CN107665845A - Board carrying machine people and vacuum treatment installation - Google Patents
Board carrying machine people and vacuum treatment installation Download PDFInfo
- Publication number
- CN107665845A CN107665845A CN201710629887.4A CN201710629887A CN107665845A CN 107665845 A CN107665845 A CN 107665845A CN 201710629887 A CN201710629887 A CN 201710629887A CN 107665845 A CN107665845 A CN 107665845A
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- Prior art keywords
- foregoing
- support plate
- plate
- quartz
- metacarpus
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The present invention is provided even if not detected the board carrying machine people for the accurate movement that can also carry out substrate to the end of hand.By hand（40）Locating finger（55）With in support plate（41）Upper configuration quartz plate（42）Mode form, in quartz plate（42）Root portion at, setting be fixed in support plate（41）Fixed part（50）.Quartz plate（42）Fixed part（50）Part in addition is not fixed in support plate（41）Even if it is heated and support plate（41）Extension, quartz plate（42）Also do not extend, in the absence of being arranged at quartz plate（42）End end side limiter（56）Due to the movement of thermal expansion.
Description
Technical field
The present invention relates to the technical field of board carrying machine people, can particularly carry out the positioning of substrate exactly
Board carrying machine people.
Background technology
Since in the past, in order that the substrate such as glass plate, semiconductor wafer moves, placement substrate on hand has been widely used in
And the board carrying machine people for moving hand.
The hand of board carrying machine people is present substrate-placing in elongated multiple finger portions（Axle portion）Carry out carrying substrate
Type.
End side limiter is set in the end of hand, prevents the skew of substrate, and determine the position of substrate（Existing text
Offer 1）.
The inside direction of the vacuum processing chamber for the preceding process that board carrying machine people terminates from processing is carried out from ensuing
The inside of the vacuum processing chamber of the i.e. rear process of reason, moves substrate in vacuum environment.
Substrate is heated sometimes during the processing of process before progress, in addition, the substrate for being intended to process movement backward is risen sometimes
Temperature is to high temperature.If the substrate of high temperature is placed in the elongated finger portion of hand, the portion of finger is heated.
Finger portion is because needing intensity, so being made up of ceramics or metal.
It is heated if referring to portion and refers to portion's heating, refers to portion and entered with the corresponding amount of the thermal coefficient of expansion of the material with being formed the portion of finger
Row thermal expansion and it is elongated, as a result, be arranged at the position of the end side limiter of the end in finger portion from the root in finger portion away from
Direction movement.
Following problems be present：Due to carrying increase and the handling time of number（The duration of runs）Process, refer to the temperature in portion
Rise, along with the rising of temperature, the position of end side limiter changes, and therefore, is moved at the vacuum of rear process
It is not constant to manage the position of the substrate of room.
Patent document 1：Japanese Unexamined Patent Publication 2015-82532 publications.
The content of the invention
The present invention is made to solve the incomplete part of above-mentioned prior art, even if its object is to provide to refer to
The temperature in portion rises, the shift in position of end side limiter also less board carrying machine people.
In order to solve the above problems, the present invention is a kind of board carrying machine people, aforesaid base plate transfer robot make by with
The hand movement of substrate is put, wherein, foregoing hand has metacarpus and the elongated finger portions of Duo Gen, and foregoing more elongated finger portions are set
Foregoing metacarpus is placed in, is configured a substrate, at least foregoing finger portion in more foregoing finger portions is with support plate, quartz
The locating finger of plate, foregoing support plate are the elongated support plates that root portion is fixed in foregoing metacarpus, and foregoing quartz plate is
The elongated quartz plate loaded on foregoing support plate along foregoing support plate, it is close foregoing in the both ends of foregoing quartz plate
One end of the root side of metacarpus, fixed part is set, in the other end of the end side remote apart from foregoing metacarpus, sets end side spacing
Device, foregoing fixed part are installed in the supporting mass being made up of foregoing metacarpus and foregoing support plate, and the foregoing other end of end side is not
It is installed in foregoing supporting mass.
There is the board carrying machine people of more than two foregoing locating fingers in addition, the present invention is foregoing hand.
The present invention is that foregoing quartz plate is formed as the board carrying machine people that multiple quartz members are interfixed.
The present invention is the board carrying machine people that foregoing support plate is made up of aluminum oxide.
The present invention is a kind of vacuum treatment installation, and aforementioned vacuum processing unit has carrying room, vacuum processing chamber, foregoing to remove
Fortune room has board carrying machine people, vacuum tank, and aforesaid base plate transfer robot makes the hand movement for being configured substrate, foregoing true
Dead slot is configured with aforesaid base plate transfer robot, and aforementioned vacuum process chamber is connected to foregoing carrying room, and aforesaid base plate is carried out
Application of vacuum, foregoing hand have metacarpus and the elongated finger portions of Duo Gen, and foregoing more elongated finger portions are arranged at foregoing metacarpus,
It is configured a substrate, at least foregoing finger portion in more foregoing finger portions is the locating finger for having support plate, quartz plate,
Foregoing support plate is the elongated support plate that root portion is fixed in foregoing metacarpus, and foregoing quartz plate is on foregoing support plate
The elongated quartz plate loaded along foregoing support plate, the root side of the close foregoing metacarpus in the both ends of foregoing quartz plate
One end, fixed part is set, in the other end of the end side remote apart from foregoing metacarpus, end side limiter, foregoing fixed part are set
The supporting mass being made up of foregoing metacarpus and foregoing support plate is installed in, the foregoing other end of end side is not installed in foregoing branch
Body is held, foregoing hand has more than two foregoing locating fingers.
The present invention is the vacuum treatment installation as described in technical scheme 5, and foregoing hand has more than two foregoing positioning
Finger portion.
The present invention is that foregoing quartz plate is formed as the vacuum treatment installation that multiple quartz members are interfixed.
In addition, the present invention is the vacuum treatment installation that foregoing support plate is made up of aluminum oxide.
The quartz plate being made up of quartz is set in finger portion, end side limiter, therefore end are provided with the end of quartz plate
Limiter amount of movement as caused by thermal expansion in side diminishes, and the positioning of substrate becomes accurate.
Brief description of the drawings
Fig. 1 is the figure for being illustrated to vacuum treatment installation.
Fig. 2 is the figure for being illustrated to carrying room.
Fig. 3 is the partial sectional view for being illustrated to board carrying machine people.
Fig. 4 is the stereogram of board carrying machine people.
Fig. 5 is the top view of hand.
Fig. 6 is the top view for being illustrated to the state that substrate is configured to the hand.
Fig. 7 is the partial sectional view for being illustrated to locating finger.
Fig. 8（a）It is Fig. 5 I-I line cut-away sectional views, Fig. 8（b）It is Fig. 5 II-II line cut-away sectional views, Fig. 8（c）It is
Represent the sectional view of an example of fixed part, Fig. 8（d）It is the top view for being illustrated to linking part.
Embodiment
Fig. 1 is the vacuum treatment installation 10 for the application of vacuum for carrying out object to be processed, and the vacuum treatment installation 10, which has, to be removed
Fortune room 11, multiple vacuum processing chambers 12, at least one take out of and move into room 13.
Each vacuum processing chamber 12 and take out of and move into room 13 and be configured in around carrying room 11, be configured to by being opened and closed lock
Valve, and by the inside of each vacuum processing chamber 12, take out of and move into the inside of room 13 and be connected or separate with the inside of carrying room 11.
As shown in Fig. 2 carrying room 11 has vacuum tank 21, transfer robot 20.
Fig. 3 is the enlarged drawing of the side of transfer robot 20, and Fig. 4 is stereogram.
Transfer robot 20 has hand 40, sliding panel 33, pedestal 32, column sections 31.
Hand 40, sliding panel 33, pedestal 32 are configured in the inside of vacuum tank 21, and the bottom of column sections 31 is arranged at very
The outside of dead slot 21, on the part of the inside of the vacuum tank 21 of column sections 31, from below by pedestal 32, sliding panel 33 and hand
40 install according to the order.
Vacuum pumping hardware 14 is connected to the vacuum tank of each room 11 ~ 13, makes the action of vacuum pumping hardware 14 by each room
11 ~ 13 inner vacuum exhaust.The action controlled device 28 of vacuum pumping hardware 14, transfer robot 20 and following motors 23
Control.
Pedestal 32 is set in column sections 31 in a manner of it can rotate and lift.Sliding panel 33 is fixed in pedestal
32, if by the action of motor 23, the rotary shaft of the inside of column sections 31 rotates, then sliding panel 33 rotates together with pedestal 32,
In addition, if rotary shaft moves up and down, sliding panel 33 moves up and down together with pedestal 32.
Hand 40 has metacarpus 34, is arranged at multiple finger portion 51a ~ 54a, the 51b ~ 54b of metacarpus 34.Metacarpus 34 is metal
System or be the ceramics system such as aluminum oxide, refer to portion 51a ~ 54a, 51b ~ 54b has metal system or the ceramics system such as aluminum oxide
Part.
Sliding panel 33 is flatly configured, and guiding groove 49 is provided with surface upward.Sliding panel 33 is in rectangular
Shape shape, guiding groove 49 is linearly, is configured to parallel with the long side of sliding panel 33, in addition, guiding groove 49 is flatly matched somebody with somebody
Put.
Metacarpus 34 be connected to controlled device 28 control motor (not shown), metacarpus 34 with the motor acted from
And the mode that can be moved along the direction that guiding groove 49 extends is installed in guiding groove 49.
In this embodiment, it is set as when metacarpus 34 is flatly moving on sliding panel 33, straight line moves metacarpus 34 in the horizontal plane
It is dynamic.
In metacarpus 34, multiple finger portion 51a ~ 54a, the 51b ~ 54b being horizontally set are provided with.In this embodiment, with finger
Portion 51a ~ 54a, 51b ~ 54b all mobile and retreat mobile direction abreast with the advance described later of metacarpus 34, direction
The mode in identical direction, is set away from each other.
Multiple finger portion 51a ~ 54a（Here it is 4）With remaining multiple finger portion 51b ~ 54b（Here it is 4）It is configured to
One side it is multiple be upper strata, the multiple of the opposing party be 2 layers of lower floor.It is configured in upper strata and one layer of multiple finger portions in lower floor
51a ~ 54a can respectively keep respective substrate with being configured in another layer of multiple finger portion 51b ~ 54b.
The finger portion 51a ~ 54a on upper strata is configured to the height of mutually the same degree, and finger portion 51b ~ 54b of lower floor is configured to
The height of mutually the same degree, a substrate 16 is loaded respectively.
Fig. 4,6 reference 16 represent to be configured in the finger portion 51a ~ 54a on upper strata or the finger portion of lower floor of hand 40
51b ~ 54b substrate.
So, in hand 40, can respectively match somebody with somebody in the finger portion 51a ~ 54a on upper strata and finger portion 51b ~ 54b of lower floor respectively
A substrate 16 is put, therefore, it is possible to configure two substrates 16 in hand 40.If metacarpus 34 along guiding groove 49 advance move or after
Retire it is dynamic, then hand 40, be configured in the substrate 16 of hand 40 and metacarpus 34 and refer to portion 51a ~ 54a, 51b ~ 54b together before
Enter mobile or retrogressing movement.
If making hand 40 advance movement, the vacuum processing chamber of hand 40 in the carrying room 11 process forward can be made
Moved in 12.Then, make hand 40 static in the fixed position of the vacuum processing chamber 12 relative to preceding process, make to be configured in
Substrate 16 in the vacuum processing chamber 12 of preceding process is placed on hand 40.Next, making hand 40 retreat movement, make hand 40
It is moved in carrying room 11, the rotation of pedestal 32 is moved if making hand 40 advance so as to which the direction of hand 40 be changed, is made substrate
16 are moved in the vacuum processing chamber 12 of rear process, and are still in the defined location of vacuum processing chamber 12 relative to rear process,
Then being capable of placement substrate 16 on the platform in the vacuum processing chamber 12 of process backward.
Be configured in some of upper strata or lower floor and be configured identical substrate 16 multiple finger portion 51a ~ 54a or
Person refers at least one in portion 51b ~ 54b, is contemplated to be finger portion 51a, 53a, 54a, 51b, 53b, 54b such as Fig. 5 institutes of more than two
Show, have elongated support plate 41, be configured on support plate 41 by the elongated quartz plate 42 that forms of quartz, if by these
Accompanying drawing marks of finger portion 51a, 53a, 54a, 51b, 53b, the 54b with support plate 41 and quartz plate 42 as locating finger, then Fig. 7
Note 55 represents locating finger.Others, which refer to portion 52a, 52b, has flat support plate 43, and quartz plate is not provided with thereon.
It is desirable that, in multiple finger portion 51a ~ 54a, 51b ~ 54b, finger portion 51a, 51b, 54a, 54b of end are pointed to
Quartz plate 42 is set, as locating finger 55.
Fig. 7 is the sectional view of the side of locating finger 55, Fig. 8（a）It is the I-I line cutting section views of Fig. 5 locating finger 55
Figure.Support plate 41 is in the U-shaped shape of opening upward, and advance of the long side direction along metacarpus 34, which is moved and retreated, moves
Direction configuration, long side direction of its long side direction along support plate 41 be configured at the bottom surface of support plate 41 by quartz plate 42
On.Two wall parts 48 of a part for composition U-shaped shape are formed to the contacts side surfaces with quartz plate 42, in quartz
When plate 42 moves up in wall side, contacted with some of two wall parts 48, therefore quartz plate 42 will not be from support plate 41
Come off.
One end in the both ends of support plate 41 is located on metacarpus 34 or near metacarpus 34, and the other end is located at apart from metacarpus
34 remote positions, quartz plate 42 are fixed in one end of the side of metacarpus 34 in support plate 41 by fixed part 50 described later, and
And the part remote apart from metacarpus 34 is not fixed.
Therefore, the thermal expansivity compared with support plate 41 of quartz plate 42 is small, and the only one end of quartz plate 42 is limited.Therefore, form
Together to be heated or together being cooled down so as to which support plate 41 exists relative to quartz plate 42 in support plate 41 and quartz plate 42
When being stretched on long side direction, movement is slided relative to support plate 41 by the part beyond fixed part, therefore, even if in temperature
Rise or decline and support plate 41 is flexible, support plate 41 is offset relative to quartz plate 42, and quartz plate 42 can also maintain and support plate
41 flexible preceding almost identical length.
Fig. 8（b）It is the II-II line cut-away sectional views of Fig. 5 locating finger 55, on quartz plate 42, in multiple opening positions
Hole 63 is formed, in each hole 63, is configured with bearing 64.
Bearing 64 has main body 65, is configured in the upper end of main body 65 and is installed in main body in a manner of it can rotate
65 ball 66, ball 66 are configured in the position higher than support plate 41, quartz plate 42, and the upper end of ball 66 is exposed.
Hole 63 is the elongated hole along long side direction, and bearing 64 is configured in branch in a manner of main body 65 contacts with support plate 41
On board 41.
The hole 63 of quartz plate 42 is that edge refers to portion（51a etc.）Length direction elongated hole, be configured to, support plate 41 with quartz
Plate 42 is heated or cooled and when support plate 41 stretches relative to quartz plate 42, bearing 64 does not contact with the edge in hole 63, i.e.,
The position of support plate 41 and quartz plate 42 is offset, is not also interfered.Bearing 64 can also be installed on quartz plate 42, but in intensity
On, it is preferably installed in support plate 41.
Bearing 64 is also configured in finger portion 52a, 52b beyond locating finger 55, is being configured the finger of identical substrate 16
The upper end exposed of the ball 66 of the bearing 64 configured in portion 51a ~ 54a, 51b ~ 54b is configured to identical height.
Therefore, when substrate 16 is being configured on hand 40, the back side of substrate 16 contacts with ball 66.
If applying the power of horizontal direction to substrate 16, ball 66 rotates and substrate 16 rolls movement on ball 66.Therefore, if
Do not contacted with support plate 41, quartz plate 42 into substrate 16, the damage of the dust as caused by slip, substrate 16 will not be produced.
In addition, the quartz plate 42 used in the present embodiment is by multiple elongated quartz members 421~423Form, respectively
Quartz member 421~423The central axis of long side direction be configured on identical straight line, each quartz member 421~423Held
Portion contiguously configures.
Multiple quartz members 421~423In a quartz member 421It is another positioned at the root side nearest apart from metacarpus 34
Individual quartz member 423Positioned at the end side opposite with root side, remaining one or more quartz member 422Positioned at root side
With two quartz members 42 of end side1、423Between.
In multiple quartz members 421~423In adjacent two quartz member 421~423The end of contact, with mutual
Embedded mode is provided with linking part 60, multiple elongated quartz members 421~423With multiple quartz members 421~423By linking
Portion 60 link mode and form a quartz plate 42.
Fig. 8（d）The amplification plan view of linking part 60, shown herein as by center quartz member 422With the stone of end side
English part 423The linking part 60 of link.In the quartz member 42 of a side3The convex portion 67 of upper formation is embedded in the quartz member of the opposing party
422Recess 37, so as to form linking part 60.
Metacarpus 34 and support plate 41 are formed with the quartz material high compared to intensity mechanically, slapped by metal, aluminum oxide etc.
Portion 34 is interfixed with support plate 41 by the grade of screw element 45.
The part of the root of quartz plate 42 is located on metacarpus 34 or on support plate 41, in the part of the root of quartz plate 42
On, it is provided with the fixed part 50 that quartz plate 42 is fixed on to support plate 41.Fixed part 50 is arranged at positioned at the quartzy portion of root
Part 421。
If being illustrated to fixed part 50, as shown in fig. 7, in this embodiment, formation quartz plate side is passed through on quartz plate 42
Through hole 46a, formed with the support plate side through hole 46b connected with quartz plate side through hole 46a on support plate 41, top is by shape
Its lower end is inserted through quartz plate side through hole 46a and support plate side through hole 46b as flange shape bolt 44, by bolt
44th, quartz plate side through hole 46a and support plate side through hole 46b, form and consolidate quartz plate 42 with what support plate 41 interfixed
Determine portion 50.Quartz plate 42 and metacarpus 34 can also be formed fixed part 50 with interfixing.
One end of the side of metacarpus 34 of quartz plate 42 is fixed in support plate 41 by fixed part 50.
Fixed part 50 can also be arranged at metacarpus 34, alternatively, it is also possible to which quartz plate 42 and support plate 41 are utilized into clamping
Part etc. is clamped to fix.
One end of the side of metacarpus 34 of quartz plate 42 can both be fixed in support plate 41, or can also be fixed in metacarpus
34, therefore, if mutually supporting mass 30 will be referred to as by fixed metacarpus 34 and support plate 41, quartz plate 42 is by the quilt of fixed part 50
Supporting mass 30 is fixed on, the weight of quartz plate 42 is supported by supporting mass 30.
From fixed part 50 to the end of quartz plate 42 or the end of support plate 41, bottom surface and the supporting mass 30 of quartz plate 42
Contact, but the ratio fixed part 50 of quartz plate 42 is not fixed in supporting mass 30, support plate 41 and quartz plate by the part of end side
42 are separated from each other, due to heating and support plate 41 it is longer than quartz plate 42 extend when, opposite with the position of fixed part 50
Side quartz plate 42 end side, support plate 41 and quartz plate 42 are extended with respective elongation.
The side opposite with fixed part 50 in the both ends of quartz plate 42 is end side, be configured in finger portion 51a ~
The height of the contacts side surfaces of substrate 16 on 54a, 51b ~ 54b is provided with end side limiter 56.
If the terminad direction of substrate 16 movement configured on finger portion 51a ~ 54a, 51b ~ 54b, it is spacing with end side
Device 56 is contacted and stopped.
The thermal coefficient of expansion of quartz plate 42 is 0.6 × 10-6/ K, aluminum oxide are 7.2 × 10-6/ K, support plate when being heated
41 thermal expansion amount becomes greatly more than 10 times compared with the thermal expansion amount of quartz plate 42, if locating finger 55 is heated, fixed
Position refers to the support plate 41 in portion 55 and in quartz plate 42, support plate 41 is than the more significantly thermal expansion of quartz plate 42.
Part of the quartz plate 42 with support plate 41 beyond fixed part 50 is not interfixed, therefore, support plate 41 with
In the state of quartz plate 42 is interfixed at fixed part 50, the end of support plate 41 is not extended with hindering by quartz plate 42,
The end of support plate 41 significantly changes relative to the position of vacuum tank 21.
The extension as caused by heating of quartz plate 42, shrink as caused by cooling with support plate 41 it is flexible compared be a small amount of
, positioned at the end of quartz plate 42 end side limiter 56 by the position caused by heating, cooling down relative to vacuum tank 21
Change it is small.
When metacarpus 34 is configured in identical position in the inside of vacuum tank 21 relative to vacuum tank 21, with relative to true
The position identical mode of dead slot 21 is by more than 16 finger portion 51a ~ 54a, 51b ~ 54b for being configured at the metacarpus 34 of substrate, now,
Even if each finger portion 51a ~ 54a, 51b ~ 54b temperature are different, the position relationship difference between substrate 16 and the end of support plate 41
Greatly, the position relationship between substrate 16 and end side limiter 56 is also without big difference.
Therefore, even if the mutual temperature of multiple finger portion 51a ~ 54a, 51b ~ 54b is different, the base of hand 40 can will be also configured at
Plate 16 is configured at identical position relative to end side limiter 56.
Fig. 7 reference 57 is root side limiter, positioned at the substrate 16 configured on finger portion 51a ~ 54a, 51b ~ 54b
Between metacarpus 34.If the substrate 16 for being set as configuring on finger portion 51a ~ 54a, 51b ~ 54b moves to root side, with root side
Limiter is contacted and stopped, therefore is set as moving not over the ground of root side limiter 57.
In addition, the reference 58 in Fig. 5,6 is the accessory plate of L-shaped shape, the side of the end of accessory plate 58 is installed on
The four of square limiter 59 and substrate 16 in, with end side limiter 56 and root side limiter 57 contact respectively while it is different
Side contact, being set as substrate 16 will not move to the direction vertical with moving direction.In Fig. 2,3,7, accessory plate 58 is omitted.
By the installation example of root side limiter 57 in Fig. 8（c）Middle expression.The construction of root side limiter 57 and end lateral spacing
The construction of position device 56 is identical.
Reference 69 is the limiter main body of root side limiter 57, in this embodiment, is provided with limiter main body 69
Multiple positioning hole 72a, a limiter elongated hole 68.Fixation through hole 72b is provided with quartz plate 42, is penetrated in fixation
The pin 74 of positioning is configured with the 72b of hole.
The direction that multiple positioning hole 72a extend along limiter elongated hole 68 configures, multiple positioning hole 72a and limiter elongated hole
68 are formed as being arranged in a row.
It is desired in multiple positioning hole 72a will be inserted to the fixed top with pin 74 prominent on through hole 72b
Positioning hole 72a mode, limiter main body 69 is placed in quartz plate 42.If the positioning hole 72a that the top of pin 74 is inserted changes
Become, then the position of limiter main body 69 can be changed.
Formed with limiter elongated hole 68 in limiter main body 69, the quartz plate in the position connected with limiter elongated hole 68
42 part, formed with quartz plate elongated hole 62a.
On the support plate 41 positioned at quartz plate elongated hole 62a lower section, formed at the position connected with quartz plate elongated hole 62a
There is support plate pore 62b.
At the limiter elongated hole 68 and quartz plate elongated hole 62a of connection, insert top is formed as flange shape bolt 61
Bar-shaped part, its thinner lower end are inserted in support plate pore 62b.
Part top the ratio support plate pore 62b of the bar-shaped part of bolt 61 is located at quartz plate elongated hole 62a inside
With the inside of limiter elongated hole 68, flange shape part is located at the inside of limiter elongated hole 68.
The side of the flange shape part of bolt 61 is set as can be with the inner periphery of the limiter elongated hole 68 of limiter main body 69
Face contacts.By pin 74 and bolt 61, limiter main body 69 is fixed in quartz plate 42.
Just quartz plate is fixed on formed with positioning hole and limiter elongated hole 68 in limiter main body and using pin and bolt
42 in this point, and end side limiter 56 is identical.
Description of reference numerals
10 ... vacuum treatment installations
16 ... substrates
20 ... transfer robots
21 ... vacuum tanks
30 ... supporting masses
34 ... metacarpus
40 ... hands
41 ... support plates
42 ... quartz plates
421~423... quartz member
50 ... fixed parts
51a ~ 54a, 51b ~ 54b ... refer to portion
55 ... locating fingers
60 ... linking parts.
Claims (8)
1. a kind of board carrying machine people, aforesaid base plate transfer robot makes the hand movement for being configured substrate, and aforesaid base plate is removed
Robot is transported to be characterised by,
Foregoing hand has metacarpus and the elongated finger portions of Duo Gen, and foregoing more elongated finger portions are arranged at foregoing metacarpus, by with
A substrate is put,
An at least foregoing finger portion in more foregoing finger portions is the locating finger for having support plate, quartz plate, foregoing support plate
It is the elongated support plate that root portion is fixed in foregoing metacarpus, foregoing quartz plate is along foregoing supporting on foregoing support plate
The elongated quartz plate loaded plate,
One end of the root side of close foregoing metacarpus in the both ends of foregoing quartz plate, fixed part is set, apart from the foregoing palm
The other end of the remote end side in portion, end side limiter is set,
Foregoing fixed part is installed in the supporting mass being made up of foregoing metacarpus and foregoing support plate, and the foregoing other end of end side is not
It is installed in foregoing supporting mass.
2. board carrying machine people as claimed in claim 1, it is characterised in that
Foregoing hand has more than two foregoing locating fingers.
3. board carrying machine people as claimed in claim 1 or 2, it is characterised in that
Foregoing quartz plate is formed as multiple quartz members and interfixed.
4. board carrying machine people as claimed any one in claims 1 to 3, it is characterised in that
Foregoing support plate is made up of aluminum oxide.
A kind of 5. vacuum treatment installation, it is characterised in that
Aforementioned vacuum processing unit has carrying room, vacuum processing chamber,
Foregoing carrying room has board carrying machine people, vacuum tank,
Aforesaid base plate transfer robot makes the hand movement for being configured substrate, and aforementioned vacuum groove is configured with aforesaid base plate conveying robot
People,
Aforementioned vacuum process chamber is connected to foregoing carrying room, and application of vacuum is carried out to aforesaid base plate,
Foregoing hand has metacarpus and the elongated finger portions of Duo Gen, and foregoing more elongated finger portions are arranged at foregoing metacarpus, by with
A substrate is put,
An at least foregoing finger portion in more foregoing finger portions is the locating finger for having support plate, quartz plate, foregoing support plate
It is the elongated support plate that root portion is fixed in foregoing metacarpus, foregoing quartz plate is along foregoing supporting on foregoing support plate
The elongated quartz plate loaded plate,
One end of the root side of close foregoing metacarpus in the both ends of foregoing quartz plate, fixed part is set, apart from the foregoing palm
The other end of the remote end side in portion, end side limiter is set,
Foregoing fixed part is installed in the supporting mass being made up of foregoing metacarpus and foregoing support plate, and the foregoing other end of end side is not
Foregoing supporting mass is installed in,
Foregoing hand has more than two foregoing locating fingers.
6. vacuum treatment installation as claimed in claim 5, it is characterised in that
Foregoing hand has more than two foregoing locating fingers.
7. the vacuum treatment installation as described in claim 5 or 6, it is characterised in that
Foregoing quartz plate is formed as multiple quartz members and interfixed.
8. the vacuum treatment installation as any one of claim 5 to 7, it is characterised in that
Foregoing support plate is made up of aluminum oxide.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016149937A JP6742849B2 (en) | 2016-07-29 | 2016-07-29 | Substrate transfer robot, vacuum processing device |
| JP2016-149937 | 2016-07-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107665845A true CN107665845A (en) | 2018-02-06 |
| CN107665845B CN107665845B (en) | 2023-04-14 |
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ID=61075966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710629887.4A Active CN107665845B (en) | 2016-07-29 | 2017-07-28 | Substrate transfer robot and vacuum processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6742849B2 (en) |
| KR (1) | KR102269697B1 (en) |
| CN (1) | CN107665845B (en) |
| TW (1) | TWI721190B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2018019015A (en) | 2018-02-01 |
| CN107665845B (en) | 2023-04-14 |
| KR102269697B1 (en) | 2021-06-25 |
| TWI721190B (en) | 2021-03-11 |
| TW201807768A (en) | 2018-03-01 |
| JP6742849B2 (en) | 2020-08-19 |
| KR20180013737A (en) | 2018-02-07 |
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