CN107611148A - 图像传感器模块及其制造方法 - Google Patents

图像传感器模块及其制造方法 Download PDF

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Publication number
CN107611148A
CN107611148A CN201610853391.0A CN201610853391A CN107611148A CN 107611148 A CN107611148 A CN 107611148A CN 201610853391 A CN201610853391 A CN 201610853391A CN 107611148 A CN107611148 A CN 107611148A
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CN
China
Prior art keywords
transparent component
image sensor
sensor module
semiconductor chip
lead
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Pending
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CN201610853391.0A
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English (en)
Chinese (zh)
Inventor
朴昇旭
朴鲁逸
郑泰成
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of CN107611148A publication Critical patent/CN107611148A/zh
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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201610853391.0A 2015-09-25 2016-09-26 图像传感器模块及其制造方法 Pending CN107611148A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0137109 2015-09-25
KR1020150137109A KR20170037459A (ko) 2015-09-25 2015-09-25 이미지 센서 모듈 및 이의 제조 방법

Publications (1)

Publication Number Publication Date
CN107611148A true CN107611148A (zh) 2018-01-19

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CN201610853391.0A Pending CN107611148A (zh) 2015-09-25 2016-09-26 图像传感器模块及其制造方法

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KR (1) KR20170037459A (ko)
CN (1) CN107611148A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102185047B1 (ko) 2019-05-20 2020-12-01 삼성전기주식회사 카메라 모듈

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076154A (ja) * 2000-08-23 2002-03-15 Kyocera Corp 半導体装置
CN1536659A (zh) * 1995-08-02 2004-10-13 松下电器产业株式会社 固体摄象装置及其制造方法
CN1707777A (zh) * 2004-05-10 2005-12-14 夏普株式会社 半导体器件及其制作方法和光学器件模块
CN1921128A (zh) * 2005-08-25 2007-02-28 矽格股份有限公司 光感测芯片的封装结构
CN1980325A (zh) * 2005-12-02 2007-06-13 鸿富锦精密工业（深圳）有限公司 数码相机模组
JP3135724U (ja) * 2007-07-11 2007-09-27 京セラケミカル株式会社 中空パッケージ
US20120104536A1 (en) * 2010-10-28 2012-05-03 Sony Corporation Imaging device package, method of manufacturing the imaging device package, and electronic apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6590269B1 (en) 2002-04-01 2003-07-08 Kingpak Technology Inc. Package structure for a photosensitive chip

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1536659A (zh) * 1995-08-02 2004-10-13 松下电器产业株式会社 固体摄象装置及其制造方法
JP2002076154A (ja) * 2000-08-23 2002-03-15 Kyocera Corp 半導体装置
CN1707777A (zh) * 2004-05-10 2005-12-14 夏普株式会社 半导体器件及其制作方法和光学器件模块
CN1921128A (zh) * 2005-08-25 2007-02-28 矽格股份有限公司 光感测芯片的封装结构
CN1980325A (zh) * 2005-12-02 2007-06-13 鸿富锦精密工业（深圳）有限公司 数码相机模组
JP3135724U (ja) * 2007-07-11 2007-09-27 京セラケミカル株式会社 中空パッケージ
US20120104536A1 (en) * 2010-10-28 2012-05-03 Sony Corporation Imaging device package, method of manufacturing the imaging device package, and electronic apparatus

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KR20170037459A (ko) 2017-04-04

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