CN107710120A - 输入装置 - Google Patents
输入装置 Download PDFInfo
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- CN107710120A CN107710120A CN201680036034.3A CN201680036034A CN107710120A CN 107710120 A CN107710120 A CN 107710120A CN 201680036034 A CN201680036034 A CN 201680036034A CN 107710120 A CN107710120 A CN 107710120A
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- 229920005989 resin Polymers 0.000 claims abstract description 73
- 239000011347 resin Substances 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 5
- 239000000057 synthetic resin Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 abstract 2
- 238000007639 printing Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000007906 compression Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 208000007578 phototoxic dermatitis Diseases 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/44—Number of layers variable across the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/422—Luminescent, fluorescent, phosphorescent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/706—Anisotropic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/71—Resistive to light or to UV
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
Abstract
本发明提供在将柔性配线基板热压接于形成于面板的装饰层的表面时能够减少对装饰层的损伤的输入装置。在由合成树脂形成的透光性的面板(2)的内表面(2b)形成有装饰层(21),在装饰层(21)的表面形成有内侧树脂层(22)。与电极层导通的连接图案(18)形成于内侧树脂层(22)的表面(22b)。柔性配线基板(7)热压接于内侧树脂层(22)的表面(22b),此时的热和压力由内侧树脂层(22)吸收,从而能够减轻装饰层(21)对面板(2)的损伤。
Description
技术领域
本发明涉及在透光性的面板的内表面形成有透光性的电极层和装饰层的输入装置。
背景技术
在以下的专利文献1中记载了关于触摸面板的发明。
在专利文献1所记载的触摸面板中,使用将第一面作为输入操作面的玻璃罩,在玻璃罩的与所述第一面相反一侧的第二面形成有输入用检测用电极和周边配线。
在专利文献1所记载的触摸面板中,如图4所记载那样,在玻璃罩的第二面的一部分区域形成有黑色的遮光性印刷层。在第二面形成有由ITO膜构成的输入检测用电极和周边配线,在遮光性印刷层的表面,周边配线的端部延伸而形成安装端子。
而且,如图5所记载那样,柔性配线基板与安装端子的形成区域重叠,柔性配线基板的导电层与在遮光性印刷层的表面形成的所述安装端子接合。
而且,安装端子与柔性配线基板的接合区域由有色印刷层覆盖。
在专利文献2所记载的输入装置中,在透明面板的内表面的端部形成有装饰层,透明电极的一部分与装饰层的表面重叠,在透明电极的表面形成有配线层。在该输入装置中,也通过在装饰层的表面形成的所述配线层的一部分形成外部连接部,柔性印刷基板与所述外部连接部重叠并接合。
在先技术文献
专利文献
专利文献1:日本特开2011-197709号公报
专利文献2:日本特开2012-208621号公报
发明内容
发明所要解决的课题
在专利文献1所记载的触摸面板中,柔性配线基板与在玻璃罩的第二面形成的遮光性印刷层的表面的安装端子重叠,并通过钎料、各向异性导电膜或者导电膏接合。在该接合工序中,在加热了的状态下将柔性配线基板按压于玻璃罩,因此遮光性印刷层上作用有热和加压力,容易在遮光性印刷层产生局部形变。该形变能够从玻璃罩的前方目视,因此接合有柔性配线基板的区域容易引人注目,有损商品的外观。
在专利文献2所记载的输入装置中,柔性印刷基板也与在装饰层形成的外部连接部接合,因此与专利文献1同样地,装饰层容易在与柔性印刷基板的接合部处形成形变。并且,在专利文献2中还记载了透明面板由透明的塑料形成。在该情况下,在对柔性印刷基板进行接合的工序中,不仅容易对装饰层、也容易对塑料制的透明面板带来形变等损伤,在完成的输入装置中,接合有柔性印刷基板的区域在从透明面板的前方观察时容易引人注目。
为了减轻对于遮光性印刷层、装饰层的损伤,并且降低对于塑料制的透明面板的损伤,不得不将接合手段调整为能够以低温且低压力对柔性配线基板进行接合。但是若进行这种调整,则柔性配线基板的接合强度降低。
本发明解决上述以往的课题,其目的在于提供在将柔性基板接合于在透光性的面板的内表面形成的装饰层时,能够减少对装饰层带来的损伤的输入装置。
用于解决课题的方案
本发明涉及一种输入装置,其在透光性的面板形成有透光区域和遮光区域,在所述透光区域中,在所述面板的内表面形成有透光性的电极层,在所述遮光区域中,在所述面板的内表面形成有非透光性的装饰层,其特征在于,在所述装饰层的表面形成有内侧树脂层,与所述电极层导通的导电性的连接图案形成在所述内侧树脂层的表面,柔性配线基板与所述内侧树脂层重叠,形成于所述柔性配线基板的配线图案与所述连接图案接合。
在本发明的输入装置中,所述柔性配线基板通过热压接工序与所述内侧树脂层接合。
在本发明的输入装置中,优选形成所述内侧树脂层的树脂材料的弹性模量比构成所述装饰层的树脂材料的弹性模量高。
另外,优选形成所述内侧树脂层的树脂材料的软化点温度比构成所述装饰层的树脂材料的软化点温度高。
在本发明的输入装置中,例如,所述装饰层由丙烯酸系树脂形成,所述内侧树脂层由环氧系树脂形成。
在本发明的输入装置中,优选在所述装饰层的表面的与所述内侧树脂层的端部之间的台阶部设置有辅助树脂层。
另外,优选所述内侧树脂层重叠有多层,上层的所述内侧树脂层的端部以与下层的所述内侧树脂层的端部相比发生错位的方式形成。
本发明的输入装置在所述面板为合成树脂制时特别有效。
发明效果
在本发明的输入装置中,在透光性的面板形成的装饰层层叠有内侧树脂层,柔性配线基板的配线图案与在该内侧树脂层的表面形成的连接图案接合。因此,在通过热压接工序对柔性配线基板进行接合时,内侧树脂层发挥缓和热和压力的功能,从而能够减少对装饰层的损伤。另外,在表面板为合成树脂制的情况下,还能够减少对面板带来的损伤。
附图说明
图1是示出本发明的实施方式的输入装置的整体结构的分解立体图。
图2是将输入装置沿图1的II-II线切断的剖视图。
图3是以从上方透视的方式示出在输入装置的面板的内表面形成的电极层和配线层的俯视图。
图4是将图2的IV向视部放大了的放大剖视图,(A)(B)示出不同的实施方式。
具体实施方式
图1和图2所示的电子设备1作为便携式电话、便携式的信息处理装置、便携式的存储装置、便携式的游戏装置等而使用。
电子设备1具有透光性的面板2。
本说明书中的透光性是指例如总光线透射率为60%以上,优选总光线透射率为80%以上。
面板2为表面面板或者操作面板,如图2所示,下部壳体3与面板2组合从而构成便携式电话等电子设备的主体壳体4。由此,面板2构成主体壳体4的一部分。在主体壳体4的内部收纳有在背部具备照明装置的液晶显示面板或电致发光面板等自发光型的显示面板5、以及安装有电子部件的配线基板6等,面板2与配线基板6由柔性配线基板7连接。
本发明的输入装置10主要包括所述面板2、形成于面板2的电极层12、13、配线层14、16、装饰层21和内侧树脂层22、以及所述柔性配线基板7等。
图1和图2所示的面板2由透光性的合成树脂材料形成,例如由丙烯酸系树脂、聚碳酸酯树脂形成。如图2所示,面板2的朝向外侧的外表面2a成为操作面,内表面2b朝向主体壳体4的内部。
如图1~图3所示,在面板2中,中央部的四边形的区域为透光区域10a,包围透光区域10a的四边的框状的区域为遮光区域10b。
如图1和图3所示,在面板2的内表面2b的所述透光区域10a形成有透光性的电极层12、14。透光性的电极层12、14由ITO(氧化铟锡)形成。或者,透光性的电极层12、14由含有导电性纳米材料的导电层、将金属线形成为网格状而成的所谓网状金属层等形成。
导电性纳米材料为由从Ag、Au、Ni、Cu、Pd、Pt、Rh、Ir、Ru、Os、Fe、Co、Sn选出的一种以上构成的金属纳米线,或者导电性纳米材料为碳纳米管等碳纤维。这些导电性纳米材料以被分散剂分散了的状态涂敷于面板2的内表面2b,并通过透明的树脂材料固接。
网状金属层通过在面板2的内表面2b将金、银、铜等金属材料印刷为网格状而形成、或者在以一定的膜厚形成所述金属材料后通过蚀刻形成为网格状而成。
在面板2的内表面2b形成的所述透光性的导电层通过蚀刻处理而被图案化,形成有多个独立电极层12和多个公共电极层13,并且形成有从独立电极层12一体地延伸的独立配线层14和从公共电极层13一体地延伸的公共配线层16。
独立电极层12和公共电极层13以规则排列的方式形成。如图3所示,独立电极层12和公共电极层13在纵向(图示上下方向)上配置在彼此不同的位置。从各个独立电极层12延伸出独立配线层14。另外,从沿纵向排列的四个公共电极层13延伸出一个公共配线层16。
如图1和图3所示,在独立配线层14和公共配线层16形成于透光区域10a内时,这些配线层14、16由ITO等所述透光性的导电层形成,在配线层14、16形成于遮光区域10b时,也可以以在透光性的导电层上重叠银膏等低电阻材料层的方式形成。
如图2所示,在遮光区域10b中,在面板2的内表面2b形成有装饰层21。装饰层21在图4中扩大地示出。装饰层21是在丙烯酸系树脂中含有用于着色的颜料的有色的墨水层。在面板2的内表面2b通过丝网印刷等方法涂敷有色的墨水层,并进行热处理从而形成装饰层21。
虽然在图1中省略,但在面板2的遮光区域10b开设有设置扬声器、麦克风的孔、设置相机透镜的孔,在该孔的部分不形成装饰层21。
如图4的(A)所示,在遮光区域10b中,在装饰层21的表面(下表面)21a重叠地形成有内侧树脂层22。装饰层21由丙烯酸系等热塑性树脂材料形成,相对于此,内侧树脂层22由环氧系等热固性树脂材料形成。在图3中,形成有内侧树脂层22的区域由四边形示出。
内侧树脂层22的弹性模量(杨氏模量)比装饰层21的弹性模量(杨氏模量)高,内侧树脂层22的软化点的温度比装饰层21的软化点的温度高。另外,内侧树脂层22的厚度尺寸优选为装饰层21的厚度尺寸的0.5倍以上,更优选为1倍以上。
在图4的(A)所示的实施方式中,为了消除内侧树脂层22的朝向透光区域10a的端部22a的台阶部,在装饰层21的表面21a与所述端部22a之间形成有辅助树脂层23。通过形成该辅助树脂层23,从而从装饰层21的表面21a直至内侧树脂层22的表面22b平滑地隆起。辅助树脂层23由丙烯酸系等热塑性树脂形成。
如图3所示,多个独立配线层14的末端部14a和多个公共配线层16的末端部16a朝向面板2的图示下侧延伸,并且朝向左右的中央部配线。如图4的(A)所示,所述末端部14a、16a从装饰层21的表面21a延伸至内侧树脂层22的表面22b。如图3所示,各配线层14、16的末端部14a、16a在内侧树脂层22的表面22b宽幅地形成从而形成连接图案18。
连接图案18也可以通过形成各电极层13、14和配线层14、16的ITO等透光性的导电层直接与装饰层21的表面21a和内侧树脂层22的表面22b连续地延伸而形成。或者,形成各电极层13、14和配线层14、16的透光性的导电层也可以直接与装饰层21的表面21a和内侧树脂层22的表面22b连续地延伸,在装饰层21的表面21a和内侧树脂层22的表面22b,在所述透光性的导电层上层叠银膏等低电阻金属层从而形成连接图案18。或者,由透光性的导电层形成的末端部14a、16a也可以形成至透光区域10a与遮光区域10b的边界部,在装饰层21的表面21a和内侧树脂层22的表面22b仅形成有与所述末端部14a、16a导通的银膏等低电阻金属层,从而形成连接图案18。
如图1和图4所示,所述柔性配线基板7包括挠性的膜基板7a、以及在该膜基板7a的表面由铜箔等形成的配线图案7b。如图4的(A)所示,柔性配线基板7以使多个配线图案7b分别与多个连接图案18一对一地对置的状态与内侧树脂层22的表面22b接合。通过热压接工序来进行该接合,在该热压接工序中,在内侧树脂层22与柔性配线基板7之间涂敷片状的或者膏状的各向异性导电性粘接剂,并利用加热了的工具将柔性配线基板7向内侧树脂层22加压。通过该热压接工序,借助各向异性导电性粘接剂将内侧树脂层22与柔性配线基板7粘接接合,另外各个配线图案7b与连接图案18接合。
在装饰层21的表面21a重叠有内侧树脂层22,内侧树脂层22与装饰层21相比,弹性模量高且软化点的温度高。因此,在通过热压接工序对柔性配线基板7进行接合时的热和压力被内侧树脂层22吸收,能够减少装饰层21因热和压力而产生的形变等损伤。另外,面板2为合成树脂制,对装饰层21带来的损伤减少,因此对面板2带来的形变等损伤也变小。
因此,在从面板2的前方观察时,能够降低目视观察到在装饰层21产生因柔性配线基板7的接合而形成的变形痕迹、形变痕迹的可能性,主体壳体4的外观变得良好。
需要说明的是,柔性配线基板7的另一端部与配线基板6上的导体图案连接。
在图4的(A)所示的实施方式中,为了消除内侧树脂层22的端部22a的台阶而形成有辅助树脂层23,因此能够以足够的膜厚形成所述端部22a处的连接图案18。
在图4的(B)所示的实施方式中,内侧树脂层22通过层叠两层以上的多个层22A、22B、22C而构成。在装饰层21的表面21a依次形成层22A、22B、22C,此时以使上层的端部比下层的端部更远离透光区域10a的方式使端部错位地形成。由此,能够消除内侧树脂层22的端部的台阶部的形成,连接图案18从装饰层21的表面21a平滑地形成至内侧树脂层22的最上层22C的表面。
接下来,对上述结构的输入装置10的动作进行说明。
在该输入装置10中,柔性配线基板7的多个配线图案7b通过多路调制器与驱动电路依次连接,对独立电极层12依次施加脉冲状的驱动电极。另外,通过多路调制器将公共电极层13设定为检测电极。在独立电极层12与公共电极层13之间形成电容,因此当对任一个独立电极层12施加脉冲状的驱动电压时,与脉冲的上升和下降相应地在公共电极层13中呈现出基于相互的耦合电容而形成的电位。
在面板2的透光区域10a,能够透视显示面板5的图像。在透光区域10a中,当作为导电体的手指、手接近面板2的外表面2a时,来自独立电极层12的电场被手指、手吸收,电极层的相互的耦合电容降低,因此公共电极层13中出现的电位发生变化。根据公共电极层13中出现的电位的变化、对哪个独立电极层12施加驱动电压的信息,能够检测手指、手接近的位置。
反之,通过对公共电极层13施加脉冲状的驱动电压,并以切换检测电路的方式依次与独立电极层12连接,也能够检测手指、手接近哪个位置。
附图标记说明
1 电子设备;
2 面板;
3 下部壳体;
4 主体壳体;
6 配线基板;
10 输入装置;
10a 透光区域;
10b 遮光区域;
12 独立电极层;
13 公共电极层;
14 独立配线层;
16 公共配线层;
18 连接图案;
21 装饰层;
22A、22B、22C 装饰层的各层;
22 内侧树脂层;
23 辅助树脂层。
Claims (8)
1.一种输入装置,其在透光性的面板形成有透光区域和遮光区域,在所述透光区域中,在所述面板的内表面形成有透光性的电极层,在所述遮光区域中,在所述面板的内表面形成有非透光性的装饰层,
所述输入装置的特征在于,
在所述装饰层的表面形成有内侧树脂层,与所述电极层导通的导电性的连接图案形成在所述内侧树脂层的表面,
柔性配线基板与所述内侧树脂层重叠,形成于所述柔性配线基板的配线图案与所述连接图案接合。
2.根据权利要求1所述的输入装置,其中,
所述柔性配线基板通过热压接工序与所述内侧树脂层接合。
3.根据权利要求1或2所述的输入装置,其中,
形成所述内侧树脂层的树脂材料的弹性模量比构成所述装饰层的树脂材料的弹性模量高。
4.根据权利要求1至3中任一项所述的输入装置,其中,
形成所述内侧树脂层的树脂材料的软化点温度比构成所述装饰层的树脂材料的软化点温度高。
5.根据权利要求3或4所述的输入装置,其中,
所述装饰层由丙烯酸系树脂形成,所述内侧树脂层由环氧系树脂形成。
6.根据权利要求1至5中任一项所述的输入装置,其中,
在所述装饰层的表面的与所述内侧树脂层的端部之间的台阶部设置有辅助树脂层。
7.根据权利要求1至5中任一项所述的输入装置,其中,
所述内侧树脂层重叠有多层,上层的所述内侧树脂层的端部以与下层的所述内侧树脂层的端部相比发生错位的方式形成。
8.根据权利要求1至7中任一项所述的输入装置,其中,
所述面板为合成树脂制。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040130500A1 (en) * | 2002-10-28 | 2004-07-08 | Yoshiki Takei | Non-contact communication medium |
US20070013856A1 (en) * | 2005-07-15 | 2007-01-18 | Mitsubishi Denki Kabushiki Kaisha | Flexible printed circuit and display device using the same |
US20100033443A1 (en) * | 2008-08-06 | 2010-02-11 | Hitachi Displays, Ltd. | Display device |
JP2010039621A (ja) * | 2008-08-01 | 2010-02-18 | Micro Gijutsu Kenkyusho:Kk | タッチパネル |
US20130299789A1 (en) * | 2012-05-09 | 2013-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Light-Emitting Device and Electronic Device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005101527A (ja) * | 2003-08-21 | 2005-04-14 | Seiko Epson Corp | 電子部品の実装構造、電気光学装置、電子機器及び電子部品の実装方法 |
JP5370944B2 (ja) * | 2010-03-17 | 2013-12-18 | 株式会社ジャパンディスプレイ | タッチパネルおよびその製造方法 |
JP5066272B2 (ja) | 2011-03-29 | 2012-11-07 | アルプス電気株式会社 | 入力装置及びその製造方法 |
JP5889718B2 (ja) | 2012-05-30 | 2016-03-22 | アルプス電気株式会社 | 電子部品の実装構造体及び入力装置、ならびに、前記実装構造体の製造方法 |
JP5768031B2 (ja) | 2012-10-22 | 2015-08-26 | アルプス電気株式会社 | 検知機能を有する表面パネル及びその製造方法 |
JP2015069267A (ja) | 2013-09-27 | 2015-04-13 | デクセリアルズ株式会社 | 静電容量型曲面形状タッチパネル及びその製造方法 |
KR101504117B1 (ko) * | 2013-11-14 | 2015-03-19 | 코닝정밀소재 주식회사 | 유기발광 디스플레이 장치 |
KR102313489B1 (ko) * | 2015-01-21 | 2021-10-18 | 삼성디스플레이 주식회사 | 터치패널 및 이를 포함하는 표시장치 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040130500A1 (en) * | 2002-10-28 | 2004-07-08 | Yoshiki Takei | Non-contact communication medium |
US20070013856A1 (en) * | 2005-07-15 | 2007-01-18 | Mitsubishi Denki Kabushiki Kaisha | Flexible printed circuit and display device using the same |
JP2010039621A (ja) * | 2008-08-01 | 2010-02-18 | Micro Gijutsu Kenkyusho:Kk | タッチパネル |
US20100033443A1 (en) * | 2008-08-06 | 2010-02-11 | Hitachi Displays, Ltd. | Display device |
US20130299789A1 (en) * | 2012-05-09 | 2013-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Light-Emitting Device and Electronic Device |
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US10310654B2 (en) | 2019-06-04 |
WO2017006613A1 (ja) | 2017-01-12 |
CN107710120B (zh) | 2020-09-15 |
KR102032631B1 (ko) | 2019-10-15 |
DE112016003061B4 (de) | 2023-05-17 |
DE112016003061T5 (de) | 2018-03-22 |
US20180074631A1 (en) | 2018-03-15 |
KR20180008759A (ko) | 2018-01-24 |
JP6435047B2 (ja) | 2018-12-05 |
JPWO2017006613A1 (ja) | 2018-02-22 |
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