CN108306089A - S to X-band gainequalizer manufacture craft - Google Patents
S to X-band gainequalizer manufacture craft Download PDFInfo
- Publication number
- CN108306089A CN108306089A CN201711441133.2A CN201711441133A CN108306089A CN 108306089 A CN108306089 A CN 108306089A CN 201711441133 A CN201711441133 A CN 201711441133A CN 108306089 A CN108306089 A CN 108306089A
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- China
- Prior art keywords
- cleaning
- sintered
- circuit boards
- circuit board
- temperature
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of S to the manufacture craft of X-band gainequalizer, including：Step 1, cleaning chamber, Rogers circuit boards and insulator；Surface Mount component is sintered on Rogers circuit boards by step 2；Circuit board, insulator are sintered on cavity by step 3；Step 4 is tested, is debugged, being covered, mark successively.The fabrication processing of the S to X-band gainequalizer is simple, conveniently, science, of less demanding to the technical merit of worker, appropriate training can be operated, and improves the qualification rate of product, improves production efficiency, saved production cost, is worthy to be popularized.
Description
Technical field
The present invention relates to microwave modules to make processing technology, and in particular, to the system of S to X-band gainequalizer a kind of
Make technique.
Background technology
Modern microwave technology has been widely used for the communications field, is carried with the development of technology with user requirement
Height, microwave technology develop towards miniaturization, integrated, broadband and high frequency direction and have become mainstream.Gain balance
Device is extensively using in the military systems such as satellite communication, radar, electronic warfare.
Therefore, it is badly in need of providing a kind of novel S to the manufacture craft of X-band gainequalizer.
Invention content
The object of the present invention is to provide a kind of S to the manufacture craft of X-band gainequalizer, the S to X-band gain balance
The fabrication processing of device is simple, conveniently, science, of less demanding to the technical merit of worker, appropriate training can be operated, and improve
The qualification rate of product, improves production efficiency, has saved production cost, be worthy to be popularized.
To achieve the goals above, the present invention provides a kind of S to the manufacture craft of X-band gainequalizer, including：
Step 1, cleaning chamber, Rogers circuit boards and insulator；
Surface Mount component is sintered on Rogers circuit boards by step 2；
Circuit board, insulator are sintered on cavity by step 3；
Step 4 is tested, is debugged, being covered, mark successively.
Preferably, step 1 includes：
A, vapour phase cleaning electromechanics source switch is opened, heating temperature is 75-80 DEG C, for use after temperature stablizes 68-70 DEG C；It beats
Baking oven power supply is opened, 80-100 DEG C of oven temperature is set, temperature is for use after stablizing；
B, cavity, Rogers circuit boards and insulator are uniformly kept flat in the cleaning basket for being placed in equipment, cleaning basket is put into
In vapour phase cleaning slot, shell is flooded with the cleaning agent that ingredient is ABZOL CEG, cleaning basket is hung in cleaning machine hanger, is cleaned
Time is 15-20min；
C, cleaning basket suspension is positioned over after condenser coil center carries out cooling dry 3-5min after cleaning and is taken out, to culture
The alcohol that 200-300ml ingredients are GB/T678-1990 is poured into ware, and inside cavity is wiped with wide mouth tweezers gripping cotton ball soaked in alcohol；
D, cavity, Rogers circuit boards and the insulator after cleaning are put into drying in oven, baking time 15-20min,
Culture dish is taken out after drying, it is for use after being cooled to room temperature.
Preferably, step 2 includes：
A, it opens dispenser and uses continuity point rubber moulding formula, dispenser pressure is set as 45-60psi, in Rogers circuit boards
217 DEG C of spot printing fusing point, the soldering paste that composition is ALPHAOM338 on pad；
B, the Rogers circuit boards for being coated with solder(ing) paste are lain on microscopical objective table, first device is gripped with sharp mouth tweezers
Part is correctly seated on the pad for being coated with solder(ing) paste；It is that 0603 sheet resistance (R1) and 15 Ω are encapsulated including 12 Ω packing forms
Form is 0603 sheet resistance (R2)；
C, heating platform temperature setting is 225-235 DEG C, circuit board is placed on 225-235 DEG C of heating platform and is burnt
Knot, the circuit board sintered is removed from heating platform, is placed on natural cooling on filter paper；
D, the cotton ball soaked in alcohol of absolute alcohol, remaining residual stains after cleaning sintering are soaked with the gripping of wide mouth tweezers.
Preferably, step 3 includes：
A, it is placed around circuit board on the cavity cleaned up in the step d of step 1, it is heat safe white to stick a circle
Color 3M welding resistance adhesive tapes；
B, it opens dispenser and uses continuity point rubber moulding formula, dispenser pressure is set as 45-60psi, in Rogers circuit boards
183 DEG C of backside coating last layer fusing point, composition are the solder(ing) paste of SN63CR32, and the circuit board for sintering component is correctly pacified
It is placed on cavity；
C, heating platform temperature setting is 195-205 DEG C, after temperature stabilization, by group to be sintered in the step b of step 3
Part is placed on heating platform and is sintered；Wherein, the both ends for pushing down circuit board when sintering with wide mouth tweezers, make circuit board in sintering process
It is not displaced；After the completion of sintering, the component sintered is moved on on filter paper, natural cooling；
D, heating platform temperature is set as 95-105 DEG C, opens electric iron temperature and be set as 295-305 DEG C, with 120 DEG C of weldering
Isolator is sintered on circuit board by tin silk；
E, cleaned using vapour phase cleaning machine, the component for welding insulator and Rogers circuit boards is placed on fill 60 DEG C,
Composition is hot brew 19-21min in the rinse bath of ABZOL CEG CLEANER cleaning agents；After taking-up place fill 60 DEG C it is anhydrous
It is scrubbed in the culture dish of ethyl alcohol, then the component after cleaning is placed in 50 DEG C of baking oven and toasts 4-6min, natural cooling
It is for use after to 22-25 DEG C.
According to above-mentioned technical proposal, present invention could apply to transmitters, and product is (old by stringent environmental test
White silk, vibration, high/low temperature, electromagnetic compatibility etc.) technical requirement is fully meet, and being capable of work steady in a long-term with complete machine, reliable
Make.Make this S to the technological process of X-band gainequalizer it is simple, conveniently, science, it is of less demanding to the technical merit of worker, fit
When training can be operated, the qualification rate of product is improved, production efficiency is improved, has saved production cost, is worthy to be popularized.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Description of the drawings
Attached drawing is to be used to provide further understanding of the present invention, an and part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 be in the present invention S to X-band gainequalizer assembling schematic diagram.
Reference sign
1- cavity 2-Rogers circuit boards
3- insulators
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
In the present invention, in the absence of explanation to the contrary, the noun of locality that " upper and lower, inside and outside " etc. is included in the term
Only represent orientation of the term under normal service condition, or be those skilled in the art understand that be commonly called as, and be not construed as pair
The limitation of the term.
Referring to Fig. 1, the present invention provides a kind of S to the manufacture craft of X-band gainequalizer, including：
Step 1, cleaning chamber 1, Rogers circuit boards 2 and insulator 3；
Surface Mount component is sintered on Rogers circuit boards 2 by step 2；
Circuit board, insulator 3 are sintered on cavity 1 by step 3；
Step 4 is tested, is debugged, being covered, mark successively.
Through the above technical solutions, product made of the present invention can be applied to transmitter, and product passes through strictly
Environmental test (seasoned, vibration, high/low temperature, electromagnetic compatibility etc.) fullys meet technical requirement, and can be long-term with complete machine
Stablize, reliably working.Make this S to the technological process of X-band gainequalizer it is simple, conveniently, science, to the technical merit of worker
Of less demanding, appropriate training can be operated, and improves the qualification rate of product, improves production efficiency, has saved production cost, be worth
It must promote.
In one embodiment, following step is specifically included：
Step 1：Cleaning chamber 1, Rogers circuit boards 2 and insulator 3
1.1 are cleaned using vapour phase cleaning machine, open vapour phase cleaning electromechanics source switch, open equipment heater switch (HEAT
ON) and set heating temperature as 75-80 DEG C, after temperature stablize 68-70 DEG C (solution boiling point is lower than set temperature to be caused) afterwards it is for use；
Baking oven power supply is opened, 80-100 DEG C of oven temperature is set, temperature is for use after stablizing.
1.2 uniformly keep flat cavity 1, Rogers circuit boards 2 and insulator 3 in the cleaning basket for being placed in equipment, are careful not to
It stacks, in order to avoid shell is caused to scratch；Cleaning basket is put into vapour phase cleaning slot, is flooded with cleaning agent (ingredient is ABZOL CEG)
Subject to shell, cleaning indigo plant is hung in cleaning machine hanger, closes cleaning machine equipment cover board, the setting time is 15-20 minutes.
1.3 scavenging periods, which open equipment cover board after and will clean basket suspension and be positioned over condenser coil center, carries out cooling drying
Cleaning basket is taken out after 3-5 minutes, 200-300ml alcohol (ingredient GB/T678-1990) is poured into culture dish, with wide mouth tweezer
Sub-folder takes inside cotton ball soaked in alcohol wiping cavity 1, notices that dynamics is uniform when cleaning, in order to avoid cavity 1 is caused to scratch.
Cavity 1, Rogers circuit boards 2 and insulator 3 after cleaning is put into drying in oven by 1.4, closes oven door, is dried
The roasting time：15-20 minutes；Culture dish is taken out using proximity gloves after drying, after cooling to room temperature for use.
Step 2：Surface Mount component is sintered on Rogers circuit boards 2
2.1, which open dispenser, uses continuity point rubber moulding formula, and dispenser pressure is set as 45-60psi, in Rogers circuit boards
Point coats the soldering paste that 217 DEG C of compositions of suitable fusing point are ALPHAOM338 on 2 pads.
2.2 lie in the Rogers circuit boards 2 for being coated with solder(ing) paste on microscopical objective table, observe and adjust simultaneously aobvious
The elevation angle, focal length and the amplification factor of micro mirror, make to get a clear view easy to operation；Component is gently gripped with sharp mouth tweezers correctly to place
On being coated with the pad of solder(ing) paste.Component inventory：R1 is that 12 Ω packing forms are 0603 sheet resistance, and R2 is 15 Ω packing forms
For 0603 sheet resistance.
2.3 heating platform temperature settings are 225-235 DEG C, and described 2.2 circuit boards to be sintered are placed on 225-235 DEG C
It is sintered on heating platform, observes under the microscope, warp, deviate as component occurs in sintering process, use tweezers in time
Gently set right.After the completion of sintering, the circuit board sintered is removed from heating platform, is placed on natural cooling on filter paper.
2.4 are soaked with the cotton ball soaked in alcohol of absolute alcohol with wide mouth tweezers gripping, the residual stains such as remaining rosin after cleaning sintering,
Component solder joint after cleaning is answered smooth, mellow and full, bright.
Step 3：Circuit board, insulator 3 are sintered on cavity 1
It is placed around circuit board on 3.1 cavitys 1 cleaned up 1.4, sticks the heat safe white 3M welding resistances of a circle
Adhesive tape, scolding tin flowing pollution cavity 1 when circuit board being prevented to be sintered.
3.2, which open dispenser, uses continuity point rubber moulding formula, and dispenser pressure is set as 45-60psi, in Rogers circuit boards
2 backside coating last layers, 183 DEG C of compositions of suitable fusing point are the solder(ing) paste of SN63CR32.The circuit board of component will sintered just
Really it is placed on cavity 1.
3.3 open heating platform, and heating platform temperature setting is 195-205 DEG C, to be sintered by 3.2 after temperature stabilization
Component be placed on heating platform and be sintered.The both ends for pushing down circuit board when sintering with wide mouth tweezers, make circuit board in sintering process
It is not displaced, suitable rosin is added with syringe when necessary, it is ensured that penetration rate is good.After the completion of sintering, it will sinter
Component move on on filter paper, naturally cool to room temperature.
Heating platform temperature is set as 95-105 DEG C by 3.4, is opened electric iron temperature and is set as 295-305 DEG C, with 120 DEG C of weldering
Isolator 3 is sintered on circuit board by tin silk.
3.5 are cleaned using vapour phase cleaning machine, and the component for welding insulator 3 and Rogers circuit boards 2 is placed on and fills 60
DEG C composition be ABZOL CEG CLEANER cleaning agents rinse bath in hot brew 19-21 minutes；It is placed after taking-up and fills 60 DEG C of nothings
It is scrubbed in the culture dish of water-ethanol, circuit board surface and 3 weld of insulator are scrubbed using yellow fur brush, circuit
Plate surrounding gap carries out scrub 4-6 minutes using yellowish pink scrub-brush；The component after cleaning is placed in 50 DEG C of baking oven again and is dried
It is 4-6 minutes roasting, it is for use after naturally cooling to 22-25 DEG C.
Step 4：Test, debugging, capping, mark
It can be tested, be debugged after connecting peripheral circuit and corresponding instrument and meter to the component that assembly is completed, be surveyed
It after the completion of examination, debugging, covers, mark, so far a kind of S to X-band gainequalizer completes.
Wherein, 1 material of cavity is made by duralumin LY12, and last layer silver layer is uniformly plated on surface；Printed board uses erect image method
It makes, the member coating of conductive pattern makes for S-Sn60 materials, and circuit plate thickness is 0.508mm.
The preferred embodiment of the present invention is described in detail above in association with attached drawing, still, the present invention is not limited to above-mentioned realities
The detail in mode is applied, within the scope of the technical concept of the present invention, a variety of letters can be carried out to technical scheme of the present invention
Monotropic type, these simple variants all belong to the scope of protection of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (4)
1. a kind of S is to the manufacture craft of X-band gainequalizer, which is characterized in that including：
Step 1, cleaning chamber (1), Rogers circuit boards (2) and insulator (3)；
Surface Mount component is sintered on Rogers circuit boards (2) by step 2；
Circuit board, insulator (3) are sintered on cavity (1) by step 3；
Step 4 is tested, is debugged, being covered, mark successively.
2. S according to claim 1 is to the manufacture craft of X-band gainequalizer, which is characterized in that step 1 includes：
A, vapour phase cleaning electromechanics source switch is opened, heating temperature is 75-80 DEG C, for use after temperature stablizes 68-70 DEG C；It opens and dries
Case power supply, is arranged 80-100 DEG C of oven temperature, and temperature is for use after stablizing；
B, cavity (1), Rogers circuit boards (2) and insulator (3) are uniformly kept flat in the cleaning basket for being placed in equipment, basket will be cleaned
It is put into vapour phase cleaning slot, shell is flooded with the cleaning agent that ingredient is ABZOL CEG, cleaning basket is hung in cleaning machine hanger,
Scavenging period is 15-20min；
C, cleaning basket suspension is positioned over after condenser coil center carries out cooling dry 3-5min after cleaning and is taken out, into culture dish
The alcohol that 200-300ml ingredients are GB/T678-1990 is poured into, it is internal with wide mouth tweezers gripping cotton ball soaked in alcohol wiping cavity (1)；
D, cavity (1), Rogers circuit boards (2) and the insulator (3) after cleaning are put into drying in oven, baking time 15-
20min takes out culture dish after drying, for use after being cooled to room temperature.
3. S according to claim 2 is to the manufacture craft of X-band gainequalizer, which is characterized in that step 2 includes：
A, opening dispenser uses continuity point rubber moulding formula, dispenser pressure to be set as 45-60psi, is welded in Rogers circuit boards (2)
217 DEG C of spot printing fusing point, the soldering paste that composition is ALPHA OM338 on disk；
B, the Rogers circuit boards (2) for being coated with solder(ing) paste are lain on microscopical objective table, first device is gripped with sharp mouth tweezers
Part is correctly seated on the pad for being coated with solder(ing) paste；It is that 0603 sheet resistance (R1) and 15 Ω are encapsulated including 12 Ω packing forms
Form is 0603 sheet resistance (R2)；
C, heating platform temperature setting is 225-235 DEG C, circuit board is placed on 225-235 DEG C of heating platform and is sintered,
The circuit board sintered is removed from heating platform, is placed on natural cooling on filter paper；
D, the cotton ball soaked in alcohol of absolute alcohol, remaining residual stains after cleaning sintering are soaked with the gripping of wide mouth tweezers.
4. S according to claim 3 is to the manufacture craft of X-band gainequalizer, which is characterized in that step 3 includes：
A, it is placed around circuit board on the cavity (1) cleaned up in the step d of step 1, it is heat safe white to stick a circle
Color 3M welding resistance adhesive tapes；
B, opening dispenser uses continuity point rubber moulding formula, dispenser pressure to be set as 45-60psi, is carried on the back in Rogers circuit boards (2)
Face coats 183 DEG C of last layer fusing point, composition is the solder(ing) paste of SN63CR32, and the circuit board for sintering component is correctly placed
On cavity (1)；
C, heating platform temperature setting is 195-205 DEG C, and after temperature stabilization, component to be sintered in the step b of step 3 is put
It is sintered on heating platform；Wherein, the both ends for pushing down circuit board when sintering with wide mouth tweezers, make circuit board in sintering process not send out
Raw displacement；After the completion of sintering, the component sintered is moved on on filter paper, natural cooling；
D, heating platform temperature is set as 95-105 DEG C, opens electric iron temperature and be set as 295-305 DEG C, with 120 DEG C of solder stick
Isolator (3) is sintered on circuit board；
E, it is cleaned using vapour phase cleaning machine, the component for welding insulator (3) and Rogers circuit boards (2) is placed on and fills 60
DEG C, composition be ABZOL CEG CLEANER cleaning agents rinse bath in hot brew 19-21min；It is placed after taking-up and fills 60 DEG C of nothings
It is scrubbed in the culture dish of water-ethanol, then the component after cleaning is placed in 50 DEG C of baking oven and toasts 4-6min, it is naturally cold
But to for use after 22-25 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711441133.2A CN108306089A (en) | 2017-12-27 | 2017-12-27 | S to X-band gainequalizer manufacture craft |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711441133.2A CN108306089A (en) | 2017-12-27 | 2017-12-27 | S to X-band gainequalizer manufacture craft |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108306089A true CN108306089A (en) | 2018-07-20 |
Family
ID=62867499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711441133.2A Pending CN108306089A (en) | 2017-12-27 | 2017-12-27 | S to X-band gainequalizer manufacture craft |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108306089A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688725A (en) * | 2018-12-10 | 2019-04-26 | 安徽华东光电技术研究所有限公司 | The production method of K1 audio range frequency source module |
| CN113747680A (en) * | 2021-09-09 | 2021-12-03 | 安徽华东光电技术研究所有限公司 | Manufacturing process of short-waveband 30SW power amplifier |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5283539A (en) * | 1992-09-09 | 1994-02-01 | Itt Corporation | Monolithic compatible, absorptive, amplitude shaping network |
| CN106027435A (en) * | 2016-07-29 | 2016-10-12 | 成都四威功率电子科技有限公司 | Adjustable equalizer |
| CN106129569A (en) * | 2016-05-19 | 2016-11-16 | 中电科仪器仪表有限公司 | A kind of power-adjustable equalizer with composite link |
| CN106714471A (en) * | 2016-12-23 | 2017-05-24 | 安徽华东光电技术研究所 | Manufacturing process of S-band pulse 3-watt amplifier |
-
2017
- 2017-12-27 CN CN201711441133.2A patent/CN108306089A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5283539A (en) * | 1992-09-09 | 1994-02-01 | Itt Corporation | Monolithic compatible, absorptive, amplitude shaping network |
| CN106129569A (en) * | 2016-05-19 | 2016-11-16 | 中电科仪器仪表有限公司 | A kind of power-adjustable equalizer with composite link |
| CN106027435A (en) * | 2016-07-29 | 2016-10-12 | 成都四威功率电子科技有限公司 | Adjustable equalizer |
| CN106714471A (en) * | 2016-12-23 | 2017-05-24 | 安徽华东光电技术研究所 | Manufacturing process of S-band pulse 3-watt amplifier |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688725A (en) * | 2018-12-10 | 2019-04-26 | 安徽华东光电技术研究所有限公司 | The production method of K1 audio range frequency source module |
| CN109688725B (en) * | 2018-12-10 | 2021-08-24 | 安徽华东光电技术研究所有限公司 | Manufacturing method of K1 waveband frequency source module |
| CN113747680A (en) * | 2021-09-09 | 2021-12-03 | 安徽华东光电技术研究所有限公司 | Manufacturing process of short-waveband 30SW power amplifier |
| CN113747680B (en) * | 2021-09-09 | 2023-08-04 | 安徽华东光电技术研究所有限公司 | Manufacturing process of short-wave-band 30SW power amplifier |
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Application publication date: 20180720 |