CN107858642B - 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法 - Google Patents

蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法 Download PDF

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CN107858642B
CN107858642B CN201710872210.3A CN201710872210A CN107858642B CN 107858642 B CN107858642 B CN 107858642B CN 201710872210 A CN201710872210 A CN 201710872210A CN 107858642 B CN107858642 B CN 107858642B
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vapor deposition
mask
resin
openings
metal
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CN107858642A (zh
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武田利彦
小幡胜也
落合洋光
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201710872210.3A 2013-04-12 2014-03-24 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法 Active CN107858642B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013-084277 2013-04-12
JP2013084277 2013-04-12
JP2013084276 2013-04-12
JP2013-084276 2013-04-12
CN201480020615.9A CN105143497B (zh) 2013-04-12 2014-03-24 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法

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CN107858642B true CN107858642B (zh) 2020-04-21

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CN201710872255.0A Pending CN107855641A (zh) 2013-04-12 2014-03-24 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法

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CN107858642B (zh) * 2013-04-12 2020-04-21 大日本印刷株式会社 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法
KR20150143433A (ko) 2013-04-12 2015-12-23 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법
JP6769692B2 (ja) * 2015-01-14 2020-10-14 大日本印刷株式会社 蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP6467931B2 (ja) * 2015-01-14 2019-02-13 大日本印刷株式会社 蒸着パターン形成方法、有機半導体素子の製造方法、及び蒸着装置
CN104966791B (zh) * 2015-07-01 2018-05-11 深圳市华星光电技术有限公司 一种掩膜板及其制造方法、oled器件封装方法
KR102430444B1 (ko) * 2015-12-18 2022-08-09 삼성디스플레이 주식회사 마스크 조립체, 이를 이용한 표시 장치의 제조 장치 및 표시 장치의 제조 방법
JP6345899B2 (ja) * 2016-02-23 2018-06-20 鴻海精密工業股▲ふん▼有限公司 蒸着マスク、蒸着マスクの製造方法および有機ｅｌ表示装置の製造方法
CN108004501A (zh) * 2016-10-27 2018-05-08 鸿富锦精密工业（深圳）有限公司 蒸镀遮罩
CN108277455B (zh) * 2018-04-25 2020-11-17 京东方科技集团股份有限公司 掩模板组件及其制备方法

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JPH07300664A (ja) * 1994-04-28 1995-11-14 Fujitsu Ltd メタルマスクの製造方法とその再生方法
CN100468824C (zh) * 2001-01-26 2009-03-11 精工爱普生株式会社 掩模的制造方法
CN100431191C (zh) * 2001-12-05 2008-11-05 三星Sdi株式会社 用于真空沉积有机电致发光器件薄膜的张力掩模组件
JP2004043898A (ja) * 2002-07-12 2004-02-12 Canon Electronics Inc 蒸着用マスク、および有機エレクトロルミネセンス表示装置
JP2004190057A (ja) * 2002-12-09 2004-07-08 Nippon Filcon Co Ltd パターニングされたマスク被膜と支持体からなる積層構造の薄膜パターン形成用マスク及びその製造方法
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CN107858642A (zh) 2018-03-30
JP2018119218A (ja) 2018-08-02
CN107855641A (zh) 2018-03-30
JP6940828B2 (ja) 2021-09-29
JP2014218750A (ja) 2014-11-20
JP2015165051A (ja) 2015-09-17
JP6327196B2 (ja) 2018-05-23
JP6569880B2 (ja) 2019-09-04
JP2019196549A (ja) 2019-11-14
JP6327048B2 (ja) 2018-05-23

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