed circuit board, packaging plastic on described bottom surface bends, and the lower end that is positioned at the leg of described bottom surface forms pad.
7. crystal oscillator as claimed in claim 6 is characterized in that, the described bottom surface of described substrate is provided with components and parts.
8. crystal oscillator as claimed in claim 7 is characterized in that, described crystal oscillator is surface-mounting type crystal oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010600073 CN102076171B (en) | 2010-12-22 | 2010-12-22 | Printed circuit board packaging method and crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010600073 CN102076171B (en) | 2010-12-22 | 2010-12-22 | Printed circuit board packaging method and crystal oscillator |
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| Publication Number | Publication Date |
|---|---|
| CN102076171A CN102076171A (en) | 2011-05-25 |
| CN102076171B true CN102076171B (en) | 2013-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010600073 Active CN102076171B (en) | 2010-12-22 | 2010-12-22 | Printed circuit board packaging method and crystal oscillator |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102366854A (en) * | 2011-09-22 | 2012-03-07 | 武汉昊昱微电子股份有限公司 | Penetration welding method for crystal oscillator |
| CN106231809A (en) * | 2016-08-31 | 2016-12-14 | 浙江朗科智能电气有限公司 | The PCBA board of a kind of encapsulating process and glue-pouring method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2478312Y (en) * | 2001-04-10 | 2002-02-20 | 伊博电源（杭州）有限公司 | Surface packed electrical connector |
| CN201069782Y (en) * | 2007-06-12 | 2008-06-04 | 一诠精密工业股份有限公司 | LED lead frame and LED with this frame |
| CN101132169A (en) * | 2007-09-19 | 2008-02-27 | 杨绍华 | Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof |
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Address after: 523000 Room 401 and 402, building 5, No. 24, industrial East Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Guangdong daguangxin Technology Co.,Ltd. Address before: 523808, 13-16, North Industrial Town, Songshan Lake Science Park, Guangdong, Dongguan Patentee before: Guangdong Dapu Telecom Technology Co.,Ltd. |
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