CN107632294A - The preparation method of portable TR component testers - Google Patents
The preparation method of portable TR component testers Download PDFInfo
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- CN107632294A CN107632294A CN201710799033.0A CN201710799033A CN107632294A CN 107632294 A CN107632294 A CN 107632294A CN 201710799033 A CN201710799033 A CN 201710799033A CN 107632294 A CN107632294 A CN 107632294A
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- component
- eutectic
- circuit board
- preparation
- portable
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Abstract
The invention discloses a kind of preparation method of portable TR component testers, including：Step 1, signal source circuit module is made；Step 2, receiving front-end circuit module is made；Step 3, amplifier circuit module is made；Step 4, complete final assembly and carry out performance test.The preparation method of the portable TR component testers, which overcomes radar system in the prior art, accurately to be judged the quality of each TR components, often there is phenomena such as erroneous judgement, misjudgement, cause the TR component depot repair that attendant holds, bad TR components cannot get on-call maintenance, the problem of wasting substantial amounts of maintenance time.
Description
Technical field
The present invention relates to the preparation method field of tester, in particular it relates to a kind of system of portable TR component testers
Make method.
Background technology
AESA is an emphasis direction of radar development, and Connectors for Active Phased Array Radar is built with substantial amounts of TR components
(transmitting-receiving subassembly), traditional independent transmitter and receiver is replaced with it.The antenna of Connectors for Active Phased Array Radar is by putting down
Face formation into, and each face battle array is exactly to be made up of substantial amounts of TR components.Connectors for Active Phased Array Radar TR components in use
Damage is inevitable, and because TR component counts are numerous, system complex etc., radar system can not be to the quality of each TR components
Accurately judged phenomena such as erroneous judgement, misjudgement often occur, the TR component depot repair for causing attendant to hold is bad
TR components cannot get on-call maintenance, cause to waste substantial amounts of maintenance time.How rapidly to judge the good of TR components or
It is bad, turn into the key of problem, for the above situation, therefore the detection to TR components is into current urgent problem.
Therefore it provides one kind can produce can be with quick detection TR components the problem of, attendant's accurate judgement is helped
The state of TR components, this can save substantial amounts of maintenance time, and the detector produced is simple in construction, in light weight, and it is easy to carry,
It is simple to operate, the problem of preparation method of portable TR component testers easy to maintenance is urgent need to resolve of the present invention.
The content of the invention
, can be with quick detection TR components it is an object of the invention to provide a kind of can produce for above-mentioned technical problem
Problem, the state of attendant's accurate judgement TR components is helped, this can save substantial amounts of maintenance time, and the detector produced
Simple in construction, in light weight, it is easy to carry, simple to operate, the preparation method of portable TR component testers easy to maintenance.
To achieve these goals, the invention provides a kind of preparation method of portable TR component testers, the system
Include as method：Step 1, signal source circuit module is made：First respectively make control board, direct current tie line plate and
Radio frequency circuit board；Then the control board made, radio frequency circuit board and direct current tie line plate are attached by screws to
In housing, and three pieces of circuit boards are electrically connected using wire, are finally cleaned and dried；Step 2, making connects
Receive front-end circuit module：Front radio-frequency circuit unit is made first, then makes front-end controlling circuit, finally by the front radio-frequency
Circuit unit and the front-end controlling circuit component distinguish Denso in cavity, are electrically connected both using wire；Step
3, make amplifier circuit module：Power amplifier circuit board is made first, is then sintered together power amplifier circuit board and copper base, then
By being sintered in power amplifier circuit board for power amplifier component, amplifier power supply circuit board element and eutectic component, finally by work(
Circuit board, amplifier power supply circuit board and cavity parting bead is put to be installed in housing；Step 4, final assembly and progressive are completed
Can test.
Preferably, also include making eutectic component in step 3：Cut and eutectic chip size size identical gold tin first
Weld tabs, it is 290-300 DEG C by eutectic platform temperature setting, then golden soldering piece is placed on carrier, and be together placed on eutectic platform
Upper heating, when to wait golden soldering piece be in molten condition, eutectic chip is placed on carrier, so as to which eutectic chip be welded on carrier
Eutectic component is obtained together.
Preferably, rubbed when eutectic chip is placed on carrier, it is necessary to grip eutectic chip both sides on the golden soldering piece
25-30s is wiped, and allows its gas to discharge, it is necessary to press eutectic chip corner in manufacturing process.
Preferably, during power amplifier circuit board and copper base being sintered together in the step 3 use 217 DEG C of models
OM338 soldering paste, and it is 235-245 DEG C to sinter the platform temperature needed.
Preferably, power amplifier component, amplifier power supply circuit board element and eutectic component are sintered to power amplifier electricity
Using 183 DEG C of model CR37 solder(ing) paste on the plate of road, and it is 195-205 DEG C to sinter the platform temperature needed.
Preferably, also need to 7 feedthrough capacitors and 2 SMA connectors being installed in housing in the step 3.
Preferably, the composition of the golden soldering piece is：80% Au and 20%Sn.
According to above-mentioned technical proposal, the preparation method of portable TR component testers provided by the invention is in use
Firstly the need of signal source circuit module is made, make the template and also need to make control board, direct current tie line plate respectively
And radio frequency circuit board, then this three pieces of circuit boards are electrically connected；Followed by receiving front-end circuit mould is made respectively
Block and amplifier circuit module；Finally by the signal source circuit module above made, receiving front-end circuit module and amplifier electricity
Road module completes final assembly and carries out performance test.The preparation method of portable TR component testers provided by the invention can
With produce can quick detection TR components the problem of, help attendant's accurate judgement TR components state, this can be saved greatly
The maintenance time of amount, and the detector produced is simple in construction, in light weight, it is easy to carry, simple to operate, easy to maintenance.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Brief description of the drawings
Accompanying drawing is for providing a further understanding of the present invention, and a part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the preparation method of the portable TR component testers provided in a kind of preferred embodiment of the present invention
FB(flow block)
Fig. 2 is in the preparation method of the portable TR component testers provided in a kind of preferred embodiment of the present invention
The assembling schematic diagram of power amplifier circuit board, amplifier power supply circuit board and cavity parting bead；
Fig. 3 is the preparation method system of the portable TR component testers provided in a kind of preferred embodiment of the present invention
The structural representation for the portable TR component testers made.
Embodiment
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
To the description of reference numerals in Fig. 2 in the present invention：1 housing；2 power control circuit boards；3 feedthrough capacitors；4 amplifiers
Circuit board；5 radio frequency connectors；6 cavity parting beads.
As Figure 1-3, the invention provides a kind of preparation method of portable TR component testers, the preparation method
Including：Step 1, signal source circuit module is made：Make control board, direct current tie line plate and radio frequency electrical respectively first
Road plate；Then the control board made, radio frequency circuit board and direct current tie line plate are attached by screws in housing,
And three pieces of circuit boards are electrically connected using wire, is finally cleaned and is dried；Step 2, receiving front-end is made
Circuit module：Front radio-frequency circuit unit is made first, then makes front-end controlling circuit, finally by the front radio-frequency circuit group
Part and the front-end controlling circuit component distinguish Denso in cavity, are electrically connected both using wire；Step 3, make
Amplifier circuit module：Power amplifier circuit board is made first, is then sintered together power amplifier circuit board and copper base, then by power amplifier
Circuit components, amplifier power supply circuit board element and eutectic component are sintered in power amplifier circuit board, finally by power amplifier
Plate, amplifier power supply circuit board and cavity parting bead are installed in housing；Step 4, complete final assembly and carry out performance test.
According to above-mentioned technical proposal, the preparation method of portable TR component testers provided by the invention is in use
Firstly the need of signal source circuit module is made, make the template and also need to make control board, direct current tie line plate respectively
And radio frequency circuit board, then this three pieces of circuit boards are electrically connected；Followed by receiving front-end circuit mould is made respectively
Block and amplifier circuit module；Finally by the signal source circuit module above made, receiving front-end circuit module and amplifier electricity
Road module completes final assembly and carries out performance test.The preparation method of portable TR component testers provided by the invention can
With produce can quick detection TR components the problem of, help attendant's accurate judgement TR components state, this can be saved greatly
The maintenance time of amount, and the detector produced is simple in construction, in light weight, it is easy to carry, simple to operate, easy to maintenance.
Also include making eutectic component in a kind of preferred embodiment of the present invention, in step 3：Cut first together
Brilliant chip size size identical gold soldering piece, it is 290-300 DEG C by eutectic platform temperature setting, golden soldering piece is then placed on load
On body, and together it is placed on eutectic platform and heats, when to wait golden soldering piece be in molten condition, eutectic chip is placed on carrier, from
And weld together to obtain eutectic component by eutectic chip and carrier, heretofore described carrier uses WCu carriers,
In a kind of preferred embodiment of the present invention, it is necessary to grip eutectic core when eutectic chip is placed on carrier
Piece both sides rub 25-30s on the golden soldering piece, and, it is necessary to which pressing eutectic chip corner allows its gas in manufacturing process
Discharge, can so improve penetration rate, so as to improve the quality of eutectic component.
In a kind of preferred embodiment of the present invention, power amplifier circuit board and copper base are sintered in the step 3
Using 217 DEG C of model OM338 soldering paste during together, and it is 235-245 DEG C to sinter the platform temperature needed, in circuit board
A thin layer of solder(ing) paste is coated on the back side, solder(ing) paste coating should be uniform, smooth.
In a kind of preferred embodiment of the present invention, by power amplifier component, amplifier power supply circuit board element
And eutectic component is sintered to using 183 DEG C of model CR37 solder(ing) paste in power amplifier circuit board, and sinter the platform temperature needed
Spend for 195-205 DEG C.
Such as Fig. 2 depicted, in a kind of preferred embodiment of the present invention, also needed to 7 punching electricity in the step 3
Hold and 2 SMA connectors are installed in housing.
In a kind of preferred embodiment of the present invention, the composition of the golden soldering piece is：80% Au and 20%Sn,
The making qualification rate of eutectic component can be improved.
First by power chip eutectic to WCu carriers in the present invention, then carrier module is bonded by solder paste attachment mode
Onto copper base, and copper base bonds together with circuit board, so not only increases the radiating effect of power chip, also carries
The high reliability of bonding；The technique that component attachment is combined using silk-screen printing and Semi-automatic dispenser dispensing, both ensured
The uniformity and reliability of component attachment, meet stability, the quality conformance requirement of manufacture craft again, while can also
Meet user's small lot supply of material demand.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, still, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, a variety of letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (7)
1. a kind of preparation method of portable TR component testers, it is characterised in that the preparation method includes：
Step 1, signal source circuit module is made：Make control board, direct current tie line plate and radio frequency electrical respectively first
Road plate；Then the control board made, radio frequency circuit board and direct current tie line plate are attached by screws in housing,
And three pieces of circuit boards are electrically connected using wire, is finally cleaned and is dried；
Step 2, receiving front-end circuit module is made：Front radio-frequency circuit unit is made first, then makes front-end controlling circuit, most
The front radio-frequency circuit unit and the front-end controlling circuit component are distinguished into Denso in cavity afterwards, utilize wire to incite somebody to action both
It is electrically connected；
Step 3, amplifier circuit module is made：Power amplifier circuit board is made first, then sinters power amplifier circuit board and copper base
Together, being sintered in power amplifier circuit board then by power amplifier component, amplifier power supply circuit board element and eutectic component,
Finally power amplifier circuit board, amplifier power supply circuit board and cavity parting bead are installed in housing；
Step 4, complete final assembly and carry out performance test.
2. the preparation method of portable TR component testers according to claim 1, it is characterised in that also wrapped in step 3
Include and make eutectic component：Cutting and eutectic chip size size identical gold soldering piece first, it is by eutectic platform temperature setting
290-300 DEG C, then golden soldering piece is placed on carrier, and is together placed on eutectic platform and heats, wait golden soldering piece in melting
During state, eutectic chip is placed on carrier, so as to weld together to obtain eutectic component eutectic chip and carrier.
3. the preparation method of portable TR component testers according to claim 2, it is characterised in that put eutectic chip
Rubbed when on carrier, it is necessary to grip eutectic chip both sides on the golden soldering piece 25-30s, and in manufacturing process, it is necessary to
Pressing eutectic chip corner allows its gas to discharge.
4. the preparation method of portable TR component testers according to claim 2, it is characterised in that in the step 3
Using 217 DEG C of model OM338 soldering paste during power amplifier circuit board and copper base are sintered together, and sinter the flat of needs
Platform temperature is 235-245 DEG C.
5. the preparation method of portable TR component testers according to claim 3, it is characterised in that by power amplifier member
Device, amplifier power supply circuit board element and eutectic component are sintered in power amplifier circuit board using 183 DEG C of model CR37's
Solder(ing) paste, and it is 195-205 DEG C to sinter the platform temperature needed.
6. the preparation method of portable TR component testers according to claim 2, it is characterised in that in the step 3
Also need to 7 feedthrough capacitors and 2 SMA connectors being installed in housing.
7. the preparation method of portable TR component testers according to claim 2, it is characterised in that the golden soldering piece
Composition be：80% Au and 20%Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710799033.0A CN107632294A (en) | 2017-09-07 | 2017-09-07 | The preparation method of portable TR component testers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710799033.0A CN107632294A (en) | 2017-09-07 | 2017-09-07 | The preparation method of portable TR component testers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107632294A true CN107632294A (en) | 2018-01-26 |
Family
ID=61100215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710799033.0A Pending CN107632294A (en) | 2017-09-07 | 2017-09-07 | The preparation method of portable TR component testers |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090076389A1 (en) * | 2007-07-09 | 2009-03-19 | Yuanwei Jin | Imaging by time reversal beamforming |
| CN205003278U (en) * | 2015-09-22 | 2016-01-27 | 安徽华东光电技术研究所 | Special detector of portable S wave band TR subassembly |
| CN205452505U (en) * | 2016-03-17 | 2016-08-10 | 南京信息职业技术学院 | S-band 3-path power combiner |
| CN106443211A (en) * | 2016-07-29 | 2017-02-22 | 西安空间无线电技术研究所 | Integrated correcting system and correcting method applied to different active array antennas |
| CN206020654U (en) * | 2016-08-30 | 2017-03-15 | 安徽华东光电技术研究所 | T/R receiving front-end module structures |
| CN106572607A (en) * | 2016-06-23 | 2017-04-19 | 安徽华东光电技术研究所 | Process manufacturing method of solid-state microwave source |
| CN107085204A (en) * | 2017-03-31 | 2017-08-22 | 西安电子工程研究所 | A kind of phased-array radar receives multichannel sensitivity test method |
| CN107104743A (en) * | 2017-05-23 | 2017-08-29 | 中国电子科技集团公司第四十研究所 | A kind of frequency conversion T/R component inter-channel phase consistency testing systems and method |
-
2017
- 2017-09-07 CN CN201710799033.0A patent/CN107632294A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090076389A1 (en) * | 2007-07-09 | 2009-03-19 | Yuanwei Jin | Imaging by time reversal beamforming |
| CN205003278U (en) * | 2015-09-22 | 2016-01-27 | 安徽华东光电技术研究所 | Special detector of portable S wave band TR subassembly |
| CN205452505U (en) * | 2016-03-17 | 2016-08-10 | 南京信息职业技术学院 | S-band 3-path power combiner |
| CN106572607A (en) * | 2016-06-23 | 2017-04-19 | 安徽华东光电技术研究所 | Process manufacturing method of solid-state microwave source |
| CN106443211A (en) * | 2016-07-29 | 2017-02-22 | 西安空间无线电技术研究所 | Integrated correcting system and correcting method applied to different active array antennas |
| CN206020654U (en) * | 2016-08-30 | 2017-03-15 | 安徽华东光电技术研究所 | T/R receiving front-end module structures |
| CN107085204A (en) * | 2017-03-31 | 2017-08-22 | 西安电子工程研究所 | A kind of phased-array radar receives multichannel sensitivity test method |
| CN107104743A (en) * | 2017-05-23 | 2017-08-29 | 中国电子科技集团公司第四十研究所 | A kind of frequency conversion T/R component inter-channel phase consistency testing systems and method |
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Application publication date: 20180126 |
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| RJ01 | Rejection of invention patent application after publication |