KR20180064367A - 전자 디바이스 패키지, 전자 디바이스 패키지의 제조 방법 및 전자 디바이스 패키지용 테이프 - Google Patents

전자 디바이스 패키지, 전자 디바이스 패키지의 제조 방법 및 전자 디바이스 패키지용 테이프 Download PDF

Info

Publication number
KR20180064367A
KR20180064367A KR1020187000032A KR20187000032A KR20180064367A KR 20180064367 A KR20180064367 A KR 20180064367A KR 1020187000032 A KR1020187000032 A KR 1020187000032A KR 20187000032 A KR20187000032 A KR 20187000032A KR 20180064367 A KR20180064367 A KR 20180064367A
Authority
KR
South Korea
Prior art keywords
adhesive layer
electronic device
metal layer
tape
plane
Prior art date
Application number
KR1020187000032A
Other languages
English (en)
Korean (ko)
Inventor
지로우 스기야마
마사미 아오야마
도루 사노
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20180064367A publication Critical patent/KR20180064367A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020187000032A 2016-03-31 2016-11-22 전자 디바이스 패키지, 전자 디바이스 패키지의 제조 방법 및 전자 디바이스 패키지용 테이프 KR20180064367A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016072254A JP2017183643A (ja) 2016-03-31 2016-03-31 電子デバイスパッケージ、電子デバイスパッケージの製造方法、および電子デバイスパッケージ用テープ
JPJP-P-2016-072254 2016-03-31
PCT/JP2016/084559 WO2017168824A1 (ja) 2016-03-31 2016-11-22 電子デバイスパッケージ、電子デバイスパッケージの製造方法、および電子デバイスパッケージ用テープ

Publications (1)

Publication Number Publication Date
KR20180064367A true KR20180064367A (ko) 2018-06-14

Family

ID=59963824

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187000032A KR20180064367A (ko) 2016-03-31 2016-11-22 전자 디바이스 패키지, 전자 디바이스 패키지의 제조 방법 및 전자 디바이스 패키지용 테이프

Country Status (5)

Country Link
JP (1) JP2017183643A (ja)
KR (1) KR20180064367A (ja)
CN (1) CN107851627A (ja)
TW (1) TW201803052A (ja)
WO (1) WO2017168824A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6935379B2 (ja) * 2018-09-25 2021-09-15 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6852030B2 (ja) * 2018-09-25 2021-03-31 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7060483B2 (ja) * 2018-09-25 2022-04-26 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7112997B2 (ja) * 2019-10-30 2022-08-04 古河電気工業株式会社 電子デバイスパッケージ用テープ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5419226A (en) 1977-07-12 1979-02-13 Paloma Kogyo Kk Liquid fuel combustion apparatus
JPS5487847A (en) 1977-12-26 1979-07-12 Nissin Electric Co Ltd Oil impregnated capacitor
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3854054B2 (ja) * 2000-10-10 2006-12-06 株式会社東芝 半導体装置
TW558814B (en) * 2001-12-18 2003-10-21 Via Tech Inc Multi-chip package structure having heat sink member
TW550717B (en) * 2002-04-30 2003-09-01 United Test Ct Inc Improvement of flip-chip package
TW200841437A (en) * 2007-04-11 2008-10-16 Siliconware Precision Industries Co Ltd Manufacturing method of semiconductor package and heat-dissipating structure applicable thereto
JP2011252109A (ja) * 2010-06-03 2011-12-15 Nitto Denko Corp シート製品
JP2012015225A (ja) * 2010-06-30 2012-01-19 Hitachi Ltd 半導体装置
US20120306067A1 (en) * 2011-06-02 2012-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally Enhanced Integrated Circuit Package
JP2015201573A (ja) * 2014-04-09 2015-11-12 富士高分子工業株式会社 放熱シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5419226A (en) 1977-07-12 1979-02-13 Paloma Kogyo Kk Liquid fuel combustion apparatus
JPS5487847A (en) 1977-12-26 1979-07-12 Nissin Electric Co Ltd Oil impregnated capacitor
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム

Also Published As

Publication number Publication date
WO2017168824A1 (ja) 2017-10-05
TW201803052A (zh) 2018-01-16
CN107851627A (zh) 2018-03-27
JP2017183643A (ja) 2017-10-05

Similar Documents

Publication Publication Date Title
TWI632625B (zh) Tape for electronic device packaging
TWI643929B (zh) Tape for electronic device packaging
CN108076669B (zh) 电子器件封装用带
TWI624885B (zh) Tape for electronic device packaging
KR20180064367A (ko) 전자 디바이스 패키지, 전자 디바이스 패키지의 제조 방법 및 전자 디바이스 패키지용 테이프
JP6852030B2 (ja) 電子デバイスパッケージ用テープ
KR102580602B1 (ko) 반도체 가공용 테이프
JP6935379B2 (ja) 電子デバイスパッケージ用テープ
JP6655576B2 (ja) 電子デバイスパッケージ用テープ
KR102593593B1 (ko) 전자 디바이스 패키지용 테이프
JP2021185610A (ja) 電子デバイスパッケージ用テープ

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application