CN108031938A - A kind of S-band one divides the manufacture craft of four power splitters - Google Patents

A kind of S-band one divides the manufacture craft of four power splitters Download PDF

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Publication number
CN108031938A
CN108031938A CN201711360256.3A CN201711360256A CN108031938A CN 108031938 A CN108031938 A CN 108031938A CN 201711360256 A CN201711360256 A CN 201711360256A CN 108031938 A CN108031938 A CN 108031938A
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CN
China
Prior art keywords
circuit board
insulator
cavity
component
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711360256.3A
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Chinese (zh)
Inventor
徐日红
蔡庆刚
汪伦源
苏银如
王瑞
程纬
吴天树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui East China Institute of Optoelectronic Technology
Original Assignee
Anhui East China Institute of Optoelectronic Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui East China Institute of Optoelectronic Technology filed Critical Anhui East China Institute of Optoelectronic Technology
Priority to CN201711360256.3A priority Critical patent/CN108031938A/en
Publication of CN108031938A publication Critical patent/CN108031938A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206Cleaning

Abstract

The present invention is suitable for microwave module Manufacturing Techniques field, there is provided a kind of S-band one divides the manufacture craft of four power splitters, which includes the following steps:S1, gas phase cleaning chamber, circuit board and insulator;Sheet resistance and power splitter, be sintered on circuit board by S2;Circuit board and insulator, be sintered on cavity by S3;S4, tested and debugged, after test passes to sintering the component finished in step S3, capping, mark.S-band one provided in an embodiment of the present invention divide the technological process of four power splitters it is simple, conveniently, science, the qualification rate of product is improved, improves the efficiency of Workshop Production, reduces the difficulty of machine product debugging, project cost has been saved, has been adapted to jobs or lots production.

Description

A kind of S-band one divides the manufacture craft of four power splitters
Technical field
The invention belongs to microwave module manufacture craft field, there is provided a kind of S-band one divides the manufacture craft of four power splitters.
Background technology
S-band is widely used in communication system, including in satellite communication, radar and electronic warfare system.Especially existing For in communication system, to handle multiple signals input, output problem, power splitter is applied and given birth to.S-band power splitter is widely used in In various microwave telecommunication systems, the quality of power splitter index directly affects the quality of microwave telecommunication system overall performance index.S Wave band one divides four power splitters to refer to believe input signal energy in part of the working frequency range between 2-4GHz into four tunnel equal energies Number output device.
It is badly in need of the manufacture craft that a kind of easy to operate, qualification rate is high S-band one divides four power splitters at present.
The content of the invention
The embodiment of the present invention provides the manufacture craft that S-band one divides four power splitters, it is desirable to provide a kind of technological process operation Strong, product qualification rate the is high S-band one of property divides the manufacture craft of four power splitters.
The present invention is achieved in that a kind of S-band one divides the manufacture craft of four power splitters, which includes following step Suddenly:
S1, gas phase cleaning chamber, circuit board and insulator;
Sheet resistance and power splitter, be sintered on circuit board by S2;
Circuit board and insulator, be sintered on cavity by S3;
S4, tested and debugged, after test passes to sintering the component finished in step S3, capping, mark.
Further, the step S1 specifically comprises the following steps:
S11, by cavity, circuit board and insulator without stacking lie against cleaning basket in, will cleaning basket be put into fill 68 DEG C~ 70 DEG C of components clean 15-20 minutes in the gas phase rinse bath of ABZOL CEG cleaning agents, to cover cleaning machine equipment cover board;
After S12, cleaning machine cleaning, equipment cover board is opened, cleaning basket suspension is positioned over condenser coil center carries out Cavity, circuit board and insulator, are put into contain in spirituous culture dish afterwards by cool drying 3-5 minutes, with cotton ball soaked in alcohol into Row wipes;
S13, the cavity by after alcohol washes, circuit board and insulator are put into the baking oven that temperature is 80 DEG C~100 DEG C, are dried Roasting time 15-20 minute;
S14, baking terminate, and take out cavity, circuit board and insulator and place on filter paper, stand-by after cooling to room temperature.
Further, the step S2 specifically comprises the following steps:
S21, the continuity point rubber moulding formula by dispenser, the spot printing soldering paste in board pads;
Component, be placed in and accordingly scribble on the pad of solder(ing) paste by S22, and the component includes:51 Ω packing forms For 0402 sheet resistance and SCN2-22 power splitters;
S23, the heating platform that the circuit board that sheet resistance and power splitter are placed in step S22 is placed on to 225 DEG C~235 DEG C On be sintered, the circuit board sintered is removed from heating platform, is placed on filter paper and is cooled to room temperature;
S24, by the cotton ball soaked in alcohol for being soaked with absolute alcohol to sintering position clean.
Further, in the sintering process of the step S23, by microscope to the position piece that warps and deviate occurs Resistance and power splitter set right.
Further, the step S3 specifically comprises the following steps:
S31, the continuity point rubber moulding formula by dispenser, respectively cavity via inner wall and insulator close to cavity one The outer surface at end applies a lap welding tin cream, and the via of the cavity is used to install insulator, in back of circuit board coating last layer weldering Circuit board and insulator, are placed in the correspondence position of cavity by tin cream;
Component to be sintered in step S31, is placed on temperature to be sintered on 195 DEG C~205 DEG C heating platforms by S32, is sintered After the completion of, the component sintered is moved on on filter paper, naturally cools to room temperature;
The component cooled down in step S32, be placed on the heating platform that temperature is 95 DEG C~105 DEG C by S33, passes through temperature The solder stick for 120 DEG C of 295 DEG C~305 DEG C electric iron and fusing point is spent, the one end of insulator away from cavity is welded to circuit board On.
Further, include after step S33:
S34, carry out gas phase cleaning to the component for welding insulator and circuit board, and the step S33 specifically includes following step Suddenly:
The component for welding insulator and circuit board, is placed on that to fill 60 DEG C of compositions be ABZOL CEG CLEANER by S341 Hot brew 19~21 minutes in the rinse bath of cleaning agent;
S342, hot brew finish, and take out the component for welding insulator and circuit board, are put into the training for filling 60 DEG C of absolute ethyl alcohols Support and scrubbed in ware;
Component after scrub, be placed in 50 DEG C of baking oven toast 4~6 minutes again by S343, naturally cool to 22 DEG C~ It is stand-by after 25 DEG C.
Make this S-band one divide the technological process of four power splitters it is simple, conveniently, science, improve the qualification rate of product, carry The high efficiency of Workshop Production, reduces the difficulty of machine product debugging, has saved project cost, be adapted to jobs or lots Production;In addition, dividing four power splitters by the S-band one that this technique productions makes, isolation is good between output port, and produces Product fully meet technical requirement by stringent environmental test (seasoned, vibration, high/low temperature, electromagnetic compatibility etc.).Deliver User uses and product is with complete machine is steady in a long-term, reliably working.
Brief description of the drawings
Fig. 1 is the fabrication processing figure that S-band one provided in an embodiment of the present invention divides four power splitters;
Fig. 2 divides the sintering of four power splitter resistance sheet resistances and power splitter to illustrate for S-band one provided in an embodiment of the present invention Figure;
Fig. 3 is the sintering schematic diagram that S-band one provided in an embodiment of the present invention divides four power divider circuit plates and insulator.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
Fig. 1 is the fabrication processing figure that the S-band one that inventive embodiments provide divides four power splitters, which includes as follows Step:
S1, cleaning chamber, circuit board and insulator;
In embodiments of the present invention, step S1 specifically comprises the following steps:
S11, cleaned using vapour phase cleaning machine, opens vapour phase cleaning electromechanics source switch, opens equipment heater switch (HEAT ON) and set heating-up temperature as 75 DEG C~80 DEG C, treat 68 DEG C~70 DEG C of temperature stabilization (solution boiling point is lower than design temperature to be caused) It is stand-by afterwards;Baking oven power supply is opened, 80 DEG C~100 DEG C of oven temperature is set, it is stand-by after temperature stabilization.
S12, uniformly keep flat cavity, circuit board and insulator in the cleaning basket for being placed in equipment, is careful not to stack, in order to avoid Housing is caused to scratch;Cleaning basket is put into vapour phase cleaning groove, shell is flooded using cleaning agent (component is ABZOL CEG), Cleaning indigo plant is hung in cleaning machine hanger, closes cleaning machine equipment cover board, the setting time is (15~20) minute.
S13, scavenging period, which open equipment cover board after and will clean basket suspension, to be positioned over condenser coil center to carry out cooling dry Cleaning basket is taken out after dry (3~5) minute, cavity, circuit board and insulator are put into and contained in spirituous culture dish, alcohol into It is divided into GB/T678-1990, wipes inside cavity with wide mouth tweezers gripping cotton ball soaked in alcohol, notice that dynamics is uniform during cleaning, in order to avoid Cavity is caused to scratch.
S14, the cavity by after cleaning, circuit board and insulator are put into drying in oven, close oven door, baking time (15~20) minute;Baking terminates, and takes out cavity, circuit board and insulator and places on filter paper, stand-by after cooling to room temperature.
Sheet resistance and power splitter, be sintered on circuit board by S2;
In embodiments of the present invention, step S2 specifically comprises the following steps:
S21, opening dispenser use continuity point rubber moulding formula, and dispenser pressure is arranged to (45~60) psi, is welded in circuit board Point coats the soldering paste that suitable 217 DEG C of compositions of fusing point are ALPHA OM338 on disk.
S22, lie in the circuit board for scribbling solder(ing) paste on microscopical objective table, observes and adjusts at the same time microscopical The elevation angle, focal length and amplification factor, make to get a clear view easy to operation;Component is gently gripped with sharp mouth tweezers be placed in accordingly scribble On the pad of solder(ing) paste, component is 0402 sheet resistance and SCN2-22 power splitters including 51 Ω packing forms, and S-band one divides four Power splitter sheet resistance and power splitter sintering schematic diagram as shown in Figure 1, the label 3 in Fig. 1 be sheet resistance, label 4 be power splitter;
S23, the heating platform that the circuit board that sheet resistance and power splitter are placed in step S22 is placed on to 225 DEG C~235 DEG C On be sintered, observe under the microscope, in sintering process as occur component warp, deviate, gently set right with tweezers in time, After the completion of sintering, the circuit board sintered is removed from heating platform, is placed on filter paper and is cooled to room temperature.
S24, be soaked with the cotton ball soaked in alcohol of absolute alcohol with the gripping of wide mouth tweezers sintering position cleaned, residual after cleaning sintering The residual stains such as the rosin stayed, the component pad surface after cleaning should be smooth, mellow and full, bright.
Circuit board, insulator, be sintered on cavity by S3;
In embodiments of the present invention, step S3 specifically comprises the following steps:
S31, opening dispenser use continuity point rubber moulding formula, and dispenser pressure is arranged to (45~60) psi, respectively in cavity Via inner wall and and insulator close to cavity one end outer surface spot printing one enclose fusing point be that 183 DEG C of compositions are SN63CR32's Solder(ing) paste, the via are used to install insulator, are in back of circuit board coating suitable 183 DEG C of compositions of fusing point of last layer The circuit board for sintering component and insulator, are individually positioned in the correspondence position of cavity, S-band by the solder(ing) paste of SN63CR32 As indicated with 2, the label 5 in Fig. 2 is insulator to the welding schematic diagram of one point of four power divider circuit plate and insulator, and label 2 is electricity Road plate, label 1 are cavity.
S32, open heating platform, and heating platform temperature setting is, after temperature stabilization, by group to be sintered in step S3 Part is placed on temperature to be sintered on 195 DEG C~205 DEG C heating platforms.The both ends of circuit board are pushed down during sintering with wide mouth tweezers, make burning Circuit board is not shifted over during knot, and insulator is gently stirred with tweezers makes sintering more abundant, is added if necessary with syringe Enter suitable rosin, it is ensured that the penetration rate of circuit board sintering.After the completion of sintering, the component sintered is moved on on filter paper, from So it is cooled to room temperature.
The component cooled down in step S32, be placed on the heating platform that temperature is 95 DEG C~105 DEG C by S33, passes through temperature The solder stick for 120 DEG C of 295 DEG C~305 DEG C electric iron and fusing point is spent, the one end of insulator away from cavity is welded to circuit board On.
S34, cleaned using vapour phase cleaning machine, and the component for welding insulator and circuit board is placed on and fills 60 DEG C of compositions and is Hot brew (19~21) minute in the rinse bath of ABZOL CEG CLEANER cleaning agents;Placed after taking-up and fill 60 DEG C of anhydrous second Scrubbed in the culture dish of alcohol, circuit board surface and insulator weld are scrubbed using yellow fur brush, circuit board four (4~6) minute is scrubbed in all gaps using yellowish pink scrub-brush;The component after cleaning is placed in 50 DEG C of baking oven again and is toasted It is (4~6) minute, stand-by after naturally cooling to 22 DEG C~25 DEG C.
S4, test, debugging, capping, mark.
The component completed to assembling can be tested after connecting peripheral circuit and corresponding instrument and meter, debugged, and be surveyed After the completion of examination, debugging, cover, mark, so far a kind of S-band one divides four power splitters to complete.
Make this S-band one divide the technological process of four power splitters it is simple, conveniently, science, improve the qualification rate of product, carry The high efficiency of Workshop Production, reduces the difficulty of machine product debugging, has saved project cost, be adapted to jobs or lots Production;In addition, dividing four power splitters by the S-band one that this technique productions makes, isolation is good between output port, and produces Product fully meet technical requirement by stringent environmental test (seasoned, vibration, high/low temperature, electromagnetic compatibility etc.).Deliver User uses and product is with complete machine is steady in a long-term, reliably working.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.

Claims (6)

1. a kind of S-band one divides the manufacture craft of four power splitters, it is characterised in that the technique includes the following steps:
S1, gas phase cleaning chamber, circuit board and insulator;
Sheet resistance and power splitter, be sintered on circuit board by S2;
Circuit board and insulator, be sintered on cavity by S3;
S4, tested and debugged, after test passes to sintering the component finished in step S3, capping, mark.
2. S-band one as claimed in claim 1 divides the manufacture craft of four power splitters, it is characterised in that the step S1 is specifically wrapped Include following steps:
S11, lie against without stacking by cavity, circuit board and insulator and clean in basket, and cleaning basket is put into and fills 68 DEG C~70 DEG C Composition cleans 15~20 points in the gas phase rinse bath of ABZOL CEG CLEANER cleaning agents, to cover cleaning machine equipment cover board Clock;
After S12, cleaning machine cleaning, equipment cover board is opened, cleaning basket suspension is positioned over condenser coil center is cooled down It is 3~5 minutes dry, cavity, circuit board and insulator are put into contain in spirituous culture dish afterwards, wiped with cotton ball soaked in alcohol Wipe;
S13, the cavity by after alcohol washes, circuit board and insulator are put into temperature, during baking Between 15~20 minutes;
S14, baking terminate, and take out cavity, circuit board and insulator and place on filter paper, stand-by after cooling to room temperature.
3. S-band one as claimed in claim 1 divides the manufacture craft of four power splitters, it is characterised in that the step S2 is specifically wrapped Include following steps:
S21, the continuity point rubber moulding formula by dispenser, the spot printing soldering paste in board pads;
Component, be placed in and accordingly scribble on the pad of solder(ing) paste by S22, and the component includes:51 Ω packing forms are 0402 sheet resistance and SCN2-22 power splitters;
S23, the heating platform that the circuit board that sheet resistance and power splitter are placed in step S22 is placed on to 225 DEG C~235 DEG C are enterprising Row sintering, the circuit board sintered is removed from heating platform, is placed on filter paper and is cooled to room temperature;
S24, by the cotton ball soaked in alcohol for being soaked with absolute alcohol to sintering position clean.
4. S-band one as claimed in claim 3 divides the manufacture craft of four power splitters, it is characterised in that in the burning of the step S23 During knot, generation position is warped and deviated by microscope sheet resistance and power splitter set right.
5. S-band one as claimed in claim 1 divides the manufacture craft of four power splitters, it is characterised in that the step S3 is specifically wrapped Include following steps:
S31, the continuity point rubber moulding formula by dispenser, respectively cavity via inner wall and insulator close to cavity one end Outer surface applies a lap welding tin cream, and the via of the cavity is used to install insulator, and last layer solder(ing) paste is coated in back of circuit board, Circuit board and insulator are placed in the correspondence position of cavity;
Component to be sintered in step S31, is placed on temperature to be sintered on 195 DEG C~205 DEG C heating platforms by S32, and sintering is completed Afterwards, the component sintered is moved on on filter paper, naturally cools to room temperature;
The component cooled down in step S32, be placed on the heating platform that temperature is 95 DEG C~105 DEG C by S33, is by temperature The solder stick of 120 DEG C of 295 DEG C~305 DEG C electric iron and fusing point, the one end of insulator away from cavity is welded on circuit board.
6. S-band one as claimed in claim 5 divides the manufacture craft of four power splitters, it is characterised in that is wrapped after step S33 Include:
S34, carry out gas phase cleaning to the component for welding insulator and circuit board, and the step S33 specifically comprises the following steps:
The component for welding insulator and circuit board, be placed on and to fill 60 DEG C of compositions and cleaned for ABZOL CEG CLEANER by S341 Hot brew 19~21 minutes in the rinse bath of agent;
S342, hot brew finish, and take out the component for welding insulator and circuit board, are put into the culture dish for filling 60 DEG C of absolute ethyl alcohols In scrubbed;
Component after scrub, be placed in 50 DEG C of baking oven toast 4~6 minutes again by S343, naturally cools to 22 DEG C~25 DEG C It is stand-by afterwards.
CN201711360256.3A 2017-12-15 2017-12-15 A kind of S-band one divides the manufacture craft of four power splitters Pending CN108031938A (en)

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CN201711360256.3A CN108031938A (en) 2017-12-15 2017-12-15 A kind of S-band one divides the manufacture craft of four power splitters

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108811362A (en) * 2018-06-14 2018-11-13 安徽华东光电技术研究所有限公司 A kind of 9 watts of power amplifiers of Ku wave bands push the manufacture craft of grade amplification module

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CN106572607A (en) * 2016-06-23 2017-04-19 安徽华东光电技术研究所 Process manufacturing method of solid-state microwave source
CN106658983A (en) * 2016-12-23 2017-05-10 安徽华东光电技术研究所 Manufacturing process of L-band 4-watt high-gain broadband power amplifier
CN106714471A (en) * 2016-12-23 2017-05-24 安徽华东光电技术研究所 Manufacturing process of S-band pulse 3-watt amplifier
CN107396546A (en) * 2017-06-22 2017-11-24 中科迪高微波系统有限公司 The preparation method of miniaturization lock same axis medium Microwave Frequency Source
CN107395197A (en) * 2017-06-21 2017-11-24 安徽华东光电技术研究所 The making processing method in frequency of phase locking source

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106572607A (en) * 2016-06-23 2017-04-19 安徽华东光电技术研究所 Process manufacturing method of solid-state microwave source
CN106658983A (en) * 2016-12-23 2017-05-10 安徽华东光电技术研究所 Manufacturing process of L-band 4-watt high-gain broadband power amplifier
CN106714471A (en) * 2016-12-23 2017-05-24 安徽华东光电技术研究所 Manufacturing process of S-band pulse 3-watt amplifier
CN107395197A (en) * 2017-06-21 2017-11-24 安徽华东光电技术研究所 The making processing method in frequency of phase locking source
CN107396546A (en) * 2017-06-22 2017-11-24 中科迪高微波系统有限公司 The preparation method of miniaturization lock same axis medium Microwave Frequency Source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108811362A (en) * 2018-06-14 2018-11-13 安徽华东光电技术研究所有限公司 A kind of 9 watts of power amplifiers of Ku wave bands push the manufacture craft of grade amplification module

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Application publication date: 20180515