CN107851627A - 电子器件封装、电子器件封装的制造方法、及电子器件封装用带 - Google Patents

电子器件封装、电子器件封装的制造方法、及电子器件封装用带 Download PDF

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Publication number
CN107851627A
CN107851627A CN201680041591.4A CN201680041591A CN107851627A CN 107851627 A CN107851627 A CN 107851627A CN 201680041591 A CN201680041591 A CN 201680041591A CN 107851627 A CN107851627 A CN 107851627A
Authority
CN
China
Prior art keywords
bond layer
metal level
electronic device
plane
size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680041591.4A
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English (en)
Chinese (zh)
Inventor
杉山二朗
青山真沙美
佐野透
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN107851627A publication Critical patent/CN107851627A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201680041591.4A 2016-03-31 2016-11-22 电子器件封装、电子器件封装的制造方法、及电子器件封装用带 Pending CN107851627A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-072254 2016-03-31
JP2016072254A JP2017183643A (ja) 2016-03-31 2016-03-31 電子デバイスパッケージ、電子デバイスパッケージの製造方法、および電子デバイスパッケージ用テープ
PCT/JP2016/084559 WO2017168824A1 (ja) 2016-03-31 2016-11-22 電子デバイスパッケージ、電子デバイスパッケージの製造方法、および電子デバイスパッケージ用テープ

Publications (1)

Publication Number Publication Date
CN107851627A true CN107851627A (zh) 2018-03-27

Family

ID=59963824

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680041591.4A Pending CN107851627A (zh) 2016-03-31 2016-11-22 电子器件封装、电子器件封装的制造方法、及电子器件封装用带

Country Status (5)

Country Link
JP (1) JP2017183643A (ja)
KR (1) KR20180064367A (ja)
CN (1) CN107851627A (ja)
TW (1) TW201803052A (ja)
WO (1) WO2017168824A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6935379B2 (ja) * 2018-09-25 2021-09-15 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6852030B2 (ja) * 2018-09-25 2021-03-31 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7060483B2 (ja) * 2018-09-25 2022-04-26 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7112997B2 (ja) * 2019-10-30 2022-08-04 古河電気工業株式会社 電子デバイスパッケージ用テープ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW558814B (en) * 2001-12-18 2003-10-21 Via Tech Inc Multi-chip package structure having heat sink member
CN102810520A (zh) * 2011-06-02 2012-12-05 台湾积体电路制造股份有限公司 热改善的集成电路封装件
CN102933673A (zh) * 2010-06-03 2013-02-13 日东电工株式会社 片制品
JP2015201573A (ja) * 2014-04-09 2015-11-12 富士高分子工業株式会社 放熱シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599007B2 (ja) 1977-07-12 1984-02-28 パロマ工業株式会社 液体燃料の燃焼装置
JPS5487847A (en) 1977-12-26 1979-07-12 Nissin Electric Co Ltd Oil impregnated capacitor
JP3854054B2 (ja) * 2000-10-10 2006-12-06 株式会社東芝 半導体装置
TW550717B (en) * 2002-04-30 2003-09-01 United Test Ct Inc Improvement of flip-chip package
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
TW200841437A (en) * 2007-04-11 2008-10-16 Siliconware Precision Industries Co Ltd Manufacturing method of semiconductor package and heat-dissipating structure applicable thereto
JP2012015225A (ja) * 2010-06-30 2012-01-19 Hitachi Ltd 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW558814B (en) * 2001-12-18 2003-10-21 Via Tech Inc Multi-chip package structure having heat sink member
CN102933673A (zh) * 2010-06-03 2013-02-13 日东电工株式会社 片制品
CN102810520A (zh) * 2011-06-02 2012-12-05 台湾积体电路制造股份有限公司 热改善的集成电路封装件
JP2015201573A (ja) * 2014-04-09 2015-11-12 富士高分子工業株式会社 放熱シート

Also Published As

Publication number Publication date
WO2017168824A1 (ja) 2017-10-05
TW201803052A (zh) 2018-01-16
KR20180064367A (ko) 2018-06-14
JP2017183643A (ja) 2017-10-05

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Application publication date: 20180327