CN107722896A - 一种改性环氧树脂胶粘剂 - Google Patents

一种改性环氧树脂胶粘剂 Download PDF

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CN107722896A
CN107722896A CN201711006854.0A CN201711006854A CN107722896A CN 107722896 A CN107722896 A CN 107722896A CN 201711006854 A CN201711006854 A CN 201711006854A CN 107722896 A CN107722896 A CN 107722896A
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叶正伟
林汉山
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Shenzhen Bao Kang Electronic Materials Co Ltd
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Abstract

本发明公开了一种改性环氧树脂胶粘剂,由以下重量组份的原料制备而成:橡胶溶液31.72份;树脂溶液19.56份;母液45.81份;DDS溶液2.02份;DICY溶液0.879份;助剂ZBN‑03 0.068份。本发明满足覆盖膜中所需的性能如阻燃性、粘合强度、耐热性等,并且该粘合剂即使在暴露于高湿度条件的情况下也未表现出性能的任何劣化,有效保护了环境,使得覆盖膜满足国家以及国际标准。

Description

一种改性环氧树脂胶粘剂
技术领域
本发明属于粘结剂领域,尤其是一种改性环氧树脂胶粘剂。
背景技术
近来,由于要求电子产品具有更小尺寸、超薄厚度和更高集成度的趋势,柔性印刷电路板(PCB)的使用大幅增加,由此导致用于保护电路的覆盖膜的使用也增加。另外,由于产品功能的改进,导致电子产品的结构变得更加复杂,相应地对覆盖膜性能的要求就更加严格。
目前,依照欧洲的WEEE(报废电气电子设备)、RoHS(有害物质的限制)等,非常需要开发环境友好的材料。然而,用于电子材料如覆盖膜、半导体密封材料等的常规粘合剂使用了含有卤素例如溴的化合物作为阻燃剂。因而,当这种粘合剂燃烧时,其产生有毒气体如基于二氧芑的化合物等。因此,迫切需要用于电子材料的无卤素粘合剂。
因此,已经努力开发了使用各种基于有机物的阻燃剂代替基于卤素的阻燃剂的覆盖膜,然而,这类覆盖膜未满足所有的所需性能。尤其是,最大的问题在于,由于因环境或者在加工过程中覆盖膜所反复暴露的湿度条件,覆盖膜的耐热性和粘合强度劣化。
发明内容
本发明的目的在于提供一种改性环氧树脂胶粘剂以解决上述技术问题。
为实现上述目的本发明采用以下技术方案:
一种改性环氧树脂胶粘剂,由以下重量组份的原料制备而成:橡胶溶液31.72份;树脂溶液19.56份;母液45.81份;DDS溶液2.02份;DICY溶液0.879份;助剂ZBN-03 0.068份。
作为本案发明进一步方案,所述橡胶溶液由以下重量组份的原料组成:丁铜80份、1072G橡胶20份。
作为本案发明进一步方案,所述母液由以下重量组份的原料组成:丁酮33.17份,OP-F22无卤阻燃剂12.27份,IXE-100离子扑捉剂0.42份,橡胶溶液42.96份,H-42M氢氧化铝11.17份。
作为本案发明进一步方案,所述DDS溶液由以下重量组份原料组成:DMF10份,4,4-DDS固化剂10份。
作为本案发明进一步方案,所述DICY溶液由以下重量组份原料组成:DMF 10份,DICY双氢胺10份。
作为本案发明进一步方案,所述树脂溶液由以下重量组份原料组成:MEK丁铜30份,DCEP-EL环氧树脂23.36份,NPES-901环氧树脂46.64份。
本发明的有益效果是:本发明满足覆盖膜中所需的性能如阻燃性、粘合强度、耐热性等,并且该粘合剂即使在暴露于高湿度条件的情况下也未表现出性能的任何劣化,有效保护了环境,使得覆盖膜满足国家以及国际标准。
具体实施方式
下面对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
下面以一种挠性印制电路板用覆盖膜的胶粘剂的配方为例:一种改性环氧树脂胶粘剂,由以下重量组份的原料制备而成:橡胶溶液31.72份;树脂溶液19.56份;母液45.81份;DDS溶液2.02份;DICY溶液0.879份;助剂ZBN-03 0.068份。
所述橡胶溶液由以下重量组份的原料组成:丁铜80份、1072G橡胶20份。
所述母液由以下重量组份的原料组成:丁酮33.17份,OP-F22无卤阻燃剂12.27份,IXE-100离子扑捉剂0.42份,橡胶溶液42.96份,H-42M氢氧化铝11.17份。
所述DDS溶液由以下重量组份原料组成:DMF10份,4,4-DDS固化剂10份。
所述DICY溶液由以下重量组份原料组成:DMF 10份,DICY双氢胺10份。
所述树脂溶液由以下重量组份原料组成:MEK丁铜30份,DCEP-EL环氧树脂23.36份,NPES-901环氧树脂46.64份。
制备而成的胶粘剂通过涂布机涂覆在聚酰亚胺膜表面,适用用于挠性电路板表面机械保护及电气绝缘性能,具有耐折性、耐热性、尺寸稳定,能够减少钻孔加工过程中形成胶渣的现象。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。

Claims (6)

1.一种改性环氧树脂胶粘剂,其特征在于,由以下重量组份的原料制备而成:橡胶溶液31.72份;树脂溶液19.56份;母液45.81份;DDS溶液2.02份;DICY溶液0.879份;助剂ZBN-030.068份。
2.根据权利要求1所述的一种改性环氧树脂胶粘剂,其特征在于,
所述橡胶溶液由以下重量组份的原料组成:丁铜80份、1072G橡胶20份。
3.根据权利要求1所述的一种改性环氧树脂胶粘剂,其特征在于,所述母液由以下重量组份的原料组成:丁酮33.17份,OP-F22无卤阻燃剂12.27份,IXE-100离子扑捉剂0.42份,橡胶溶液42.96份,H-42M氢氧化铝11.17份。
4.根据权利要求1所述的一种改性环氧树脂胶粘剂,其特征在于,所述DDS溶液由以下重量组份原料组成:DMF10份,4,4-DDS固化剂10份。
5.根据权利要求1所述的一种改性环氧树脂胶粘剂,其特征在于,所述DICY溶液由以下重量组份原料组成:DMF 10份,DICY双氢胺10份。
6.根据权利要求1所述的一种改性环氧树脂胶粘剂,其特征在于,所述树脂溶液由以下重量组份原料组成:MEK丁铜30份,DCEP-EL环氧树脂23.36份,NPES-901环氧树脂46.64份。
CN201711006854.0A 2017-10-25 2017-10-25 一种改性环氧树脂胶粘剂 Pending CN107722896A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108753226A (zh) * 2018-05-31 2018-11-06 深圳科诺桥科技股份有限公司 一种遮光膜及fpc
CN108913094A (zh) * 2018-05-31 2018-11-30 深圳科诺桥科技股份有限公司 一种粘胶剂、其制备方法、其使用方法、屏光膜及fpc

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101121868A (zh) * 2007-09-17 2008-02-13 东华大学 改性环氧树脂胶粘剂及其制备方法
WO2012132656A1 (ja) * 2011-03-29 2012-10-04 日本ゼオン株式会社 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品
CN103074019A (zh) * 2013-01-22 2013-05-01 浙江华正新材料股份有限公司 无卤环氧胶粘剂及使用其制备的挠性覆铜板
CN103834342A (zh) * 2014-03-19 2014-06-04 天津科技大学 一种用于柔性印刷电路板的耐高温无卤阻燃胶粘剂
CN104212395A (zh) * 2014-09-29 2014-12-17 莱芜金鼎电子材料有限公司 一种挠性覆铜板用环氧树脂胶黏剂及其制备方法
WO2017111115A1 (ja) * 2015-12-24 2017-06-29 株式会社カネカ 樹脂組成物およびそれを用いた半硬化性熱伝導フィルムおよび回路基板および接着シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101121868A (zh) * 2007-09-17 2008-02-13 东华大学 改性环氧树脂胶粘剂及其制备方法
WO2012132656A1 (ja) * 2011-03-29 2012-10-04 日本ゼオン株式会社 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品
CN103074019A (zh) * 2013-01-22 2013-05-01 浙江华正新材料股份有限公司 无卤环氧胶粘剂及使用其制备的挠性覆铜板
CN103834342A (zh) * 2014-03-19 2014-06-04 天津科技大学 一种用于柔性印刷电路板的耐高温无卤阻燃胶粘剂
CN104212395A (zh) * 2014-09-29 2014-12-17 莱芜金鼎电子材料有限公司 一种挠性覆铜板用环氧树脂胶黏剂及其制备方法
WO2017111115A1 (ja) * 2015-12-24 2017-06-29 株式会社カネカ 樹脂組成物およびそれを用いた半硬化性熱伝導フィルムおよび回路基板および接着シート

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
廖圣智: "《金属损伤结构复合材料原位胶接修补指南》", 31 January 2017, 北京:国防工业出版社 *
李红强: "《胶粘原理、技术及应用》", 31 January 2014, 广州;华南理工大学出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108753226A (zh) * 2018-05-31 2018-11-06 深圳科诺桥科技股份有限公司 一种遮光膜及fpc
CN108913094A (zh) * 2018-05-31 2018-11-30 深圳科诺桥科技股份有限公司 一种粘胶剂、其制备方法、其使用方法、屏光膜及fpc

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