CN107768506A - Stacked plate type light emitting diode - Google Patents
Stacked plate type light emitting diode Download PDFInfo
- Publication number
- CN107768506A CN107768506A CN201711165291.XA CN201711165291A CN107768506A CN 107768506 A CN107768506 A CN 107768506A CN 201711165291 A CN201711165291 A CN 201711165291A CN 107768506 A CN107768506 A CN 107768506A
- Authority
- CN
- China
- Prior art keywords
- chip
- led chip
- emitting diode
- light emitting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000011120 plywood Substances 0.000 claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of stacked plate type light emitting diode, including substrate, LED chip, the substrate includes top plate, lower plywood, the substrate is arranged on the upper surface of underlying substrate by cohesive mode, the top plate is made up of at least one layer of plate-like piece, the top plate is provided with least two pieces, at least two pieces of top plates are arranged at intervals to form the chip containing groove for accommodating LED chip, it is provided with conducting wire on the lower plywood, the LED chip in the chip containing groove is welded with conducting wire.After such scheme, LED chip without being arranged on substrate again, it is set directly in chip manner groove, reduce the integral thickness of light emitting diode, reduce space, save material, the pad of flip-chip bottom is directly connected with lower plywood, for positive cartridge chip (welding the top of the pin at the top of LED chip and substrate), flip-chip can save space, and corresponding thickness also reduces.
Description
Technical field
The present invention relates to diode field, more particularly to a kind of stacked plate type light emitting diode.
Background technology
Light emitting diode (LightEmitting Diode, LED), is a kind of semiconductor subassembly.It is at the beginning to be used as indicating more
Lamp, display light-emitting diode panel etc.；With the appearance of white light LEDs, used also as illumination.The part of light emitting diode generally comprises
Substrate, LED, general LED are directly welded on substrate, because substrate has certain thickness, along with support is arranged on base
The thickness of the LED of plate surface, the thickness of the LED of single is thicker, and space-consuming is big, integral thickness big (luminescence chip and base
The gross thickness of plate), it is impossible to well adapt to the lightening demand of end product.
The content of the invention
To overcome disadvantages mentioned above, it is an object of the invention to provide a kind of stacked plate type that can reduce integral thickness luminous two
Pole pipe.
In order to reach object above, the technical solution adopted by the present invention is：A kind of stacked plate type light emitting diode, including base
Plate, LED chip, the substrate include top plate, lower plywood, and the substrate is arranged on the upper of underlying substrate by cohesive mode
End face, the top plate are made up of at least one layer of plate-like piece, and the top plate is provided with least two pieces, at least two pieces of upper stratas
Plate is arranged at intervals to form the chip containing groove for accommodating LED chip, and conducting wire, the chip are provided with the lower plywood
LED chip in storage tank is welded with conducting wire.
The beneficial effect of stacked plate type light emitting diode of the present invention is to set the substrate of script in by least two pieces of upper stratas
Plate, lower plywood are formed, and the interval setting of at least two pieces top plates is formed to accommodate the chip containing groove of LED chip, LED
Upper surface of the chip without being arranged on substrate again, is set directly in chip manner groove, reduces the overall thick of light emitting diode
Degree, reduces space, saves material, well adapt to the lightening demand of end product.
Preferably, LED chip is encapsulated in chip containing groove by packaging plastic in the chip containing groove.Packaging plastic edge
With prior art.
It is that the chip containing groove is cylindrical as a further improvement on the present invention, the LED chip is centrally located.
Be easy to the installation of LED chip by columned chip containing groove, at the same light caused by LED chip transmitting can uniformly to
The notch of chip containing groove projects, help to ensure that outside notch brightness be not in obvious deviation (brightness deviation is small,
Naked eyes cannot be distinguished by).
Preferably, twice of the width of a diameter of LED chip of the chip containing groove.It is further ensured that light can be equal
The even notch to chip containing groove projects.
Preferably, the height of the chip containing groove and LED chip is highly consistent, or the LED chip is less than described
Chip containing groove.It is in highly consistent with LED chip that the height of chip containing groove, which is set, and this is highly optimal structure.
Preferably, the thickness of the lower plywood is less than the thickness of top plate.The thickness of substrate is reduced as far as possible, due to upper
Laminate be installation LED chip, LED chip be have it is certain thickness, therefore the thickness of top plate guaranteeing accommodate LED chip
It can not again reduce afterwards, in order to reduce the integral thickness of substrate, be only capable of reducing the thickness of lower plywood.
Preferably, the top of the top plate sets matcoveredn, to the LED chip on protective substrate.
Preferably, the top plate, the lower plywood use BT plates.Top plate, lower plywood use glass mat, have
Higher mechanical performance and dielectric properties, substrate intensity in itself and electric conductivity are improved, and then the thickness of substrate can be reduced
Use without influenceing substrate.
Preferably, the top plate is formed by stacking by least two layers of plate-like piece.
Preferably, the LED chip uses flip-chip, and the bottom of the flip-chip has a pad, the pad with
The conducting wire welding of lower plywood, SMD connection, the i.e. pad of flip-chip bottom are directly connected with lower plywood, compared to
For positive cartridge chip (welding the top of the pin at the top of LED chip and substrate), flip-chip can save space, corresponding thick
Degree also reduces.
Preferably, the integral thickness of the substrate and protective layer can accomplish 0.01mm~2mm；If not increasing protective layer,
The integral thickness of the substrate can be arranged to 0.01mm~2mm.
Preferably, the pad is SMD pads, LED flip chip is not influenceed by cabling.
Brief description of the drawings
Fig. 1 is the structural representation of embodiment one；
Fig. 2 is the structural representation of embodiment two；
Fig. 3 is the structural representation of embodiment three.
In figure：
1- substrates；2- top plates；3- lower plywoods；4-LED chips；5- chip containing grooves；6- pads；7- packaging plastics；8- is protected
Sheath.
Embodiment
Presently preferred embodiments of the present invention is described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent is clearly defined so as to be made to protection scope of the present invention.
Embodiment one, referring to shown in accompanying drawing 1, a kind of stacked plate type light emitting diode in the present embodiment, including substrate 1, LED
Chip 4, substrate 1 include top plate 2, the lower plywood 3 being made up of BT plates, and substrate 1 is arranged on underlying substrate 1 by cohesive mode
Upper surface, top plate 2 can be made up of at least one layer of plate-like piece, and the top plate in the present embodiment is made up of one layer of plate-like piece,
It can also be superimposed by multilayer plate-like piece and form top plate 2, depending on demand.Top plate 2 is provided with least two pieces, at least
The interval setting of two pieces of top plates 2 forms chip containing groove 5, and to accommodate LED chip 4, LED chip 4 is less than chip containing groove 5
Chip containing groove 5, LED chip 4 use flip-chip, and the bottom of flip-chip has pad 6, conduction is provided with lower plywood 3
Circuit, the conducting wire of pad 6 and lower plywood 3 are welded.
LED chip 4 is encapsulated in chip containing groove 5 by packaging plastic 7 in chip containing groove 5.Chip containing groove 5 is in circle
Column, LED chip 4 are centrally located.Twice of the width of a diameter of LED chip 4 of chip containing groove 5, the thickness of lower plywood 3 is small
In the thickness of top plate 2, the integral thickness of substrate 1 is 0.01-2mm, and pad 6 is SMD pads 6.
Embodiment two, referring to shown in accompanying drawing 2, unlike embodiment one, the top of top plate 2 sets matcoveredn 8.
The integral thickness of substrate 1 and protective layer 8 is 0.01mm~2mm.
Embodiment three, referring to shown in accompanying drawing 3, unlike embodiment one, height and the LED chip 4 of chip containing groove 5
It is highly consistent.
Example IV,, can also be in the upper of lower plywood 3 on the basis of embodiment one is continued to use unlike embodiment one
Surface is provided with boss (not shown).Because LED chip 4 is using flip-chip (inversion chip), flip-chip and lower plywood 3
Conductive circuit layer connection.In the present embodiment, because the conducting wire of lower plywood 3 is divided into two parts, the N of LED chip 4
The conductive circuit layer side of the less lower plywood 3 of pole corresponding area, the conductive circuit layer of the larger lower plywood 3 of P poles corresponding area
Side.During using 3 encapsulating structure of flip LED chips, when connecting flip-chip with conducting wire, typically conducting resinl or weldering are used
Coated on boss, conducting resinl or the solder bubble therein when melting on boss are easily discharged material.Therefore, flip-chip is put
Put when on boss, the pad 6 (electrode) of flip-chip extrudes the bubble in conducting resinl or solder, reduces interconnection cavity, drop
The thermal resistance of low interconnection, improves substrate heat dispersion, extend LED life, and then raising product yield.
Further, it is also possible to which the lower surface of lower plywood 3 and pad 6 is arranged into dentalation, it can also reach above-mentioned function.
Embodiment five, unlike embodiment one, the LED chip of formal dress (just putting) can be installed in chip containing groove 5
4, the pin at the top of LED chip 4 can be connected by the way of welding with conducting wire.
The technical concepts and features of embodiment of above only to illustrate the invention, its object is to allow be familiar with technique
People understands present disclosure and is carried out, and it is not intended to limit the scope of the present invention, all according to spirit of the invention
The equivalent change or modification that essence is done, it should all cover within the scope of the present invention.
Claims (8)
1. a kind of stacked plate type light emitting diode, including substrate (1), LED chip (4), it is characterised in that：The substrate (1) includes
Top plate (2), lower plywood (3), the substrate (1) are arranged on the upper surface of underlying substrate (1) by cohesive mode, it is described on
Laminate (2) is made up of at least one layer of plate-like piece, and the top plate (2) is provided with least two pieces, at least two pieces of top plates (2)
It is arranged at intervals and is formed to accommodate the chip containing groove of LED chip (4) (5), conducting wire is provided with the lower plywood (3),
LED chip (4) in the chip containing groove (5) is welded with conducting wire.
2. stacked plate type light emitting diode according to claim 1, it is characterised in that：Pass through in the chip containing groove (5)
LED chip (4) is encapsulated in chip containing groove (5) by packaging plastic (7).
3. stacked plate type light emitting diode according to claim 1, it is characterised in that：The diameter of the chip containing groove (5)
For 2-50 times of the width of LED chip (4).
4. stacked plate type light emitting diode according to claim 1, it is characterised in that：The height of the chip containing groove (5)
It is highly consistent with LED chip (4)；Or the LED chip (4) is less than the chip containing groove (5).
5. stacked plate type light emitting diode according to claim 1, it is characterised in that：The thickness of the lower plywood (3) is less than
The thickness of top plate (2).
6. stacked plate type light emitting diode according to claim 1, it is characterised in that：The top of the top plate (2) is set
Matcoveredn (8).
7. stacked plate type light emitting diode according to claim 1, it is characterised in that：The top plate (2) is by least two layers
Plate-like piece is formed by stacking.
8. stacked plate type light emitting diode according to claim 1, it is characterised in that：The LED chip (4) uses upside-down mounting core
Piece or positive cartridge chip, the bottom of the flip-chip have pad (6), and the pad (6) and the conducting wire of lower plywood (3) are welded
Connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165291.XA CN107768506A (en) | 2017-11-21 | 2017-11-21 | Stacked plate type light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165291.XA CN107768506A (en) | 2017-11-21 | 2017-11-21 | Stacked plate type light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107768506A true CN107768506A (en) | 2018-03-06 |
Family
ID=61278460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711165291.XA Pending CN107768506A (en) | 2017-11-21 | 2017-11-21 | Stacked plate type light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107768506A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216764A (en) * | 2005-02-03 | 2006-08-17 | Ngk Spark Plug Co Ltd | Wiring board for packaging light-emitting device |
| CN101322254A (en) * | 2005-10-28 | 2008-12-10 | 阿莫先思电子电器有限公司 | Electronic parts packages and method for forming a cavity thereof |
| CN101593934A (en) * | 2008-05-29 | 2009-12-02 | 株式会社理光 | Light-emitting device, optical scanner and imaging device |
| CN102779932A (en) * | 2011-05-13 | 2012-11-14 | Lg伊诺特有限公司 | Light emitting device package and ultraviolet lamp having the same |
| CN103078040A (en) * | 2011-08-22 | 2013-05-01 | Lg伊诺特有限公司 | Light emitting device package and light unit |
-
2017
- 2017-11-21 CN CN201711165291.XA patent/CN107768506A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216764A (en) * | 2005-02-03 | 2006-08-17 | Ngk Spark Plug Co Ltd | Wiring board for packaging light-emitting device |
| CN101322254A (en) * | 2005-10-28 | 2008-12-10 | 阿莫先思电子电器有限公司 | Electronic parts packages and method for forming a cavity thereof |
| CN101593934A (en) * | 2008-05-29 | 2009-12-02 | 株式会社理光 | Light-emitting device, optical scanner and imaging device |
| CN102779932A (en) * | 2011-05-13 | 2012-11-14 | Lg伊诺特有限公司 | Light emitting device package and ultraviolet lamp having the same |
| CN103078040A (en) * | 2011-08-22 | 2013-05-01 | Lg伊诺特有限公司 | Light emitting device package and light unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180306 |
|
| RJ01 | Rejection of invention patent application after publication |