CN107636774B - 导电材料及连接结构体 - Google Patents

导电材料及连接结构体 Download PDF

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Publication number
CN107636774B
CN107636774B CN201680033297.9A CN201680033297A CN107636774B CN 107636774 B CN107636774 B CN 107636774B CN 201680033297 A CN201680033297 A CN 201680033297A CN 107636774 B CN107636774 B CN 107636774B
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China
Prior art keywords
solder
electrode
conductive
conductive material
particles
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CN201680033297.9A
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English (en)
Chinese (zh)
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CN107636774A (zh
Inventor
定永周治郎
永田麻衣
伊藤将大
久保田敬士
石泽英亮
夏井宏
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Publication of CN107636774A publication Critical patent/CN107636774A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201680033297.9A 2015-08-24 2016-08-23 导电材料及连接结构体 Active CN107636774B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-165214 2015-08-24
JP2015165214 2015-08-24
PCT/JP2016/074532 WO2017033935A1 (ja) 2015-08-24 2016-08-23 導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
CN107636774A CN107636774A (zh) 2018-01-26
CN107636774B true CN107636774B (zh) 2020-11-06

Family

ID=58100133

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680033297.9A Active CN107636774B (zh) 2015-08-24 2016-08-23 导电材料及连接结构体

Country Status (5)

Country Link
JP (1) JP6798887B2 (ko)
KR (1) KR102605942B1 (ko)
CN (1) CN107636774B (ko)
TW (1) TWI686820B (ko)
WO (1) WO2017033935A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6581434B2 (ja) * 2015-08-24 2019-09-25 積水化学工業株式会社 導電材料及び接続構造体
US11101052B2 (en) 2016-10-06 2021-08-24 Sekisui Chemical Co., Ltd. Conductive material, connection structure and method for producing connection structure
JP6767307B2 (ja) * 2017-05-22 2020-10-14 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2019156964A (ja) 2018-03-13 2019-09-19 パナソニックＩｐマネジメント株式会社 樹脂組成物およびこれを含む異方導電性フィルム、並びに電子装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142271A (ja) * 2010-12-14 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2013149610A (ja) * 2011-12-20 2013-08-01 Sekisui Chem Co Ltd 電子部品接続材料及び接続構造体
JP2015026606A (ja) * 2013-06-20 2015-02-05 積水化学工業株式会社 導電材料及び接続構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
KR20090045195A (ko) 2006-08-25 2009-05-07 스미토모 베이클리트 컴퍼니 리미티드 접착 테이프, 접합체 및 반도체 패키지
CN102484326B (zh) * 2009-08-26 2014-12-10 积水化学工业株式会社 各向异性导电材料、连接结构体及连接结构体的制造方法
WO2013125517A1 (ja) * 2012-02-21 2013-08-29 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP5746797B1 (ja) * 2013-09-05 2015-07-08 積水化学工業株式会社 硬化性組成物及び接続構造体
WO2015056754A1 (ja) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142271A (ja) * 2010-12-14 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2013149610A (ja) * 2011-12-20 2013-08-01 Sekisui Chem Co Ltd 電子部品接続材料及び接続構造体
JP2015026606A (ja) * 2013-06-20 2015-02-05 積水化学工業株式会社 導電材料及び接続構造体

Also Published As

Publication number Publication date
JPWO2017033935A1 (ja) 2018-06-07
JP6798887B2 (ja) 2020-12-09
KR20180043193A (ko) 2018-04-27
TWI686820B (zh) 2020-03-01
CN107636774A (zh) 2018-01-26
KR102605942B1 (ko) 2023-11-27
TW201721664A (zh) 2017-06-16
WO2017033935A1 (ja) 2017-03-02

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