CN107881019B - 一种低碱度环保电解去除溢料的溶液、其制备方法及其应用 - Google Patents
一种低碱度环保电解去除溢料的溶液、其制备方法及其应用 Download PDFInfo
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- CN107881019B CN107881019B CN201711065374.1A CN201711065374A CN107881019B CN 107881019 B CN107881019 B CN 107881019B CN 201711065374 A CN201711065374 A CN 201711065374A CN 107881019 B CN107881019 B CN 107881019B
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- cyclodextrin
- flash
- solution
- amino
- sulfonated
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- OZLVLKFBPJMRCM-FUFZOPRGSA-N 3a-amino-3a-deoxy-(2as,3as)-β-cyclodextrin Chemical compound O1[C@H](CO)[C@@H]2[C@@H](N)[C@H](O)[C@H]1O[C@H]([C@@H](CO)O1)[C@H](O)[C@@H](O)[C@H]1O[C@H]([C@@H](CO)O1)[C@H](O)[C@@H](O)[C@H]1O[C@H]([C@@H](CO)O1)[C@H](O)[C@@H](O)[C@H]1O[C@H]([C@@H](CO)O1)[C@H](O)[C@@H](O)[C@H]1O[C@H]([C@@H](CO)O1)[C@H](O)[C@@H](O)[C@H]1O[C@H]([C@@H](CO)O1)[C@H](O)[C@@H](O)[C@H]1O2 OZLVLKFBPJMRCM-FUFZOPRGSA-N 0.000 claims description 6
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/662—Carbohydrates or derivatives
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
- C11D1/721—End blocked ethers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0047—Other compounding ingredients characterised by their effect pH regulated compositions
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/046—Salts
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
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Abstract
本发明公开了一种低碱度环保电解去除溢料的溶液、其制备方法及应用。低碱度环保电解去除溢料的溶液，其由下述原料制得，所述的原料包括下列质量分数的组分：1％‑10％的无机碱、1％‑5％的有机胺、5％‑12％的缓冲剂、1％‑5％的有机溶剂、0.1％‑1％的表面活性剂和水，各组分质量分数之和为100％；所述去除溢料的溶液的pH值为7‑8。本发明的去除溢料的溶液碱度低，pH为7‑8，碱度小于20g/L，有机物组分含量低，含水量高大于80％，能有效去除溢料，且能有效避免塑封体和金属框架或基体的损伤，以及产品内部分层的问题。此外，本发明的电解去除溢料的溶液具有环保性。
Description
技术领域
本发明涉及一种低碱度环保电解去除溢料的溶液、其制备方法及其应用。
背景技术
随着国内IC设计和芯片制造的规模不断扩大，内地崛起的半导体晶圆代工产业的发展，对后段制造的拉动效应已经开始显现，中国半导体封装测试行业在近几年也同样保持了稳定快速发展的势头。半导体封装是指将通过测试的晶圆按照产品型号及功能需求加工得到独立芯片的过程。常用封装方式有：使用金属及新陶瓷的气密封装和使用树脂的非气密封装。根据资料显示，目前半导体IC的封装，树脂密封约达90％。在树脂封装过程中，由于塑封模具尺寸偏差以及使用过程中的磨损、金属膜污垢、树脂质量等条件的制约，不可避免会产生溢料。溢料在半导体器件的引脚或金属散热面上形成，覆盖或包裹引脚和散热面上，影响成品的外观、可焊性和散热性。因此，如何去除溢料成了影响IC元件质量的一个关键性问题。通常溢料主要包括三部分：未完全固化的环氧树脂、脱模剂以及固化的环氧膜塑料。现有技术中去除溢料的方法一般分为三种：机械喷砂法、化学浸泡法以及电解法。其中，机械喷砂法容易使得塑封体表面受损，比较少使用；化学浸泡法对环境影响较大；与前两者相比，电解法更环保和高效。但现有技术中电解法去除溢料又存在以下问题：
(1)溶液普遍采用氢氧化钠或氢氧化钾为主，含量达到100-200g/L(以氢氧化钠计)，pH通常大于13，碱度过高，会使金属框架与塑封体之间因析出氢气而剥离，形成产品内部的分层现象，且对部分塑封体易造成损伤，对小塑封体大载体的封装形式尤其明显；
(2)溶液的组分中含有大量有机物，使用过程中，会造成产品分层，同时由于加热会使有机物大量挥发，造成环境污染和对人体健康产生危害。
因此，当前研发一种低碱度环保电解去除溢料的溶液技术是十分迫切的。
发明内容
本发明所要解决的技术问题是为了克服现有的去除溢料的方法存在塑封体表面受损和对环境影响较大等缺陷，而提供了一种低碱度环保电解去除溢料的溶液、其制备方法及其应用。本发明的去除溢料的溶液碱度低，pH为7-8，有机物组分含量低，例如在本发明一优选实施方案中，有机物含量为12-20％；水分含量高，例如：大于80％，能有效去除溢料，且能有效避免塑封体和金属框架或基体的损伤，以及产品内部分层的问题。此外，本发明的电解去除溢料的溶液具有环保性。
本发明主要是通过以下技术手段解决上述技术问题的：
本发明提供了一种低碱度环保电解去除溢料的溶液，其由下述原料制得，所述的原料包括下列质量分数的组分：1％-10％的无机碱、1％-5％的有机胺、5％-12％的缓冲剂、1％-5％的有机溶剂、0.1％-1％的表面活性剂和水，各组分质量分数之和为100％；所述低碱度环保电解去除溢料的溶液的pH值为7-8。
其中，所述的无机碱的质量分数优选为1％-6％，更优选为5％-6％。所述的有机胺的质量分数优选为1％-4％，更优选为3％-4％。所述的缓冲剂的质量分数优选为7.5％-10％，例如：7.5％、9％、9％或10％。所述的有机溶剂的质量分数优选为1-2％。所述的表面活性剂的质量分数优选为0.5％-0.8％。
其中，所述的低碱度环保电解去除溢料的溶液中，各组分质量分数之和为100％，故水的用量优选以补足各组分质量分数之和为100％计。各组分的质量分数是指各组分的质量占所有原料组分总质量的质量百分比。
其中，所述的无机碱可为本领域的常规无机碱，优选为碱金属的碳酸盐和/或碳酸氢盐。所述的碳酸盐优选为碳酸钠和/或碳酸钾；所述的碳酸氢盐优选为碳酸氢钠。
其中，所述的有机胺可为本领域的常规有机胺，优选为单乙醇胺、二乙醇胺、三乙醇胺、二甘醇胺和四甲基氢氧化铵中的一种或多种。
其中，所述的缓冲剂可为本领域的常规缓冲剂，优选为弱酸及其盐、碱及其盐和多元弱酸的酸式盐及其对应的次级盐配对的缓冲剂。所述的弱酸优选为硼酸；所述的碱优选无机强碱、氨水或无机弱碱，例如氢氧化钠和/或氨水；所述的多元弱酸的酸式盐优选磷酸二氢钠。所述的缓冲剂中可含有碱金属盐，例如氯化钾。在本发明一优选实施方案中，所述的缓冲剂为①磷酸二氢钠(5％)和氢氧化钠(2％)、②磷酸二氢钠(5％)和氨水(4％)、③硼酸(5％)、氯化钾(1％)和氢氧化钠(1.5％)、④硼酸(5％)、氯化钾(1％)和氢氧化钠(2％)、⑤、硼酸(5％)氯化钾(3％)、氢氧化钠(2％)、⑥磷酸二氢钠(5％)和氢氧化钠(2％)、⑦磷酸二氢钠(5％)和氨水(4％)、⑧硼酸(5％)、氯化钾(1％)和氢氧化钠(1.5％)、⑨硼酸(5％)、氯化钾(1％)和氢氧化钠(2％)或⑩硼酸(5％)、氯化钾(3％)和氢氧化钠(2％)，所述的百分比为各组分占低碱度环保电解去除溢料的溶液的质量百分比。
其中，所述的有机溶剂可为本领域的常规有机溶剂，优选为砜类、醇类、醚类和烷烃类溶剂中的一种或多种。所述的砜类溶剂优选二甲基亚砜；所述的醇类溶剂优选为乙醇和/或异丙醇；所述的醚类溶剂优选为二乙二醇单丁醚和乙醚中的一种或多种。所述的烷烃类溶剂优选石油醚。
其中，所述的表面活性剂可为本领域的常规表面活性剂，优选为碳6烷基糖苷、碳8烷基糖苷、烷基醇醚和脂肪醇聚氧乙烯醚中的一种或多种。
本发明的所述的原料组分按所述的含量混合后通常情况下，pH为7-8，但是若pH<7或pH>8，所述的pH值还可根据低碱度环保电解去除溢料的溶液中各组分和含量的实际情况调节。例如可使用无机酸、无机碱、多元弱酸的酸式盐和缓冲溶液中的一种或多种。若避免去溶剂的pH值发生剧烈波动，可使用本领域常规的缓冲溶液进行调节。所述的无机酸优选硼酸。所述的无机碱优选氢氧化钠。所述的多元弱酸的酸式盐优选磷酸二氢钠。
其中，所述水优选去离子水、蒸馏水、纯水和超纯水中的一种或多种(例如两种)。
较佳地，所述的原料还可包括如下所示的活化剂，所述活化剂的质量分数为1-5％；所述的百分比是指活化剂的质量占所有原料组分的百分比；
其中，x为8-20的任意整数，y为1或2；R1为C5-C12的正烷基、正庚基苯基、或正十二烷基苯基；R2为甲基或甲氧基，当y为1时，R3为
或
当y为2时，R3为
A为磺化环糊精基团，所述的磺化环糊精基团为磺化羟基环糊精中的羟基或磺化氨基环糊精中的氨基脱除H后得到的基团，优选磺化氨基环糊精。所述的磺化环糊精基团的磺化度优选为5-15％，更优选为6-10％。
所述的活化剂的重均分子量优选为1500～4000；更优选地，活化剂的重均分子量为1800～3000。
所述的磺化羟基环糊精是指浓硫酸磺化羟基环糊精制备而得；所述的磺化氨基环糊精是指浓硫酸磺化氨基环糊精制备而得；所述的羟基环糊精是指环糊精中的基团全部为羟基，可为α-环糊精、β-环糊精、γ-环糊精，优选β-环糊精。所述的氨基环糊精优选为3A-氨基-3A-脱氧-(2AS,3AS)-α-环糊精、3A-氨基-3A-脱氧-(2AS,3AS)-β-环糊精、3A-氨基-3A-脱氧-(2AS,3AS)-γ-环糊精，更优选3A-氨基-3A-脱氧-(2AS,3AS)-β-环糊精。
在本发明一优选实施方案中，所述的低碱度环保电解去除溢料的溶液，其由下述原料制得，所述的原料组分由1-10％的无机碱、1-5％的有机胺、5-12％的缓冲剂、1-5％的有机溶剂、0.1-1％的表面活性剂和水组成，各组分质量分数之和为100％；所述去除溢料的溶液的pH值为7-8。
在本发明一更优选实施方案中，所述的低碱度环保电解去除溢料的溶液，其由下述原料制得，所述的原料组分由1-10％的无机碱、1-5％的有机胺、5-12％的缓冲剂、1-5％的有机溶剂、0.1-1％的表面活性剂、1-5％的活化剂和水组成，各组分质量分数之和为100％；所述低碱度环保电解去除溢料的溶液的pH值为7-8。
本发明还提供了一种低碱度环保电解去除溢料的溶液的制备方法，其包括如下步骤：将所述的原料组分混合均匀。其中，所述的混合优选为将所述的原料组分中的固体组分加入到液体组分中，搅拌均匀，即可。所述的混合的温度优选为室温。所述的混合后，较佳地还进一步包含振荡，过滤的操作。振荡的目的是为了使各原料组分充分混合，振荡速度和时间不限。过滤是为了除去不溶物。
本发明还提供了一种低碱度环保电解去除溢料的溶液在去除半导体器件的引脚或金属散热面上形成的溢料中的应用。
本发明中室温是指10-30℃。
在不违背本领域常识的基础上，上述各优选条件，可任意组合，即得本发明各较佳实例。
本发明所用试剂和原料均市售可得。
本发明的积极进步效果在于：本发明的低碱度环保电解去除溢料的溶液碱度低，pH为7-8，有机物组分含量低，水分含量高，大于80％，有效去除溢料，且能有效避免塑封体和金属框架或基体的损伤，以及产品内部分层的问题。此外，本发明的低碱度环保电解去除溢料的溶液具有环保性。
附图说明
图1为将金属框架浸入实施例5中的溶液去除溢料后的金相显微镜图。
图2为将金属框架浸入实施例6中的溶液去除溢料后的金相显微镜图。
图3为将金属框架浸入实施例10中的溶液去除溢料后的金相显微镜图。
图4为将金属框架浸入对比例3中的溶液去除溢料后的金相显微镜图。
具体实施方式
下面通过实施例的方式进一步说明本发明，但并不因此将本发明限制在所述的实施例范围之中。下列实施例中未注明具体条件的实验方法，按照常规方法和条件，或按照商品说明书选择。
下列实施例未注明具体条件的，按室温常压选择，所述室温指10-30℃，常压指1个大气压。
1、活化剂的制备方法实施例
活化剂种类：
A1:活化剂(R1为辛烷基，R2为甲基，R3为
A为磺化β-环糊精，磺化度为5％，x为10，y为1)
A2:活化剂(R1为庚基苯基，R2为甲氧基，R3为
A为磺化β-环糊精，磺化度为10％，x为15，y为1)
A3:活化剂(R1为庚基苯基，R2为甲氧基，R3为
A为磺化3A-氨基-3A-脱氧-(2AS,3AS)-β-环糊精，磺化度为10％，x为20，y为2)
A4:活化剂(R1为十二烷基苯基，R2为甲氧基，R3为
A为磺化3A-氨基-3A-脱氧-(2AS,3AS)-β-环糊精，磺化度为10％，x为15，y为2)
所述的活化剂的制备方法，其包括如下步骤：
(1)将R1-OH加入反应釜中，氮气置换后，边升温边抽真空，当温度升到120℃时，关闭真空阀，并加入环氧丙烷，在130～150℃下，反应至完全后，降温至80℃出料，即得产物A；所述的R1-OH与环氧丙烷的投料摩尔比为1.01:1。
(2)将步骤(1)中的产物A、乙酰酮或乙酰乙酸酯、DMAP、甲苯加入装有分水器和冷凝器的反应釜中，加热至120～130℃回流，反应生成的水通过与甲苯共沸经分水器排出，待无水生成时结束，降温至70℃出料，即得产物B；产物A：乙酰酮或乙酰乙酸酯：DMAP的投料摩尔比为1:1:0.005。
(3)在步骤(2)中的产物B加入与产物A等当量的有机胺，在搅拌下缓慢加热至120～130℃回流，生成的水通过与甲苯共沸经分水器排出，待无水生成时，减压蒸馏除溶剂及其他低沸物，即得产物C。
(4)将步骤(3)中的产物C、马来酸酐溶解于甲苯中，在90℃下反应24h后分离提纯得到产物D；产物C、马来酸酐的投料摩尔比为1.01～1.05:1；
将产物D、磺化环糊精、对甲苯磺酸溶解于甲苯中，在130℃下反应36h后分离提纯得到活化剂；产物D、磺化环糊精的投料摩尔比为1：1.2～1.6，对甲苯磺酸投料占产物D和磺化环糊精总质量的0.01～1％。
所述的磺化环糊精的制备方法，其包括如下步骤：将一定量的80％的浓硫酸置于圆底烧瓶中，缓慢的加入环糊精并于0-5℃冰水中搅拌1.5-2h，反应结束后，将反应液倒入水中，加入一定量的碳酸钙，滤除生成的硫酸钙沉淀，水洗，将滤液合并，加入一定量的95％的乙醇，于0-5℃下过夜，除去沉淀，滤液用碳酸钠调节pH为10，过滤，用醋酸调节pH为7，减压真空抽滤，加入无水乙醇，产生大量白色沉淀，过滤，洗涤，干燥即得。
所述的乙酰酮优选为乙酰丙酮。所述的乙酰乙酸酯优选为乙酰乙酸甲酯。所述的有机胺优选为乙二胺、哌嗪或二乙烯三胺，优选二乙烯三胺。
2、低碱度环保电解去除溢料的溶液的制备方法实施例
将表1的原料组分按以下表2的质量分数混合均匀。其中，所述的混合优选为将所述的原料组分中的固体组分加入到液体组分中，搅拌均匀，即可。下列实施例所制得的溶液的pH值均为7-8。
表1各实施例中的组分种类
表2各实施例中组分的质量分数
3、效果实施例
工艺：
方法步骤：将塑封的金属框架浸入40℃的低碱度环保电解去除溢料的溶液中，在电流密度0.01A/cm2下采用阴极电解60s。电解后处理方式为：20kg高压水并吹干。
表3效果实施例
以上实施例中(1-10)，在金相显微镜观察时，并没有观察到金属框架有基质受损的情况。但对比例(1-3)在金相显微镜观察时，观察到金属框架有基质受损严重。从图1、图2和图3可以看出，金属框架没有基质受损；从图4可以看出，金属框架有基质受损严重。
Claims (11)
1.一种电解去除溢料的溶液，其特征在于，其由下述原料制得，所述的原料包括下列质量分数的组分：1％-10％的无机碱、1％-5％的有机胺、5％-12％的缓冲剂、1％-5％的有机溶剂、0.1％-1％的表面活性剂和水，各组分质量分数之和为100％；所述去除溢料的溶液的pH值为7-8；
所述的原料还包括如下的活化剂，所述活化剂的质量分数为1-5％；所述的百分比是指活化剂的质量占所有原料组分的百分比；
其中，x为8-20的任意整数，y为1或2；R1为C5-C12的正烷基、正庚基苯基、或正十二烷基苯基；R2为甲基或甲氧基，当y为1时，R3为
当y为2时，R3为
A为磺化环糊精基团，所述的磺化环糊精基团的磺化度为5-15％；
所述的表面活性剂为碳6烷基糖苷、碳8烷基糖苷和脂肪醇聚氧乙烯醚中的一种或多种。
2.如权利要求1所述的电解去除溢料的溶液，其特征在于，所述的无机碱的质量分数为1％-6％；
和/或，所述的有机胺的质量分数为1％-4％；
和/或，所述的缓冲剂的质量分数为7％-10％；
和/或，所述的有机溶剂的质量分数为1-2％；
和/或，所述的表面活性剂的质量分数为0.5％-0.8％。
3.如权利要求2所述的电解去除溢料的溶液，其特征在于，所述的无机碱的质量分数为5％-6％；
和/或，所述的有机胺的质量分数为3％-4％。
4.如权利要求2或3所述的电解去除溢料的溶液，其特征在于，所述的无机碱为碱金属的碳酸盐和/或碳酸氢盐；
和/或，所述的有机胺为单乙醇胺、二乙醇胺、三乙醇胺、二甘醇胺和四甲基氢氧化铵中的一种或多种；
和/或，所述的缓冲剂为弱酸及其盐、碱及其盐和多元弱酸的酸式盐及其对应的次级盐配对的缓冲剂；
和/或，所述的有机溶剂为砜类、醇类、醚类和烷烃类溶剂中的一种或多种。
5.如权利要求4所述的电解去除溢料的溶液，其特征在于，所述的碳酸盐为碳酸钠和/或碳酸钾；
和/或，所述的碳酸氢盐为碳酸氢钠；
和/或，所述的弱酸为硼酸；
和/或，所述的碱为无机强碱、氨水或无机弱碱；
和/或，所述的多元弱酸的酸式盐为磷酸二氢钠；
和/或，所述的缓冲剂中含有碱金属盐；
和/或，所述的砜类溶剂为二甲基亚砜；
和/或，所述的醇类溶剂为乙醇和/或异丙醇；
和/或，所述的醚类溶剂为二乙二醇单丁醚和乙醚中的一种或多种；
和/或，所述的烷烃类溶剂为石油醚。
6.如权利要求1所述的电解去除溢料的溶液，其特征在于，所述的活化剂的重均分子量为1500～4000；
和/或，所述的磺化环糊精基团为磺化羟基环糊精中的羟基或磺化氨基环糊精中的氨基脱除H后得到的基团；所述的磺化羟基环糊精是指浓硫酸磺化羟基环糊精制备而得；所述的磺化氨基环糊精是指浓硫酸磺化氨基环糊精制备而得；所述的羟基环糊精是指环糊精中的基团全部为羟基，为α-环糊精、β-环糊精、γ-环糊精；
和/或，所述的磺化环糊精基团的磺化度为6-10％。
7.如权利要求6所述的电解去除溢料的溶液，其特征在于，所述的活化剂的重均分子量为1800～3000；
和/或，所述的羟基环糊精为β-环糊精；
和/或，所述的氨基环糊精为3A-氨基-3A-脱氧-(2AS,3AS)-α-环糊精、3A-氨基-3A-脱氧-(2AS,3AS)-β-环糊精、3A-氨基-3A-脱氧-(2AS,3AS)-γ-环糊精。
8.如权利要求7所述的电解去除溢料的溶液，其特征在于，所述的氨基环糊精为3A-氨基-3A-脱氧-(2AS,3AS)-β-环糊精。
9.一种如权利要求1-8任一项所述的电解去除溢料的溶液的制备方法，其包括如下步骤：将所述的组分混合均匀，即得电解去除溢料的溶液。
10.如权利要求9所述的电解去除溢料的溶液的制备方法，其特征在于，所述的混合为将所述的原料组分中的固体组分加入到液体组分中，搅拌均匀，即可。
11.一种如权利要求1-8任一项所述的电解去除溢料的溶液在去除半导体器件的引脚或金属散热面上形成的溢料中的应用。
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