CN107695904A - 制备用于化学机械抛光垫的抛光层的方法 - Google Patents

制备用于化学机械抛光垫的抛光层的方法 Download PDF

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Publication number
CN107695904A
CN107695904A CN201610465720.4A CN201610465720A CN107695904A CN 107695904 A CN107695904 A CN 107695904A CN 201610465720 A CN201610465720 A CN 201610465720A CN 107695904 A CN107695904 A CN 107695904A
Authority
CN
China
Prior art keywords
inner cylindrical
liquid component
cylindrical cavity
cylindrical chamber
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610465720.4A
Other languages
English (en)
Chinese (zh)
Inventor
D·M·韦内齐亚莱
B·钱
T·布鲁加罗拉斯布鲁福
J·考兹休克
Y·童
J·B·米勒
D·卢戈
G·C·雅各布
M·W·德格罗特
A·旺克
F·叶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROHM AND HAAS ELECTRONIC MATER
Dow Global Technologies LLC
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/751,423 external-priority patent/US10105825B2/en
Application filed by ROHM AND HAAS ELECTRONIC MATER, Dow Global Technologies LLC filed Critical ROHM AND HAAS ELECTRONIC MATER
Publication of CN107695904A publication Critical patent/CN107695904A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
CN201610465720.4A 2015-06-26 2016-06-23 制备用于化学机械抛光垫的抛光层的方法 Pending CN107695904A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14/751,423 US10105825B2 (en) 2015-06-26 2015-06-26 Method of making polishing layer for chemical mechanical polishing pad
US14/751423 2015-06-26
US15/163,213 US10144115B2 (en) 2015-06-26 2016-05-24 Method of making polishing layer for chemical mechanical polishing pad
US15/163213 2016-05-24

Publications (1)

Publication Number Publication Date
CN107695904A true CN107695904A (zh) 2018-02-16

Family

ID=57537134

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610465720.4A Pending CN107695904A (zh) 2015-06-26 2016-06-23 制备用于化学机械抛光垫的抛光层的方法

Country Status (7)

Country Link
US (1) US10144115B2 (https=)
JP (1) JP6783563B2 (https=)
KR (1) KR102548640B1 (https=)
CN (1) CN107695904A (https=)
DE (1) DE102016007771A1 (https=)
FR (1) FR3037837B1 (https=)
TW (1) TWI705992B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9776300B2 (en) 2015-06-26 2017-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Chemical mechanical polishing pad and method of making same
US10092998B2 (en) 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
TWI642516B (zh) * 2017-10-02 2018-12-01 智勝科技股份有限公司 研磨墊以及研磨方法
WO2020255744A1 (ja) * 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
KR102293781B1 (ko) * 2019-11-11 2021-08-25 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
US11772230B2 (en) * 2021-01-21 2023-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1738845A (zh) * 2002-11-18 2006-02-22 东省A&T株式会社 具有微孔的聚氨酯泡沫的制备方法和由此获得的抛光垫

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1916330A1 (de) 1969-03-29 1970-10-08 Richard Zippel & Co Kg Farbspr Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen
US3705821A (en) 1970-08-07 1972-12-12 Bayer Ag Process and apparatus for applying polyurethane foam-forming composition
US3954544A (en) 1974-06-20 1976-05-04 Thomas Hooker Foam applying apparatus
DE2538437C3 (de) 1975-08-29 1980-05-08 Elastogran Maschinenbau Gmbh & Co, 8021 Strasslach Mischvorrichtung für Mehrkomponentenkunststoffe mit Poren- oder Zellenstruktur, insbesondere Polyurethan
US4158535A (en) 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
US5110081A (en) * 1990-09-26 1992-05-05 Lang Jr William O Vibration-isolating mount
US5163584A (en) 1990-12-18 1992-11-17 Polyfoam Products, Inc. Method and apparatus for mixing and dispensing foam with injected low pressure gas
US6315820B1 (en) 1999-10-19 2001-11-13 Ford Global Technologies, Inc. Method of manufacturing thin metal alloy foils
US7214757B2 (en) * 2000-03-09 2007-05-08 Eastman Kodak Company Polyurethane elastomers and shaped articles prepared therefrom
JP3776428B2 (ja) 2002-12-27 2006-05-17 株式会社加平 ポリウレタン発泡体シート及びそれを用いた積層体シートの製造方法
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
DE102005058292A1 (de) 2005-12-07 2007-06-14 Hennecke Gmbh Verfahren und Vorrichtung zur Herstellung von beschichteten Formteilen
JP4954762B2 (ja) 2007-03-27 2012-06-20 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法
US20090094900A1 (en) 2007-10-15 2009-04-16 Ppg Industries Ohio, Inc. Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
SG11201402224WA (en) * 2011-11-29 2014-09-26 Nexplanar Corp Polishing pad with foundation layer and polishing surface layer
WO2014153048A1 (en) 2013-03-14 2014-09-25 Zte Wistron Telecom Ab Method and apparatus to adapt the number of harq processes in a distributed network topology
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9630293B2 (en) 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
US9457449B1 (en) 2015-06-26 2016-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with composite polishing layer
US10105825B2 (en) 2015-06-26 2018-10-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US9586305B2 (en) 2015-06-26 2017-03-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and method of making same
US10092998B2 (en) 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
US9776300B2 (en) 2015-06-26 2017-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Chemical mechanical polishing pad and method of making same
US10005172B2 (en) 2015-06-26 2018-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-porosity method for forming polishing pad

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1738845A (zh) * 2002-11-18 2006-02-22 东省A&T株式会社 具有微孔的聚氨酯泡沫的制备方法和由此获得的抛光垫

Also Published As

Publication number Publication date
JP2017013224A (ja) 2017-01-19
KR102548640B1 (ko) 2023-06-28
JP6783563B2 (ja) 2020-11-11
DE102016007771A1 (de) 2016-12-29
TWI705992B (zh) 2020-10-01
TW201700557A (zh) 2017-01-01
KR20170001625A (ko) 2017-01-04
US20160375555A1 (en) 2016-12-29
FR3037837A1 (https=) 2016-12-30
FR3037837B1 (fr) 2020-05-22
US10144115B2 (en) 2018-12-04

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Application publication date: 20180216