CN107978579A - 电子部件、连接体、电子部件的设计方法 - Google Patents

电子部件、连接体、电子部件的设计方法 Download PDF

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Publication number
CN107978579A
CN107978579A CN201710137728.2A CN201710137728A CN107978579A CN 107978579 A CN107978579 A CN 107978579A CN 201710137728 A CN201710137728 A CN 201710137728A CN 107978579 A CN107978579 A CN 107978579A
Authority
CN
China
Prior art keywords
substrate
chip
electronic component
bump
anisotropic conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710137728.2A
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English (en)
Chinese (zh)
Inventor
饭山昌弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN107978579A publication Critical patent/CN107978579A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/22—Conductive package substrates serving as an interconnection, e.g. metal plates having an heterogeneous or anisotropic structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN201710137728.2A 2016-03-25 2017-03-09 电子部件、连接体、电子部件的设计方法 Pending CN107978579A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-062870 2016-03-25
JP2016062870A JP2017175093A (ja) 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法

Publications (1)

Publication Number Publication Date
CN107978579A true CN107978579A (zh) 2018-05-01

Family

ID=59972211

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710137728.2A Pending CN107978579A (zh) 2016-03-25 2017-03-09 电子部件、连接体、电子部件的设计方法

Country Status (4)

Country Link
JP (1) JP2017175093A (https=)
KR (1) KR20170113039A (https=)
CN (1) CN107978579A (https=)
HK (1) HK1254852A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111179750A (zh) * 2019-12-12 2020-05-19 武汉华星光电技术有限公司 显示面板的结构和其制作方法
CN111642058A (zh) * 2020-05-08 2020-09-08 欧菲微电子技术有限公司 电路板、电路板组件及电子设备

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム
JP7274810B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
JP7274811B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
DE102019126859A1 (de) 2019-10-07 2021-04-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigevorrichtung und Anzeigeeinheit
CN114388420B (zh) * 2020-10-19 2025-02-18 重庆康佳光电科技有限公司 临时基板及其制作方法，及微型发光芯片转移方法
KR20240123431A (ko) * 2022-03-31 2024-08-13 데쿠세리아루즈 가부시키가이샤 접속 구조체

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329806A (ja) * 2001-04-27 2002-11-15 Toshiba Corp 電気回路部品
CN101543147A (zh) * 2006-11-29 2009-09-23 夏普株式会社 配线基板和显示装置
JP2014222701A (ja) * 2013-05-13 2014-11-27 日立化成株式会社 回路部材、接続構造体及び接続構造体の製造方法
WO2015056518A1 (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154876A (ja) * 1997-08-05 1999-02-26 Sony Corp 基板端子の接続構造および接続方法
JP4130746B2 (ja) * 2002-03-28 2008-08-06 旭化成エレクトロニクス株式会社 異方性を有する導電性接着シートおよびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329806A (ja) * 2001-04-27 2002-11-15 Toshiba Corp 電気回路部品
CN101543147A (zh) * 2006-11-29 2009-09-23 夏普株式会社 配线基板和显示装置
JP2014222701A (ja) * 2013-05-13 2014-11-27 日立化成株式会社 回路部材、接続構造体及び接続構造体の製造方法
WO2015056518A1 (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111179750A (zh) * 2019-12-12 2020-05-19 武汉华星光电技术有限公司 显示面板的结构和其制作方法
CN111642058A (zh) * 2020-05-08 2020-09-08 欧菲微电子技术有限公司 电路板、电路板组件及电子设备

Also Published As

Publication number Publication date
HK1254852A1 (zh) 2019-07-26
JP2017175093A (ja) 2017-09-28
KR20170113039A (ko) 2017-10-12

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