TW201807768A - Substrate transfer robot, vacuum processing apparatus to precisely move a substrate even without detecting the end of arm because the quartz plate will not extend even if the supporting plate extends due to a heating treatment - Google Patents

Substrate transfer robot, vacuum processing apparatus to precisely move a substrate even without detecting the end of arm because the quartz plate will not extend even if the supporting plate extends due to a heating treatment Download PDF

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TW201807768A
TW201807768A TW106122561A TW106122561A TW201807768A TW 201807768 A TW201807768 A TW 201807768A TW 106122561 A TW106122561 A TW 106122561A TW 106122561 A TW106122561 A TW 106122561A TW 201807768 A TW201807768 A TW 201807768A
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support plate
substrate
quartz
plate
arm
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TW106122561A
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Chinese (zh)
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TWI721190B (en
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神保洋介
江藤謙次
藤井厳
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愛發科股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

The present invention provides a substrate transfer robot to precisely move a substrate even without detecting the end of arm. The positioning finger part (55) of arm (40) is constituted in a manner of configuring a quartz plate (42) on a supporting plate (41). A fixed part (50) fixed at the supporting plate (41) is disposed at the root portion of quartz plate (42). The portion of quartz plate (42) other than the fixed part (50) is not fixed to the supporting plate (41). The quartz plate (42) will not extend even if the supporting plate (41) extends due to a heating treatment, so the end-side position-limiting device (56) disposed at the end of quartz plate (42) will not move in response to the thermal expansion.

Description

基板搬送機器人、真空處理裝置 Board transfer robot, vacuum processing device

本發明是關於基板搬送機器人的技術領域,特別是關於一種能夠準確地進行基板的定位的基板搬送機器人。 The present invention relates to the technical field of substrate transfer robots, and in particular, to a substrate transfer robot capable of accurately positioning a substrate.

過去以來,為了使玻璃板、半導體晶圓等基板移動,廣泛地使用一種在手臂上配置基板並使手臂移動的基板搬送機器人。 In the past, in order to move a substrate such as a glass plate or a semiconductor wafer, a substrate transfer robot that has placed a substrate on an arm and moved the arm has been widely used.

基板搬送機器人的手臂存在將基板載置於細長的多個指部(軸部)來搬送基板的類型。 An arm of the substrate transfer robot has a type in which the substrate is placed on a plurality of elongated fingers (axis portions) to transfer the substrate.

在手臂的末端設置末端側限位器,防止基板的偏移,並且確定基板的位置(現有文獻1)。 A tip-side stopper is provided at the end of the arm to prevent displacement of the substrate and determine the position of the substrate (Existing Document 1).

基板搬送機器人從處理結束的前工序的真空處理室的內部朝向要進行接下來的處理的後工序的真空處理室的內部,在真空環境中使基板移動。 The substrate transfer robot moves the substrate in a vacuum environment from the inside of the vacuum processing chamber in the pre-process of the processing end to the inside of the vacuum processing chamber in the post-process to perform the next processing.

在進行前工序的處理時基板有時被加熱,另 外,欲向後工序移動的基板有時被升溫至高溫。若高溫的基板被載置於手臂的細長的指部上,則指部會被加熱。 The substrate may be heated during the pre-treatment process. In addition, the substrate to be moved to a later step may be heated to a high temperature. When a high-temperature substrate is placed on the elongated fingers of the arm, the fingers are heated.

指部因需要強度,所以由陶瓷或金屬構成。 Since the fingers need strength, they are made of ceramic or metal.

若指部被加熱以致指部升溫,則指部僅以與構成指部的材料之熱膨脹係數對應的量進行熱膨脹而變長,結果,被設置於指部的末端的末端側限位器的位置從指部的根部朝向遠離的方向移動。 If the finger is heated so that the temperature of the finger is increased, the finger is thermally expanded only by an amount corresponding to the thermal expansion coefficient of the material constituting the finger, and as a result, it is set at the position of the end stopper at the end of the finger Move from the root of your finger in a direction away.

由於搬送片數的增加及搬送時間(運轉時間)的經過,指部的溫度上升,伴隨著溫度的上升,末端側限位器的位置發生變化,因此,存在有被搬送到後工序的真空處理室的基板的位置不是恆定的課題。 Due to the increase in the number of conveyed pieces and the elapse of the conveying time (running time), the temperature of the fingers rises, and the position of the end stopper changes with the rise in temperature. Therefore, there is a vacuum treatment that is conveyed to the subsequent process. The position of the substrate of the chamber is not a constant issue.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Literature]

專利文獻1:日本特開2015-82532號公報。 Patent Document 1: Japanese Patent Application Laid-Open No. 2015-82532.

本發明是為了解決上述現有技術的不完備之處而完成的,其目的在於提供一種即使指部的溫度上升,末端側限位器的位置變動也較小的基板搬送機器人。 The present invention has been made in order to solve the incompleteness of the above-mentioned prior art, and an object thereof is to provide a substrate transfer robot that has a small variation in the position of the end-side stopper even if the temperature of a finger portion rises.

為了解決上述問題,本發明是一種基板搬送機器人,前述基板搬送機器人使可配置基板的手臂移動,其中,前述手臂具有掌部和多根細長的指部,前述多根細 長的指部被設置於前述掌部,可配置一片基板,多根前述指部中的至少一根前述指部是具有支承板、石英板的定位指部,前述支承板是根部部分被固定於前述掌部的細長的支承板,前述石英板是在前述支承板上沿前述支承板而載置的細長的石英板,在前述石英板的兩端中的接近前述掌部的根部側的一端設置固定部,在距離前述掌部較遠的末端側的另一端設置末端側限位器,前述固定部被安裝於由前述掌部與前述支承板構成的支承體,末端側的前述另一端未被安裝於前述支承體。 In order to solve the above problem, the present invention is a substrate transfer robot that moves an arm on which a substrate can be arranged, wherein the arm has a palm portion and a plurality of elongated fingers, and the plurality of thin arms A long finger is provided on the palm, and a substrate can be arranged. At least one of the plurality of fingers is a positioning finger having a support plate and a quartz plate, and the support plate is fixed to the root portion. The elongated support plate of the palm portion, the quartz plate is an elongated quartz plate placed along the support plate on the support plate, and is provided on one end of the quartz plate near one end of the palm portion near the root side of the palm portion. The fixing part is provided with a distal end stopper at the other end on the distal end side far from the palm part. The fixing part is mounted on a support body composed of the palm part and the supporting plate, and the other end on the distal end side is not Mounted on the support.

此外,本發明是前述手臂具有兩個以上的前述定位指部的基板搬送機器人。 Moreover, this invention is a board | substrate conveying robot with the said arm having two or more said positioning fingers.

本發明是前述石英板形成為多個石英構件被相互固定的基板搬送機器人。 The present invention is a substrate transfer robot in which the aforementioned quartz plate is formed by fixing a plurality of quartz members to each other.

本發明是前述支承板由氧化鋁構成的基板搬送機器人。 The present invention is a substrate transfer robot in which the support plate is made of alumina.

本發明是一種真空處理裝置,前述真空處理裝置具有搬送室、真空處理室,前述搬送室具有使可配置基板的手臂移動的基板搬送機器人、以及配置有前述基板搬送機器人的真空槽,前述真空處理室被連接於前述搬送室,對前述基板進行真空處理,前述手臂具有掌部和多根細長的指部,前述多根細長的指部被設置於前述掌部,可配置一片基板,多根前述指部中的至少一根前述指部是具有支承板、石英板的定位指部,前述支承板是根部部分被固定於前述掌部的細長的支承板,前述石英板是在前述支承板上 沿前述支承板而載置的細長的石英板,在前述石英板的兩端中的接近前述掌部的根部側的一端設置固定部,在距離前述掌部較遠的末端側的另一端設置末端側限位器,前述固定部被安裝於由前述掌部與前述支承板構成的支承體,末端側的前述另一端未被安裝於前述支承體,前述手臂具有兩個以上的前述定位指部。 The present invention is a vacuum processing apparatus including a transfer chamber and a vacuum processing chamber. The transfer chamber includes a substrate transfer robot that moves an arm on which a substrate can be disposed, and a vacuum tank in which the substrate transfer robot is disposed. The chamber is connected to the transfer chamber and vacuum-processes the substrate. The arm has a palm and a plurality of elongated fingers. The plurality of elongated fingers are provided on the palm. One substrate can be arranged. At least one of the fingers is a positioning finger having a support plate and a quartz plate. The support plate is an elongated support plate whose root portion is fixed to the palm. The quartz plate is on the support plate. An elongated quartz plate placed along the support plate is provided with a fixing portion at one end of the quartz plate near the root side of the palm portion, and an end at the other end of the distal end side far from the palm portion. In the side stopper, the fixing portion is mounted on a support body composed of the palm portion and the support plate, the other end on the tip side is not mounted on the support body, and the arm has two or more of the positioning finger portions.

本發明是如申請專利範圍第5項的真空處理裝置,前述手臂具有兩個以上的前述定位指部。 The present invention is the vacuum processing device according to item 5 of the patent application scope, wherein the arm has two or more positioning fingers.

本發明是前述石英板形成為多個石英構件被相互固定的真空處理裝置。 The present invention is a vacuum processing apparatus in which the aforementioned quartz plate is formed such that a plurality of quartz members are fixed to each other.

此外,本發明是前述支承板由氧化鋁構成的真空處理裝置。 The present invention is a vacuum processing apparatus in which the support plate is made of alumina.

在指部設置由石英構成的石英板,在石英板的末端設置有末端側限位器,因此末端側限位器之由熱膨脹導致的移動量變小,基板的定位變得準確。 A quartz plate made of quartz is provided at the finger portion, and an end-side stopper is provided at the end of the quartz plate. Therefore, the amount of movement of the end-side stopper due to thermal expansion becomes smaller, and the positioning of the substrate becomes accurate.

10‧‧‧真空處理裝置 10‧‧‧Vacuum processing equipment

16‧‧‧基板 16‧‧‧ substrate

20‧‧‧搬送機器人 20‧‧‧ transfer robot

21‧‧‧真空槽 21‧‧‧Vacuum tank

30‧‧‧支承體 30‧‧‧ support

34‧‧‧掌部 34‧‧‧ Palm

40‧‧‧手臂 40‧‧‧ arm

41‧‧‧支承板 41‧‧‧ support plate

42‧‧‧石英板 42‧‧‧Quartz Plate

421~423‧‧‧石英構件 42 1 ~ 42 3 ‧‧‧Quartz

50‧‧‧固定部 50‧‧‧Fixed section

51a~54a、51b~54b‧‧‧指部 51a ~ 54a, 51b ~ 54b‧‧‧finger

55‧‧‧定位指部 55‧‧‧ Positioning Finger

60‧‧‧連結部 60‧‧‧Connection Department

第1圖是用於對真空處理裝置進行說明的圖。 FIG. 1 is a diagram for explaining a vacuum processing apparatus.

第2圖是用於對搬送室進行說明的圖。 Fig. 2 is a diagram for explaining a transfer room.

第3圖是用於對基板搬送機器人進行說明的局部剖視圖。 FIG. 3 is a partial cross-sectional view for explaining a substrate transfer robot.

第4圖是該基板搬送機器人的立體圖。 FIG. 4 is a perspective view of the substrate transfer robot.

第5圖是手臂的俯視圖。 Figure 5 is a plan view of the arm.

第6圖是用於對將基板配置於該手臂的狀態進行說明的俯視圖。 FIG. 6 is a plan view for explaining a state in which a substrate is placed on the arm.

第7圖是用於對定位指部進行說明的局部剖視圖。 FIG. 7 is a partial cross-sectional view for explaining the positioning finger.

第8圖(a)是第5圖的I-I線剖切剖視圖,第8圖(b)是第5圖的II-II線剖切剖視圖,第8圖(c)是表示固定部的一個例子的剖視圖,第8圖(d)是用於對連結部進行說明的俯視圖。 Fig. 8 (a) is a sectional view taken along the line II in Fig. 5, Fig. 8 (b) is a sectional view taken along the line II-II in Fig. 5, and Fig. 8 (c) is an example of a fixing portion Sectional drawing, FIG.8 (d) is a top view for demonstrating a connection part.

第1圖是進行處理對象物的真空處理的真空處理裝置10,該真空處理裝置10具有搬送室11、多個真空處理室12、以及至少一台搬出搬入室13。 FIG. 1 is a vacuum processing apparatus 10 that performs vacuum processing of a processing object. The vacuum processing apparatus 10 includes a transfer chamber 11, a plurality of vacuum processing chambers 12, and at least one carry-in and carry-out chamber 13.

各真空處理室12與搬出搬入室13被配置於搬送室11的周圍,構成為可透過開閉閘閥,而將各真空處理室12的內部、搬出搬入室13的內部與搬送室11的內部連接或者隔斷。 Each of the vacuum processing chambers 12 and the loading / unloading chambers 13 are arranged around the transfer chambers 11 and are configured to allow the inside of each of the vacuum processing chambers 12 and the loading / unloading chambers 13 to be connected to the interior of the transfer chambers 11 through opening and closing gate valves. cut off.

如第2圖所示,搬送室11具有真空槽21、搬送機器人20。 As shown in FIG. 2, the transfer chamber 11 includes a vacuum tank 21 and a transfer robot 20.

第3圖是搬送機器人20的側面的放大圖,第4圖是立體圖。 FIG. 3 is an enlarged view of a side surface of the transfer robot 20, and FIG. 4 is a perspective view.

搬送機器人20具有手臂40、滑動板33、底座32、支柱部31。 The transfer robot 20 includes an arm 40, a slide plate 33, a base 32, and a pillar portion 31.

手臂40、滑動板33、底座32被配置於真空槽21的內部,支柱部31的下部被設置於真空槽21的外部,在支柱部31的真空槽21之內部的部分,從下方將底座32、滑動板33和手臂40按照該順序安裝。 The arm 40, the slide plate 33, and the base 32 are arranged inside the vacuum tank 21, and the lower part of the pillar part 31 is provided outside the vacuum tank 21, and the base 32 is placed in the vacuum tank 21 of the pillar part 31 from below The slide plate 33 and the arm 40 are mounted in this order.

真空排氣裝置14被連接於各室11~13的真空槽,使真空排氣裝置14動作來將各室11~13的內部真空排氣。真空排氣裝置14、搬送機器人20和下述馬達23的動作被控制裝置28控制。 The vacuum evacuation device 14 is connected to a vacuum tank of each of the chambers 11 to 13, and the vacuum evacuation device 14 is operated to evacuate the interior of each of the chambers 11 to 13. The operations of the vacuum evacuation device 14, the transfer robot 20, and the motor 23 described below are controlled by the control device 28.

底座32在支柱部31上以能夠旋轉以及升降的方式被設置。滑動板33被固定於底座32,若借助馬達23的動作,支柱部31的內部的旋轉軸旋轉,則滑動板33與底座32一起旋轉,另外,若旋轉軸上下地移動,則滑動板33與底座32一起上下地移動。 The base 32 is provided on the pillar portion 31 so as to be rotatable and liftable. The slide plate 33 is fixed to the base 32. When the rotation axis inside the pillar portion 31 is rotated by the operation of the motor 23, the slide plate 33 rotates together with the base 32, and if the rotation axis moves up and down, the slide plate 33 and The base 32 moves up and down together.

手臂40具有掌部34、被設置於掌部34的多個指部51a~54a、51b~54b。掌部34是金屬製的、或者是氧化鋁等陶瓷製的,指部51a~54a、51b~54b具有金屬製、或者氧化鋁等陶瓷製的構件。 The arm 40 includes a palm portion 34 and a plurality of fingers 51 a to 54 a and 51 b to 54 b provided on the palm portion 34. The palm portion 34 is made of metal or ceramic such as alumina, and the finger portions 51a to 54a and 51b to 54b include metal or ceramic members such as alumina.

滑動板33被水平地配置,在朝向上方的表面上設置有引導槽49。滑動板33呈長方形形狀,引導槽49呈直線狀,被設置成與滑動板33的長邊平行,另外,引導槽49被水平地配置。 The slide plate 33 is arranged horizontally, and a guide groove 49 is provided on a surface facing upward. The slide plate 33 has a rectangular shape, the guide groove 49 has a linear shape, and is provided parallel to the long side of the slide plate 33. The guide groove 49 is horizontally arranged.

掌部34被連接於被控制裝置28控制的未圖示的馬達,掌部34以該馬達進行動作從而能夠沿引導槽49延伸的方向移動的方式被安裝於引導槽49。 The palm portion 34 is connected to a motor (not shown) controlled by the control device 28, and the palm portion 34 is attached to the guide groove 49 so that the motor can move in a direction in which the guide groove 49 extends.

在該例中,設成當掌部34在滑動板33上水平地移動時,掌部34在水平面內直線移動。 In this example, it is assumed that when the palm portion 34 moves horizontally on the slide plate 33, the palm portion 34 moves linearly in the horizontal plane.

在掌部34中,設置有被水平地設置的多個指部51a~54a、51b~54b。在該例中,指部51a~54a、51b~54b全部以與掌部34的後述的前進移動以及後退移動的方向平行,且朝向相同方向的方式,相互分開地被設置。 The palm portion 34 is provided with a plurality of fingers 51 a to 54 a and 51 b to 54 b that are horizontally provided. In this example, all of the finger portions 51a to 54a and 51b to 54b are provided separately from each other so as to be parallel to the direction of forward movement and backward movement of the palm portion 34 and to the same direction.

多個指部51a~54a(這裡為4根)與其餘的多個指部51b~54b(這裡為4根)被設置成一方的多個為上層、另一方的多個為下層的2層。被配置於上層與下層中的一層的多個指部51a~54a與被配置於另一層的多個指部51b~54b能夠分別保持各自的基板。 The plurality of fingers 51 a to 54 a (here, four) and the remaining plurality of fingers 51 b to 54 b (here, four) are provided in two layers, one of which is an upper layer and the other of which is a lower layer. The plurality of finger portions 51 a to 54 a disposed on one of the upper and lower layers and the plurality of finger portions 51 b to 54 b disposed on the other layer can respectively hold the respective substrates.

上層的指部51a~54a被設置成彼此相同程度的高度,下層的指部51b~54b被設置成彼此相同程度的高度,分別可載置一片基板16。 Fingers 51a to 54a in the upper layer are set to the same height as each other, and fingers 51b to 54b in the lower layer are set to the same height as each other, and one substrate 16 can be placed on each.

第4、6圖的符號16表示被配置於手臂40的上層的指部51a~54a、或者下層的指部51b~54b的基板。 Reference numerals 16 in FIGS. 4 and 6 indicate substrates that are arranged on the upper fingers 51 a to 54 a or the lower fingers 51 b to 54 b on the arm 40.

這樣,在手臂40中,能夠分別在上層的指部51a~54a與下層的指部51b~54b中各配置一片基板16,因此,能夠在手臂40配置兩片基板16。若掌部34沿引導槽49前進移動或者後退移動,則手臂40、被配置於手臂40的基板16與掌部34以及指部51a~54a、51b~54b一同地前進移動或者後退移動。 In this way, in the arm 40, one substrate 16 can be disposed in each of the upper fingers 51a to 54a and the lower fingers 51b to 54b, and therefore, two substrates 16 can be disposed in the arm 40. When the palm portion 34 moves forward or backward along the guide groove 49, the arm 40 and the substrate 16 disposed on the arm 40 move forward or backward together with the palm portion 34 and the fingers 51a to 54a and 51b to 54b.

若使手臂40前進移動,則能夠使位於搬送室11內的手臂40向前工序的真空處理室12內移動。接著,使 手臂40在相對於前工序的真空處理室12的固定位置處靜止,將被配置於前工序的真空處理室12內的基板16載置於手臂40上。接下來,使手臂40後退移動,使手臂40移動至搬送室11內,使底座32旋轉從而改變手臂40的方向,若使手臂40前進移動,使基板16移動至後工序的真空處理室12內,並且在相對於後工序的真空處理室12的固定位置靜止,則能夠向後工序的真空處理室12內的工作臺上配置基板16。 When the arm 40 is moved forward, the arm 40 located in the transfer chamber 11 can be moved to the vacuum processing chamber 12 in the previous step. Then, make The arm 40 is stationary at a fixed position relative to the vacuum processing chamber 12 in the previous step, and the substrate 16 placed in the vacuum processing chamber 12 in the previous step is placed on the arm 40. Next, the arm 40 is moved backward, the arm 40 is moved into the transfer chamber 11, and the base 32 is rotated to change the direction of the arm 40. If the arm 40 is moved forward, the substrate 16 is moved to the vacuum processing chamber 12 in the subsequent process. Furthermore, the substrate 16 can be placed on a table in the vacuum processing chamber 12 in the subsequent step while being stationary at a fixed position relative to the vacuum processing chamber 12 in the subsequent step.

被配置於上層或者下層的任一個並且可配置相同的基板16的多個指部51a~54a或者指部51b~54b中的至少一根、最好是兩根以上的指部51a、53a、54a、51b、53b、54b如第5圖所示,具有細長的支承板41、被配置於支承板41上且由石英構成的細長的石英板42,若將這些具有支承板41與石英板42的指部51a、53a、54a、51b、53b、54b作為定位指部,則第7圖的符號55表示定位指部。其他的指部52a、52b具有平板狀的支承板43,在其上未設置石英板。 At least one of the plurality of fingers 51a to 54a or the fingers 51b to 54b, preferably two or more fingers 51a, 53a, and 54a, which are arranged on any one of the upper and lower layers and can arrange the same substrate 16 51b, 53b, and 54b have an elongated support plate 41 and an elongated quartz plate 42 made of quartz, which are arranged on the support plate 41, as shown in FIG. 5, and if these have the support plate 41 and the quartz plate 42, The finger portions 51a, 53a, 54a, 51b, 53b, and 54b serve as positioning finger portions, and the reference numeral 55 in FIG. 7 indicates the positioning finger portions. The other fingers 52a and 52b have a flat plate-shaped support plate 43 on which a quartz plate is not provided.

最好在多個指部51a~54a、51b~54b中位於端部的指部51a、51b、54a、54b設置石英板42,作為定位指部55。 Preferably, a quartz plate 42 is provided as the positioning finger portion 55 in the finger portions 51a, 51b, 54a, and 54b located at the ends of the plurality of finger portions 51a to 54a and 51b to 54b.

第7圖是定位指部55的側面的剖視圖,第8圖(a)是第5圖的定位指部55的I-I線剖切剖視圖。支承板41呈開口朝向上方的ㄇ字形形狀,長邊方向沿掌部34的前進移動以及後退移動的方向配置,石英板42將其長邊方向沿著支承板41的長邊方向配置於支承板41的底面上。構成ㄇ 字形形狀的一部分的兩個壁部分48形成為能夠與石英板42的側面接觸,在石英板42在壁方向上移動時,會與兩個壁部分48的任一個接觸,因此石英板42不會從支承板41上脫落。 FIG. 7 is a cross-sectional view of the side of the positioning finger 55, and FIG. 8 (a) is a cross-sectional view taken along the line I-I of the positioning finger 55 of FIG. The support plate 41 has a zigzag shape with an opening facing upward. The long side direction is arranged along the forward and backward movement directions of the palm portion 34. The quartz plate 42 is arranged on the support plate along the long side direction along the long side direction of the support plate 41. 41 on the underside. Make up The two wall portions 48 that are part of the zigzag shape are formed so as to be able to contact the side surface of the quartz plate 42. When the quartz plate 42 moves in the wall direction, it will come into contact with either of the two wall portions 48. Comes off from the support plate 41.

支承板41的兩端中的一端位於掌部34上或者掌部34的附近,另一端位於距離掌部34較遠的位置,石英板42借助後述的固定部50而被固定於支承板41中的掌部34側的一端,並且,距離掌部34較遠的部分未被固定。 One end of both ends of the support plate 41 is located on or near the palm portion 34, and the other end is located far from the palm portion 34. The quartz plate 42 is fixed to the support plate 41 by a fixing portion 50 described later. An end on the side of the palm 34, and a part farther from the palm 34 is not fixed.

因此,石英板42與支承板41相比熱膨脹性小,石英板42僅一端被限制。因此,構成為,在支承板41與石英板42被一同加熱、或者被一同冷卻從而支承板41相對於石英板42在長邊方向上伸縮時,被固定的部分以外的部分相對於支承板41滑動移動,因此,即使溫度上升或者下降以致支承板41伸縮,支承板41也會相對於石英板42偏移,石英板42也能維持與支承板41的伸縮前幾乎相同的長度。 Therefore, the quartz plate 42 has a smaller thermal expansion property than the support plate 41, and only one end of the quartz plate 42 is restricted. Therefore, when the support plate 41 and the quartz plate 42 are heated together or cooled together so that the support plate 41 expands and contracts in the longitudinal direction with respect to the quartz plate 42, portions other than the fixed portion are opposed to the support plate 41. Sliding movement, therefore, even if the temperature rises or falls so that the support plate 41 expands and contracts, the support plate 41 is offset from the quartz plate 42 and the quartz plate 42 can maintain almost the same length as before the expansion of the support plate 41.

第8圖(b)是第5圖的定位指部55的II-II線剖切剖視圖,在石英板42上,在多個位置處形成孔63,在各孔63內配置有軸承64。 FIG. 8B is a cross-sectional view taken along the line II-II of the positioning finger 55 in FIG. 5. Holes 63 are formed in the quartz plate 42 at a plurality of positions, and bearings 64 are arranged in the holes 63.

軸承64具有主體65、被配置於主體65的上端並且以能夠旋轉的方式被安裝於主體65的滾珠66,滾珠66被配置於比支承板41、石英板42高的位置,滾珠66的上端露出。 The bearing 64 includes a main body 65 and a ball 66 disposed on the upper end of the main body 65 and rotatably mounted on the main body 65. The ball 66 is disposed higher than the support plate 41 and the quartz plate 42. The upper end of the ball 66 is exposed. .

孔63是沿著長邊方向的長形孔,軸承64以主體65與支承板41接觸的方式被配置於支承板41上。 The hole 63 is an elongated hole along the longitudinal direction, and the bearing 64 is arranged on the support plate 41 so that the main body 65 contacts the support plate 41.

石英板42的孔63是沿指部(51a等)的長度方向的長形孔,構成為,在支承板41與石英板42被加熱或者冷卻而支承板41相對於石英板42伸縮時,軸承64與孔63的邊緣不接觸,即使支承板41與石英板42的位置偏移也不干擾。軸承64也能夠安裝於石英板42,但在強度上,以安裝於支承板41為佳。 The hole 63 of the quartz plate 42 is an elongated hole along the length direction of the finger (51a, etc.). When the support plate 41 and the quartz plate 42 are heated or cooled and the support plate 41 expands and contracts with respect to the quartz plate 42, the bearing 64 does not contact the edge of the hole 63, and does not interfere even if the positions of the support plate 41 and the quartz plate 42 are shifted. The bearing 64 can be attached to the quartz plate 42, but it is preferable to attach the bearing 64 to the support plate 41 in terms of strength.

軸承64也被配置於定位指部55以外的指部52a、52b,在可配置相同的基板16的指部51a~54a、51b~54b中所配置的軸承64的滾珠66的露出的上端被配置成相同的高度。 The bearing 64 is also arranged on the fingers 52 a and 52 b other than the positioning finger 55, and the exposed upper end of the ball 66 of the bearing 64 arranged on the fingers 51 a to 54 a and 51 b to 54 b of the same substrate 16 is arranged. Into the same height.

因此,在將基板16配置於手臂40上時,基板16的背面與滾珠66接觸。 Therefore, when the substrate 16 is placed on the arm 40, the back surface of the substrate 16 is in contact with the balls 66.

若對基板16施加水平方向的力,則滾珠66旋轉而基板16在滾珠66上滾動移動。因此,設成基板16與支承板41、石英板42不接觸,避免產生由滑動導致的灰塵、基板16的損傷。 When a horizontal force is applied to the substrate 16, the balls 66 rotate and the substrate 16 rolls on the balls 66. Therefore, it is assumed that the substrate 16 is not in contact with the support plate 41 and the quartz plate 42 to prevent dust and damage to the substrate 16 caused by sliding.

此外,在本實施例中使用的一片石英板42由多個細長的石英構件421~423構成,各石英構件421~423的長邊方向的中心軸線被配置在相同的直線上,各石英構件421~423以端部接觸的方式配置。 In addition, one quartz plate 42 used in this embodiment is composed of a plurality of elongated quartz members 42 1 to 42 3 , and the central axes of the long sides of each quartz member 42 1 to 42 3 are arranged on the same straight line. Each of the quartz members 42 1 to 42 3 is arranged so that the ends are in contact with each other.

多個石英構件421~423中的一個石英構件421位於最靠近掌部34的根部側,另一個石英構件423位於與根部側相反的末端側,其餘的一個或者多個石英構件422位於根部側與末端側的兩個石英構件421、423之間。 A plurality of quartz member quartz member 421 ~ 423 421 located closest to the root side of the palm portion 34, the other end of the quartz member 423 located on the side opposite to the base side, the remaining one or more of quartz member 42 2 is located between the two quartz members 42 1 and 42 3 on the root side and the tip side.

在多個石英構件421~423中相鄰的兩個石英構件421~423接觸的端部處,以相互嵌入的方式設置有連結部60,多個細長的石英構件421~423以多個石英構件421~423藉由連結部60連結的方式而形成一片石英板42。 At the end of 42 1 to 42 3 of the contact members adjacent to the plurality of quartz 42 1 to 42 3 two quartz member to engage in each other with a coupling portion is provided 60, a plurality of elongated quartz members 42 1 to 42 3 A plurality of quartz members 42 1 to 42 3 are connected by a connecting portion 60 to form a single quartz plate 42.

第8圖(d)是連結部60的放大俯視圖,這裡表示將中央的石英構件422與末端側的石英構件423連結的連結部60。在一方的石英構件423上形成的凸部67嵌入另一方的石英構件422的凹部37,從而構成連結部60。 Fig. 8 (d) is an enlarged plan view of the connecting portion 60. Here, the connecting portion 60 connecting the central quartz member 42 2 and the distal-side quartz member 42 3 is shown . Protrusions 67 fitted in the other of the quartz member is formed on one of the quartz member recess 423 37 422, which constitutes the connecting part 60.

掌部34與支承板41由金屬、氧化鋁等,與石英相比機械上的強度較高的材料構成,掌部34與支承板41借助螺絲45等被相互固定。 The palm portion 34 and the support plate 41 are made of a metal, alumina, or the like, which is a material having higher mechanical strength than quartz, and the palm portion 34 and the support plate 41 are fixed to each other by screws 45 or the like.

石英板42的根部的部分位於掌部34上或者支承板41上,在石英板42的根部的部分上,設置有將石英板42固定於支承板41的固定部50。固定部50被設置於位於根部的石英構件421The root portion of the quartz plate 42 is located on the palm portion 34 or the support plate 41. The root portion of the quartz plate 42 is provided with a fixing portion 50 that fixes the quartz plate 42 to the support plate 41. The fixing portion 50 is provided on the quartz member 42 1 located at the root portion.

若對固定部50進行說明,則如第7圖所示,在該例中,在石英板42上形成石英板側貫通孔46a,在支承板41上形成有與石英板側貫通孔46a連通的支承板側貫通孔46b,上部形成為凸緣狀的螺栓44將其下端插通於石英板側貫通孔46a與支承板側貫通孔46b,借助螺栓44、石英板側貫通孔46a與支承板側貫通孔46b,構成將石英板42與支承板41相互固定的固定部50。也可以將石英板42與掌部34相互固定地構成固定部50。 When the fixing portion 50 is described, as shown in FIG. 7, in this example, a quartz plate-side through hole 46 a is formed in the quartz plate 42, and a support plate 41 is formed to communicate with the quartz plate-side through hole 46 a. The support plate-side through hole 46b is formed with a flange-shaped bolt 44 at the upper portion, and its lower end is inserted into the quartz plate-side through hole 46a and the support plate-side through hole 46b. The through-hole 46b constitutes a fixing portion 50 that fixes the quartz plate 42 and the support plate 41 to each other. The quartz plate 42 and the palm portion 34 may be fixed to each other to form the fixing portion 50.

石英板42的掌部34側的一端借助固定部50被固定於支 承板41。 One end on the palm portion 34 side of the quartz plate 42 is fixed to the support via a fixing portion 50. Bearing plate 41.

固定部50也可以被設置於掌部34,另外,也可以將石英板42與支承板41利用夾緊件等夾住來固定。 The fixing portion 50 may be provided on the palm portion 34, or the quartz plate 42 and the support plate 41 may be clamped and fixed by a clamp or the like.

石英板42的掌部34側的一端既可以被固定於支承板41,或者也可以被固定於掌部34,因此,若將相互被固定的掌部34與支承板41稱為支承體30,則石英板42借助固定部50被固定於支承體30即可,石英板42的重量由支承體30支承。 The one end on the palm 34 side of the quartz plate 42 may be fixed to the support plate 41 or the palm 34. Therefore, if the palm 34 and the support plate 41 which are fixed to each other are referred to as the support body 30, The quartz plate 42 may be fixed to the support body 30 via the fixing portion 50, and the weight of the quartz plate 42 is supported by the support body 30.

從固定部50到石英板42的末端或者支承板41的末端,石英板42的底面與支承體30接觸,但石英板42的比固定部50靠末端側的部分未被固定於支承體30,支承板41與石英板42相互分離,在由於升溫以致支承板41比石英板42更長地伸長時,在與固定部50的位置為相反側的石英板42的末端側,支承板41與石英板42以各自的伸長量伸長。 From the fixed portion 50 to the end of the quartz plate 42 or the end of the support plate 41, the bottom surface of the quartz plate 42 is in contact with the support 30, but the portion of the quartz plate 42 on the distal side of the fixed portion 50 is not fixed to the support 30. The support plate 41 and the quartz plate 42 are separated from each other. When the support plate 41 is extended longer than the quartz plate 42 due to temperature rise, the support plate 41 and quartz are on the distal end side of the quartz plate 42 on the opposite side from the position of the fixing portion 50. The plates 42 are stretched by respective stretch amounts.

在石英板42的兩端中與固定部50為相反側的末端側,以會與被配置於指部51a~54a、51b~54b上的基板16的側面接觸的高度設置有末端側限位器56。 Of the two ends of the quartz plate 42, the end side opposite to the fixed portion 50 is provided at the end side stopper at a height that will contact the side surface of the substrate 16 disposed on the fingers 51a to 54a, 51b to 54b. 56.

當配置在指部51a~54a、51b~54b上的基板16向末端方向移動時,則其與末端側限位器56接觸並停止。 When the substrate 16 disposed on the fingers 51 a to 54 a and 51 b to 54 b moves in the distal direction, it comes into contact with the distal side stopper 56 and stops.

石英板42的熱膨脹係數是0.6×10-6/K,氧化鋁是7.2×10-6/K,被加熱時的支承板41的熱膨脹量與石英板42的熱膨脹量相比變大為10倍以上,若定位指部55被加熱,則在定位指部55的支承板41與石英板42中,支承板41 比石英板42更大幅地熱膨脹。 The thermal expansion coefficient of the quartz plate 42 is 0.6 × 10 -6 / K, and the alumina is 7.2 × 10 -6 / K. The thermal expansion amount of the support plate 41 when heated is 10 times larger than that of the quartz plate 42. As described above, when the positioning finger portion 55 is heated, the support plate 41 and the quartz plate 42 of the positioning finger portion 55 thermally expand more than the quartz plate 42.

石英板42與支承板41在固定部50以外的部分未被相互固定,因此,在支承板41與石英板42在固定部50處被相互固定的狀態下,支承板41的末端不受石英板42妨礙地延伸,支承板41的末端相對於真空槽21的位置大幅地變化。 The parts of the quartz plate 42 and the support plate 41 other than the fixing portion 50 are not fixed to each other. Therefore, in a state where the support plate 41 and the quartz plate 42 are fixed to each other at the fixing portion 50, the ends of the support plate 41 are not affected by the quartz plate. 42 extends obstructively, and the position of the end of the support plate 41 with respect to the vacuum tank 21 greatly changes.

石英板42由於加熱導致的延伸、由於冷卻導致的收縮與支承板41的伸縮相比是少量的,位於石英板42的末端的末端側限位器56之由加熱、冷卻導致的相對於真空槽21的位置的變化小。 The extension of the quartz plate 42 due to heating and the shrinkage due to cooling are small compared to the expansion and contraction of the support plate 41. The end-side stopper 56 located at the end of the quartz plate 42 is caused by heating and cooling relative to the vacuum tank The position of 21 is small.

當掌部34在真空槽21的內部相對於真空槽21被配置於相同的位置時,以相對於真空槽21的位置相同的方式將基板16多次配置於該掌部34的指部51a~54a、51b~54b上,此時,即使各指部51a~54a、51b~54b的溫度不同,基板16與支承板41的末端之間的位置關係差別大,基板16與末端側限位器56之間的位置關係也沒有大的差異。 When the palm portion 34 is disposed at the same position with respect to the vacuum tank 21 inside the vacuum tank 21, the substrate 16 is disposed at the fingers 51a of the palm portion 34 multiple times in the same manner as the position with respect to the vacuum tank 21. 54a, 51b to 54b, at this time, even if the temperatures of the fingers 51a to 54a, 51b to 54b are different, the positional relationship between the substrate 16 and the end of the support plate 41 is greatly different, and the substrate 16 and the end stopper 56 are different. There is no big difference between the positional relationships.

因此,即使多個指部51a~54a、51b~54b彼此的溫度不同,也能將配置於手臂40的基板16相對於末端側限位器56配置於相同的位置。 Therefore, even if the temperatures of the plurality of fingers 51 a to 54 a and 51 b to 54 b are different from each other, the substrate 16 disposed on the arm 40 can be disposed at the same position with respect to the end stopper 56.

第7圖的符號57是根部側限位器,位於配置在指部51a~54a、51b~54b上的基板16與掌部34之間。配置在指部51a~54a、51b~54b上的基板16若向根部側移動,則與根部側限位器接觸而停止,因此設成不會超過根部側限位 器57地移動。 Numeral 57 in FIG. 7 is a root-side stopper and is located between the base plate 16 and the palm portion 34 arranged on the finger portions 51 a to 54 a and 51 b to 54 b. When the substrate 16 arranged on the fingers 51a to 54a and 51b to 54b moves to the root side, it contacts the root side stopper and stops, so it is set so as not to exceed the root side limit 器 57 地 移。 The 57 ground.

此外,第5、6圖中的符號58是L字形形狀的輔助板,安裝於輔助板58的末端的側方限位器59被設成與基板16的四邊中與末端側限位器56和根部側限位器57分別接觸的邊不同的邊接觸,以免基板16朝向與移動方向垂直的方向移動。在第2、3、7圖中,省略輔助板58。 In addition, reference numeral 58 in FIGS. 5 and 6 is an L-shaped auxiliary board, and the side stoppers 59 attached to the ends of the auxiliary board 58 are provided to the four sides of the base plate 16 and the end side stoppers 56 and The sides of the root-side stopper 57 are in contact with each other to prevent the substrate 16 from moving in a direction perpendicular to the moving direction. In FIGS. 2, 3 and 7, the auxiliary plate 58 is omitted.

將根部側限位器57的安裝例在第8圖(c)中表示。根部側限位器57的構造與末端側限位器56的構造相同。 An example of mounting the root-side stopper 57 is shown in FIG. 8 (c). The structure of the root-side stopper 57 is the same as that of the tip-side stopper 56.

符號69是根部側限位器57的限位器主體,在該例中,限位器主體69上設置有多個定位孔72a、以及一個限位器長形孔68。在石英板42上設置有固定用貫通孔72b,在固定用貫通孔72b上配置有定位用的銷74。 Numeral 69 is a stopper body of the root-side stopper 57. In this example, the stopper body 69 is provided with a plurality of positioning holes 72a and one stopper elongated hole 68. The quartz plate 42 is provided with a fixing through-hole 72b, and a positioning pin 74 is arranged in the fixing through-hole 72b.

多個定位孔72a沿著限位器長形孔68延伸的方向配置,多個定位孔72a與限位器長形孔68形成為排列成一列。 The plurality of positioning holes 72a are arranged along a direction in which the stopper elongated hole 68 extends, and the plurality of positioning holes 72a and the stopper elongated hole 68 are formed in a line.

以在固定用貫通孔72b上突出的銷74的上部插入多個定位孔72a中所希望的定位孔72a的方式,將限位器主體69載置於石英板42。若改變銷74的上部所插入的定位孔72a,則能夠改變限位器主體69的位置。 The stopper body 69 is placed on the quartz plate 42 so that a desired positioning hole 72a of the plurality of positioning holes 72a is inserted into the upper portion of the pin 74 protruding from the fixing through-hole 72b. When the positioning hole 72a inserted in the upper part of the pin 74 is changed, the position of the stopper body 69 can be changed.

在限位器主體69上形成有限位器長形孔68,在與限位器長形孔68連通的位置的石英板42的部分形成有石英板長形孔62a。 A stopper elongated hole 68 is formed in the stopper body 69, and a quartz plate elongated hole 62a is formed in a portion of the quartz plate 42 at a position communicating with the stopper elongated hole 68.

在位於石英板長形孔62a的下方的支承板41上,在與 石英板長形孔62a連通的部位形成有支承板細孔62b。 On the support plate 41 located below the quartz plate elongated hole 62a, A support plate fine hole 62b is formed at a portion where the quartz plate elongated hole 62a communicates.

在連通的限位器長形孔68與石英板長形孔62a處,插通有上部形成為凸緣狀的螺栓61的棒狀的部分,其較細的下端插入支承板細孔62b中。 A rod-shaped portion of a bolt 61 formed as a flange at the upper portion is inserted into the elongated hole 68 of the stopper and the elongated hole 62a of the quartz plate which are communicated with each other.

螺栓61的棒狀的部分當中比支承板細孔62b更靠上方的部分位於石英板長形孔62a的內部與限位器長形孔68的內部,凸緣狀的部分位於限位器長形孔68的內部。 The rod-shaped portion of the bolt 61 is located above the support plate pore 62b and is located inside the quartz plate elongated hole 62a and the stopper elongated hole 68, and the flange-shaped portion is located in the stopper elongated The inside of the hole 68.

螺栓61的凸緣狀的部分的側面設成能與限位器主體69的限位器長形孔68的內圓周面接觸。借助銷74與螺栓61,限位器主體69被固定於石英板42。 The side surface of the flange-shaped portion of the bolt 61 is provided so as to be in contact with the inner circumferential surface of the stopper elongated hole 68 of the stopper body 69. The stopper body 69 is fixed to the quartz plate 42 by the pin 74 and the bolt 61.

就在限位器主體上形成有定位孔與限位器長形孔68並利用銷與螺栓固定於石英板42這點而言,末端側限位器56是相同的。 The end stopper 56 is the same in that the stopper body has a positioning hole and a stopper elongated hole 68 and is fixed to the quartz plate 42 with a pin and a bolt.

16‧‧‧基板 16‧‧‧ substrate

30‧‧‧支承體 30‧‧‧ support

34‧‧‧掌部 34‧‧‧ Palm

41‧‧‧支承板 41‧‧‧ support plate

40‧‧‧手臂 40‧‧‧ arm

42‧‧‧石英板 42‧‧‧Quartz Plate

421~423‧‧‧石英構件 42 1 ~ 42 3 ‧‧‧Quartz

43‧‧‧支承板 43‧‧‧ support plate

45‧‧‧螺絲 45‧‧‧screw

50‧‧‧固定部 50‧‧‧Fixed section

51a~54a‧‧‧指部 51a ~ 54a‧‧‧finger

51b~54b‧‧‧指部 51b ~ 54b‧‧‧finger

55‧‧‧定位指部 55‧‧‧ Positioning Finger

56‧‧‧末端側限位器 56‧‧‧ end stop

57‧‧‧根部側限位器 57‧‧‧ Root side stopper

58‧‧‧輔助板 58‧‧‧Auxiliary board

59‧‧‧側方限位器 59‧‧‧side stopper

60‧‧‧連結部 60‧‧‧Connection Department

64‧‧‧軸承 64‧‧‧bearing

Claims (8)

一種基板搬送機器人,是使可配置基板的手臂移動的基板搬送機器人,其特徵在於:前述手臂具有:掌部;和多根細長的指部,前述多根細長的指部被設置於前述掌部,可配置一片基板,多根前述指部中的至少一根前述指部是具有支承板、石英板的定位指部,前述支承板是根部部分被固定於前述掌部的細長的支承板,前述石英板是在前述支承板上沿前述支承板而載置的細長的石英板,在前述石英板的兩端中接近前述掌部的根部側的一端設置固定部,在距離前述掌部較遠的末端側的另一端設置末端側限位器,前述固定部被安裝於由前述掌部與前述支承板構成的支承體,末端側的前述另一端未被安裝於前述支承體。 A substrate transfer robot is a substrate transfer robot that moves an arm on which a substrate can be arranged, characterized in that the arm has: a palm portion; and a plurality of elongated finger portions, and the plurality of elongated finger portions are provided on the palm portion A substrate can be arranged. At least one of the plurality of fingers is a positioning finger with a support plate and a quartz plate. The support plate is an elongated support plate whose root portion is fixed to the palm. The quartz plate is an elongated quartz plate placed along the support plate on the support plate, and a fixing portion is provided on one end of the quartz plate near the root side of the palm portion, and is farther from the palm portion. A distal end stopper is provided on the other end of the distal end side, the fixing portion is mounted on a support body composed of the palm portion and the support plate, and the other end on the distal end side is not mounted on the support body. 如申請專利範圍第1項的基板搬送機器人,其中,前述手臂具有兩個以上的前述定位指部。 For example, the substrate transfer robot according to the first patent application scope, wherein the arm has two or more positioning fingers. 如申請專利範圍第1或2項的基板搬送機器人,其中,前述石英板形成為多個石英構件被相互固定。 For example, the substrate transfer robot according to item 1 or 2 of the patent application scope, wherein the quartz plate is formed so that a plurality of quartz members are fixed to each other. 如申請專利範圍第1至3項任一項的基板搬送機器人, 其中,前述支承板由氧化鋁構成。 If the substrate transfer robot of any one of the scope of patent application is applied, The support plate is made of alumina. 一種真空處理裝置,其特徵為具有搬送室、真空處理室,前述搬送室具有使可配置基板的手臂移動的基板搬送機器人、以及配置有前述基板搬送機器人的真空槽,前述真空處理室被連接於前述搬送室,對前述基板進行真空處理,前述手臂具有掌部和多根細長的指部,前述多根細長的指部被設置於前述掌部,可配置一片基板,多根前述指部中的至少一根前述指部是具有支承板、石英板的定位指部,前述支承板是根部部分被固定於前述掌部的細長的支承板,前述石英板是在前述支承板上沿前述支承板而載置的細長的石英板,在前述石英板的兩端中接近前述掌部的根部側的一端設置固定部,在距離前述掌部較遠的末端側的另一端設置末端側限位器,前述固定部被安裝於由前述掌部與前述支承板構成的支承體,末端側的前述另一端未被安裝於前述支承體,前述手臂具有兩個以上的前述定位指部。 A vacuum processing apparatus is characterized by having a transfer chamber, a vacuum processing chamber, the transfer chamber includes a substrate transfer robot that moves an arm on which a substrate can be arranged, and a vacuum tank that is configured with the substrate transfer robot, and the vacuum processing chamber is connected to The transfer chamber vacuum-processes the substrate. The arm has a palm and a plurality of elongated fingers. The plurality of elongated fingers are provided on the palm. One substrate can be arranged. At least one of the fingers is a positioning finger having a support plate and a quartz plate. The support plate is an elongated support plate whose root portion is fixed to the palm portion. The quartz plate is along the support plate on the support plate. A long and narrow quartz plate is placed, a fixed portion is provided on one end of the quartz plate near the root side of the palm portion, and an end stopper is provided on the other end of the distal end side far from the palm portion. The fixing portion is attached to a support body composed of the palm portion and the support plate, and the other end on the distal end side is not attached to the support body. Said arm having at least two fingers of the positioning. 如申請專利範圍第5項的真空處理裝置,其中,前述手臂具有兩個以上的前述定位指部。 For example, the vacuum processing apparatus according to claim 5 in which the arm has two or more positioning fingers. 如申請專利範圍第5或6項的真空處理裝置,其中,前述石英板形成為多個石英構件被相互固定。 For example, the vacuum processing apparatus according to claim 5 or 6, wherein the aforementioned quartz plate is formed such that a plurality of quartz members are fixed to each other. 如申請專利範圍第5至7項任一項的真空處理裝置,其中,前述支承板由氧化鋁構成。 The vacuum processing apparatus according to any one of claims 5 to 7, wherein the support plate is made of alumina.
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