CN107849357B - 用于窗膜的组合物、可挠性窗膜以及可挠性显示装置 - Google Patents
用于窗膜的组合物、可挠性窗膜以及可挠性显示装置 Download PDFInfo
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- CN107849357B CN107849357B CN201680044671.5A CN201680044671A CN107849357B CN 107849357 B CN107849357 B CN 107849357B CN 201680044671 A CN201680044671 A CN 201680044671A CN 107849357 B CN107849357 B CN 107849357B
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- C09J2483/00—Presence of polysiloxane
- C09J2483/006—Presence of polysiloxane in the substrate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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Abstract
Description
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KR10-2015-0109757 | 2015-08-03 | ||
KR1020150109757A KR101788386B1 (ko) | 2015-08-03 | 2015-08-03 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
PCT/KR2016/008015 WO2017022987A1 (ko) | 2015-08-03 | 2016-07-22 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
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CN107849357A CN107849357A (zh) | 2018-03-27 |
CN107849357B true CN107849357B (zh) | 2021-11-23 |
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US (1) | US10563092B2 (zh) |
KR (1) | KR101788386B1 (zh) |
CN (1) | CN107849357B (zh) |
WO (1) | WO2017022987A1 (zh) |
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US10591761B2 (en) | 2016-10-21 | 2020-03-17 | Samsung Electronics Co., Ltd. | Flexible plastic substrate and display device including same |
KR102001613B1 (ko) * | 2017-05-24 | 2019-07-18 | 주식회사 엘지화학 | 유기전자장치 |
US10858541B2 (en) | 2017-12-19 | 2020-12-08 | Rohm And Haas Electronic Materials Llc | Curable composition |
US10826017B2 (en) * | 2018-03-30 | 2020-11-03 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Packaging assembly and preparation method thereof, and display device |
CN109273492B (zh) * | 2018-08-30 | 2021-06-01 | 云谷(固安)科技有限公司 | 显示面板及显示装置 |
US11667757B2 (en) | 2020-12-31 | 2023-06-06 | Industrial Technology Research Institute | Polymer, composition, and polysiloxane-polyimide material thereof |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105646881A (zh) * | 2014-12-02 | 2016-06-08 | 三星Sdi株式会社 | 窗膜用组成物、使用其制成的柔性窗膜以及包含其的柔性显示器 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5280098A (en) | 1992-09-30 | 1994-01-18 | Dow Corning Corporation | Epoxy-functional silicone resin |
EP0620242B1 (en) * | 1993-04-15 | 1998-08-19 | Dow Corning Toray Silicone Company, Limited | Epoxy group-containing silicone resin and compositions based thereon |
JP3592825B2 (ja) * | 1996-02-07 | 2004-11-24 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性エポキシ樹脂組成物および電子部品 |
US6210790B1 (en) | 1998-07-15 | 2001-04-03 | Rensselaer Polytechnic Institute | Glass-like composites comprising a surface-modified colloidal silica and method of making thereof |
JP2000328000A (ja) | 1999-05-21 | 2000-11-28 | Jsr Corp | フィルム用コーティング組成物およびコーティングフィルム |
JP2007176542A (ja) | 2005-12-27 | 2007-07-12 | Showa Highpolymer Co Ltd | 電子部品用透明包装袋体 |
US20080113188A1 (en) | 2006-11-09 | 2008-05-15 | Shah Pratik B | Hydrophobic organic-inorganic hybrid silane coatings |
JP5568240B2 (ja) | 2009-02-02 | 2014-08-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンゴム組成物 |
JP5394094B2 (ja) | 2009-02-18 | 2014-01-22 | 富士フイルム株式会社 | 複層フィルム及びその製造方法 |
KR101717107B1 (ko) | 2010-08-13 | 2017-03-16 | 엘지전자 주식회사 | 휴대 단말기 및 그의 디스플레이 모듈 |
US9617449B2 (en) * | 2012-06-12 | 2017-04-11 | Korea Advanced Institute Of Science And Technology | Siloxane hard coating resin |
KR101482687B1 (ko) | 2013-02-20 | 2015-01-16 | 한국과학기술원 | 투명 플렉시블 하드코팅 필름, 및 이의 제조 방법 |
KR102264361B1 (ko) * | 2013-05-17 | 2021-06-15 | 다우 실리콘즈 코포레이션 | 경화성 조성물, 경화된 물품의 제조 방법 및 이에 의해 형성된 경화된 물품 |
KR101546729B1 (ko) | 2013-12-11 | 2015-08-24 | 한국과학기술원 | 에폭시 실록산 수지 조성물을 이용한 하드코팅막 및 이의 제조 방법 |
KR102347532B1 (ko) * | 2014-01-23 | 2022-01-05 | 삼성디스플레이 주식회사 | 접을 수 있는 플렉서블 표시 장치 및 이의 제조 방법 |
KR101845081B1 (ko) | 2014-11-28 | 2018-04-04 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
KR101835867B1 (ko) * | 2014-12-23 | 2018-03-08 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
US10696016B2 (en) * | 2015-07-31 | 2020-06-30 | Samsung Sdi Co., Ltd. | Window film and flexible display including the same |
-
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- 2016-07-22 US US15/745,699 patent/US10563092B2/en active Active
- 2016-07-22 WO PCT/KR2016/008015 patent/WO2017022987A1/ko active Application Filing
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CN105646881A (zh) * | 2014-12-02 | 2016-06-08 | 三星Sdi株式会社 | 窗膜用组成物、使用其制成的柔性窗膜以及包含其的柔性显示器 |
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US10563092B2 (en) | 2020-02-18 |
CN107849357A (zh) | 2018-03-27 |
US20180215948A1 (en) | 2018-08-02 |
WO2017022987A1 (ko) | 2017-02-09 |
KR20170016570A (ko) | 2017-02-14 |
KR101788386B1 (ko) | 2017-10-20 |
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