CN107706283A - 一种柔性led灯丝及其封装方法 - Google Patents
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Abstract
本发明公开了一种柔性LED灯丝，包括电路层、多个LED倒装芯片及外部荧光胶；其中，LED倒装芯片固定在电路层上，多个倒装芯片是串联的，外部荧光胶包裹在LED倒装芯片的正反面。本发明还公开了一种柔性LED灯丝的封装方法，本发明采用载板上制作金属电路技术，载板具有一定的强度，降低柔性灯丝固晶难度，提升生产效率。本发明采用LED荧光膜压合技术制作柔性灯丝，采用正反面两次荧光膜压合即可实现批量荧光胶涂覆，降低了柔性灯丝点胶难度，大幅提升生产效率。本发明采用载板剥离技术，柔性灯丝内部不含有易造成光衰的FPC板，灯丝寿命得到大幅提升。
Description
技术领域
本发明涉及LED封装技术领域，特别是一种柔性LED灯丝及其封装方法。
背景技术
目前市场上LED灯丝主要采用陶瓷、蓝宝石作为基材，所封装出的LED灯丝均为硬质灯丝，无法实现弯曲。随着LED灯丝灯的普及，市场对灯丝的美观性及多样化提出了需求。柔性灯丝可以随意弯曲，满足更多的灯具的设计和美观的需求；目前市场上柔性灯丝采用FPC(柔性PCB板)，上使用倒装芯片固晶，固晶后分别在FPC正面及反面两次点胶并烘烤实现柔性LED灯丝的封装，此种封装由于FPC可弯曲，固晶作业难度大，点胶作业难度大较难实现规模化大批量生产； FPC材质透光率低造成LED灯丝光损失光效降低，FPC在灯丝在长期高温工作下，FPC材质进一步裂化发黑，光衰大产品寿命短。
发明内容
本发明所要解决的技术问题是克服现有技术的不足而提供一种柔性LED灯丝及其封装方法，满足市场对于柔性LED灯丝的需求，简化了柔性LED灯丝的封装方法，能够实现大规模批量化生产，提升了柔性LED灯丝光效，同时降低了柔性LED灯丝的光衰，提升了柔性LED灯丝的寿命。
本发明为解决上述技术问题采用以下技术方案：
根据本发明提出的一种柔性LED灯丝，包括电路层、多个LED倒装芯片及外部荧光胶；其中，LED倒装芯片固定在电路层上，多个倒装芯片是串联的，外部荧光胶包裹在LED倒装芯片的正反面。
作为本发明所述的一种柔性LED灯丝进一步优化方案，外部荧光胶采用荧光膜压合方式包裹在LED倒装芯片的表面。
作为本发明所述的一种柔性LED灯丝进一步优化方案，LED倒装芯片通过覆晶技术固定到金属电路层上。
作为本发明所述的一种柔性LED灯丝进一步优化方案，电路层为金属电路层。
作为本发明所述的一种柔性LED灯丝进一步优化方案，电路层为合金电路层。
一种柔性LED灯丝的封装方法，包括以下步骤：
步骤一、提供载板；
步骤二、在载板上制作电路层；
步骤三、在电路层上将倒装LED芯片通过覆晶技术固定到电路层上，形成多个倒装LED芯片串联电路；
步骤四、在倒装LED芯片表面压合荧光膜；
步骤五、将包含荧光膜、倒装芯片的电路层从载板上剥离；
步骤六、将剥离后的半成品背面再次压合荧光膜，使得倒装LED芯片正反面都被荧光胶包裹；
步骤七、 将压合完两面荧光膜的产品进行划切，划切为单根灯丝；
步骤八、对单根灯丝进行测试，完成柔性LED灯丝的封装。
作为本发明所述的一种柔性LED灯丝的封装方法进一步优化方案，电路层为单一金属、合金或者电镀处理后的金属、合金。
本发明采用以上技术方案与现有技术相比，具有以下技术效果：
（1）本发明采用载板上制作金属电路技术，载板具有一定的强度，降低柔性灯丝固晶难度，提升生产效率。
（2）本发明采用LED荧光膜压合技术制作柔性灯丝，采用正反面两次荧光膜压合即可实现批量荧光胶涂覆，降低了柔性灯丝点胶难度，大幅提升生产效率。
（3）本发明采用载板剥离技术，载板仅在封装过程中起辅助作用，最终剥离，柔性灯丝内部不含有硬质载板，也不含后市场上主流的易造成光衰的FPC板，实现柔性灯丝，同时灯丝寿命得到大幅提升。
附图说明
图1是载板示意图。
图2是载板上制作电路层示意图。
图3是将倒装芯片固定到电路层示意图。
图4是在倒装芯片表面压合荧光膜示意图。
图5是将压合荧光膜后的半成品剥离载板示意图。
图6是剥离载板后的半成品背面示意图。
图7是在半成品背面再次压合荧光膜的示意图。
图8是划切后产品示意图。
图9是完成封装后单根柔性灯丝正面示意图。
图10是单根柔性灯丝侧面示意图。
图中的标记说明：1-载板，2-金属电路层，3-倒装LED芯片，4-正面荧光膜，5-背面荧光膜，6-划切道口。
具体实施方式
下面结合附图对本发明的技术方案做进一步的详细说明：
如图1是载板，图2是载板上的金属电路层，在载板1上制作金属电路层2，图3是将倒装LED芯片3固定到金属电路层2上，图4是在倒装LED芯片3表面压合正面荧光膜4，图5是将载板1与金属电路层2进行剥离，图6是载板1与金属电路层2剥离后背面示意图，图7是在剥离基板后的半成品背面再次压合背面荧光膜5，图8是将压合荧光膜后的半成品划切成单根柔性灯丝LED，6是划切道口，图9是完成封装后的柔性灯丝LED正面，图10是柔性灯丝LED侧面。
本发明提出的一种柔性LED灯丝封装方法，包括以下步骤：
步骤一、提供载板；
步骤二、在载板上制作电路层；
步骤三、在电路层上将倒装LED芯片通过覆晶技术固定到电路层上，形成多个倒装LED芯片串联电路；
步骤四、在倒装LED芯片表面压合荧光膜；
步骤五、将包含荧光膜、倒装芯片的电路层从载板上剥离；
步骤六、将剥离后的半成品背面再次压合荧光膜，使得倒装LED芯片正反面都被荧光胶包裹；
步骤七、 将压合完两面荧光膜的产品进行划切，划切为单根灯丝；
步骤八、对单根灯丝进行测试，完成柔性LED灯丝的封装。
本发明采用载板上制作金属电路技术，载板具有一定的强度，降低柔性灯丝固晶难度，提升生产效率。采用LED荧光膜压合技术制作柔性灯丝，采用正反面两次荧光膜压合即可实现批量荧光胶涂覆，降低了柔性灯丝点胶难度，大幅提升生产效率。采用载板剥离技术，柔性灯丝内部不含有易造成光衰的FPC板，灯丝寿命得到大幅提升。
显然，本发明的上述实施例仅仅是为清楚地说明本发明所作的举例，而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而这些属于本发明的实质精神所引伸出的显而易见的变化或变动仍属于本发明的保护范围。
Claims (7)
1.一种柔性LED灯丝，其特征在于，包括电路层、多个LED倒装芯片及外部荧光胶；其中，LED倒装芯片固定在电路层上，多个倒装芯片是串联的，外部荧光胶包裹在LED倒装芯片的正反面。
2.根据权利要求1所述的一种柔性LED灯丝，其特征在于，外部荧光胶采用荧光膜压合方式包裹在LED倒装芯片的表面。
3.根据权利要求1所述的一种柔性LED灯丝，其特征在于，LED倒装芯片通过覆晶技术固定到电路层上。
4.根据权利要求1所述的一种柔性LED灯丝，其特征在于，电路层为金属电路层。
5.根据权利要求1所述的一种柔性LED灯丝，其特征在于，电路层为合金电路层。
6.一种柔性LED灯丝的封装方法，其特征在于，包括以下步骤：
步骤一、提供载板；
步骤二、在载板上制作电路层；
步骤三、在电路层上将倒装LED芯片通过覆晶技术固定到电路层上，形成多个倒装LED芯片串联电路；
步骤四、在倒装LED芯片表面压合荧光膜；
步骤五、将包含荧光膜、倒装芯片的电路层从载板上剥离；
步骤六、将剥离后的半成品背面再次压合荧光膜，使得倒装LED芯片正反面都被荧光胶包裹；
步骤七、 将压合完两面荧光膜的产品进行划切，划切为单根灯丝；
步骤八、对单根灯丝进行测试，完成柔性LED灯丝的封装。
7.根据权利要求6所述的一种柔性LED灯丝的封装方法，其特征在于，电路层为单一金属、合金或者电镀处理后的金属、合金。
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| CN109742068A (zh) * | 2018-12-28 | 2019-05-10 | 苏州工业园区客临和鑫电器有限公司 | 一种全彩rgb柔性灯丝及其封装方法 |
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| CN109742068A (zh) * | 2018-12-28 | 2019-05-10 | 苏州工业园区客临和鑫电器有限公司 | 一种全彩rgb柔性灯丝及其封装方法 |
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