CN107591420B

CN107591420B - Sensor package structure

Info

Publication number: CN107591420B
Application number: CN201610868073.1A
Authority: CN
Inventors: 杜修文; 辛宗宪; 陈建儒
Original assignee: Kingpak Technology Inc
Current assignee: Tong Hsing Electronic Industries Ltd
Priority date: 2016-07-06
Filing date: 2016-09-30
Publication date: 2020-02-18
Anticipated expiration: 2036-09-30
Also published as: TWI631675B; TWI630688B; CN107591374A; CN107591420A; CN107591374B; TW201803040A; TW201813024A

Abstract

A sensor package structure, comprising: the sensing device comprises a substrate, a sensing chip arranged on the substrate, a plurality of metal wires electrically connecting the substrate and the sensing chip, a light-transmitting layer corresponding to the sensing chip in position, and an adhesive body capable of enabling the light-transmitting layer to be stably adhered to the sensing chip and the substrate. The top surface of the sensing chip far away from the substrate comprises a sensing region and a spacing region surrounding the sensing region, the top surface is provided with at least one first edge and at least one second edge, and the distance between the first edge and the spacing region is larger than that between the second edge and the spacing region. The sensing chip is provided with a plurality of connecting pads between the first edge of the top surface and the spacing area, and no connecting pad is formed between the second edge and the spacing area. The adhesive body covers the outer edge of the sensing chip, the top surface part between the first edge and the interval area and the outer edge of the light-transmitting layer, and at least part of each metal wire is embedded in the adhesive body. Therefore, the sensor packaging structure can be suitable for packaging the sensing chip with smaller size.

Description

Sensor package structure

Technical Field

The present invention relates to a package structure and a sensor package structure.

Background

Electronic components in the existing electronic devices need to be developed in a direction of size reduction so that the electronic devices can mount more electronic components in a limited space. However, the development of the conventional sensor package structure (e.g., image sensor package structure) has faced the problem of difficulty in further reducing the size, and one of the main reasons is that the conventional sensor package structure is not suitable for packaging the smaller-sized sensing chip.

The present inventors have considered that the above-mentioned drawbacks can be improved, and have conducted extensive studies in conjunction with the use of the theory, and finally have proposed an invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.

Disclosure of Invention

Embodiments of the present invention provide a sensor package structure, which can effectively solve the problems of the conventional sensor package structure.

The embodiment of the invention discloses a sensor packaging structure, which comprises: the substrate comprises an upper surface and a lower surface which are positioned on two opposite sides, and a plurality of welding pads are formed on the upper surface of the substrate; a sensing chip, wherein the sensing chip comprises a top surface and a bottom surface which are positioned at two opposite sides, the bottom surface of the sensing chip is arranged on the upper surface of the substrate, and the top surface comprises a sensing region and a spacing region which surrounds the sensing region; the top surface is provided with at least one first edge and at least one second edge, a plurality of connecting pads are formed between the at least one first edge of the top surface and the spacing area of the sensing chip, and no connecting pad is formed between the at least one second edge and the spacing area; one end of each metal wire is connected to the corresponding welding pad, and the other end of each metal wire is connected to the corresponding connecting pad; a first bonding layer disposed on the top surface portion between at least one of the first edges and the spacer region; a second bonding layer disposed on the upper surface and adjacent to at least one of the second edges of the sensing chip, wherein a height of the second bonding layer relative to the upper surface is equal to a height of the first bonding layer relative to the upper surface; the light-transmitting layer is provided with a first surface and a second surface which are positioned at two opposite sides, and the second surface of the light-transmitting layer is adhered to the first bonding layer and the second bonding layer; and the sealing colloid is arranged on the upper surface of the substrate and covers the outer edge of the sensing chip, the outer edge of the first bonding layer, the outer edge of the second bonding layer and the outer edge of the light-transmitting layer, and at least part of each metal wire and each welding pad are embedded in the sealing colloid.

Preferably, the outer edge of the first bonding layer includes an arc-shaped curved surface, and an arc center of the arc-shaped curved surface is located on the molding compound.

Preferably, the outer edge of the second bonding layer is S-shaped curved in a cross section perpendicular to the upper surface.

Preferably, the outer edge of the second bonding layer is a distance from the sensing region equal to a distance of at least one of the first edges from the sensing region.

Preferably, the second bonding layer is further disposed on the top surface portion between at least one of the second edges and the spacer region.

Preferably, the area of the top surface region between at least one of the second edges and the spacer region is smaller than the area of the spacer region to which it is connected.

Preferably, at least one of the first edges is spaced further from the spacer than at least one of the second edges.

Preferably, the sensing chip is orthographically projected on the second surface to form a projection area, and the projection area is located in the outline of the second surface; and a fixing area is reserved on the outer side of the part of the second surface, which is adhered to the first bonding layer and the second bonding layer, and the fixing area is further coated by the sealing colloid.

Preferably, the encapsulant is further defined as a liquid encapsulant, and an included angle between the first surface of the transparent layer and the surface of the adjacent encapsulant is greater than 90 degrees and less than or equal to 180 degrees.

Preferably, the sensor package structure further includes a molding compound disposed at a top edge of the molding compound, a top surface of the molding compound is parallel to the adjacent first surface, and a side surface of the molding compound is coplanar with an adjacent side edge of the molding compound.

Preferably, the molding compound is further defined as a molding compound, and an included angle of 180 degrees is formed between the first surface of the light-transmitting layer and the surface of the adjacent molding compound.

The embodiment of the invention also discloses a sensor packaging structure, which is characterized by comprising the following components: the substrate comprises an upper surface and a lower surface which are positioned on two opposite sides, and a plurality of welding pads are formed on the upper surface of the substrate; a sensing chip, wherein the sensing chip comprises a top surface and a bottom surface which are positioned at two opposite sides, the bottom surface of the sensing chip is arranged on the upper surface of the substrate, and the top surface comprises a sensing region and a spacing region which surrounds the sensing region; the top surface is provided with at least one first edge and at least one second edge, the distance between the at least one first edge and the spacing area is larger than the distance between the at least one second edge and the spacing area, a plurality of connecting pads are formed between the at least one first edge of the top surface and the spacing area of the sensing chip, and no connecting pad is formed between the at least one second edge and the spacing area of the top surface; one end of each metal wire is connected to the corresponding welding pad, and the other end of each metal wire is connected to the corresponding connecting pad; the light-transmitting layer is provided with a first surface and a second surface which are positioned at two opposite sides, and the second surface of the light-transmitting layer faces the top surface of the sensing chip; and the bonding body is arranged on the upper surface of the substrate and covers the outer edge of the sensing chip, the top surface part between at least one first edge and the spacing area, and the outer edge of the light-transmitting layer and part of the second surface, and at least part of each metal wire and each welding pad are embedded in the bonding body.

Preferably, the adhesive body comprises: the supporting layer is arranged beside at least one second edge of the sensing chip in an adjacent mode, and the end edge of the supporting layer far away from the substrate is as high as the top surface of the sensing chip; the bonding layer is arranged on the supporting layer and the top surface part between at least one first edge and the spacing area, and the second surface of the light-transmitting layer is adhered to the bonding layer; and the sealing colloid is arranged on the upper surface of the substrate and covers the outer edges of the sensing chip, the supporting layer, the bonding layer and the light transmitting layer, and at least part of each metal wire and each welding pad are embedded in the sealing colloid.

Preferably, the outer edge of the supporting layer includes an arc-shaped side surface, and an arc center of the arc-shaped side surface is located inside the molding compound.

Preferably, the outer edge of the bonding layer includes an arc-shaped curved surface, and an arc center of the arc-shaped curved surface is located on the molding compound.

Preferably, the outer edge of the attachment layer is spaced from the sensing region by a distance equal to the distance of at least one of the first edges from the sensing region.

Preferably, the bonding layer is further disposed on the top surface portion between at least one of the second edges and the spacer region.

Preferably, the sensing chip is orthographically projected on the second surface to form a projection area, and the projection area is located in the outline of the second surface; the second surface is provided with a fixed area outside the part adhered to the jointing layer, and the sealing colloid further coats the fixed area.

In summary, the sensor package structure disclosed in the present invention can be applied to a sensing chip without a connecting pad between the top edge (e.g., the second edge) and the sensing region, thereby facilitating the packaging of the sensing chip with a reduced size.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are set forth to illustrate, but are not intended to limit the scope of the invention.

Drawings

FIG. 1 is a schematic cross-sectional view of a sensor package structure according to an embodiment of the invention.

Fig. 2 is a schematic top view of fig. 1 (omitting the encapsulant, the transparent layer, and the metal lines).

Fig. 3 is a schematic top view of fig. 1 (omitting the sealing compound).

Fig. 4 is another schematic top view of fig. 1 (omitting the encapsulant).

Fig. 5A is a partially enlarged schematic view of the region a in fig. 1.

Fig. 5B is a schematic diagram of a variation of fig. 5A.

Fig. 6 is a partially enlarged view of the region B of fig. 1.

Fig. 7 is a schematic cross-sectional view of a variation of fig. 1.

Fig. 8 is a schematic cross-sectional view of another variation of fig. 1.

Fig. 9 is a schematic cross-sectional view of yet another variation of fig. 1.

FIG. 10 is a schematic cross-sectional view of a second embodiment of a sensor package structure according to the present invention.

FIG. 11 is a top view of a sensor package structure in accordance with a third embodiment of the present invention.

FIG. 12 is a schematic cross-sectional view taken along section line XII-XII of FIG. 11.

Detailed Description

[ example one ]

Please refer to fig. 1 to 9, which are related to a first embodiment of the present invention, it should be noted that, in the present embodiment, related numbers and shapes are mentioned in the drawings for describing the embodiments of the present invention in detail only, so as to facilitate understanding of the present invention, and not for limiting the scope of the present invention.

As shown in fig. 1 and fig. 2, the present embodiment discloses a sensor package structure 100, and more particularly, to an image sensor package structure 100, but the invention is not limited thereto. The sensor package structure 100 includes: the sensor comprises a substrate 1, a sensing chip 2 arranged on the substrate 1, a plurality of metal wires 3 for establishing electrical connection between the substrate 1 and the sensing chip 2, a light-transmitting layer 4 corresponding to the sensing chip 2, and an adhesive body 5 for stably adhering the light-transmitting layer 4 to the sensing chip 2 and the substrate 1. The structure of each component in the sensor package structure 100 will be described separately, and the connection relationship between the components will be described in due course.

As shown in fig. 1 and fig. 2, the substrate 1 may be a plastic substrate, a ceramic substrate, a lead frame (leadframe), or other plate-shaped materials, which is not limited in this embodiment. The substrate 1 includes an upper surface 11 and a lower surface 12 located on opposite sides, and the substrate 1 has a plurality of pads 111 formed on the upper surface 11 and spaced apart from each other. Furthermore, the substrate is also formed with a plurality of bonding pads (not labeled) on the lower surface 12 for respectively bonding a plurality of bonding balls (not labeled). That is, the substrate 1 of the present embodiment is described as a structure having a Ball Grid Array (BGA), but is not limited thereto.

As shown in fig. 1 and fig. 2, the sensing chip 2 is an image sensing chip in the embodiment, but the embodiment does not limit the type of the sensing chip 2. The sensor chip 2 includes a top surface 21 and a bottom surface 22 on opposite sides, and an outer edge 23 perpendicularly connecting the top surface 21 and the bottom surface 22. The top surface 21 includes a sensing region 211 and a spacer region 212 surrounding the sensing region 211. The sensing region 211 is substantially square (e.g., square or rectangular) in the present embodiment, and the center of the sensing region 211 may be the center of the top surface 21 (see fig. 4) or a distance from the center of the top surface 21 (see fig. 2 and 3). The spacers 212 are in a square ring shape in the present embodiment, and the width of each portion of the spacers 212 is substantially the same, but the specific shape of the spacers 212 may be adjusted according to the requirement of the designer or the manufacturer, which is not limited herein.

Further, the top surface 21 has at least one first edge 213 and at least one second edge 214, and the outer edge 23 includes at least one side surface 231 connected to at least one of the second edges 214. The distance D1 (fig. 6) between the first edge 213 and the spacer 212 is greater than the distance D2 (fig. 5A) between the second edge 214 and the spacer 212. In the embodiment, the distance D2 between the second edge 214 and the sensing region 211 is smaller than the distance D1 between the first edge 213 of 1/3 to 1/4 and the sensing region 211 (D2<1/3 to 1/4D1), but the ratio of the distance D2 to the distance D1 can be adjusted according to the needs of the designer or manufacturer, and is not limited herein. The sensing chip 2 has a plurality of connection pads 215 formed between the first edge 213 of the top surface 21 and the spacer 212, and no connection pads 215 are formed between the second edge 214 and the spacer 212.

The top surface 21 may include a plurality of first edges 213 and a single second edge 214 (see fig. 3), a plurality of first edges 213 and a plurality of second edges 214 (see fig. 4), or a single first edge 213 and a plurality of second edges 214 (not shown), which is not limited herein. That is, FIG. 1 is a schematic sectional view taken along section line IA-IA of FIG. 3 or a schematic sectional view taken along section line IB-IB of FIG. 4.

Furthermore, the sensing chip 2 is disposed on the upper surface 11 of the substrate 1 by the bottom surface 22, and the portion of the upper surface 11 of the substrate 1 on which the sensing chip 2 is disposed is substantially located within the area surrounded by the plurality of pads 111. In the embodiment, the bottom surface 22 of the sensing chip 2 is fixed on the upper surface 11 of the substrate 1 by a Die attach epoxy (not labeled), but the specific arrangement is not limited thereto.

As shown in fig. 1 and 2, one end of each of the metal lines 3 is connected to the pads 111 of the substrate 1, and the other end of each of the metal lines 3 is connected to the connection pads 215 of the sensing chip 2. In this embodiment, each metal line 3 is formed in a reverse bond manner, so that an included angle (not shown) smaller than or equal to 45 degrees can be formed between the top surface 21 of the sensing chip 2 and an adjacent portion of each metal line 3 (such as the metal line 3 portion above the top surface 21 in fig. 1), so that the vertex 31 of each metal line 3 can be located at a lower height position to avoid touching the light-transmitting layer 4, but the invention is not limited thereto. For example, the angle may be 30 degrees or less.

As shown in fig. 1 and fig. 2, the transparent layer 4 is a flat glass in this embodiment, but the type of the transparent layer 4 is not limited in this embodiment. The transparent layer 4 has a first surface 41 and a second surface 42 on opposite sides, and an outer edge 43 perpendicularly connected to the first surface 41 and the second surface 42. The first surface 41 and the second surface 42 of the present embodiment are square (e.g., square or rectangle) with the same size, and the area of the second surface 42 of the light-transmissive layer 4 is larger than the area of the top surface 21 of the sensor chip 2, but not limited thereto.

Furthermore, the light-transmitting layer 4 is fixed to the substrate 1 and the sensing chip 2 by the adhesive body 5, and the second surface 42 of the light-transmitting layer 4 is substantially parallel and faces the top surface 21 of the sensing chip 2. Further, the sensing chip 2 is orthographically projected on the second surface 42 to form a projection area (not labeled), and the projection area is located within the contour of the second surface 42. In addition, the second surface 42 of the light-transmissive layer 4 is preferably disposed adjacent to but not in contact with each metal line 3, and the vertex 31 of each metal line 3 is located outside the space formed by the forward projection of the light-transmissive layer 4 toward the substrate 1, and the height H1 (as shown in fig. 6) of the vertex 31 of each metal line 3 relative to the top surface 21 of the sensing chip 2 is preferably smaller than the height H2 (as shown in fig. 6) of the second surface 42 of the light-transmissive layer 4 relative to the top surface 21 of the sensing chip 2, but is not limited thereto.

Referring to fig. 1, 5A and 6, the bonding body 5 may be a single member made of the same material or a composite member made of multiple materials, and the type of the bonding body 5 is not limited in this embodiment. The adhesive body 5 is disposed on the upper surface of the substrate 1 and covers the outer edge 23 of the sensing chip 2, the top surface 21 between the first edge 213 and the spacer 212, and the outer edge 43 and a portion of the second surface 42 of the light-transmissive layer 4. At least a portion of each metal line 3 and each pad 111 are embedded in the bonding body 5.

In more detail, the adhesive body 5 of the present embodiment includes a supporting layer 51, a bonding layer 52, and an encapsulant 53 connected to each other, but the invention is not limited thereto. The support layer 51 and the bonding layer 52 are preferably made of the same material (e.g., Glass bonding resin) but different from the encapsulant 53 (e.g., liquid encapsulant). The connection relationship of the support layer 51, the bonding layer 52, and the sealant 53 with respect to other members will be described below.

Referring to fig. 2 and 5A, the shape and the forming position of the supporting layer 51 in the present embodiment are related to the second edge 214 of the top surface 21 of the sensing chip 2. For example, the support layer 51 shown in fig. 3 is a single elongated configuration that is substantially parallel to the second edge 214, and the support layer 51 shown in fig. 4 is two elongated configurations that are substantially parallel to the second edge 214. The supporting layer 51 is disposed adjacent to the second edge 214 of the sensing chip 2 (e.g., the supporting layer 51 abuts against the side 231 of the sensing chip 2 connected to the second edge 214), and an end edge of the supporting layer 51 (e.g., a top edge of the supporting layer 51 in fig. 5A) away from the substrate 1 is substantially equal to the top 21 (or the second edge 214) of the sensing chip 2.

Further, the outer edge 511 of the supporting layer 51 includes an arc-shaped side 511, and an arc center (not labeled) of the arc-shaped side 511 is located inside the molding compound 53 (e.g., the arc center is located inside the supporting layer 51), but is not limited thereto. For example, as shown in fig. 5B, the arc center (not labeled) of the arc-shaped side surface 511 may also be located on the molding compound 53.

As shown in fig. 2, 5A, and 6, the bonding layer 52 is substantially a square ring, and the inner edge of the ring shape of the bonding layer 52 is preferably connected to the outer edge of the spacer 212 of the sensor chip 2. That is, the spacer region 212 is a region that is predetermined to be reserved for spacing the bonding layer 52 from the sensing region 211. The bonding layer 52 is disposed on the support layer 51 and the portion of the top surface 21 between the first edge 213 and the spacer 212, and the bonding layer 52 disposed on the support layer 51 (as shown in fig. 5A) may be further disposed on the portion of the top surface 21 between the second edge 214 and the spacer 212. The area of the top surface 21 between the second edge 214 and the spacer 212 is preferably smaller than the area of the spacer 212 connected thereto. In another aspect, in an embodiment not shown, when the bonding layer 52 disposed on the supporting layer 51 is not disposed on the top surface 21 of the sensing chip 2, the second edge 214 of the top surface 21 is equivalent to the outer edge of the spacer 212.

Further, the width and height of the bonding layer 52 portion (see fig. 5A) disposed on the support layer 51 are substantially equal to the width and height of the bonding layer 52 portion (see fig. 6) disposed on the top surface 21 portion between the first edge 213 and the spacer 212. The outer edge 521 of the bonding layer 52 includes an arc-shaped curved surface 521, and the arc center of the arc-shaped curved surface 521 is located on the molding compound 53. The maximum distance D3 (fig. 5A) between the curved surface 521 of the bonding layer 52 and the sensing region 211 is preferably substantially equal to the distance D4 (fig. 6) between the first edge 213 and the sensing region 211. In a cross section (as shown in fig. 5A) of the sensor package structure 100 perpendicular to the upper surface 11 of the substrate 1, the arc-shaped side surface 511 of the supporting layer 51 is connected with the arc-shaped curved surface 521 of the bonding layer 52 to form an S-shaped curve, but the invention is not limited thereto (as shown in fig. 5B).

Furthermore, a portion of each metal line 3 is embedded in the bonding layer 52, that is, each connection pad 215 and the local metal line 3 connected thereto are embedded in the bonding layer 52 in the present embodiment. In a not-shown embodiment, the connection pads 215 and the local metal lines 3 connected thereto may not be embedded in the bonding layer 52.

As shown in fig. 1, the second surface 42 of the transparent layer 4 is adhered to the bonding layer 52, so that the second surface 42 of the transparent layer 4, the bonding layer 52, and the top surface 21 of the sensing chip 2 together surround and form a closed space 6, and the sensing region 211 of the sensing chip 2 is located in the closed space 6. The second surface 42 has a fixing region 421 in a square ring shape outside the portion adhered to the bonding layer 52.

As shown in fig. 1, 5A, and 6, the encapsulant 53 is disposed on the upper surface 11 of the substrate 1 and covers the outer edge 23 of the sensing chip 2, the outer edge 511 of the supporting layer 51, the outer edge 521 of the bonding layer 52, the outer edge 43 of the light-transmitting layer 4, and the fixing region 421. At least a portion of each metal line 3 and each pad 111 are embedded in the molding compound 53. In the present embodiment, each metal wire 3 is embedded in the encapsulant 53 and the bonding layer 52, and the vertex 31 of each metal wire 3 is embedded in the encapsulant 53. However, in an embodiment not shown, each metal wire 3 may be completely embedded in the molding compound 53.

More specifically, an included angle between the first surface 41 of the transparent layer 4 and the surface of the adjacent encapsulant 53 (such as the top edge of the encapsulant 53 in fig. 1) is greater than 90 degrees and less than or equal to 180 degreesThe angle

Preferably between 115 degrees and 150 degrees. The side edge of the sealing colloid 53 is substantially aligned with the side edge of the substrate 1. Although the encapsulant 53 in this embodiment is described as not being attached to the first surface 41 of the light-transmitting layer 4, the present invention does not exclude the encapsulant 53 from being attached to a part of the first surface 41 (e.g., the outer edge of the first surface 41) of the light-transmitting layer 4.

In summary, the sensor package structure 100 disclosed in the present embodiment can be applied to the sensing chip 2 without the connecting pad 215 between the edge of the top surface 21 (e.g., the second edge 214) and the sensing region 211, so as to facilitate packaging the sensing chip 2 with reduced size. The sensor package structure 100 can also facilitate the packaging of the sensor chip 2 with reduced size by embedding a portion of the metal wire 3 in the bonding layer 52.

Furthermore, the encapsulant 53 is adhered to the arc-shaped side surface 511 of the supporting layer 51 and the arc-shaped curved surface 521 of the bonding layer 52, and the outer edge 43 and the fixing region 421 of the light-transmitting layer 4, so that the light-transmitting layer 4 is more stably disposed at a predetermined position, and the light-transmitting layer 4 is kept away from the metal wire 3, so as to achieve the requirement that the light-transmitting layer 4 is substantially parallel to the top surface 21 of the sensing chip 2, thereby providing the sensor package structure 100 with better reliability.

Moreover, since the supporting layer 51 is manufactured in one process, and then the bonding layer 52 is manufactured in another process, the reduced portion of the sensing chip 2 (e.g., the portion between the sensing region 211 and the second edge 214) can be filled with the supporting layer 51, so as to provide sufficient space for disposing the bonding layer 52, and prevent the bonding layer 52 from crossing the spacer region 212 and contacting the sensing region 211.

In addition, the sensor package structure 100 disclosed in fig. 1 to 6 of the present embodiment can also be adjusted according to the requirement of the designer, but since the variation types of the sensor package structure 100 of the present embodiment are too many to be disclosed one by the drawings, the following only lists the variation types of some sensor package structures 100.

As shown in fig. 7, the outer edge 43 of the light-transmitting layer 4 is stepped and embedded in the encapsulant 53, and the area of the first surface 41 of the light-transmitting layer 4 is smaller than that of the second surface 42. However, in an embodiment not shown, it is not excluded that the area of the first surface 41 is larger than the area of the second surface 42.

As shown in fig. 8, the adhesive 5 of the sensor package 100 may further include a molding compound 54(molding compound). The molding compound 54 is disposed at the top edge of the molding compound 53, the top surface of the molding compound 54 is substantially parallel to the first surface 41 of the light-transmitting layer 4, and the side surface of the molding compound 54 is coplanar with the side edge of the adjacent molding compound 53, but not limited thereto. Moreover, the top surface of the molding compound 54 and the first surface 41 of the light-transmitting layer 4 adjacent to the molding compound may be substantially coplanar, but the invention is not limited thereto.

As shown in fig. 9, the encapsulant 53 may be a molding encapsulant 54, and the first surface 41 of the transparent layer 4 is substantially parallel to the adjacent surface of the encapsulant 53, preferably forming an included angle of substantially 180 degrees

[ example two ]

Please refer to fig. 10, which is a second embodiment of the present invention, the present embodiment is similar to the above embodiments, and the same points are not repeated, and the difference between the two embodiments mainly lies in: the bonding layer 52 and the supporting layer 51 of the first embodiment can be replaced by the first bonding layer 55 and the second bonding layer 56 of this embodiment, that is, the supporting layer 51 of the first embodiment and the portion of the bonding layer 52 disposed thereon (as shown in fig. 5A) are manufactured by one process and defined as the second bonding layer 56 in this embodiment, and the rest of the bonding layer 52 of the first embodiment (as shown in fig. 6) are manufactured by another process and defined as the first bonding layer 55 in this embodiment, but the invention is not limited thereto. The specific structural differences of the present embodiment compared to the first embodiment are substantially as follows.

The first bonding layer 55 is disposed on the top surface 21 between the first edge 213 and the spacer 212, and the second bonding layer 56 is disposed on the upper surface 11 of the substrate 1 and adjacent to the second edge 214 of the sensor chip 2 (e.g., the second bonding layer 56 abuts against the side 231 of the sensor chip 2). Wherein the second bonding layer 56 may be further disposed on the portion of the top surface 21 between the second edge 214 and the spacer region 212, and the area of the portion of the top surface 21 between the second edge 214 and the spacer region 212 is smaller than the area of the portion of the spacer region 212 to which it is attached. And the height of the top edge of the second bonding layer 56 relative to the upper surface 11 of the substrate 1 is substantially the same as the height of the top edge of the first bonding layer 55 relative to the upper surface 11 of the substrate 1.

Furthermore, the maximum distance between the outer edge 561 of the upper half block of the second bonding layer 56 and the sensing region 211 is substantially equal to the distance between the first edge 213 and the sensing region 211. The outer edge 551 of the first bonding layer 55 includes an arc-shaped side 551, and the arc center of the arc-shaped side 551 is located on the molding compound 53. In a cross section of the sensor package structure 100 perpendicular to the upper surface 11 of the substrate 1, the outer edge of the second bonding layer 56 has an S-shaped curve, but is not limited thereto (see fig. 5B).

The second surface 42 of the light-transmissive layer 4 is adhered to the first bonding layer 55 and the second bonding layer 56; and a fixing region 421 is left on the second surface 42 outside the portion bonded to the first bonding layer 55 and the second bonding layer 56.

The encapsulant 53 is disposed on the upper surface 11 of the substrate 1 and covers the outer edge 23 of the sensing chip 2, the outer edge 551 of the first bonding layer 55, the outer edge 561 of the second bonding layer 56, the outer edge 43 of the transparent layer 4, and the fixing region 421, and a portion of each metal line 3 and each pad 111 are embedded in the encapsulant 53.

[ third example ]

Please refer to fig. 11 and 12, which are third embodiments of the present invention, and the present embodiment is similar to the above embodiments, and the same parts are not repeated, and the difference between the two embodiments mainly lies in: the sensor package structure 100 of the present embodiment does not need to have any supporting layer 51, that is, the edges of the top surface 21 of the sensing chip 2 of the present embodiment are all the first edges 213.

It should be noted that the size of the sensor package structure 100 of the above three embodiments can be reduced in many places, for example, as shown in fig. 12, the distance D5 between the outer edge 43 of the transparent layer 4 and the adjacent side edge of the encapsulant 53 is approximately 300 μm to 500 μm, the maximum distance D6 between the outer edge of any one of the bonding pads 111 of the substrate 1 and the outer edge 23 of the adjacent sensing chip 2 is approximately 200 μm to 350 μm, and the distance D7 between the outer edge 23 of the sensing chip 2 adjacent to any one of the bonding pads 111 and the adjacent side edge of the encapsulant 53 is approximately 225 μm to 425 μm. Therefore, the size of the sensor package structure 100 is smaller than that of the prior art, and a smaller amount of the sealing adhesive 53 can be used, so that the thermal expansion and cold contraction stress of the sensor package structure 100 is reduced by using the small amount of the sealing adhesive 53, and the reliability is improved.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, which is defined by the appended claims.

Claims

1. A sensor package, comprising:

the substrate comprises an upper surface and a lower surface which are positioned on two opposite sides, and a plurality of welding pads are formed on the upper surface of the substrate;

a sensing chip, wherein the sensing chip comprises a top surface and a bottom surface which are positioned at two opposite sides, the bottom surface of the sensing chip is arranged on the upper surface of the substrate, and the top surface comprises a sensing region and a spacing region which surrounds the sensing region; the top surface is provided with at least one first edge and at least one second edge, a plurality of connecting pads are formed between the at least one first edge of the top surface and the spacing area of the sensing chip, and no connecting pad is formed between the at least one second edge and the spacing area;

one end of each metal wire is connected to the corresponding welding pad, and the other end of each metal wire is connected to the corresponding connecting pad;

a first bonding layer disposed on the top surface portion between at least one of the first edges and the spacer region;

a second bonding layer disposed on the upper surface and adjacent to at least one of the second edges of the sensing chip, wherein a height of the second bonding layer relative to the upper surface is equal to a height of the first bonding layer relative to the upper surface;

the light-transmitting layer is provided with a first surface and a second surface which are positioned at two opposite sides, and the second surface of the light-transmitting layer is adhered to the first bonding layer and the second bonding layer; and

the sealing colloid is arranged on the upper surface of the substrate and covers the outer edge of the sensing chip, the outer edge of the first bonding layer, the outer edge of the second bonding layer and the outer edge of the light-transmitting layer, and at least part of each metal wire and each welding pad are embedded in the sealing colloid;

the outer edge of the first bonding layer comprises an arc-shaped curved surface, and the arc center of the arc-shaped curved surface is positioned on the sealing colloid.

2. The sensor package structure of claim 1, wherein the outer edge of the second bonding layer is S-shaped in a cross-section perpendicular to the upper surface.

3. The sensor package structure of claim 1, wherein the outer edge of the second bonding layer is a distance from the sensing region equal to a distance of at least one of the first edges from the sensing region.

4. The sensor package structure of claim 1, wherein the second bonding layer is further disposed on the top surface portion between at least one of the second edges and the spacers.

5. The sensor package structure of claim 4, wherein an area of the top surface portion between at least one of the second edges and the spacers is smaller than an area of the spacer portion to which it is connected.

6. The sensor package structure of any one of claims 1-5, wherein at least one of the first edges is farther from the spacers than at least one of the second edges.

7. The sensor package structure of any one of claims 1 to 5, wherein the sensing chip is orthographically projected onto the second surface to form a projected area, and the projected area is located within a contour of the second surface; and a fixing area is reserved on the outer side of the part of the second surface, which is adhered to the first bonding layer and the second bonding layer, and the fixing area is further coated by the sealing colloid.

8. The sensor package structure of any one of claims 1 to 5, wherein the encapsulant is further defined as a liquid encapsulant, and an included angle between the first surface of the transparent layer and the adjacent surface of the encapsulant is greater than 90 degrees and less than or equal to 180 degrees.

9. The sensor package of claim 8, further comprising a molding compound disposed at a top edge of the molding compound, wherein a top surface of the molding compound is parallel to the adjacent first surface, and a side surface of the molding compound is coplanar with an adjacent side edge of the molding compound.

10. The sensor package structure as recited in any one of claims 1 to 5, wherein the encapsulant is further defined as a molding encapsulant, and the first surface of the transparent layer forms an angle of 180 degrees with an adjacent surface of the encapsulant.

11. A sensor package, comprising:

a sensing chip, wherein the sensing chip comprises a top surface and a bottom surface which are positioned at two opposite sides, the bottom surface of the sensing chip is arranged on the upper surface of the substrate, and the top surface comprises a sensing region and a spacing region which surrounds the sensing region; the top surface is provided with at least one first edge and at least one second edge, the distance between the at least one first edge and the spacing area is larger than the distance between the at least one second edge and the spacing area, a plurality of connecting pads are formed between the at least one first edge of the top surface and the spacing area of the sensing chip, and no connecting pad is formed between the at least one second edge and the spacing area of the top surface;

the light-transmitting layer is provided with a first surface and a second surface which are positioned at two opposite sides, and the second surface of the light-transmitting layer faces the top surface of the sensing chip; and

an adhesive disposed on the upper surface of the substrate and covering the outer edge of the sensing chip, the top portion between at least one of the first edge and the spacer, and the outer edge of the light transmissive layer and a portion of the second surface, wherein at least a portion of each of the metal lines and each of the pads are embedded in the adhesive, the adhesive comprising:

the supporting layer is arranged beside at least one second edge of the sensing chip in an adjacent mode, and the end edge of the supporting layer far away from the substrate is as high as the top surface of the sensing chip;

the bonding layer is arranged on the supporting layer and the top surface part between at least one first edge and the spacing area, and the second surface of the light-transmitting layer is adhered to the bonding layer;

the sealing colloid is arranged on the upper surface of the substrate and covers the outer edge of the sensing chip, the outer edge of the supporting layer, the outer edge of the bonding layer and the outer edge of the light-transmitting layer, and at least part of each metal wire and each welding pad are embedded in the sealing colloid; the outer edge of the supporting layer comprises an arc-shaped side surface, and the arc center of the arc-shaped side surface is positioned on the inner side of the sealing colloid.

12. The sensor package structure of claim 11, wherein the outer edge of the bonding layer comprises an arc-shaped curved surface, and an arc center of the arc-shaped curved surface of the bonding layer is located on the encapsulant.

13. The sensor package structure of claim 11, wherein a maximum distance between the outer edge of the bonding layer and the sensing region is equal to a distance between at least one of the first edges and the sensing region.

14. The sensor package structure of claim 11, wherein the bonding layer is further disposed on the top surface portion between at least one of the second edges and the spacers.

15. The sensor package structure of claim 14, wherein an area of the top surface portion between at least one of the second edges and the spacers is less than an area of the spacer portion to which it is connected.

16. The sensor package structure of any one of claims 11 to 15, wherein the sensing chip is orthographically projected onto the second surface to form a projected area, and the projected area is located within a contour of the second surface; the second surface is provided with a fixed area outside the part adhered to the jointing layer, and the sealing colloid further coats the fixed area.