CN106658983A - Manufacturing process of L-band 4-watt high-gain broadband power amplifier - Google Patents
Manufacturing process of L-band 4-watt high-gain broadband power amplifier Download PDFInfo
- Publication number
- CN106658983A CN106658983A CN201611203390.8A CN201611203390A CN106658983A CN 106658983 A CN106658983 A CN 106658983A CN 201611203390 A CN201611203390 A CN 201611203390A CN 106658983 A CN106658983 A CN 106658983A
- Authority
- CN
- China
- Prior art keywords
- circuit boards
- rogers
- rogers circuit
- base plate
- manufacture craft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing process of an L-band 4-watt high-gain broadband power amplifier, which comprises the following steps: step 1, sintering a component on a Rogers circuit board; step 2, sintering the Rogers circuit board with the mounted components on a bottom plate; and 3, debugging, testing and marking the assembled component. The manufacturing process is scientific and simple, and the produced product has high qualification rate and is easy to master.
Description
Technical field
The present invention relates to microwave module makes processing technology, in particular it relates to 4 watts of high-gain broadband power amplifications of L-band
The manufacture craft of device.
Background technology
Radio-frequency power amplifier has in the systems such as radar, radio communication, navigation, satellite communication, countermeasures set
It is widely applied, is the key equipment of Modern wireless communication.
In Connectors for Active Phased Array Radar, microwave power amplifier plays important role.The weight of Connectors for Active Phased Array Radar
Part is wanted to be T/R components, T/R components are one of deciding factors of system cost height, and the quality of its performance will affect
The technique and tactics index such as ability of discovery, operating distance of phased array radar system.On the one hand require there is height in the design of T/R components
Power, while also require that small volume, lightweight, reliability be high, cost is low, and microwave power amplifier is used as T/R components
Important component part, directly determines above-mentioned technical parameter.In the communications, microwave power amplifier is widely used in small-power or low number
According to rate terminal；In electronic warfare, Microwave Power Amplifier can be made into active decoy, it is to avoid aircraft is by missile attack.In a word, needing to micro-
Ripple signal carries out all be unableing to do without microwave power amplifier during the equipment of power amplification is constituted.The development of microwave device and microwave technology
It is the two big factors for promoting microwave solid-state power amplifier development, the development of microwave device makes sending out for microwave solid-state power amplifier
Exhibition is possibly realized, and the development of microwave technology is improved the performance of microwave solid-state power amplifier.
Therefore, urgent need will provide a kind of technological process science, simplicity, and the product percent of pass of production is high, the L-band easily grasped
The manufacture craft of 4 watts of high-gain broadband power amplifiers.
The content of the invention
It is an object of the invention to provide a kind of manufacture craft of 4 watts of high-gain broadband power amplifiers of L-band, the making work
Skill flow process science, simplicity, the product percent of pass of production is high, and is easily mastered.
To achieve these goals, the invention provides a kind of making work of 4 watts of high-gain broadband power amplifiers of L-band
Skill, including：
Step 1, components and parts are sintered on Rogers circuit boards；
Step 2, the Rogers circuit boards for installing components and parts are sintered on base plate；
Step 3, the component to installing are debugged, tested, mark.
Preferably, step 1 includes：
First, the base plate of 4 watts of high-gain broadband power amplifiers of L-band, Rogers circuit boards and pressing plate be placed on respectively
In filling the culture dish of 60 DEG C of absolute ethyl alcohols, and scrubbed with brush；
Secondly, the base plate after cleaning up, Rogers circuit boards and pressing plate are placed in 50 DEG C of baking oven and toast 4-
22-25 DEG C is naturally cooled to after 6min；
Then, at Rogers board pads, with the ALPHA OM338 welderings that fusing point on pneumatic point gum machine point is 217 DEG C
Cream, and components and parts to be welded are correctly placed at soldering paste；
Then, Rogers circuit boards are placed on 245-255 DEG C of heating platform and are sintered, and check welding under the microscope
Effect, it is to be welded after the completion of the Rogers circuit boards for welding are placed on into natural cooling on filter paper；
Finally, Rogers circuit boards are placed on heat in the rinse bath for filling 60 DEG C of ABZOL CEG CLEANER cleaning agents
Take out after brew 18-22 minute, scrub 4-6min in the culture dish for filling 60 DEG C of absolute ethyl alcohols, then by the Rogers after cleaning
Circuit board is placed in 50 DEG C of baking oven and naturally cools to 22-25 DEG C after baking 4-6min.
Preferably, step 2 includes：
First, fusing point is 183 DEG C of SN63CR32 soldering paste in the printing of Rogers back of circuit board, will subsequently be brushed with soldering paste
Rogers circuit boards be arranged on base plate on, pressing plate bottom patch last layer 3M white tapes after pressing plate is mutually fixed with base plate；
Then, the component for fixing is placed on 185-195 DEG C of heating platform after sintering be placed on it is naturally cold on filter paper
But；
Finally, the component for welding is placed on heat in the rinse bath for filling 60 DEG C of ABZOL CEG CLEANER cleaning agents to boil
Take out after bubble 18-22 minutes, 4-6min is scrubbed in the culture dish for filling 60 DEG C of absolute ethyl alcohols, then the component after cleaning is placed
22-25 DEG C is naturally cooled to after toasting 4-6min in 50 DEG C of baking oven.
Preferably, also include before step 1：
First, two-sided turmeric is done to the surface of Rogers circuit boards to process；
Then, the top layer in Rogers circuit boards does welding resistance green oil, and the bottom of Rogers circuit boards is not processed；
Finally, metallization via is made on Rogers circuit boards.
Preferably, base plate is made up of H62 brass.
Preferably, the surface of base plate is coated with one layer of layer gold and the thickness of layer gold is more than 6um.
Preferably, Rogers circuit boards are FR-4 sheet materials, and the dielectric constant of Rogers circuit boards is 4.6, and thickness is
0.6mm, copper thickness is 0.035mm.
Preferably, the pressing plate of 4 watts of high-gain broadband power amplifiers of L-band is made up of LY12 duralumin materials.
According to above-mentioned technical proposal, through through 4 watts of high-gain broadband power amplifiers of L-band of this technique productions and survey
Examination, environmental experiment and whole machine field adjustable, property indices are fully achieved machine requirement.Technological process science, the simplicity,
The product percent of pass of production is higher, to the less demanding of Manufacturing Worker, is easily mastered.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Description of the drawings
Accompanying drawing is, for providing a further understanding of the present invention, and to constitute the part of specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the structural representation of the base plate of the 4 watts of high-gain broadband power amplifiers of L-band provided according to the present invention；
Fig. 2 is the structure of the Rogers circuit boards of the 4 watts of high-gain broadband power amplifiers of L-band provided according to the present invention
Schematic diagram；
Fig. 3 is the components and parts attachment schematic diagram of the 4 watts of high-gain broadband power amplifiers of L-band provided according to the present invention；
Fig. 4 is the Rogers circuit board and pressing plate of the 4 watts of high-gain broadband power amplifiers of L-band provided according to the present invention
Sintering schematic diagram；And
Fig. 5 is the structural representation of the pressing plate of the 4 watts of high-gain broadband power amplifiers of L-band provided according to the present invention.
Specific embodiment
The specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The specific embodiment stated is merely to illustrate and explains the present invention, is not limited to the present invention.
In the present invention, in the case where contrary explanation is not made, the noun of locality that " top, bottom " etc. is included in term is only represented
Orientation of the term under normal service condition, or be skilled artisan understands that be commonly called as, and be not construed as to the term
Restriction.
The present invention provides a kind of manufacture craft of 4 watts of high-gain broadband power amplifiers of L-band, including：
Step 1, components and parts are sintered on Rogers circuit boards；
Step 2, the Rogers circuit boards for installing components and parts are sintered on base plate；
Step 3, the component to installing are debugged, tested, mark.
Specifically, step 1 includes：First, respectively by the base plate of 4 watts of high-gain broadband power amplifiers of L-band (such as Fig. 1
It is shown), Rogers circuit boards (as shown in Figure 2) and pressing plate (as shown in Figure 5) be placed in the culture dish for filling 60 DEG C of absolute ethyl alcohols,
And scrubbed with brush；Secondly, the base plate after cleaning up, Rogers circuit boards and pressing plate are placed in 50 DEG C of baking oven
22-25 DEG C is naturally cooled to after baking 4-6min；Then, at Rogers board pads, with fusing point on pneumatic point gum machine point
For 217 DEG C of ALPHA OM338 soldering paste, and components and parts to be welded are correctly placed at soldering paste；Then, by Rogers circuit boards
Be placed on 245-255 DEG C of heating platform and sinter, and check welding effect under the microscope, it is to be welded after the completion of will weld
Rogers circuit boards are placed on natural cooling on filter paper；Finally, Rogers circuit boards are placed on and fill 60 DEG C of ABZOL CEG
Take out after hot brew 18-22 minute in the rinse bath of CLEANER cleaning agents, scrub in the culture dish for filling 60 DEG C of absolute ethyl alcohols
4-6min, then by the Rogers circuit boards after cleaning be placed in 50 DEG C of baking oven toast 4-6min after naturally cool to 22-25
℃。
Step 2 includes：First, fusing point is 183 DEG C of SN63CR32 soldering paste in the printing of Rogers back of circuit board, subsequently
The Rogers circuit boards of soldering paste will be brushed with base plate, by pressing plate and bottom after the patch last layer 3M white tapes of pressing plate bottom
Plate is mutually fixed；Then, the component for fixing is placed on 185-195 DEG C of heating platform after sintering be placed on it is naturally cold on filter paper
But；Finally, the component for welding (as shown in Figure 4) is placed on the rinse bath for filling 60 DEG C of ABZOL CEG CLEANER cleaning agents
Take out after middle hot brew 18-22 minute, scrub 4-6min in the culture dish for filling 60 DEG C of absolute ethyl alcohols, then by the group after cleaning
Part is placed in 50 DEG C of baking oven and naturally cools to 22-25 DEG C after baking 4-6min.
In one embodiment, the components and parts welding in above-mentioned steps 1 is as shown in figure 3, wherein,
R1, R2, R3, R4 are 1.5 Ω resistance, and R5, R6, R9, R13, R19, R20, R22 are the resistance of 0 Ω, R7, R18, R21
For the resistance of 100 Ω, R8, R14, R17, R24 are the resistance of 11K Ω, and R23, R25 are the resistance of 220 Ω, and R10, R15 are 2K Ω
Resistance, R11, R12, R16 for 10K Ω resistance, L1 be 4.7nH inductance, L2, L3, L4 be 12nH inductance, C10 be 0.5pF it is electric
Hold, C9 is 2pF electric capacity, C7, C8, C11 are 22pF electric capacity, and C2, C13, C14 are 1000pF electric capacity, and C4 is 100nF electric capacity, and C1 is
22uF electric capacity, C3, C5, C12, C15 are 1uF electric capacity, and D1 is NZ9F5V1ST5G diodes, and Q2 is 9013 (SOT-23) triodes,
Q1 is IRFML9301TRBF transistors, and IC5 is SN74LVC1G08DRLR logic chips, and IC4 is UCC27511DBV drivers,
IC3 is TPS60403DBV power supply chips, and IC2 is MGF0915A high power amplifiers, and IC1 is TQL9042 low-noise amplifiers.
Before using Rogers circuit boards, in order that deposited colors are steady in Rogers circuit boards circuit surfaces
Fixed, brightness is good, while coating is smooth and with good solderability, it is preferable that also include before step 1：
First, two-sided turmeric is done to the surface of Rogers circuit boards to process；
Then, the top layer in Rogers circuit boards does welding resistance green oil, and the bottom of Rogers circuit boards is not processed；
Finally, metallization via is made on Rogers circuit boards.
In one embodiment, preferred base plate is made up of H62 brass, the spy that so make use of the thermal conductivity of copper good
Point, the effect for being conducive to the conductibility of power amplifier module to radiate.
Additionally, for the ease of ensureing that Rogers circuit boards bottom is good with layer gold surface soldered when solder(ing) paste is welded, it is excellent
The surface for selecting base plate is coated with the thickness of one layer of layer gold and layer gold more than 6um.
Likewise, in order that Rogers circuit boards have good mechanical performance and dimensional stability, improving its anti-impact
Hitting property and moisture resistance properties, it is preferable that Rogers circuit boards are FR-4 sheet materials, and the dielectric constant of Rogers circuit boards is 4.6,
Thickness is 0.6mm, and copper thickness is 0.035mm.
Still there is good heat resistance in order to cause it while the high intensity of pressing plate is ensured, it is preferable that L-band 4
The pressing plate of watt high-gain broadband power amplifier is made up of LY12 duralumin materials.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, but, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, various letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned specific embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy is no longer separately illustrated.
Additionally, can also be combined between a variety of embodiments of the present invention, as long as it is without prejudice to this
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (8)
1. the manufacture craft of 4 watts of high-gain broadband power amplifiers of a kind of L-band, it is characterised in that include：
Step 1, components and parts are sintered on Rogers circuit boards；
Step 2, the Rogers circuit boards for installing components and parts are sintered on base plate；
Step 3, the component to installing are debugged, tested, mark.
2. manufacture craft according to claim 1, it is characterised in that step 1 includes：
First, respectively the base plate of 4 watts of high-gain broadband power amplifiers of L-band, Rogers circuit boards and pressing plate be placed on and filled
In the culture dish of 60 DEG C of absolute ethyl alcohols, and scrubbed with brush；
Secondly, the base plate after cleaning up, Rogers circuit boards and pressing plate are placed in 50 DEG C of baking oven and are toasted after 4-6min
Naturally cool to 22-25 DEG C；
Then, at Rogers board pads, with the ALPHA OM338 soldering paste that fusing point on pneumatic point gum machine point is 217 DEG C, and
Components and parts to be welded are correctly placed at soldering paste；
Then, Rogers circuit boards are placed on 245-255 DEG C of heating platform and are sintered, and check welding effect under the microscope
Really, the Rogers circuit boards for welding are placed on into natural cooling on filter paper after the completion of to be welded；
Finally, Rogers circuit boards are placed on hot brew in the rinse bath for filling 60 DEG C of ABZOL CEG CLEANER cleaning agents
Take out after 18-22 minutes, scrub 4-6min in the culture dish for filling 60 DEG C of absolute ethyl alcohols, then by the Rogers circuits after cleaning
Plate is placed in 50 DEG C of baking oven and naturally cools to 22-25 DEG C after baking 4-6min.
3. manufacture craft according to claim 2, it is characterised in that step 2 includes：
First, fusing point is 183 DEG C of SN63CR32 soldering paste in the printing of Rogers back of circuit board, will subsequently be brushed with soldering paste
Rogers circuit boards are arranged on base plate, are mutually fixed pressing plate with base plate after the patch last layer 3M white tapes of pressing plate bottom；
Then, the component for fixing is placed on 185-195 DEG C of heating platform and is placed on natural cooling on filter paper after sintering；
Finally, the component for welding is placed on hot brew 18- in the rinse bath for filling 60 DEG C of ABZOL CEG CLEANER cleaning agents
Take out after 22 minutes, 4-6min is scrubbed in the culture dish for filling 60 DEG C of absolute ethyl alcohols, then the component after cleaning is placed on into 50
DEG C baking oven in baking 4-6min after naturally cool to 22-25 DEG C.
4. manufacture craft according to claim 3, it is characterised in that also include before step 1：
First, two-sided turmeric is done to the surface of Rogers circuit boards to process；
Then, the top layer in Rogers circuit boards does welding resistance green oil, and the bottom of Rogers circuit boards is not processed；
Finally, metallization via is made on Rogers circuit boards.
5. manufacture craft according to claim 4, it is characterised in that base plate is made up of H62 brass.
6. manufacture craft according to claim 5, it is characterised in that the surface of base plate is coated with the thickness of one layer of layer gold and layer gold
Degree is more than 6um.
7. manufacture craft according to claim 4, it is characterised in that Rogers circuit boards are FR-4 sheet materials, and
The dielectric constant of Rogers circuit boards is 4.6, and thickness is 0.6mm, and copper thickness is 0.035mm.
8. manufacture craft according to claim 4, it is characterised in that the pressure of 4 watts of high-gain broadband power amplifiers of L-band
Plate is made up of LY12 duralumin materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611203390.8A CN106658983B (en) | 2016-12-23 | 2016-12-23 | Manufacturing process of L-band 4-watt high-gain broadband power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611203390.8A CN106658983B (en) | 2016-12-23 | 2016-12-23 | Manufacturing process of L-band 4-watt high-gain broadband power amplifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106658983A true CN106658983A (en) | 2017-05-10 |
| CN106658983B CN106658983B (en) | 2019-08-20 |
Family
ID=58826677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611203390.8A Active CN106658983B (en) | 2016-12-23 | 2016-12-23 | Manufacturing process of L-band 4-watt high-gain broadband power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106658983B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107350585A (en) * | 2017-06-26 | 2017-11-17 | 安徽华东光电技术研究所 | A kind of method of flat gold plated lead manual welding |
| CN107395197A (en) * | 2017-06-21 | 2017-11-24 | 安徽华东光电技术研究所 | The making processing method in frequency of phase locking source |
| CN107612509A (en) * | 2017-09-01 | 2018-01-19 | 安徽华东光电技术研究所 | The processing method of 120 watts of miniaturization high power amplifiers of L-band |
| CN107645848A (en) * | 2017-09-07 | 2018-01-30 | 中科迪高微波系统有限公司 | The processing method of microwave power amplifier module |
| CN107968632A (en) * | 2017-11-02 | 2018-04-27 | 安徽华东光电技术研究所 | A kind of manufacture craft of 40 watts of power amplifiers of Ku wave bands |
| CN108031938A (en) * | 2017-12-15 | 2018-05-15 | 安徽华东光电技术研究所 | A kind of S-band one divides the manufacture craft of four power splitters |
| CN108111138A (en) * | 2017-12-27 | 2018-06-01 | 安徽华东光电技术研究所 | Method for manufacturing power amplifier |
| CN108111128A (en) * | 2017-12-15 | 2018-06-01 | 安徽华东光电技术研究所 | A kind of manufacture craft of 60 watts of miniaturization power amplifiers of Ku wave bands |
| CN108112184A (en) * | 2017-11-02 | 2018-06-01 | 安徽华东光电技术研究所 | Manufacturing method of S-band 100-watt pulse power amplifier |
| CN109618502A (en) * | 2018-12-11 | 2019-04-12 | 安徽华东光电技术研究所有限公司 | A kind of high-gain amplifier module making processing method |
| CN113939109A (en) * | 2021-09-29 | 2022-01-14 | 隆扬电子(昆山)股份有限公司 | Rogers product mounting process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090163152A1 (en) * | 2007-12-21 | 2009-06-25 | Mike Jiang | Circuit board and power amplifier provided thereon |
| JP2014053445A (en) * | 2012-09-07 | 2014-03-20 | Murata Mfg Co Ltd | Circuit board and composite module |
| CN105530017A (en) * | 2015-11-27 | 2016-04-27 | 安徽华东光电技术研究所 | Method for manufacturing receiving front end of broadband receiving and transmitting system |
| CN106132119A (en) * | 2016-07-13 | 2016-11-16 | 南京宏睿普林微波技术股份有限公司 | A kind of PTFE medium method of manufacturing circuit board of multilayer dielectricity circuit |
-
2016
- 2016-12-23 CN CN201611203390.8A patent/CN106658983B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090163152A1 (en) * | 2007-12-21 | 2009-06-25 | Mike Jiang | Circuit board and power amplifier provided thereon |
| JP2014053445A (en) * | 2012-09-07 | 2014-03-20 | Murata Mfg Co Ltd | Circuit board and composite module |
| CN105530017A (en) * | 2015-11-27 | 2016-04-27 | 安徽华东光电技术研究所 | Method for manufacturing receiving front end of broadband receiving and transmitting system |
| CN106132119A (en) * | 2016-07-13 | 2016-11-16 | 南京宏睿普林微波技术股份有限公司 | A kind of PTFE medium method of manufacturing circuit board of multilayer dielectricity circuit |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107395197A (en) * | 2017-06-21 | 2017-11-24 | 安徽华东光电技术研究所 | The making processing method in frequency of phase locking source |
| CN107350585A (en) * | 2017-06-26 | 2017-11-17 | 安徽华东光电技术研究所 | A kind of method of flat gold plated lead manual welding |
| CN107612509A (en) * | 2017-09-01 | 2018-01-19 | 安徽华东光电技术研究所 | The processing method of 120 watts of miniaturization high power amplifiers of L-band |
| CN107645848B (en) * | 2017-09-07 | 2019-11-22 | 中科迪高微波系统有限公司 | The processing method of microwave power amplifier module |
| CN107645848A (en) * | 2017-09-07 | 2018-01-30 | 中科迪高微波系统有限公司 | The processing method of microwave power amplifier module |
| CN107968632A (en) * | 2017-11-02 | 2018-04-27 | 安徽华东光电技术研究所 | A kind of manufacture craft of 40 watts of power amplifiers of Ku wave bands |
| CN108112184A (en) * | 2017-11-02 | 2018-06-01 | 安徽华东光电技术研究所 | Manufacturing method of S-band 100-watt pulse power amplifier |
| CN108112184B (en) * | 2017-11-02 | 2020-08-04 | 安徽华东光电技术研究所 | Manufacturing method of S-band 100-watt pulse power amplifier |
| CN108031938A (en) * | 2017-12-15 | 2018-05-15 | 安徽华东光电技术研究所 | A kind of S-band one divides the manufacture craft of four power splitters |
| CN108111128A (en) * | 2017-12-15 | 2018-06-01 | 安徽华东光电技术研究所 | A kind of manufacture craft of 60 watts of miniaturization power amplifiers of Ku wave bands |
| CN108111138A (en) * | 2017-12-27 | 2018-06-01 | 安徽华东光电技术研究所 | Method for manufacturing power amplifier |
| CN108111138B (en) * | 2017-12-27 | 2021-06-15 | 安徽华东光电技术研究所 | Method for manufacturing power amplifier |
| CN109618502A (en) * | 2018-12-11 | 2019-04-12 | 安徽华东光电技术研究所有限公司 | A kind of high-gain amplifier module making processing method |
| CN113939109A (en) * | 2021-09-29 | 2022-01-14 | 隆扬电子(昆山)股份有限公司 | Rogers product mounting process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106658983B (en) | 2019-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106658983A (en) | Manufacturing process of L-band 4-watt high-gain broadband power amplifier | |
| CN106714471B (en) | Manufacturing process of S-band pulse 3-watt amplifier | |
| CN102164455B (en) | Process for assembling radio frequency power amplifier circuit board | |
| CN105474050B (en) | The converter heat dissipation element set composite being welded to connect with metal | |
| CN104051099A (en) | Production method of high-power precision alloy SMD (surface mount device) resistor | |
| CN105230137A (en) | Electronic component mounting equipment | |
| WO2021184190A1 (en) | Circuit board structure, electronic product, and manufacturing method and repair method for circuit board structure | |
| CN105530017A (en) | Method for manufacturing receiving front end of broadband receiving and transmitting system | |
| CN103179781A (en) | Method for improving thermal conduction capability of printed board of surface-mounted device | |
| CN106098277A (en) | Flexible LED lamp bar dedicated resistor and manufacture method thereof | |
| TW201238149A (en) | Monopole, dipole and mixed MIMO antenna | |
| CN107612509A (en) | The processing method of 120 watts of miniaturization high power amplifiers of L-band | |
| CN107068634A (en) | A kind of multi-chip power amplifier architecture for minimizing high-cooling property and preparation method thereof | |
| CN102164453A (en) | Circuit module | |
| CN102065646B (en) | Surface mount technology of ratio frequency power amplification mainboard | |
| CN203733848U (en) | Substrate for carrying reversely mounted chip and LED packaging structure | |
| CN206412345U (en) | A kind of multi-chip power amplifier architecture for minimizing high-cooling property | |
| CN109451677A (en) | A kind of processing method for defending logical field 35W power amplifier module | |
| US8420948B2 (en) | Printed circuit board | |
| CN110994100B (en) | Surface-mounted type load sheet for 5G communication and preparation method thereof | |
| CN111886691B (en) | Chip assembly and terminal equipment | |
| CN205830144U (en) | Circuit board cooling structure | |
| CN207858226U (en) | A kind of production equipment of immersion electronic product | |
| CN219536383U (en) | High temperature resistant effectual PCB board | |
| CN211720827U (en) | Active circuit printed board and phased array antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 241000 Emshan Road, Yijiang District, Wuhu City, Anhui Province Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241000 Huaxia science and Technology Park, Wuhu high tech Industrial Development Zone, Anhui Patentee before: Anhui Huadong Polytechnic Institute |
|
| CP03 | Change of name, title or address |