CN107912085B - 用于制造连接载体的方法、连接载体以及具有连接载体的光电子半导体组件 - Google Patents
用于制造连接载体的方法、连接载体以及具有连接载体的光电子半导体组件 Download PDFInfo
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- CN107912085B CN107912085B CN201680027955.3A CN201680027955A CN107912085B CN 107912085 B CN107912085 B CN 107912085B CN 201680027955 A CN201680027955 A CN 201680027955A CN 107912085 B CN107912085 B CN 107912085B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Adhesive Tapes (AREA)
- Wire Bonding (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015107657.8A DE102015107657A1 (de) | 2015-05-15 | 2015-05-15 | Verfahren zur Herstellung eines Anschlussträgers, Anschlussträger sowie optoelektronisches Halbleiterbauteil mit einem Anschlussträger |
DE102015107657.8 | 2015-05-15 | ||
PCT/EP2016/058643 WO2016184632A1 (de) | 2015-05-15 | 2016-04-19 | Verfahren zur herstellung eines anschlussträgers, anschlussträger sowie optoelektronisches halbleiterbauteil mit einem anschlussträger |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107912085A CN107912085A (zh) | 2018-04-13 |
CN107912085B true CN107912085B (zh) | 2020-10-20 |
Family
ID=55802362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201680027955.3A Active CN107912085B (zh) | 2015-05-15 | 2016-04-19 | 用于制造连接载体的方法、连接载体以及具有连接载体的光电子半导体组件 |
Country Status (8)
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US (1) | US10468569B2 (zh) |
EP (1) | EP3295774A1 (zh) |
JP (1) | JP6856627B2 (zh) |
KR (1) | KR102527885B1 (zh) |
CN (1) | CN107912085B (zh) |
DE (1) | DE102015107657A1 (zh) |
TW (1) | TWI728976B (zh) |
WO (1) | WO2016184632A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016102588B4 (de) | 2016-02-15 | 2021-12-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Anschlussträgers, Anschlussträger, optoelektronisches Bauelement mit einem Anschlussträger und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE112017000857B4 (de) * | 2017-07-06 | 2024-02-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102018105861B3 (de) | 2018-03-14 | 2019-07-04 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur Herstellung eines Leiterbahnabschnitts eines Anschlussträgers, Verfahren zur Herstellung eines Anschlussträgers, und optoelektronisches Halbleiterbauteil |
JP7240148B2 (ja) * | 2018-11-21 | 2023-03-15 | 株式会社東芝 | 光結合装置 |
CN109819816A (zh) * | 2019-03-05 | 2019-05-31 | 徐州工程学院 | 一种喜树栽培固水载体生产装置 |
DE102019119348B4 (de) * | 2019-07-17 | 2022-09-15 | Inovan Gmbh & Co. Kg | Beschichtetes Trägerband und Verwendung desselben zum Bonden einer Leistungselektronik |
JP7111993B2 (ja) * | 2019-12-20 | 2022-08-03 | 日亜化学工業株式会社 | 発光モジュールの製造方法 |
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2015
- 2015-05-15 DE DE102015107657.8A patent/DE102015107657A1/de active Pending
-
2016
- 2016-04-19 EP EP16717620.5A patent/EP3295774A1/de active Pending
- 2016-04-19 WO PCT/EP2016/058643 patent/WO2016184632A1/de active Application Filing
- 2016-04-19 JP JP2018511334A patent/JP6856627B2/ja active Active
- 2016-04-19 CN CN201680027955.3A patent/CN107912085B/zh active Active
- 2016-04-19 US US15/574,385 patent/US10468569B2/en active Active
- 2016-04-19 KR KR1020177035492A patent/KR102527885B1/ko active IP Right Grant
- 2016-05-13 TW TW105114889A patent/TWI728976B/zh active
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US4158745A (en) * | 1977-10-27 | 1979-06-19 | Amp Incorporated | Lead frame having integral terminal tabs |
CN1934718A (zh) * | 2004-03-17 | 2007-03-21 | 陶氏康宁东丽株式会社 | 用于光学装置的金属基电路衬底及制造前述衬底的方法 |
TWM342619U (en) * | 2008-03-14 | 2008-10-11 | Qiao-En Huang | Light emitting body structure |
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Also Published As
Publication number | Publication date |
---|---|
DE102015107657A1 (de) | 2016-12-01 |
KR102527885B1 (ko) | 2023-04-28 |
WO2016184632A1 (de) | 2016-11-24 |
JP6856627B2 (ja) | 2021-04-07 |
JP2018517307A (ja) | 2018-06-28 |
US10468569B2 (en) | 2019-11-05 |
EP3295774A1 (de) | 2018-03-21 |
TW201707094A (zh) | 2017-02-16 |
CN107912085A (zh) | 2018-04-13 |
US20180138379A1 (en) | 2018-05-17 |
KR20180021694A (ko) | 2018-03-05 |
TWI728976B (zh) | 2021-06-01 |
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Effective date of registration: 20181024 Address after: Regensburg, Germany Applicant after: Osram Opto Semiconductors GmbH Applicant after: HERAEUS PRECIOUS METALS GMBH & CO., KG Applicant after: Alanod Aluminium Veredlung GmbH & Co. KG Address before: Munich, Germany Applicant before: Osram Co., Ltd. Applicant before: HERAEUS PRECIOUS METALS GMBH & CO., KG Applicant before: Alanod Aluminium Veredlung GmbH & Co. KG |
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