CN107793990A - A kind of low temperature adhesive and preparation method thereof - Google Patents
A kind of low temperature adhesive and preparation method thereof Download PDFInfo
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- CN107793990A CN107793990A CN201711085367.8A CN201711085367A CN107793990A CN 107793990 A CN107793990 A CN 107793990A CN 201711085367 A CN201711085367 A CN 201711085367A CN 107793990 A CN107793990 A CN 107793990A
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- low temperature
- temperature adhesive
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of low temperature adhesive and preparation method thereof, belong to chemical technology field.It is made up of the raw material of following parts by weight：3~9 parts of 4~10 parts of POLYPROPYLENE GLYCOL, 3~9 parts of tricresyl phosphate, 1~5 part of expoxy propane phenyl ether, 4~10 parts of oleic acid glycol ester, 3~9 parts of ethylenediamine tetra-acetic acid, 4~10 parts of polyurethane resin, 1~5 part of diisooctyl phthalate, 4~8 parts of methyl hydroxyethylcellulose, 2~6 parts of toluene di-isocyanate(TDI), 4~10 parts of PTMG, 1~9 part of N methyl pyrrolidones, 3~9 parts of antioxidant and crosslinking agent.The adhesive of the present invention has good resistance to low temperature, at high temperature can be with normal use, while has good caking property, and bond effect is good, and making is simple, cost is cheap, function admirable.
Description
Technical field
The present invention relates to a kind of low temperature adhesive and preparation method thereof, belong to chemical technology field.
Background technology
Adhesive, refer to homogeneity or the technology that heterogeneous body surface is linked together with adhesive, there is stress distribution to connect
The features such as continuous, in light weight, technological temperature is low.It is glued especially suitable for unlike material, different-thickness, ultra-thin specification and complex component
Connection.Splicing RECENT DEVELOPMENTS is most fast, and application industry is extremely wide.The sorting technique of adhesive is a lot, can be divided into heat by application process
Curable type, heat molten type, room temperature curing type, pressure sensitive etc.；It is divided into structural type, non-configuration or special gelatin by application；Connecing form can
It is divided into water-soluble, emulsion type, solvent-borne type and various solid-state versions etc.；Traditional adhesive production cost is high, and using effect is bad.
The content of the invention
The purpose of the present invention is to make up the deficiencies in the prior art, there is provided a kind of low temperature adhesive and preparation method thereof.This
The adhesive of invention has good resistance to low temperature, at high temperature can be with normal use, while has good caking property, glues
It is good to tie effect, and making is simple, cost is cheap, function admirable.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of low temperature adhesive, by following parts by weight
Raw material be made：4~10 parts of POLYPROPYLENE GLYCOL, 3~9 parts of tricresyl phosphate, 1~5 part of expoxy propane phenyl ether, oleic acid ethylene glycol
4~10 parts of ester, 3~9 parts of ethylenediamine tetra-acetic acid, 4~10 parts of polyurethane resin, 1~5 part of diisooctyl phthalate, methyl
4~8 parts of hydroxyethyl cellulose, 2~6 parts of toluene di-isocyanate(TDI), 4~10 parts of PTMG, N- crassitudes
3~9 parts of 1~9 part of ketone, 3~9 parts of antioxidant and crosslinking agent.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, it is made up of the raw material of following parts by weight：7 parts of POLYPROPYLENE GLYCOL, 6 parts of tricresyl phosphate, expoxy propane
3 parts of phenyl ether, 7 parts of oleic acid glycol ester, 6 parts of ethylenediamine tetra-acetic acid, 7 parts of polyurethane resin, diisooctyl phthalate 3
Part, 6 parts of methyl hydroxyethylcellulose, 4 parts of toluene di-isocyanate(TDI), 7 parts of PTMG, 1-METHYLPYRROLIDONE 5
6 parts of part, 6 parts of antioxidant and crosslinking agent.
Further, the antioxidant is vitamin E oil, and the crosslinking agent is glyoxal.
A kind of preparation method of low temperature adhesive, comprises the following steps：
(1) raw material of following parts by weight is weighed：4~10 parts of POLYPROPYLENE GLYCOL, 3~9 parts of tricresyl phosphate, expoxy propane
1~5 part of phenyl ether, 4~10 parts of oleic acid glycol ester, 3~9 parts of ethylenediamine tetra-acetic acid, 4~10 parts of polyurethane resin, adjacent benzene two
1~5 part of formic acid di-isooctyl, 4~8 parts of methyl hydroxyethylcellulose, 2~6 parts of toluene di-isocyanate(TDI), PTMG two
4~10 parts of alcohol, 1~9 part of 1-METHYLPYRROLIDONE, add in reactor, progressively heat up, and be slowly stirred, treat that temperature rises to 90
Start timing at~98 DEG C, be incubated 25 minutes, while at the uniform velocity stirred, until reaching reaction end；
(2) 100 DEG C are continuously heating to, antioxidant and 3~9 parts of crosslinking agent that parts by weight are 3~9 parts is added, stirs
After mixing uniformly, the low temperature adhesive is produced.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the parts by weight of step (1) described raw material are：7 parts of POLYPROPYLENE GLYCOL, 6 parts of tricresyl phosphate, epoxy third
3 parts of alkane phenyl ether, 7 parts of oleic acid glycol ester, 6 parts of ethylenediamine tetra-acetic acid, 7 parts of polyurethane resin, diisooctyl phthalate 3
Part, 6 parts of methyl hydroxyethylcellulose, 4 parts of toluene di-isocyanate(TDI), 7 parts of PTMG, 1-METHYLPYRROLIDONE 5
Part.
Further, the parts by weight of step (2) described antioxidant are 6 parts, and the parts by weight of the crosslinking agent are 6 parts.
Further, the antioxidant is vitamin E oil, and the crosslinking agent is glyoxal.
The beneficial effects of the invention are as follows：
(1) adhesive of the invention has good resistance to low temperature, at high temperature can be with normal use, while has very
Good caking property, bond effect are good.
(2) making of the invention is simple, cost is cheap, function admirable, is adapted to large-scale production.
Embodiment
The principle and feature of the present invention are described below in conjunction with specific embodiment, example is served only for explaining this hair
It is bright, it is not intended to limit the scope of the present invention.
Embodiment 1：
The low temperature adhesive of the present embodiment, it is made up of the raw material of following weight：POLYPROPYLENE GLYCOL 4kg, tricresyl phosphate
9kg, expoxy propane phenyl ether 1kg, oleic acid glycol ester 10kg, ethylenediamine tetra-acetic acid 3kg, polyurethane resin 10kg, adjacent benzene two
Formic acid di-isooctyl 1kg, methyl hydroxyethylcellulose 8kg, toluene di-isocyanate(TDI) 2kg, PTMG 10kg, N-
Methyl pyrrolidone 1kg, vitamin E oil 9kg and glyoxal 3kg.
The preparation method of the low temperature adhesive of the present embodiment, comprises the following steps：
(1) raw material of following weight is weighed：POLYPROPYLENE GLYCOL 4kg, tricresyl phosphate 9kg, expoxy propane phenyl ether 1kg,
Oleic acid glycol ester 10kg, ethylenediamine tetra-acetic acid 3kg, polyurethane resin 10kg, diisooctyl phthalate 1kg, methyl hydroxyl
Ethyl cellulose 8kg, toluene di-isocyanate(TDI) 2kg, PTMG 10kg, 1-METHYLPYRROLIDONE 1kg, add anti-
Answer in kettle, progressively heat up, and be slowly stirred, start timing when temperature rises to 90 DEG C, be incubated 25 minutes, while at the uniform velocity stirred
Mix, until reaching reaction end；
(2) 100 DEG C are continuously heating to, adds 9kg vitamin E oil and 3kg glyoxal, after stirring, produces institute
State low temperature adhesive.
Embodiment 2：
The low temperature adhesive of the present embodiment, it is made up of the raw material of following weight：POLYPROPYLENE GLYCOL 7kg, tricresyl phosphate
6kg, expoxy propane phenyl ether 3kg, oleic acid glycol ester 7kg, ethylenediamine tetra-acetic acid 6kg, polyurethane resin 7kg, O-phthalic
Sour di-isooctyl 3kg, methyl hydroxyethylcellulose 6kg, toluene di-isocyanate(TDI) 4kg, PTMG 7kg, N- first
Base pyrrolidones 5kg, vitamin E oil 6kg and glyoxal 6kg.
The preparation method of the low temperature adhesive of the present embodiment, comprises the following steps：
(1) raw material of following weight is weighed：POLYPROPYLENE GLYCOL 7kg, tricresyl phosphate 6kg, expoxy propane phenyl ether 3kg,
Oleic acid glycol ester 7kg, ethylenediamine tetra-acetic acid 6kg, polyurethane resin 7kg, diisooctyl phthalate 3kg, methyl hydroxyl second
Base cellulose 6kg, toluene di-isocyanate(TDI) 4kg, PTMG 7kg, 1-METHYLPYRROLIDONE 5kg, add reaction
In kettle, progressively heat up, and be slowly stirred, start timing when temperature rises to 94 DEG C, be incubated 25 minutes, while at the uniform velocity stirred
Mix, until reaching reaction end；
(2) 100 DEG C are continuously heating to, adds 6kg vitamin E oil and 6kg glyoxal, after stirring, produces institute
State low temperature adhesive.
Embodiment 3：
The low temperature adhesive of the present embodiment, it is made up of the raw material of following weight：POLYPROPYLENE GLYCOL 10kg, tricresyl phosphate
3kg, expoxy propane phenyl ether 5kg, oleic acid glycol ester 4kg, ethylenediamine tetra-acetic acid 9kg, polyurethane resin 4kg, O-phthalic
Sour di-isooctyl 5kg, methyl hydroxyethylcellulose 4kg, toluene di-isocyanate(TDI) 6kg, PTMG 4kg, N- first
Base pyrrolidones 9kg, vitamin E oil 3kg and glyoxal 9kg.
The preparation method of the low temperature adhesive of the present embodiment, comprises the following steps：
(1) raw material of following weight is weighed：POLYPROPYLENE GLYCOL 10kg, tricresyl phosphate 3kg, expoxy propane phenyl ether 5kg,
Oleic acid glycol ester 4kg, ethylenediamine tetra-acetic acid 9kg, polyurethane resin 4kg, diisooctyl phthalate 5kg, methyl hydroxyl second
Base cellulose 4kg, toluene di-isocyanate(TDI) 6kg, PTMG 4kg, 1-METHYLPYRROLIDONE 9kg, add reaction
In kettle, progressively heat up, and be slowly stirred, start timing when temperature rises to 98 DEG C, be incubated 25 minutes, while at the uniform velocity stirred
Mix, until reaching reaction end；
(2) 100 DEG C are continuously heating to, adds 3kg vitamin E oil and 9kg glyoxal, after stirring, produces institute
State low temperature adhesive.
Comparative example
The adhesive of certain domestic producer is taken, it includes the raw material of following weight：Hydroxypropyl PASELLI EASYGEL 7kg, phosphoric acid
Front three phenolic ester 3kg, expoxy propane phenyl ether 6kg, oleic acid glycol ester 5kg, ethylenediamine tetra-acetic acid 7kg, polyurethane resin 5kg,
Diisooctyl phthalate 7kg, methyl hydroxyethylcellulose 5kg, with embodiment 1-3 obtained by resistant to elevated temperatures adhesive do pair
Than, viscous material phase same material fine powder 300kg.Comparing result is as shown in table 1.
The comparing result of the prior art of table 1 and the method for the present invention
As can be seen here, adhesive of the invention has good resistance to low temperature, at high temperature can be with normal use, simultaneously
It is good with good caking property, bond effect.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (7)
1. a kind of low temperature adhesive, it is characterised in that be made up of the raw material of following parts by weight：4~10 parts of POLYPROPYLENE GLYCOL, phosphorus
Sour 3~9 parts of front three phenolic ester, 1~5 part of expoxy propane phenyl ether, 4~10 parts of oleic acid glycol ester, 3~9 parts of ethylenediamine tetra-acetic acid,
4~10 parts of polyurethane resin, 1~5 part of diisooctyl phthalate, 4~8 parts of methyl hydroxyethylcellulose, toluene diisocyanate
2~6 parts of acid esters, 4~10 parts of PTMG, 1~9 part of 1-METHYLPYRROLIDONE, 3~9 parts of antioxidant and crosslinking
3~9 parts of agent.
2. a kind of low temperature adhesive according to claim 1, it is characterised in that by the raw material system of following parts by weight
Into：7 parts of POLYPROPYLENE GLYCOL, 6 parts of tricresyl phosphate, 3 parts of expoxy propane phenyl ether, 7 parts of oleic acid glycol ester, ethylenediamine tetra-acetic acid
6 parts, 7 parts of polyurethane resin, 3 parts of diisooctyl phthalate, 6 parts of methyl hydroxyethylcellulose, toluene di-isocyanate(TDI) 4
Part, 7 parts of PTMG, 5 parts of 1-METHYLPYRROLIDONE, 6 parts of antioxidant and 6 parts of crosslinking agent.
3. a kind of low temperature adhesive according to claim 1 or 2, it is characterised in that the antioxidant is vitamin E
Oil, the crosslinking agent are glyoxal.
4. a kind of preparation method of low temperature adhesive, it is characterised in that comprise the following steps：
(1) raw material of following parts by weight is weighed：4~10 parts of POLYPROPYLENE GLYCOL, 3~9 parts of tricresyl phosphate, expoxy propane phenyl
1~5 part of ether, 4~10 parts of oleic acid glycol ester, 3~9 parts of ethylenediamine tetra-acetic acid, 4~10 parts of polyurethane resin, phthalic acid
1~5 part of di-isooctyl, 4~8 parts of methyl hydroxyethylcellulose, 2~6 parts of toluene di-isocyanate(TDI), PTMG 4
~10 parts, 1~9 part of 1-METHYLPYRROLIDONE, add in reactor, progressively heat up, and be slowly stirred, treat that temperature rises to 90~98
DEG C when start timing, 25 minutes are incubated, while at the uniform velocity stirred, up to reaching reaction end；
(2) 100 DEG C are continuously heating to, adds antioxidant and 3~9 parts of crosslinking agent that parts by weight are 3~9 parts, stirring is equal
After even, the low temperature adhesive is produced.
A kind of 5. preparation method of low temperature adhesive according to claim 4, it is characterised in that step (1) described original
The parts by weight of material are：7 parts of POLYPROPYLENE GLYCOL, 6 parts of tricresyl phosphate, 3 parts of expoxy propane phenyl ether, 7 parts of oleic acid glycol ester,
6 parts of ethylenediamine tetra-acetic acid, 7 parts of polyurethane resin, 3 parts of diisooctyl phthalate, 6 parts of methyl hydroxyethylcellulose, toluene
4 parts of diisocyanate, 7 parts of PTMG, 5 parts of 1-METHYLPYRROLIDONE.
6. the preparation method of a kind of low temperature adhesive according to claim 4, it is characterised in that step (2) is described anti-
The parts by weight of oxidant are 6 parts, and the parts by weight of the crosslinking agent are 6 parts.
7. the preparation method of a kind of low temperature adhesive according to claim any one of 4-6, it is characterised in that described anti-
Oxidant is vitamin E oil, and the crosslinking agent is glyoxal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711085367.8A CN107793990A (en) | 2017-11-07 | 2017-11-07 | A kind of low temperature adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711085367.8A CN107793990A (en) | 2017-11-07 | 2017-11-07 | A kind of low temperature adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107793990A true CN107793990A (en) | 2018-03-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711085367.8A Withdrawn CN107793990A (en) | 2017-11-07 | 2017-11-07 | A kind of low temperature adhesive and preparation method thereof |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105255445A (en) * | 2015-10-13 | 2016-01-20 | 罗志坤 | Novel high-temperature-resistant adhesive and preparation method thereof |
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2017
- 2017-11-07 CN CN201711085367.8A patent/CN107793990A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105255445A (en) * | 2015-10-13 | 2016-01-20 | 罗志坤 | Novel high-temperature-resistant adhesive and preparation method thereof |
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Application publication date: 20180313 |