CN107615015B - 树脂成形体及传感器装置 - Google Patents

树脂成形体及传感器装置 Download PDF

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CN107615015B
CN107615015B CN201680028632.6A CN201680028632A CN107615015B CN 107615015 B CN107615015 B CN 107615015B CN 201680028632 A CN201680028632 A CN 201680028632A CN 107615015 B CN107615015 B CN 107615015B
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resin
circuit board
molded body
semiconductor element
body according
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CN107615015A (zh
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渡边翼
河野务
余语孝之
星加浩昭
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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Abstract

树脂成形体具备：半导体元件；电路基板，形成有供半导体元件连接的导体；以及树脂，与电路基板密合而被一体化，在电路基板中的沿着与树脂密合的部分且沿着树脂的至少一方侧的侧面的边缘部区域中，设置有树脂泄漏抑制层，该树脂泄漏抑制层由具有比形成电路基板的表面层的材料的导热率更高的导热率的材料构成。

Description

树脂成形体及传感器装置
技术领域
本发明涉及树脂成形体及传感器装置。
背景技术
汽车等的内燃机具备用于适当地调整流入至内燃机的空气和燃料的量而使内燃机有效地工作的电子控制燃料喷射装置。在电子控制燃料喷射装置中，设置用于测定流入至内燃机的空气的流量的流量传感器装置。
流量传感器装置具有如下构造：在电路基板上安装流量传感器及控制用的半导体元件，在由下部盒和上部罩形成的箱体的空间内配置了半导体元件。流量传感器从箱体露出，通过布线与半导体元件连接。电路基板通过粘结剂被固定于箱体。
在将电路基板粘结于箱体的构造中，粘结剂的涂覆工序、硬化工序花费时间，生产量降低。
已知将电路基板和树脂通过注塑成形进行一体化而成的旋转型电阻部件。该旋转型电阻部件通过下述的方法来制作。
在电路基板上配置环形状的O环，通过具有圆柱状的中空部的圆筒状的中心销将该O环按压在电路基板上。如下在电路基板上按压O环：在中心销的中空部内以可滑动的方式设置保持销，在该保持销上嵌入O环，通过弹簧的施力使保持销从中心销的前端突出，将所嵌入的O环按压在电路基板上。O环形成为外径与中心销相比稍大的环形状，通过中心销，不压缩O环的外周侧的一部分而仅内周侧被压缩。在该状态下，在中心销的外周侧射出树脂，包含O环的与中心销相比外周侧地，中心销的外周侧的电路基板的正反面被树脂覆盖。其后，拔出中心销，在配置过中心销的电路基板上的圆柱状的空间部安装旋转构件。此外，在旋转构件的上表面上，安装作为按压构件的盖。根据该构造，电路基板和树脂通过注塑成形被一体化，因此生产量提高。此外还记载了：旋转构件与电路基板的间隙被O环密封，因此阻止树脂侵入电路基板的上表面侧形成树脂溢料(例如，参照专利文献1)。
现有技术文献
专利文献
专利文献1：日本特开平6-45117号公报
发明内容
发明要解决的课题
在上述专利文献1中，记载了电路基板与形成了圆柱状的空间的树脂被一体化而成的树脂成形体的制造方法。但是，在该文献中记载的方法中，限定为树脂形状具有圆柱状的空间的构造。没有公开能够使用树脂形状不受制约的通常的注塑成形且能够抑制成形时的树脂泄漏的树脂成形体。
用于解决课题的手段
根据本发明的第一方式，树脂成形体具备：半导体元件；形成了供所述半导体元件连接的导体的电路基板；以及与所述电路基板密合而一体化的树脂，在所述电路基板中的沿着所述电路基板中的与所述树脂密合的部分且沿着所述树脂的至少一方侧的侧面的边缘部区域中，设置有由具有与形成所述电路基板的表面层的材料的导热率相比更高的导热率的材料构成的树脂泄漏抑制层。
根据本发明的第二方式，传感器装置为：将上述树脂成形体中的半导体元件设为传感器元件。
发明效果
根据本发明，能够将电路基板和树脂高效地一体化，能够提高生产量。此外，通过树脂泄漏抑制层，能够抑制树脂向电路基板侧的泄漏。
附图说明
图1是作为本发明的第一实施方式的传感器装置的电路模块的俯视图。
图2是图1中图示的电路模块的II-II线剖面图。
图3是表示对图1中图示的电路模块进行注塑成形的状态的剖面图。
图4是在刚对图1中图示的电路模块进行注塑成形之后的树脂成形体的俯视图。
图5是本发明的第一实施方式的传感器装置的剖面图。
图6是用于说明树脂泄漏的抑制作用的图，(A)是表示具有本发明的树脂泄漏抑制层的构造的图，(B)是不具有树脂泄漏抑制层的以往的树脂成形体的图。
图7是作为本发明的第二实施方式的传感器装置的电路模块的俯视图。
图8是图7中图示的电路模块的VIII-VIII线剖面图。
图9是表示对图7中图示的电路模块进行注塑成形的状态的剖面图。
图10是作为本发明的第三实施方式的传感器装置的电路模块的俯视图。
图11是图10中图示的电路模块的XI-XI线剖面图。
图12是表示对图10中图示的电路模块进行注塑成形的状态的剖面图。
图13是在刚对图12中图示的电路模块进行注塑成形之后的树脂成形体的剖面图。
图14是作为本发明的第四实施方式的传感器装置的电路模块的俯视图。
图15是图14中图示的电路模块的XV-XV线剖面图。
图16是表示对图14中图示的电路模块进行注塑成形的状态的剖面图。
图17是在刚对图14中图示的电路模块进行注塑成形之后的树脂成形体的剖面图。
图18是本发明的第五实施方式的传感器装置的剖面图。
具体实施方式
以下，作为使用了电路基板的注塑成形品，举例说明具有被搭载于汽车的内燃机的吸入空气量传感器的传感器装置。吸入空气量传感器是测定气体(空气)的流量的流量传感器，设置以便用于由被搭载于内燃机的电子控制燃料喷射装置进行的吸入空气量控制。成为如下架构：在吸入空气量传感器中使用薄片的隔膜(diaphragm)的传感器芯片，针对传感器芯片中的计测数据，在控制芯片中进行收集/校正，并输出至外部。
-第一实施方式-
以下，参照图1～图5，说明本发明的第一实施方式。
图5是本发明的第一实施方式的传感器装置的剖面图。图1是构成图5所示的传感器装置的电路模块的俯视图，图2是图1中图示的电路模块的II-II线剖面图。
如图5所图示，传感器装置100具有将电路模块30和多个连接器引线18作为注塑品，电路模块30及连接器引线18与树脂50(参照图4)通过注塑成形被一体化而成的构造。
首先，说明电路模块30。
另外，在以下的说明中，X方向、Y方向、Z方向设为如各图所图示那样。
如图1、图2所示，电路模块30具备电路基板1、第一半导体元件3、第二半导体元件4、由导体形成的内层布线8、以及树脂泄漏抑制层21。
第一半导体元件3是流量传感器元件。第一半导体元件3在呈矩形形状的半导体基板的主面侧具有流量传感器部2。流量传感器部2形成在被设置于第一半导体元件3的隔膜上。隔膜是将半导体基板从反面侧蚀刻而成为薄片的薄片区域。虽未图示，在隔膜上，设置有发热电阻体、以及配置于该发热电阻体的周围而构成桥电路的作为控制用的多个电阻体。流量传感器部2利用由于被发热电阻体加热的气体而上升的控制用的电阻体的温度与气体的流量相关联，来检测其流量。
电路基板1由多层布线基板形成，在布线基板间具有内层布线8。各布线基板例如由环氧树脂等的聚氨酯树脂等热硬化性树脂、聚酰亚胺、丙烯酸等热可塑性树脂形成。或者，由在这些树脂材料中含有玻璃、二氧化硅等填料而成的基材形成。在电路基板1上，形成有容纳第一半导体元件3的凹部。第一半导体元件3以流量传感器部2作为上部侧而配置在该凹部内，通过粘结剂5被粘结在凹部的底面。第一半导体元件3通过线7被接合在被设置于电路基板1的焊盘(pad)9上。线7被通过灌封形成的封固树脂10封固。
第二半导体元件4具有CPU、输入电路、输出电路及存储器等，控制流量传感器部2以检测气体的流量。第二半导体元件4通过粘结剂5粘结在电路基板1的一面上，通过线7接合在被设置于电路基板1的焊盘9上。第二半导体元件4是裸芯片，其上表面被通过灌封形成的封固树脂10封固。
粘结剂5及封固树脂10由与电路基板1同样的材料形成。
第一半导体元件3和第二半导体元件4经由焊盘9通过内层布线8连接。此外，第二半导体元件4通过内层布线8与电路基板1的X方向后端的输入输出用的焊盘9a连接。
在电路基板1的上下表面，形成有树脂泄漏抑制层21。传感器装置100的树脂50如图4所图示，形成为矩形的框状，该矩形的框状具有X方向前方的前壁部51、X方向后方的后壁部52、以及在Y方向上延伸且将前壁部51和后壁部52连接的一对中间壁部53。被设置在电路基板1的上表面的树脂泄漏抑制层21在X方向的前方侧具有在Y方向上直线状地延伸的外边缘部21a，在X方向的后方侧具有形成为コ形的内边缘部21b。在电路基板1的上表面侧形成的树脂泄漏抑制层21沿着树脂50的前壁部51的外侧面51a、内侧面51b及一对中间壁部53的内侧面53a的各个而形成。此外，在电路基板1的下表面形成的树脂泄漏抑制层21形成于与在上表面侧形成的树脂泄漏抑制层21对置的位置。
接着，说明制作将该电路模块30作为注塑品，电路模块30与树脂50通过注塑成形被一体化而成的传感器装置100的方法。
图3是表示对图1中图示的电路模块30进行注塑成形的状态的剖面图，图4是在刚对图1中图示的电路模块30进行注塑成形之后的树脂成形体的俯视图。
另外，如上所述，传感器装置100具有将电路模块30和多个连接器引线18作为注塑品，该注塑品和树脂50被一体化而成的构造。
在上模具11和下模具12中，形成有容纳电路模块30和多个连接器引线18的容纳部。将电路模块30和多个连接器引线18容纳于下模具12的容纳部，闭合上模具11。在上模具11和下模具12中，分别形成有外周侧壁11a、12a、及在树脂泄漏抑制层21上配置的分隔壁11b、11c、11d、12b、12c、12d。在各分隔壁11b、11c、12b、12c与电路基板1的抵接面上，设置有夹紧部15。但是，如后述，根据电路基板1的厚度，夹紧部15不与电路基板1抵接。
上模具11的分隔壁11b、11c分别形成在与树脂泄漏抑制层21对应的位置。下模具12的分隔壁12b、12c分别形成在与上模具11的分隔壁11b、11c对应的位置。分隔壁11d、12d用于分隔电路基板1的输入输出用的焊盘9a和连接器引线18。在上下模具11、12的分隔壁11b、12b与分隔壁11c、12c之间，形成有空洞部13。此外，在上下模具11、12的分隔壁11d、12d与上下模具11、12的X方向的后端侧的外周侧壁11a、12a之间形成有空洞部14。另外，设为输入输出用的焊盘9a被上模具11的分隔壁11d覆盖。
在图3中图示的状态中，向上下模具11、12的空洞部13、14注入熔融树脂50a(参照图6)，填充空洞部13、14内。即，将电路模块30和多个连接器引线18作为注塑品，进行注塑成形。由此，熔融树脂50a被硬化，形成树脂50的前壁部51及一对中间壁部53与电路基板1密合而被一体化的树脂成形体。
另外，在注塑成形中，存在在注塑品和树脂之间不具有接合机构的一体化以及具有接合机构的一体化。不具有接合机构的一体化是将注塑品通过树脂围入、也就是夹持的构造。具有接合机构的一体化是在注塑品和树脂之间设置粘结层，或将注塑品和树脂化学地结合的构造。在本说明书中，电路基板1和树脂50密合既包含具有接合机构的构造，也包含不具有接合机构的构造。
在形成了树脂50后，将电路模块30从上下模具11、12取出后的状态如图4所示。
在电路基板1上，具有前壁部51、后壁部52及一对中间壁部53的矩形框状的树脂50被一体化。在后壁部52，多个连接器引线18被一体化。
其后，将电路基板1的输入输出的焊盘9a与连接器引线18通过线17连接。线17能够通过引线键合形成。
并且，在树脂50的正反面的各个面上，接合上罩54、和下罩55。由此，得到图5中图示的传感器装置100。
在图3中，在向上下模具11、12的空洞部13、14注入熔融树脂50a的工序中，为了防止树脂泄漏，需要使在各分隔壁11b、11c、12b、12c上设置的夹紧部15分别与电路基板1抵接。但是，电路基板1的厚度存在偏差，所以在电路基板1薄的情况下，在对上下模具11、12进行合模的状态下在电路基板1和夹紧部15之间产生间隙。特别是，若使用多层布线基板作为电路基板1，则有时各层的布线基板的偏差增大，厚度整体的偏差变大。如果以使得电路基板1的厚度变薄的方式发生偏差，在电路基板1和夹紧部15之间产生间隙，则存在发生树脂泄漏的可能性。
图6是用于说明树脂泄漏的抑制作用的图，图6的(A)是表示具有本发明的树脂泄漏抑制层的构造的图，图6的(B)是不具有树脂泄漏抑制层的以往的树脂成形体的图。
在图6的(B)中图示的以往的构造中，电路基板1的一面1a直接与夹紧部15对置。电路基板1由低导热的材料形成，所以熔融树脂50a的温度的冷却速度慢。因此，从电路基板1的一面1a和夹紧部15的间隙S漏出的熔融树脂50a的硬化花费时间，漏出树脂61的量变多。漏出树脂61的厚度与间隙S相比变得更厚，若漏出树脂61的收缩导致的负荷变大则使电路基板1变形。此外，有时漏出树脂61覆盖被安装在电路基板1上的电子部件32，压力作用于电子部件32。这样，若由于漏出树脂61而电路基板1变形，或压力作用于所安装的电子部件32，则对传感器装置100的性能带来影响。
相对于此，在本发明的第一实施方式中，成为图6的(A)中图示的构造。也就是说，沿着电路基板1中的形成树脂50的各侧面而形成树脂泄漏抑制层21。树脂泄漏抑制层21和夹紧部15的间隙S设定为与电路基板1的偏差量相等。树脂泄漏抑制层21由与电路基板1的基材的导热率相比更高的导热率的基材形成。因此，从树脂泄漏抑制层21和夹紧部15的间隙S漏出的熔融树脂50a通过树脂泄漏抑制层21而快速地冷却并固化。由此，漏出树脂61的量被抑制。若使树脂泄漏抑制层21的形成范围比树脂泄漏区域更广，则树脂的冷却效果变大而能够增大漏出树脂61的抑制效果。
树脂泄漏抑制层21能够使用铁、铜等金属、氮化铝、氧化铝等陶瓷、或混合了由碳等高导热材料构成的微粒子而成的环氧树脂、苯酚树脂等热硬化性树脂、或聚碳酸酯、聚对苯二甲酸乙脂等热可塑性树脂。
树脂泄漏抑制层21优选前壁部51、中间壁部53侧的端部形成在与前壁部51、中间壁部53重叠的位置，以使熔融树脂50a不直接与电路基板1接触。此外，树脂泄漏抑制层21优选在比形成漏出树脂61的区域更广的范围上形成。
根据上述第一实施方式，实现下述的效果。
(1)设为如下构造：沿着电路基板1中的与树脂50密合的部分，在该部分的至少边缘部区域中，设置由具有与电路基板1的基材的导热率相比更高的导热率的材料构成的树脂泄漏抑制层21。因此，从树脂泄漏抑制层21与上模具11的夹紧部15之间的间隙S漏出的熔融树脂50a的冷却、固化快速进行，能够抑制漏出树脂61。
(2)第一实施方式中的传感器装置100能够仅通过对于通常的注塑成形，追加在电路基板1中的与上下模具11、12的夹紧部15对应的位置上形成树脂泄漏抑制层21的工序而得到。因此，树脂50的形状等不受任何制约，能够进行将电路基板1作为注塑品的注塑成形，能够提高生产量。
(3)设为将在电路基板1和漏出树脂61之间设置的树脂泄漏抑制层21设置为比漏出树脂61更广的范围。因此，能够使抑制漏出树脂61的效果更大。
另外，在使用厚度的偏差大的多层布线基板作为电路基板1的构造中，伴随着漏出树脂61的抑制效果，能够提升可靠性提高的效果。
-第二实施方式-
图7是作为本发明的第二实施方式的传感器装置的电路模块的俯视图，图8是图7中图示的电路模块的VIII-VIII线剖面图。图9是表示对图7中图示的电路模块进行注塑成形的状态的剖面图。
第二实施方式与第一实施方式的不同点在于：将第二半导体元件24与输入输出用的焊盘9a通过外层布线22来连接。
在第二实施方式中，作为在电路基板1上安装的第二半导体元件24，使用DFP(双扁平封装：Dual Flat Package)或QFP(四扁平封装：Quad Flat Package)等被树脂封固的扁平封装。代替第一实施方式中的将第二半导体元件4和输入输出用的焊盘9a连接的内层布线8，在第二实施方式中，在电路基板1的上表面形成有外层布线22。外层布线22的一端与输入输出用的焊盘9a连接。
在第二实施方式中，在电路基板1上，安装有第二半导体元件24、第三半导体元件25及其他电子部件26。通过引线31与焊盘9接合而安装第二、第三半导体元件24、25。此外，通过端子部(未图示)与焊盘9接合而安装其他电子部件26。外层布线22如图7中虚线所示，被配设在电路基板1的上表面，将第二、第三半导体元件24、25及其他电子部件26经由焊盘9而连接。外层布线22被保护层23覆盖。其中，焊盘9、9a从保护层23露出。
铜等基本金属(贱金属)是廉价的，但若用作外层布线则易于被腐蚀。因此，露出焊盘9、9a，而将外层布线22整体通过保护层23覆盖。在将外层布线22整体通过保护层23覆盖后，将第二、第三半导体元件24、25及其他电子部件26与焊盘9接合。通过该过程，能够将保护层23高效地设置在电路基板1的上表面。
电路模块30及连接器引线18与树脂50的注塑成形如图9中图示那样，以在电路基板1上安装了第二、第三半导体元件24、25及其他电子部件26的状态来进行。
在第二实施方式中，还能够通过与树脂泄漏抑制层21相同的材料形成保护层23。若将保护层23设为与树脂泄漏抑制层21同一材料，则能够以与形成树脂泄漏抑制层21相同的工序来形成保护层23，能够节省工序数。
第二实施方式的其他结构与第一实施方式同样，对对应的构件赋予同一标号而省略说明。
在第二实施方式中，也实现与第一实施方式同样的效果。
-第三实施方式-
图10是作为本发明的第三实施方式的传感器装置的电路模块的俯视图，图11是图10中图示的电路模块的XI-XI线剖面图。图12是表示对图10中图示的电路模块进行注塑成形的状态的剖面图，图13是在刚对图12中图示的电路模块进行注塑成形之后的树脂成形体的剖面图。
第三实施方式与第二实施方式的不同点在于，还将树脂泄漏抑制层21设置在外边缘部21a和内边缘部21b之间，设为将外边缘部21a和内边缘部21b一体地连接的结构。
如图10、图11等所图示，在电路基板1上形成的树脂泄漏抑制层21具有外边缘部21a、内边缘部21b以及将外边缘部21a和内边缘部21b连接的中间部21c被一体化而形成的构造。另外，在图11中，将上模具11的分隔壁11b、11c以虚线来图示。
第三实施方式的其他结构与第一实施方式同样，对对应的构件赋予同一标号而省略说明。
在第三实施方式中，也实现与第一实施方式同样的效果。
另外，在第三实施方式中，也与第一、第二实施方式同样地进行注塑成形。在第三实施方式中，如图12中图示那样，树脂泄漏抑制层21跨越上下模具11、12的分隔壁11b和分隔壁11c而设置。因此，不需要将树脂泄漏抑制层21与夹紧部15准确地进行对位。由此，成为生产性好的结构，且能够使成品率好。此外，熔融树脂50a在从树脂泄漏抑制层21的外边缘部21a侧或树脂泄漏抑制层21的内边缘部21b侧漏出前，与树脂泄漏抑制层21的中间部21c接触而冷却，所以能够使漏出树脂61的量减少，或使其不存在。
-第四实施方式-
图14是作为本发明的第四实施方式的传感器装置的电路模块的俯视图，图15是图14中图示的电路模块的XV-XV线剖面图。图16是表示对图14中图示的电路模块进行注塑成形的状态的剖面图，图17是在刚对图14中图示的电路模块进行注塑成形之后的树脂成形体的剖面图。
第四实施方式与第三实施方式的不同点在于，代替内层布线8及树脂泄漏抑制层21，设置兼作树脂泄漏抑制层的外层布线27或焊盘状导体28。
如图14、图15中图示那样，供线7连接的焊盘9与供第二半导体元件24连接的焊盘9通过外层布线27连接。外层布线27例如由铜等金属导体形成，被配设多个。各外层布线27与第三实施方式的树脂泄漏抑制层21同样，具有外边缘部、内边缘部、中间部被一体地形成的长度，跨越上下模具11、12的分隔壁11b和分隔壁11c而设置。也就是说，多个外层布线27被配设为，相互分离地横断与树脂50的前壁部51密合的部分。
此外，如图14中图示那样，沿着树脂50的前壁部51的内侧面51b及一对中间壁部53各自的内侧面53a(参照图4)，排列有多个焊盘状导体28。换言之，多个焊盘状导体28与二点划线所示的上模具11的分隔部11c对应而排列。其中，焊盘状导体28没有形成在外层布线27延伸的区域。各焊盘状导体28由铜等金属导体形成，与外层布线22连接。由金属导体形成的外层布线27及焊盘状导体28与电路基板1的基材相比导热率更高。因此，能够抑制漏出树脂61的量。
另外，外层布线27及焊盘状导体28在与排列方向上相邻的外层布线27或焊盘状导体28之间具有间隙K。但是，熔融树脂50a在外层布线27或焊盘状导体28的上表面及侧面被冷却，所以具有抑制从该间隙K漏出的熔融树脂50a的效果。其中，优选间隙K不要太大。作为一例，在外层布线27或焊盘状导体28的上表面与夹紧部15的下表面之间的间隙S为0.75mm左右的情况下，间隙K能够设为几十μm～几百μm左右。其中，这仅是作为参考而示出的，间隙K根据树脂泄漏抑制层21和夹紧部15的间隙S、外层布线27、焊盘状导体28的材质、面积、形状等而变化。
第四实施方式的其他结构与第三实施方式同样，对对应的构件赋予同一标号而省略说明。
在第四实施方式中，也实现与第三实施方式同样的效果。
此外，在第四实施方式中，外层布线27或焊盘状导体28兼作树脂泄漏抑制层的功能，所以能够节省工序数。
另外，在第四实施方式中，也可以设为如下构造：代替外层布线27而设置内层布线8，仅具有焊盘状导体28。此外，也可以将焊盘状导体28设为仅与1～2个外层布线22连接的细长的形状。
-第五实施方式-
图18是本发明的第五实施方式的传感器装置的剖面图。
第五实施方式与第一实施方式的不同点在于，连接器引线没有被注塑成形。
如图18中图示那样，具有前壁部51、后壁部52及一对中间壁部53(在图18中未图示)的矩形框状的树脂50在电路基板1的区域内与电路基板1一体化。树脂泄漏抑制层21沿着前壁部51及后壁部52各自的内外侧面而形成。虽未图示，但树脂泄漏抑制层21也沿着一对中间壁部53而形成。
输入输出用的焊盘9a在树脂50的后壁部52的外部在电路基板1的上表面上形成。如二点划线所图示，还能够设为将与连接器65一体化的连接器引线64与输入输出用的焊盘9a连接的构造。还能够对输入输出用的焊盘9a连接线(wire)或汇流条(bus bar)等连接器引线以外的连接构件。
第五实施方式中的其他结构与第一实施方式同样，对对应的构件赋予同一标号而省略说明。
另外，还能够将第五实施方式所示的连接器引线没有被注塑成形的构造应用于第二～第四实施方式。
在上述各实施方式中，例示了具有流量传感器的传感器装置100。但是，本发明能够应用于具有流量传感器以外的其他传感器元件的传感器装置。传感器元件不限于1个，也可以具有多个传感器元件。
此外，本发明能够应用于安装了传感器元件以外的半导体元件的电路模块和树脂被一体化而成的树脂成形体。
上述，在第一～第三实施方式中，例示了将树脂泄漏抑制层21设置在电路基板1的上下双面的构造。但是，也可以将树脂泄漏抑制层21仅设置在电路基板1的上表面及下表面中的一方。
在上述各实施方式中，例示了使用多层布线基板作为电路基板1的构造，但电路基板1也可以设为单层的电路基板。此外，电路基板1也可以由基材和表面层不同的材料形成。在该情况下，树脂泄漏抑制层21、27、焊盘状导体28的导热率与电路基板1的表面层的材料的导热率相比更高即可。
上述说明了各种实施方式及变形例，但本发明并非限定于这些内容。也可以将上述各实施方式组合，进而，在本发明的技术思想的范围内想到的其他方式也包含于本发明的范围内。
下面的优先权基础申请的公开内容以引用方式编入于此。
日本专利申请2015年第193796号(2015年9月30日申请)
标号说明
1 电路基板
2 流量传感器部
3 第一半导体元件
4 第二半导体元件
8 内层布线
21 树脂泄漏抑制层
21a 外边缘部
21b 内边缘部
21c 中间部
22 外层布线
24 第二半导体元件
27 外层布线
28 焊盘状导体
30 电路模块
50 树脂
50a 熔融树脂
51 前壁部
51a 外侧面
51b 内侧面
52 后壁部
53 中间壁部
53a 内侧面
61 漏出树脂
100 传感器装置

Claims (12)

1.一种树脂成形体，具备：
半导体元件；
电路基板，形成有供所述半导体元件连接的导体；以及
树脂，与所述电路基板密合而被一体化，
在所述电路基板中的沿着与所述树脂密合的部分且沿着所述树脂的至少一方侧的侧面的边缘部区域中，设置有树脂泄漏抑制层，该树脂泄漏抑制层由具有比形成所述电路基板的表面层的材料的导热率更高的导热率的材料构成，
所述树脂泄漏抑制层由与所述导体同一材料形成。
2.如权利要求1所述的树脂成形体，
所述电路基板由多层布线基板形成。
3.如权利要求1所述的树脂成形体，
所述电路基板由含填料树脂形成。
4.如权利要求1所述的树脂成形体，
所述树脂包含热可塑性树脂。
5.如权利要求1所述的树脂成形体，
所述树脂泄漏抑制层在从所述树脂泄露的树脂泄漏部分与所述电路基板之间被设置于比所述树脂泄漏部分更广的范围。
6.如权利要求1所述的树脂成形体，
所述树脂泄漏抑制层还被设置在所述电路基板中的与所述树脂密合的部分。
7.如权利要求1所述的树脂成形体，
所述树脂泄漏抑制层与所述导体连接。
8.如权利要求1或7所述的树脂成形体，
所述树脂泄漏抑制层为：在所述电路基板中的沿着与所述树脂密合的部分的所述边缘部区域中，由相互分离地排列的焊盘状导体构成。
9.如权利要求1所述的树脂成形体，
所述树脂成形体具备多个与所述半导体元件连接的所述导体，
多个所述导体被配设为相互分离地横断所述电路基板中的与所述树脂密合的部分，
所述导体兼用作所述树脂泄漏抑制层的功能。
10.如权利要求1所述的树脂成形体，
所述电路基板和所述树脂是将所述电路基板作为注塑品进行一体化而成的注塑成形体。
11.一种传感器装置，
包含权利要求1至10的任一项所述的树脂成形体，
所述半导体元件是传感器元件。
12.如权利要求11所述的传感器装置，
所述传感器元件是流量传感器元件，所述流量传感器元件从所述树脂露出。
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