CN107841278A - A kind of high-temperature Resistance Adhesives and preparation method thereof - Google Patents

A kind of high-temperature Resistance Adhesives and preparation method thereof Download PDF

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Publication number
CN107841278A
CN107841278A CN201710982844.4A CN201710982844A CN107841278A CN 107841278 A CN107841278 A CN 107841278A CN 201710982844 A CN201710982844 A CN 201710982844A CN 107841278 A CN107841278 A CN 107841278A
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parts
acid
temperature resistance
resistance adhesives
weight
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黄云鸿
李力
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Guilin Chunxiao Environmental Protection Technology Co Ltd
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Guilin Chunxiao Environmental Protection Technology Co Ltd
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Priority to CN201710982844.4A priority Critical patent/CN107841278A/en
Publication of CN107841278A publication Critical patent/CN107841278A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3225—Polyamines
    • C08G18/3237—Polyamines aromatic
    • C08G18/3243—Polyamines aromatic containing two or more aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3271—Hydroxyamines
    • C08G18/3278—Hydroxyamines containing at least three hydroxy groups
    • C08G18/3284—Hydroxyamines containing at least three hydroxy groups containing four hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/36—Hydroxylated esters of higher fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/675—Low-molecular-weight compounds
    • C08G18/6755—Unsaturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a kind of high-temperature Resistance Adhesives and preparation method thereof, belong to chemical technology field.It is made up of the raw material of following parts by weight：4~10 parts of 5~15 parts of dibutyl phthalate, 6~18 parts of diaminodiphenyl-methane, 5~15 parts of expoxy propane phenyl ether, 4~12 parts of hydrogenated rosin glyceride, 4~12 parts of ethylenediamine tetra-acetic acid, 5~15 parts of benzoic acid isooctyl acid diethylene glycol (DEG) ester, 4~12 parts of succinic acid, 6~18 parts of acrylic acid, 3~9 parts of toluene di-isocyanate(TDI), 4~12 parts of PTMG, 3~9 parts of N methyl pyrrolidones, 4~10 parts of antioxidant and crosslinking agent.The adhesive of the present invention has good resistance to elevated temperatures, at high temperature can be with normal use, while has good caking property, and bond effect is good, and making is simple, cost is cheap, function admirable.

Description

A kind of high-temperature Resistance Adhesives and preparation method thereof
Technical field
The present invention relates to a kind of high-temperature Resistance Adhesives and preparation method thereof, belong to chemical technology field.
Background technology
Adhesive, refer to homogeneity or the technology that heterogeneous body surface is linked together with adhesive, there is stress distribution to connect The features such as continuous, in light weight, technological temperature is low.It is glued especially suitable for unlike material, different-thickness, ultra-thin specification and complex component Connection.Splicing RECENT DEVELOPMENTS is most fast, and application industry is extremely wide.The sorting technique of adhesive is a lot, can be divided into heat by application process Curable type, heat molten type, room temperature curing type, pressure sensitive etc.；It is divided into structural type, non-configuration or special gelatin by application；Connecing form can It is divided into water-soluble, emulsion type, solvent-borne type and various solid-state versions etc.；Traditional adhesive production cost is high, and using effect is bad.
The content of the invention
The purpose of the present invention is to make up the deficiencies in the prior art, there is provided a kind of high-temperature Resistance Adhesives and preparation method thereof.This The adhesive of invention has good resistance to elevated temperatures, at high temperature can be with normal use, while has good caking property, glues It is good to tie effect, and making is simple, cost is cheap, function admirable.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of high-temperature Resistance Adhesives, by following parts by weight Raw material be made：5~15 parts of dibutyl phthalate, 6~18 parts of diaminodiphenyl-methane, expoxy propane phenyl ether 5~ 15 parts, 4~12 parts of hydrogenated rosin glyceride, 4~12 parts of ethylenediamine tetra-acetic acid, 5~15 parts of benzoic acid isooctyl acid diethylene glycol (DEG) ester, fourth 4~12 parts of diacid, 6~18 parts of acrylic acid, 3~9 parts of toluene di-isocyanate(TDI), 4~12 parts of PTMG, N- methyl 4~10 parts of 3~9 parts of pyrrolidones, 4~10 parts of antioxidant and crosslinking agent.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, it is made up of the raw material of following parts by weight：10 parts of dibutyl phthalate, diaminodiphenyl-methane 12 parts, 10 parts of expoxy propane phenyl ether, 8 parts of hydrogenated rosin glyceride, 8 parts of ethylenediamine tetra-acetic acid, benzoic acid isooctyl acid diethylene glycol (DEG) 10 parts of ester, 8 parts of succinic acid, 12 parts of acrylic acid, 6 parts of toluene di-isocyanate(TDI), 8 parts of PTMG, N- methylpyrroles 7 parts of 6 parts of alkanone, 7 parts of antioxidant and crosslinking agent.
Further, the antioxidant is vitamin E oil.
Further, the crosslinking agent is glyoxal.
A kind of preparation method of high-temperature Resistance Adhesives, comprises the following steps：
(1) raw material of following parts by weight is weighed：5~15 parts of dibutyl phthalate, diaminodiphenyl-methane 6~ 18 parts, 5~15 parts of expoxy propane phenyl ether, 4~12 parts of hydrogenated rosin glyceride, 4~12 parts of ethylenediamine tetra-acetic acid, benzoic acid it is different Sad 5~15 parts of diethylene glycol (DEG) ester, 4~12 parts of succinic acid, 6~18 parts of acrylic acid, 3~9 parts of toluene di-isocyanate(TDI), poly- tetrahydrochysene furan Mutter 4~12 parts of ether glycol, 3~9 parts of 1-METHYLPYRROLIDONE, add in reactor, progressively heat up, and be slowly stirred, treat temperature Start timing when rising to 90~95 DEG C, be incubated 20 minutes, while at the uniform velocity stirred, until reaching reaction end；
(2) 100 DEG C are continuously heating to, adds antioxidant and 4~10 parts of crosslinking agent that parts by weight are 4~10 parts, After stirring, the high-temperature Resistance Adhesives are produced.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the parts by weight of step (1) described raw material are：10 parts of dibutyl phthalate, diamino-diphenyl 12 parts of methane, 10 parts of expoxy propane phenyl ether, 8 parts of hydrogenated rosin glyceride, 8 parts of ethylenediamine tetra-acetic acid, benzoic acid isooctyl acid two 10 parts of glycol ester, 8 parts of succinic acid, 12 parts of acrylic acid, 6 parts of toluene di-isocyanate(TDI), 8 parts of PTMG, N- methyl 6 parts of pyrrolidones.
Further, the parts by weight of step (2) described antioxidant are 7 parts, and the parts by weight of the crosslinking agent are 7 parts.
Further, the antioxidant is vitamin E oil.
Further, the crosslinking agent is glyoxal.
The beneficial effects of the invention are as follows：
(1) adhesive of the invention has good resistance to elevated temperatures, at high temperature can be with normal use, while has very Good caking property, bond effect are good.
(2) making of the invention is simple, cost is cheap, function admirable, is adapted to large-scale production.
Embodiment
The principle and feature of the present invention are described below in conjunction with specific embodiment, example is served only for explaining this hair It is bright, it is not intended to limit the scope of the present invention.
Embodiment 1：
The high-temperature Resistance Adhesives of the present embodiment, it is made up of the raw material of following weight：Dibutyl phthalate 5kg, diamino Base diphenyl methane 18kg, expoxy propane phenyl ether 5kg, hydrogenated rosin glyceride 12kg, ethylenediamine tetra-acetic acid 4kg, benzoic acid Isooctyl acid diethylene glycol (DEG) ester 15kg, succinic acid 4kg, acrylic acid 18kg, toluene di-isocyanate(TDI) 3kg, PTMG 12kg, 1-METHYLPYRROLIDONE 3kg, antioxidant 10kg and crosslinking agent 4kg, wherein, the antioxidant is vitamin E oil, The crosslinking agent is glyoxal.
The preparation method of the high-temperature Resistance Adhesives of the present embodiment, comprises the following steps：
(1) raw material of following weight is weighed：Dibutyl phthalate 5kg, diaminodiphenyl-methane 18kg, epoxy third Alkane phenyl ether 5kg, hydrogenated rosin glyceride 12kg, ethylenediamine tetra-acetic acid 4kg, benzoic acid isooctyl acid diethylene glycol (DEG) ester 15kg, fourth two Sour 4kg, acrylic acid 18kg, toluene di-isocyanate(TDI) 3kg, PTMG 12kg, 1-METHYLPYRROLIDONE 3kg, add Enter in reactor, progressively heat up, and be slowly stirred, start timing when temperature rises to 90~95 DEG C, be incubated 20 minutes, enter simultaneously Row at the uniform velocity stirs, until reaching reaction end；
(2) 100 DEG C are continuously heating to, antioxidant 10kg and crosslinking agent 4kg is added, after stirring, produces described resistance to High temperature adhesive.
Embodiment 2：
The high-temperature Resistance Adhesives of the present embodiment, it is made up of the raw material of following weight：Dibutyl phthalate 10kg, diamino Base diphenyl methane 12kg, expoxy propane phenyl ether 10kg, hydrogenated rosin glyceride 8kg, ethylenediamine tetra-acetic acid 8kg, benzoic acid Isooctyl acid diethylene glycol (DEG) ester 10kg, succinic acid 8kg, acrylic acid 12kg, toluene di-isocyanate(TDI) 6kg, PTMG 8kg, 1-METHYLPYRROLIDONE 6kg, antioxidant 7kg and crosslinking agent 7kg, wherein, the antioxidant is vitamin E oil, institute It is glyoxal to state crosslinking agent.
The preparation method of the high-temperature Resistance Adhesives of the present embodiment, comprises the following steps：
(1) raw material of following weight is weighed：Dibutyl phthalate 10kg, diaminodiphenyl-methane 12kg, epoxy Propane phenyl ether 10kg, hydrogenated rosin glyceride 8kg, ethylenediamine tetra-acetic acid 8kg, benzoic acid isooctyl acid diethylene glycol (DEG) ester 10kg, fourth Diacid 8kg, acrylic acid 12kg, toluene di-isocyanate(TDI) 6kg, PTMG 8kg, 1-METHYLPYRROLIDONE 6kg, add Enter in reactor, progressively heat up, and be slowly stirred, start timing when temperature rises to 90~95 DEG C, be incubated 20 minutes, enter simultaneously Row at the uniform velocity stirs, until reaching reaction end；
(2) 100 DEG C are continuously heating to, antioxidant 7kg and crosslinking agent 7kg is added, after stirring, produces the resistance to height Warm adhesive.
Embodiment 3：
The high-temperature Resistance Adhesives of the present embodiment, it is made up of the raw material of following weight：Dibutyl phthalate 15kg, diamino Base diphenyl methane 6kg, expoxy propane phenyl ether 15kg, hydrogenated rosin glyceride 4kg, ethylenediamine tetra-acetic acid 12kg, benzoic acid Isooctyl acid diethylene glycol (DEG) ester 5kg, succinic acid 12kg, acrylic acid 6kg, toluene di-isocyanate(TDI) 9kg, PTMG 4kg, 1-METHYLPYRROLIDONE 9kg, antioxidant 4kg and crosslinking agent 10kg, wherein, the antioxidant is vitamin E oil, the friendship Connection agent is glyoxal.
The preparation method of the high-temperature Resistance Adhesives of the present embodiment, comprises the following steps：
(1) raw material of following weight is weighed：Dibutyl phthalate 15kg, diaminodiphenyl-methane 6kg, epoxy third Alkane phenyl ether 15kg, hydrogenated rosin glyceride 4kg, ethylenediamine tetra-acetic acid 12kg, benzoic acid isooctyl acid diethylene glycol (DEG) ester 5kg, fourth two Sour 12kg, acrylic acid 6kg, toluene di-isocyanate(TDI) 9kg, PTMG 4kg, 1-METHYLPYRROLIDONE 9kg, add In reactor, progressively heat up, and be slowly stirred, start timing when temperature rises to 90~95 DEG C, be incubated 20 minutes, carry out simultaneously At the uniform velocity stir, until reaching reaction end；
(2) 100 DEG C are continuously heating to, antioxidant 4kg and crosslinking agent 10kg is added, after stirring, produces described resistance to High temperature adhesive.
Comparative example
The adhesive of certain domestic producer is taken, it includes the raw material of following weight：Hydroxypropyl PASELLI EASYGEL 5kg, diamino Base diphenyl methane 5kg, expoxy propane phenyl ether 4kg, hydrogenated rosin glyceride 3kg, ethylenediamine tetra-acetic acid 5kg, benzoic acid are different Sad diethylene glycol (DEG) ester 6kg, succinic acid 6kg, acrylic acid 5kg, contrast, glue with the resistant to elevated temperatures adhesive of embodiment 1-3 gained The fine powder 300kg of material phase same material.Comparing result is as shown in table 1.
The comparing result of the prior art of table 1 and the method for the present invention
As can be seen here, adhesive of the invention has good resistance to elevated temperatures, at high temperature can be with normal use, simultaneously It is good with good caking property, bond effect.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.

Claims (9)

1. a kind of high-temperature Resistance Adhesives, it is characterised in that be made up of the raw material of following parts by weight：Dibutyl phthalate 5 ~15 parts, 6~18 parts of diaminodiphenyl-methane, 5~15 parts of expoxy propane phenyl ether, 4~12 parts of hydrogenated rosin glyceride, second 4~12 parts of ethylenediamine tetraacetic acid (EDTA), 5~15 parts of benzoic acid isooctyl acid diethylene glycol (DEG) ester, 4~12 parts of succinic acid, 6~18 parts of acrylic acid, first 3~9 parts of phenylene diisocyanate, 4~12 parts of PTMG, 3~9 parts of 1-METHYLPYRROLIDONE, antioxidant 4~10 4~10 parts of part and crosslinking agent.
2. a kind of high-temperature Resistance Adhesives according to claim 1, it is characterised in that by the raw material system of following parts by weight Into：10 parts of dibutyl phthalate, 12 parts of diaminodiphenyl-methane, 10 parts of expoxy propane phenyl ether, hydrogenated rosin glycerine 8 parts of ester, 8 parts of ethylenediamine tetra-acetic acid, 10 parts of benzoic acid isooctyl acid diethylene glycol (DEG) ester, 8 parts of succinic acid, 12 parts of acrylic acid, toluene two are different 7 parts of 6 parts of cyanate, 8 parts of PTMG, 6 parts of 1-METHYLPYRROLIDONE, 7 parts of antioxidant and crosslinking agent.
3. a kind of high-temperature Resistance Adhesives according to claim 1 or 2, it is characterised in that the antioxidant is vitamin E Oil.
4. a kind of high-temperature Resistance Adhesives according to claim 1 or 2, it is characterised in that the crosslinking agent is glyoxal.
5. a kind of preparation method of high-temperature Resistance Adhesives, it is characterised in that comprise the following steps：
(1) raw material of following parts by weight is weighed：5~15 parts of dibutyl phthalate, diaminodiphenyl-methane 6~18 Part, 5~15 parts of expoxy propane phenyl ether, 4~12 parts of hydrogenated rosin glyceride, 4~12 parts of ethylenediamine tetra-acetic acid, benzoic acid are different pungent Sour 5~15 parts of diethylene glycol (DEG) ester, 4~12 parts of succinic acid, 6~18 parts of acrylic acid, 3~9 parts of toluene di-isocyanate(TDI), PolyTHF 4~12 parts of ether glycol, 3~9 parts of 1-METHYLPYRROLIDONE, add in reactor, progressively heat up, and be slowly stirred, treat temperature liter Start timing during to 90~95 DEG C, be incubated 20 minutes, while at the uniform velocity stirred, until reaching reaction end；
(2) 100 DEG C are continuously heating to, adds antioxidant and 4~10 parts of crosslinking agent that parts by weight are 4~10 parts, stirring After uniformly, the high-temperature Resistance Adhesives are produced.
A kind of 6. preparation method of high-temperature Resistance Adhesives according to claim 5, it is characterised in that step (1) described original The parts by weight of material are：10 parts of dibutyl phthalate, 12 parts of diaminodiphenyl-methane, 10 parts of expoxy propane phenyl ether, 8 parts of hydrogenated rosin glyceride, 8 parts of ethylenediamine tetra-acetic acid, 10 parts of benzoic acid isooctyl acid diethylene glycol (DEG) ester, 8 parts of succinic acid, acrylic acid 12 Part, 6 parts of toluene di-isocyanate(TDI), 8 parts of PTMG, 6 parts of 1-METHYLPYRROLIDONE.
7. the preparation method of a kind of high-temperature Resistance Adhesives according to claim 5, it is characterised in that step (2) is described anti- The parts by weight of oxidant are 7 parts, and the parts by weight of the crosslinking agent are 7 parts.
8. the preparation method of a kind of high-temperature Resistance Adhesives according to claim any one of 5-7, it is characterised in that described anti- Oxidant is vitamin E oil.
A kind of 9. preparation method of high-temperature Resistance Adhesives according to claim any one of 5-7, it is characterised in that the friendship Connection agent is glyoxal.
CN201710982844.4A 2017-10-20 2017-10-20 A kind of high-temperature Resistance Adhesives and preparation method thereof Pending CN107841278A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105255445A (en) * 2015-10-13 2016-01-20 罗志坤 Novel high-temperature-resistant adhesive and preparation method thereof
CN106336846A (en) * 2016-08-22 2017-01-18 桂林新艺制冷设备有限责任公司 Novel high temperature resistant adhesive and preparation method thereof,
CN106336837A (en) * 2016-08-22 2017-01-18 桂林新艺制冷设备有限责任公司 Heat resistant adhesive and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105255445A (en) * 2015-10-13 2016-01-20 罗志坤 Novel high-temperature-resistant adhesive and preparation method thereof
CN106336846A (en) * 2016-08-22 2017-01-18 桂林新艺制冷设备有限责任公司 Novel high temperature resistant adhesive and preparation method thereof,
CN106336837A (en) * 2016-08-22 2017-01-18 桂林新艺制冷设备有限责任公司 Heat resistant adhesive and preparation method thereof

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