201001254201001254
1 W4786PA 六、發明說明： 【發明所屬之技術領域】 本發明是有關％ —種觸控面板，且特別是有關於一種 整合電容與電阻式之觸控面板。 【先前技術】 市面上可見的觸控面板有電容式、電阻式、超音波 式、紅外線式以及電磁感應式等，各具有不同的優缺點。 以電容式觸控面板為例，其可多點觸控且構造簡單，故適 於大量生產，然而，電容式觸控面板對於手指之感應的準 確度較差，通常需搭配一觸控筆使用。至於電阻式觸控面 板，其並無法提供多點觸控之功能，因而靈敏度較為不 足。考量到成本、效能與操作便捷性，如何滿足市場需求 乃實為各家廠商積極研發產品之重點。 【發明内容】 本發明係有關於一種整合式觸控面板，係同時整合電 容式與電阻式觸控面板之功能與特點，以使產品更能滿足 市場需求。 本發明提出一種整合式觸控面板，其包括第一基板、 第二基板、第三基板、第一貼合層、第二貼合層、第一轴 感應層、第二軸感應層、遮蔽層、第一導電膜、第二導電 膜、二個第一導電電極與二個第二導電電極。第二基板設 置在第一基板與第三基板之間。第一轴感應層、第一貼合 層與第二軸感應層依序層疊設置在第一基板與第二基板 4 之間，其中，第一軸感應層與第二轴感應層對應觸控面板 之一電容式觸控區域。遮蔽層與第一導電膜相鄰設置在第 二基板與第三基板之間，其中，遮蔽層對應電容式觸控區 域，第一導電膜則對應觸控面板之一電阻式觸控區域。第 二貼合層與第二導電膜依序層疊設置在第一導電膜與第 三基板之間，其中，第二貼合層沿著觸控面板之邊緣設 置，而第二導電膜對應第一導電膜。二個第一導電電極相 互平行地設置在第一導電膜與第二貼合層之間，二個第二 導電電極則相互平行地設置在第二導電膜與第二貼合層 之間，且弟·一導電電極之延伸方向係垂直於弟二導電電極 之延伸方向。其餘本發明所提的多種整合式觸控面板將分別 詳述於實施例中。 本發明另提出一種電子裝置，其包括一顯示面板與上 述之整合式觸控面板。其餘本發明所提的多種電子裝置將分 別詳述於實施例中。 為讓本發明之上述内容能更明顯易懂，下文特舉較佳 實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 請參照第1、2A圖，第1圖繪示依照本發明較佳實 施例的整合式觸控面板之爆炸圖，第2A圖繪示第1圖整 合式觸控面板各元件組合後之平面示意圖。如第1圖所 示，整合式觸控面板10包括第一基板110、第二基板120、 第三基板130、第一貼合層141、第二貼合層142、第一軸 感應層151、第二軸感應層152、遮蔽層160、第一導電膜 5 2010012541 W4786PA VI. Description of the Invention: [Technical Field] The present invention relates to a %-type touch panel, and more particularly to an integrated capacitive and resistive touch panel. [Prior Art] Touch panels that are commercially available include capacitive, resistive, ultrasonic, infrared, and electromagnetic induction, each having different advantages and disadvantages. Taking a capacitive touch panel as an example, it can be multi-touch and has a simple structure, so it is suitable for mass production. However, the capacitive touch panel is less accurate for finger sensing, and usually needs to be used with a stylus. As for the resistive touch panel, it does not provide a multi-touch function, and thus the sensitivity is insufficient. Considering the cost, efficiency and ease of operation, how to meet the market demand is the focus of actively developing products for various manufacturers. SUMMARY OF THE INVENTION The present invention relates to an integrated touch panel that combines the functions and features of a capacitive and resistive touch panel to meet the needs of the market. The present invention provides an integrated touch panel including a first substrate, a second substrate, a third substrate, a first bonding layer, a second bonding layer, a first axis sensing layer, a second axis sensing layer, and a shielding layer. a first conductive film, a second conductive film, two first conductive electrodes and two second conductive electrodes. The second substrate is disposed between the first substrate and the third substrate. The first axis sensing layer, the first bonding layer and the second axis sensing layer are sequentially stacked between the first substrate and the second substrate 4, wherein the first axis sensing layer and the second axis sensing layer correspond to the touch panel One capacitive touch area. The shielding layer is disposed between the second substrate and the third substrate, wherein the shielding layer corresponds to the capacitive touch region, and the first conductive film corresponds to one of the resistive touch regions of the touch panel. The second bonding layer and the second conductive film are sequentially stacked between the first conductive film and the third substrate, wherein the second bonding layer is disposed along an edge of the touch panel, and the second conductive film corresponds to the first Conductive film. The two first conductive electrodes are disposed in parallel with each other between the first conductive film and the second bonding layer, and the two second conductive electrodes are disposed in parallel with each other between the second conductive film and the second bonding layer, and The extension direction of a conductive electrode is perpendicular to the extending direction of the second conductive electrode. The remaining integrated touch panels of the present invention will be separately described in the embodiments. The invention further provides an electronic device comprising a display panel and the integrated touch panel described above. The remaining various electronic devices of the present invention will be described in detail in the embodiments. In order to make the above-mentioned contents of the present invention more comprehensible, the following description of the preferred embodiments and the accompanying drawings will be described in detail as follows: [Embodiment] Please refer to Fig. 1, 2A, and Fig. 1 FIG. 2A is a schematic plan view showing the components of the integrated touch panel of FIG. 1 combined with the exploded view of the integrated touch panel according to the preferred embodiment of the present invention. As shown in FIG. 1 , the integrated touch panel 10 includes a first substrate 110 , a second substrate 120 , a third substrate 130 , a first bonding layer 141 , a second bonding layer 142 , and a first axis sensing layer 151 . Second axis sensing layer 152, shielding layer 160, first conductive film 5 201001254
1 W4786PA 171、第二導電膜172、二個第一導電電極181與二個第二 導電電極182。第二基板120設置在第一基板11〇與第三 基板130之間。第一軸感應層151設置在第一基板no之 下表面，第二軸感應層152則設置在第二基板12〇之上表 面，第一軸感應層151與第二軸感應層152對應觸控面板 1〇之電容式觸控區域CTP (見第2A圖）。第一貼合層141 5又置在第一軸感應層151與第二軸感應層152之間，用以 將第一軸感應層151與第二軸感應層152二者絕緣隔離並 結合起來。 遮蔽層160與第一導電膜171相鄰設置在第二基板 12〇之下表面’其中，遮㈣16G對應電容式觸控區域 CTP’第-導電膜171則對應觸控面板1G之電阻式觸控區 域RTP (見第2A圖）。第二導電膜172設置在第三基板 13〇之上表面。第二貼合層142沿著觸控面板1〇之邊ς配 置且δ又置在第一導電膜171與第二導電膜之間，用 =將第-導電Μ171與第二導電膜172絕緣隔離並結合起 來。二個第—導電電極181相互平行地設置在第—導電膜 171與第—貼合層142之間，二個第二導電電極丨82則相 互平行地設置在第：導電膜172與第二貼合層142之間， 其中，第-導電電極⑻之延伸方向係垂直於第二導電電 極182之延伸方向。 、第2Α圖所示，電谷式觸控區域與電阻式* = 係相鄰且不重疊’使整合式觸控面板ig 一部^ Μ電谷^控之功能，另—部份則具有電阻觸控之功能。 電令式觸控區域CTP之面積與電阻式觸控區域灯Ρ 6 之面積係可相同或不相同，使整合式觸控面板10之結構 可依據不同產品之設計需求而更具有彈性。 如第1圖所示，整合式觸控面板10更包括二個訊號 傳輸排線191、192，其中，訊號傳輸排線191電性連接至 電容式觸控區域CTP 5以傳輸訊號用以控制電容式觸控區 域CTP之觸控感應。訊號傳輸排線192電性連接至電阻式 觸控區域RTP，以控制電阻式觸控區域RTP之觸控感應。 訊號傳輸排線191、192例如是軟性印刷電路板。另外， 整合式觸控面板10於第三基板130相對於第二導電膜172 的另一面更可設置一第三貼合層143，用以加強觸控面板 10與其他元件結合之強度，第三貼合層143之材質可為壓 感膠（pressure sensitivity adhesive, PS A )。另可在第三貼 合層143相對於第三基板130的另一面再設置一離形膜 (release film ) 195，用以保護第三貼合層143。 請參照第2B、2C與2D圖，第2B圖繪示第2A圖整 合式觸控面板沿著B-B’切線之剖面圖，第2C圖繪示第2B 圖於電容式觸控區域之部分放大圖，第2D圖繪示第2B圖 於電容式與電阻式觸控區域交接處之部分放大圖。於第1 圖的各元件組裝後，如第2B圖所示，整合式觸控面板10 由上至下的基板順序例如是第一基板110、第二基板120 與第三基板130。這三個基板例如是透明基板或具撓性之 薄膜等，其可由聚脂材料（PET )製作。如第2C圖所示， 第一軸感應層151設置在第一基板110下表面，第二軸感 應層152設置在第二基板120上表面。第一軸感應層151 與第二軸感應層152之材質為透明電極材料，其例如是氧 7 2010012541 W4786PA 171, a second conductive film 172, two first conductive electrodes 181 and two second conductive electrodes 182. The second substrate 120 is disposed between the first substrate 11A and the third substrate 130. The first axis sensing layer 151 is disposed on the lower surface of the first substrate no, the second axis sensing layer 152 is disposed on the upper surface of the second substrate 12, and the first axis sensing layer 151 is corresponding to the second axis sensing layer 152. Capacitive touch area CTP of panel 1 (see Figure 2A). The first bonding layer 141 5 is disposed between the first axis sensing layer 151 and the second axis sensing layer 152 to insulate and combine the first axis sensing layer 151 and the second axis sensing layer 152. The shielding layer 160 is disposed adjacent to the first conductive film 171 on the lower surface of the second substrate 12, wherein the shielding layer (16) corresponding to the capacitive touch region CTP' the first conductive film 171 corresponds to the resistive touch of the touch panel 1G. Regional RTP (see Figure 2A). The second conductive film 172 is disposed on the upper surface of the third substrate 13A. The second bonding layer 142 is disposed along the edge of the touch panel 1 且 and is further disposed between the first conductive film 171 and the second conductive film, and is insulated from the second conductive film 172 by = And combined. The two first conductive electrodes 181 are disposed in parallel with each other between the first conductive film 171 and the first bonding layer 142, and the two second conductive electrodes 82 are disposed in parallel with each other on the first: the conductive film 172 and the second sticker. Between the layers 142, the extending direction of the first conductive electrode (8) is perpendicular to the extending direction of the second conductive electrode 182. As shown in the second figure, the electric valley touch area and the resistive type * = are adjacent and do not overlap 'to make the integrated touch panel ig a part ^ Μ electric valley control function, and the other part has resistance Touch function. The area of the CTP of the electric touch area and the area of the resistive touch area lamp Ρ 6 may be the same or different, so that the structure of the integrated touch panel 10 can be more flexible according to the design requirements of different products. As shown in FIG. 1 , the integrated touch panel 10 further includes two signal transmission lines 191 and 192 , wherein the signal transmission line 191 is electrically connected to the capacitive touch area CTP 5 to transmit signals for controlling the capacitance. Touch sensing of the touch area CTP. The signal transmission cable 192 is electrically connected to the resistive touch area RTP to control the touch sensing of the resistive touch area RTP. The signal transmission cables 191, 192 are, for example, flexible printed circuit boards. In addition, the integrated touch panel 10 can further provide a third bonding layer 143 on the other surface of the third substrate 130 relative to the second conductive film 172 for enhancing the strength of the touch panel 10 combined with other components. The material of the bonding layer 143 may be a pressure sensitivity adhesive (PS A ). Further, a release film 195 may be further disposed on the other surface of the third bonding layer 143 with respect to the third substrate 130 to protect the third bonding layer 143. Please refer to FIGS. 2B, 2C and 2D, FIG. 2B is a cross-sectional view of the integrated touch panel of FIG. 2A along the line B-B', and FIG. 2C is a part of the capacitive touch area of FIG. 2B. The enlarged view, FIG. 2D is a partial enlarged view of the junction of the capacitive and resistive touch regions of FIG. 2B. After the components of FIG. 1 are assembled, as shown in FIG. 2B, the substrate sequence of the integrated touch panel 10 from top to bottom is, for example, the first substrate 110, the second substrate 120, and the third substrate 130. These three substrates are, for example, a transparent substrate or a flexible film or the like which can be made of a polyester material (PET). As shown in Fig. 2C, the first axis sensing layer 151 is disposed on the lower surface of the first substrate 110, and the second axis sensing layer 152 is disposed on the upper surface of the second substrate 120. The material of the first axis sensing layer 151 and the second axis sensing layer 152 is a transparent electrode material, which is, for example, oxygen 7 201001254
I W4/«6PA 化銦錫（indi_tinoxides，IT〇)，並可藉由塗佈、曝光、 #刻、剝膜等步驟形成不同的電極圖案（p咖印）， 使^軸感應層⑸與第二軸感應層152於面板ι〇 石亚％產生電容變化’因而可憤測到不同的觸控位置。第— :占合層1二用以黏合第一軸感應層i5i與第二軸感應層 並適自保持二者之絕緣間隔。第一貼合層141之材 質可為絕緣材料或壓感膠。訊號傳輸 連接至第一軸感應層151。 疋電性 -置示’遮蔽層160與第一導電臈171相鄰 =置在弟二基板no之下表面，其中，遮蔽層_對應至 軸感應㉟151與第二軸感應層152之位置，而第 =财匕純13Q上表面之第二導電m對 ί作出:層丄一導電膜171可由透明電極材料同時 ΐ = t’了狀料使二者分關來。遮蔽 層⑽除了可將電容式觸控區域CTp m區分開來’更用以防止外部之電子雜訊傳=3 = CTP。於第一導電膜171之下方設置有二二1 …極181 (見第1圖），第二導㈣172之上方則設 導電電極182(見第1圖或第2C圖)。第二第 =2，181、182較佳為銀導電電極’並可藉由^刷 合h42(見第！圖或第職）設置在第一=占 導電電極182之間’其材質可為一絕1 v電電極182例如是透過第二貼合層142之貫* 弟一 示）電性連接至訊號傳輪排線192 (見第2c圖牙)。（未繪 請參照第3圖，其繪示依照本發明較佳實施例的電子 裝置之示意圖。如第3圖所示，整合式觸控面板10例如 應用於電子裝置200中，並搭配一顯示面板210使用。整 合式觸控面板10係覆蓋在顯示面板210上，二者之間係 透過訊號傳輸排線191、192與其他控制電路（未繪示） 電性連接。由於整合式觸控面板10之觸控區域劃分為電 容式觸控區域CTP與電阻式觸控區域RTP，使整合式觸控 面板10同時兼具多點觸控、手寫等功能。如此一來，依 據電子裝置200之功能需求，可適當分配電容式觸控區域 CTP與電阻式觸控區域RTP之面積大小，並搭配顯示面板 210之顯示晝面，將手寫與顯示區域分開，或是預留區域 給其他功能使用。 本發明上述實施例所揭露之整合式觸控面板與應用 其之電子裝置，係將電容式與電阻式之觸控機制整合在單 一個觸控面板上，使觸控面板同時具有電容式與電阻式之 觸控功能，而可兼顧以往傳統上觸控面板之優點，進而提 升產品的功能性與競爭力。此外，由於本發明上述實施例 之整合式觸控面板於電容式與電阻式觸控區域之構成元 件可藉由現有製程與設備製作完成，因而並不會增加製程 成本。如此，本發明上述實施例之整合式觸控面板與應用 其之電子裝置更符合市場需求。 綜上所述，雖然本發明已以較佳實施例揭露如上，然 其並非用以限定本發明。本發明所屬技術領域中具有通常 知識者，在不脫離本發明之精神和範圍内，當可作各種之 更動與潤飾。因此，本發明之保護範圍當視後附之申請專 9 201001254 TW4786FA 利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示依照本發明較佳實施例的整合式觸控面 板之爆炸圖。 第2A圖繪示第1圖整合式觸控面板各元件組合後之 平面示意圖。 第2B圖繪示第2A圖整合式觸控面板沿著B-B’切線 之剖面圖。 第2C圖繪示第2B圖於電容式觸控區域之部分放大 圖。 第2D圖繪示第2B圖於電容式與電阻式觸控區域交 接處之部分放大圖。 第3圖繪示依照本發明較佳實施例的電子裝置之示 意圖。 141 143 152 171 181 【主要元件符號說明】 10 :整合式觸控面板 120 :第二基板 第一貼合層 第三貼合層 第二軸感應層 第一導電膜 第一導電電極 110 :第一基板 130 :第三基板 142 :第二貼合層 151 :第一軸感應層 160 :遮蔽層 172 :第二導電膜 182 :第二導電電極 191、192 :訊號傳輸排線 195 :離形膜 200 :電子裝置 210 :顯示面板 CTP :電容式觸控區域 RTP :電阻式觸控區域I W4/«6PA indium oxide (IT), and can form different electrode patterns (p-printing) by coating, exposure, #刻, 剥, etc., so that the axis sensing layer (5) and The two-axis sensing layer 152 produces a capacitance change in the panel 〇 亚 亚 亚 因而 因而 因而 因而 因而 因而 。 。 。 。 。 。 。 。 The first: the occupant layer 1 2 is used for bonding the first axis sensing layer i5i and the second axis sensing layer and is suitable for maintaining the insulation interval between the two. The material of the first bonding layer 141 may be an insulating material or a pressure sensitive adhesive. The signal transmission is connected to the first axis sensing layer 151.疋--the 'shading layer 160 is adjacent to the first conductive 臈 171= is disposed on the lower surface of the second substrate no, wherein the shielding layer _ corresponds to the position of the axis sensing 35151 and the second axis sensing layer 152, and The second conductive m of the upper surface of the 13Q pure 13Q is made of: 丄 丄 a conductive film 171 can be separated from the transparent electrode material by ΐ = t'. In addition to shielding the capacitive touch area CTp m, the shielding layer (10) is used to prevent external electronic noise transmission = 3 = CTP. A diode 181 (see FIG. 1) is disposed under the first conductive film 171, and a conductive electrode 182 is disposed above the second conductive layer 172 (see FIG. 1 or FIG. 2C). The second second=2,181,182 is preferably a silver conductive electrode' and can be disposed between the first=accounting electrode 182 by brushing h42 (see Fig. or the first position). The first electrical electrode 182 is electrically connected to the signal transmission cable 192 (see FIG. 2c) through, for example, the second bonding layer 142. (Undescribed, please refer to FIG. 3, which is a schematic diagram of an electronic device according to a preferred embodiment of the present invention. As shown in FIG. 3, the integrated touch panel 10 is applied to, for example, an electronic device 200 with a display. The integrated touch panel 10 is disposed on the display panel 210, and is electrically connected to other control circuits (not shown) through the signal transmission lines 191 and 192. The touch area of the touch panel is divided into a capacitive touch area CTP and a resistive touch area RTP, so that the integrated touch panel 10 has both multi-touch, handwriting and the like. Thus, according to the function of the electronic device 200 The area size of the capacitive touch area CTP and the resistive touch area RTP can be appropriately allocated, and the display area of the display panel 210 can be used to separate the handwriting from the display area, or the reserved area can be used for other functions. The integrated touch panel and the electronic device using the same disclosed in the above embodiments integrate a capacitive touch mode and a resistive touch mechanism on a single touch panel, so that the touch panel simultaneously Capacitive and resistive touch functions can be used to balance the advantages of the conventional touch panel, thereby improving the functionality and competitiveness of the product. In addition, the integrated touch panel of the above embodiment of the present invention is capacitive. The components of the resistive touch area can be fabricated by the existing processes and devices, and thus the process cost is not increased. Thus, the integrated touch panel of the above embodiment of the present invention and the electronic device using the same are more suitable for the market. In the above, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. It is to be understood by those skilled in the art without departing from the spirit and scope of the invention. Various modifications and refinements can be made. Therefore, the scope of protection of the present invention is defined by the scope of the application of the application No. 9 201001254 TW4786FA. [Simplified Schematic] FIG. 1 is a preferred embodiment of the present invention. Explosion diagram of the integrated touch panel of the example. Fig. 2A is a plan view showing the combination of the components of the integrated touch panel of Fig. 1. 2A is a cross-sectional view of the integrated touch panel along the B-B' tangent line. FIG. 2C is a partial enlarged view of the capacitive touch region of FIG. 2B. FIG. 2D is a diagram showing the second schematic view of the capacitor FIG. 3 is a schematic view showing an electronic device according to a preferred embodiment of the present invention. 141 143 152 171 181 [Description of main components] 10: Integrated touch panel 120: second substrate first bonding layer third bonding layer second axis sensing layer first conductive film first conductive electrode 110: first substrate 130: third substrate 142: second bonding layer 151: first axis Sensing layer 160: shielding layer 172: second conductive film 182: second conductive electrode 191, 192: signal transmission cable 195: release film 200: electronic device 210: display panel CTP: capacitive touch region RTP: resistive Touch area