CN111524881B

CN111524881B - Light source device

Info

Publication number: CN111524881B
Application number: CN201911258466.0A
Authority: CN
Inventors: 蔡心伟; 蔡濬璘; 吴家政; 于宥辰; 王建添; 蔡泰文; 张百豪; 杨淑桦; 苏渝宏
Original assignee: Lite On Opto Technology Changzhou Co Ltd; Lite On Technology Corp
Current assignee: Lite On Opto Technology Changzhou Co Ltd; Lite On Technology Corp
Priority date: 2019-02-01
Filing date: 2019-12-10
Publication date: 2022-07-05
Anticipated expiration: 2039-12-10
Also published as: CN111520690A; CN111524881A; CN111520690B; CN111520619A

Abstract

The invention discloses a light source device, which comprises a substrate, a light-emitting unit, an enclosing wall, a light-transmitting piece and a heightening block. The substrate comprises a plate body, and an upper electrode layer and a lower electrode layer which are respectively arranged on two opposite sides of the plate body and are electrically coupled with each other. The light emitting unit is mounted on the upper electrode layer. The enclosing wall is arranged on the substrate and surrounds the outer side of the light-emitting unit. The light-transmitting piece is arranged on the wall and covers the light-emitting unit. The heightening block comprises an insulating body, and a top electrode layer and a bottom electrode layer which are respectively positioned at two opposite sides of the insulating body and electrically coupled with each other. The top electrode layer is connected to the lower electrode layer, and the outline of the top electrode layer is cut to be identical to the outline of the lower electrode layer. Therefore, the light source device adopts a structure different from a TO-CAN package so as TO meet different requirements of various types at present.

Description

Light source device

Technical Field

The present disclosure relates to light source devices, and particularly to a light source device with a novel packaging structure.

Background

In recent years, the conventional light source device is not greatly improved in structure because of adopting a TO-CAN (Transistor Outline-CAN) package, and thus, the conventional light source device is gradually difficult TO meet various requirements. The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.

Disclosure of Invention

Embodiments of the present invention provide a light source device, which can effectively overcome the possible defects of the conventional light source device.

The embodiment of the invention discloses a light source device, which is characterized by comprising: the substrate comprises a plate body, an upper electrode layer and a lower electrode layer which are respectively arranged on two opposite sides of the plate body, and the upper electrode layer and the lower electrode layer are electrically coupled with each other; a light emitting unit mounted on the upper electrode layer; an enclosure wall arranged on the substrate and surrounding the outer side of the light-emitting unit; the light-transmitting piece is arranged on the wall and covers the light-emitting unit; the heightening block comprises an insulating body, and a top electrode layer and a bottom electrode layer which are respectively positioned at two opposite sides of the insulating body, and the top electrode layer and the bottom electrode layer are electrically coupled with each other; the top electrode layer is connected to the lower electrode layer, and the outline of the top electrode layer is cut to be aligned with the outline of the lower electrode layer.

Preferably, the insulation body includes a top surface, a bottom surface, and a ring side surface connected to the top surface and the bottom surface, the top electrode layer is disposed on the top surface, the bottom electrode layer is disposed on the bottom surface, the block includes a plurality of extension lines formed on the ring side surface, and the plurality of extension lines are connected to the top electrode layer and the bottom electrode layer.

Preferably, the top electrode layer of the block includes N heat dissipation pads and a plurality of metal pads surrounding the N heat dissipation pads, N is a positive integer greater than 1, and the plurality of metal pads are arranged in a square ring, and the number of any row of the metal pads in the square ring is not less than N.

Preferably, the heightening block comprises M heat dissipation pillars and a plurality of metal pillars surrounding the M heat dissipation pillars, M being a positive integer and smaller than N; the M heat dissipation posts and the plurality of metal posts are all embedded in the insulating body, and the top electrode layer and the bottom electrode layer are electrically coupled with each other through the M heat dissipation posts and the plurality of metal posts; the M radiating columns are respectively connected to the N radiating pads, and the plurality of metal columns are respectively connected to the plurality of metal pads.

Preferably, the area of any one of the heat dissipation pads is larger than that of any one of the metal pads, and the outline of the bottom electrode layer of the raised block is identical to the outline of the top electrode layer.

Preferably, the light source device includes a driving chip and a detector, the driving chip and the detector are mounted on the upper electrode layer, and the driving chip and the detector are electrically coupled to the light emitting unit through the upper electrode layer, and the light emitting unit and the detector are located on the same side of the driving chip.

Preferably, the light source device includes a cover plate disposed on the light-transmitting member and fixed to the wall, and the cover plate is formed with a through hole corresponding to the light-emitting unit and the detector.

Preferably, the light source device includes a detection loop and two transmission lines, the detection loop is formed on at least one of the transparent member and the cover plate, the two transmission lines are formed on the surrounding wall, and the detection loop is electrically coupled to the upper electrode layer through the two transmission lines.

Preferably, the upper electrode layer includes a ground pad, the light source device includes a metal cover fixed to the inner edge of the surrounding wall and connected to the ground pad, and the metal cover at least covers the driving chip, and the metal cover has an opening corresponding to the light emitting unit and the detector.

Preferably, the light source device includes a driving chip, the substrate includes an inner circuit unit embedded in the board, the driving chip is embedded in the board, and the driving chip is electrically coupled to the light emitting unit and the lower electrode layer through the inner circuit unit.

Preferably, the insulation body is concavely provided with a plurality of grooves extending from the top surface to the bottom surface on the ring side surface, and the plurality of extension lines are respectively formed in the plurality of grooves.

In summary, the light source device disclosed in the embodiments of the present invention adopts a structure different from the TO-CAN package, so as TO meet different requirements of the present application. Furthermore, the light source device is mounted on the heightening block through the substrate to change the height of the light emitting unit, thereby being beneficial to being applicable to different height requirements. Furthermore, the light source device can effectively improve the heat dissipation efficiency of the substrate by the design of the raised block structure of the embodiment (for example, the contour of the top electrode layer is equal to the contour of the lower electrode layer of the substrate).

For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.

Drawings

Fig. 1 is a schematic perspective view of a light source device according to a first embodiment of the invention.

Fig. 2 is an exploded view of fig. 1.

Fig. 3 is an exploded view of fig. 1 from another perspective.

Fig. 4 is a schematic cross-sectional view of fig. 1 along the sectional line IV-IV.

Fig. 5 is a schematic cross-sectional view of another embodiment of fig. 1 (the block is not shown).

Fig. 6 is a schematic perspective view illustrating a light source device according to an embodiment of the invention, in which a detection circuit is formed on a light-transmitting member.

Fig. 7 is a schematic perspective view illustrating a light source device according to an embodiment of the invention, in which a detection circuit is formed on a light-transmitting member and a cover plate is not included.

Fig. 8 is a perspective view of another aspect of the block according to the first embodiment of the invention.

Fig. 9 is a schematic perspective view of a light source device according to a second embodiment of the invention.

Fig. 10 is an exploded view of fig. 9.

Fig. 11 is an exploded view of fig. 9 from another perspective.

Fig. 12 is a schematic perspective view of a light source device according to a third embodiment of the invention.

Fig. 13 is a schematic cross-sectional view of fig. 12 along the sectional line XIII-XIII.

Fig. 14 is a schematic perspective view of a light source device according to a fourth embodiment of the invention.

Fig. 15 is a schematic perspective view of a light source device according to a fifth embodiment of the present invention.

Fig. 16 is a schematic cross-sectional view of fig. 15 taken along section line XVI-XVI.

Detailed Description

The following is a description of the embodiments of the "light source device" disclosed in the present application with reference to specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure in the present application. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

[ first embodiment ]

Fig. 1 to 8 show a first embodiment of the present invention. The embodiment discloses a light source device 100, which includes a substrate 1, an electronic component 2 mounted on the substrate 1, a wall 3 disposed on the substrate 1, a metal cover 4 fixed at an inner edge of the wall 3 and electrically coupled to the substrate 1, a light-transmitting member 5 disposed on the wall 3, a cover plate 6 disposed on the light-transmitting member 5 and fixed to the wall 3, a detecting unit 7 electrically coupled to the substrate 1, and a raising block 8 for the substrate 1 to set.

It should be noted that, although the light source device 100 is described in the embodiment as including the above components, the invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, some components (such as the metal housing 4, the block 8, the cover plate 6, or other components) of the light source device 100 may be omitted according to design requirements. The respective component configurations of the light source device 100 of the present embodiment and the connection relationships thereof will be described below, respectively.

The substrate 1 includes a plate 11 (e.g., a ceramic plate or a plastic plate), an upper electrode layer 12 and a lower electrode layer 13 respectively disposed on two opposite sides of the plate 11, and an inner circuit unit 14 (e.g., fig. 5) embedded in the plate 11 and connecting the upper electrode layer 12 and the lower electrode layer 13. That is, the upper electrode layer 12 and the lower electrode layer 13 are electrically coupled to each other (through the plurality of internal circuit units 14) in the present embodiment.

The board 11 includes a first board 111 and a second board 112 located on opposite sides, the upper electrode layer 12 is formed on the first board 111 and includes a ground pad 121 and a signal pad 122, and the lower electrode layer 13 is formed on the second board 112. Furthermore, the inner circuit unit 14 includes a plurality of metal pillars (not labeled), and two ends of each metal pillar are respectively connected to the upper electrode layer 12 and the lower electrode layer 13.

In the present embodiment, the electronic component 2 includes a light emitting unit 21, a detector 22, a driving chip 23, and a plurality of capacitors 24. The light emitting unit 21, the detector 22, the driving chip 23, and the plurality of capacitors 24 are mounted (or disposed) on the upper electrode layer 12, and are electrically coupled to each other through the upper electrode layer 12 (e.g., the driving chip 23 is electrically coupled to the light emitting unit 21 through the upper electrode layer 12, and the plurality of capacitors 24 are electrically coupled to the driving chip 23 through the upper electrode layer 12). It should be noted that, the electronic component 2 may also omit components (such as at least one capacitor 24, the detector 22, and/or the driving chip 23) other than the light-emitting unit 21 according to design requirements, but the invention is not limited thereto.

Furthermore, the light emitting unit 21, the detector 22, and the capacitors 24 are located on the same side of the driving chip 23 in this embodiment (for example, the light emitting unit 21, the detector 22, and the capacitors 24 are located on the right half of the substrate 1, and the driving chip 23 is located on the left half of the substrate 1 in fig. 2), and the capacitors 24 are adjacent to the light emitting unit 21 and the detector 22. In addition, the ground pad 121 and the signal pad 122 of the upper electrode layer 12 are both adjacent to the same edge of the substrate 1, the ground pad 121 is adjacent to the driving chip 23, and the signal pad 122 is adjacent to the light emitting unit 21 or the detector 22.

In more detail, the light Emitting unit 21 is illustrated in the present embodiment as a Vertical-Cavity Surface-Emitting Laser (VCSEL) to provide an infrared light, and the detector 22 is exemplified by a Photodiode (PD) chip in the present embodiment, but the invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the light emitting unit 21 may also be at least one infrared light emitting diode chip.

In the present embodiment, the detector 22 can be used to receive an invisible light emitted from the light emitting unit 21 and reflected by the light-transmitting member 5, so as to monitor the damage condition of the light-transmitting member 5 (or monitor the light signal of the light emitting unit 21). In addition, the detector 22 can be used for other detection control according to design requirements.

In the present embodiment, the plurality of capacitors 24 are illustrated as two capacitors 24 with different sizes, one of the capacitors 24 is used for stabilizing the voltage of the light source apparatus 100, and the other capacitor 24 is used for reducing the Equivalent series inductance (ESL) of the light source apparatus 100.

The driving chip 23 is illustrated as the upper electrode layer 12 disposed on the substrate 1 in the embodiment, but the invention is not limited thereto. For example, as shown in fig. 5, the driving chip 23 is embedded in the board body 11 of the substrate 1, and the driving chip 23 is electrically coupled to the light emitting unit 21, the detector 22, the plurality of capacitors 24, and the lower electrode layer 13 through the internal wiring unit 14 embedded in the board body 11, and the driving chip 23 is preferably located below the light emitting unit 21, the detector 22, and the plurality of capacitors 24.

Accordingly, in the present embodiment, the light source device 100 integrates the light emitting unit 21, the detector 22, the driving chip 23, and the capacitors 24, so as to effectively shorten the signal transmission path between the above components, and further effectively reduce the inductance value of the light source device 100. Furthermore, the light source device 100 can be embedded in the board 11 through the driving chip 23, so as to effectively reduce the overall size of the light source device 100 and further reduce the inductance value of the light source device 100.

The enclosing wall 3 is in a rectangular ring shape, and an inner edge of the enclosing wall 3 is formed with a configuration groove 31 at an upper half portion thereof and an accommodating space 32 communicated with the configuration groove 31 at a lower half portion thereof. The disposition slot 31 has an annular slot bottom 311 adjacent to the accommodation space 32, and the annular slot bottom 311 is concavely provided with a C-shaped rubber channel 312 and an air escape opening 313 located between two ends of the C-shaped rubber channel 312, and the air escape opening 313 is not communicated to the rubber channel 312.

Furthermore, the enclosing wall 3 is formed with two notches 33 at its top edge, two notches 34 at its bottom edge, and two separated circuit grooves 35 at its outer surface. Wherein, two of the slots 33 are respectively located on two short sides of the enclosing wall 3, two of the notches 34 are located on one of the long sides of the enclosing wall 3, and two of the wire grooves 35 are respectively formed by extending from two of the slots 33 to two of the notches 34. Further, each of the wire grooves 35 is substantially L-shaped in the present embodiment, and the groove width of the wire groove 35 is not greater than the width of the notch 33 and not greater than the width of the notch 34, but the present invention is not limited thereto.

The bottom edge of the enclosing wall 3 is disposed on the first plate surface 111 of the substrate 1 and surrounds at least a portion of the electronic component 2. For example: in fig. 4, the enclosing wall 3 surrounds the outer sides of all the electronic components 2; however, in fig. 5, the enclosing wall 3 only surrounds the light emitting unit 21, the detector 22, and the plurality of capacitors 24, but does not surround the driving chip 23. That is, at least a portion of the electronic component 2 surrounded by the enclosing wall 3 is located in the accommodating space 32.

Furthermore, the bottom edge of the enclosing wall 3 is disposed on the periphery of the first board surface 111, and the two notches 34 of the enclosing wall 3 are respectively corresponding to the grounding pad 121 and the signal pad 122 of the substrate 1; that is, the two circuit grooves 35 are formed by extending from the two notches 33 toward the ground pad 121 and the signal pad 122, respectively, and the accommodating space 32 of the surrounding wall 3 can be communicated with the space outside the surrounding wall 3 through the two notches 34, so that the ground pad 121 and the signal pad 122 are exposed outside the accommodating space 32 through the two notches 34, respectively.

In this embodiment, the metal cover 4 includes a rectangular main board 41 and a plurality of side boards 42 bent and extended from the edge of the main board 41, and each of the side boards 42 is connected to the main board 41 in a substantially perpendicular manner, but the invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the metal cover 4 may omit the portions of the side plates 42; alternatively, the side plates 42 may be integrally connected to each other.

Furthermore, the metal cover 4 (on the main board 41) is formed with an opening 411, and the size of the opening 411 substantially occupies at least 50% of the main board 41. One side plate 42 of the metal cover 4 is formed with two grooves 421 arranged at intervals and a bending foot 422 extending from one of the grooves 421, and the rest side plates 42 are in a complete rectangle shape. In this embodiment, the metal cover 4 extends the groove 421 away from the opening 411 to form the bending leg 422.

Further, the metal cover 4 is fixed (e.g., embedded) on the inner edge of the surrounding wall 3 and located in the accommodating space 32 so as to surround at least a portion of the electronic component 2. For example: in fig. 4, the metal casing 4 surrounds the outer sides of all the electronic components 2; however, in fig. 5, the metal cover 4 surrounds only the light emitting unit 21, the detector 22, and the capacitors 24, but does not surround the driving chip 23.

The opening 411 of the metal cover 4 corresponds to the light emitting unit 21 and the detector 22 (i.e., the light emitting unit 21 and the detector 22 are located below the opening 411), the main board 41 of the metal cover 4 at least shields the driving chip 23, the two grooves 421 correspond to the ground pad 121 and the signal pad 122 of the substrate 1, and the lower surface of the bending pin 422 is connected to the ground pad 121 and passes through the corresponding notch 34 (see fig. 1). That is, the light source device 100 can see the local bending leg 422 from the outside through the notch 34. The upper surface of the bend angle 422 is connected to the transmission line 72 located in the recess 34.

Accordingly, in the present embodiment, the electronic component 2 is disposed inside the metal cover 4 (or the metal cover 4 surrounds the electronic component 2), so that the electronic component 2 can be effectively prevented from being interfered by external signals through the metal cover 4, and the electronic component 2 provides a more stable operation performance.

In the present embodiment, the light-transmitting member 5 is a rectangular transparent glass plate, and in other embodiments not shown in the present invention, the light-transmitting member 5 may further have a light-diffusing polymer (light-diffusing polymer) disposed on a bottom surface thereof. The light-transmitting member 5 is disposed on the enclosing wall 3 and located in the disposition groove 31. Specifically, the bottom surface of the light-transmitting member 5 is disposed on the annular groove bottom 311 of the disposition groove 31, and the adhesive channel 312 is filled with an adhesive (not shown) to firmly adhere the light-transmitting member 5 to the enclosing wall 3, while the top surface of the light-transmitting member 5 does not exceed any of the notches 33 of the enclosing wall 3 (i.e., the top surface of the light-transmitting member 5 is lower than any of the notches 33).

Moreover, the light-transmitting element 5 is located above the metal cover 4, and the light-transmitting element 5 is spaced from the metal cover 4 in this embodiment, but the invention is not limited thereto. The light-transmitting element 5 covers most of the metal cover 4 (e.g., only the local bending leg 422 is not covered by the light-transmitting element 5), so that the light-transmitting element 5 also covers the light-emitting unit 21; that is, the light emitted from the light emitting unit 21 can only pass through the light-transmitting member 5 through the opening 411 of the metal cover 4 in this embodiment.

It should be noted that, the light emitting unit 21 is "covered" by the light-transmitting member 5, and the connection relationship between the two components can be understood in this embodiment as follows: the light emitting unit 21 is located in an area along which the light-transmitting member 5 projects forward toward the substrate 1, but the invention is not limited thereto.

The cover plate 6 is flat and opaque in the present embodiment, and two bumps 61 are formed on the cover plate 6 and located at two opposite ends respectively. The cover plate 6 is further formed with a through hole 62, and the through hole 62 is located adjacent to one of the protrusions 61. In addition, the cover plate 6 is disposed on the light-transmitting member 5 and fixed to the enclosing wall 3, and the cover plate 6 and the light-transmitting member 5 are disposed at an interval in the embodiment, but the invention is not limited thereto. The two protrusions 61 of the cover plate 6 are respectively disposed in the two notches 33 of the enclosing wall 3, and the top surface of the cover plate 6 preferably does not protrude from the top edge of the enclosing wall 3.

Furthermore, the through hole 62 of the cover plate 6 corresponds to the light emitting unit 21 but not to the driving chip 23. That is to say, the opening 411 of the metal cover 4 and the light emitting unit 21 are both located right below the through hole 62 of the cover plate 6, so that the light emitted by the light emitting unit 21 can only be emitted out through the through hole 62 of the cover plate 6 after passing through the opening 411 of the metal cover 4 and the light-transmitting member 5. In addition, in other embodiments not shown in the present disclosure, the position of the through hole 62 may also correspond to the light emitting unit 21 and the detector 22.

The detecting unit 7 includes a detecting circuit 71 and two transmission lines 72 connected to the detecting circuit 71. In the present embodiment, the detection circuit 71 is formed on the bottom surface of the cover plate 6 (i.e., the surface of the cover plate 6 facing the light-transmitting member 5), and the detection circuit 71 is formed by extending one of the two bumps 61 of the cover plate 6 from the other bump 61 to the other bump 61 by bypassing the through hole 62, but the shape or layout of the detection circuit 71 can be adjusted and changed according to design requirements, and is not limited to the drawings of the present embodiment.

Accordingly, in the light source device 100 of the present embodiment, the cover plate 6 is installed on the light-transmitting member 5, so that the cover plate 6 effectively protects the light-transmitting member 5, and the cover plate 6 can also provide a non-transparent detection circuit 71, so as to greatly reduce the material cost of the detection circuit 71.

In more detail, in the present embodiment, a circuit groove 63 extending from one of the bumps 61 to the other bump 61 is concavely formed on the surface of the cover plate 6 facing the light-transmitting member 5 for forming or disposing the detection circuit 71, but the invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the surface of the cover plate 6 facing the light-transmitting member 5 may also be planar (i.e., the cover plate 6 does not have the wiring groove 63).

Furthermore, two transmission lines 72 are formed on the surrounding wall 3, and the two transmission lines 72 are respectively connected to two ends of the detection loop 71, so that the detection loop 71 can be electrically coupled to the upper electrode layer 12 through the two transmission lines 72 (including conductive adhesive). In this embodiment, the two transmission lines 72 are respectively connected to the detection circuit 71 through the two slots 33, and the two transmission lines 72 are respectively located in the two line slots 35 of the enclosure 3, and each of the transmission lines 72 does not protrude out of the corresponding line slot 35.

As shown in fig. 4, the light source device 100 further includes two protection layers 9 respectively disposed in the two wire grooves 35, and the two transmission lines 72 are respectively embedded in the two protection layers 9, so that any one of the transmission lines 72 can be effectively protected by the corresponding protection layer 9, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the light source device 100 may also omit the protection layer 9, so as to expose the transmission line 72; alternatively, the light source device 100 may omit the protective layer 9, and the two line grooves 35 are not formed in the peripheral wall 3, so that the transmission line 72 is formed in a protruding manner on the outer surface of the peripheral wall 3.

It should be noted that, although the detection circuit 71 shown in fig. 1 to 4 is illustrated as being formed on the cover plate 6, the invention is not limited thereto. For example, as shown in fig. 6, the detection circuit 71 may also be transparent and formed on (the top surface of) the light-transmitting member 5; alternatively, as shown in fig. 7, the transparent detection circuit 71 is not only formed on the top surface of the light-transmitting member 5, but also the cover plate 6 and the block 8 are omitted from the light source device 100. Accordingly, it can be inferred from the configurations shown in fig. 3, fig. 6, and fig. 7 that the detection circuit 71 can be formed on at least one of the transparent member 5 and the cover 6 in the present invention.

Furthermore, one of the two transmission lines 72 is connected to the signal pad 122 of the substrate 1, and the other transmission line 72 is electrically coupled to the ground pad 121 of the substrate 1 through the bending pin 422. That is, the bending pin 422 is clamped between the ground pad 121 and one of the transmission lines 72 in this embodiment, but the invention is not limited thereto. For example. In other embodiments not shown in the present invention, the metal cover 4 of the light source device 100 may be omitted, one end of the two transmission lines 72 of the detection unit 7 is connected to the detection circuit 71 through the two slots 33, and the other end of the two transmission lines 72 is directly connected to the signal pad 122 and the ground pad 121, respectively.

The block 8 includes an insulating body 81, a top electrode layer 82 and a bottom electrode layer 83 respectively disposed on two opposite sides of the insulating body 81 and electrically coupled to each other, and at least one heat dissipation pillar 84 and a plurality of metal pillars 85 embedded in the insulating body 81. The material of the insulating body 81 may be ceramic or plastic, and the insulating body 81 is a substantially rectangular cylinder. In other words, the insulating body 81 includes a top surface 811, a bottom surface 812, and a ring side surface 813 connecting the top surface 811 and the bottom surface 812.

The top electrode layer 82 is disposed on the top surface 811 of the insulating body 81, the bottom electrode layer 83 is disposed on the bottom surface 812 of the insulating body 81, and the outline of the top electrode layer 82 is equal to the outline of the bottom electrode layer 83 and also equal to the outline of the lower electrode layer 13 of the substrate 1, so for brevity, the embodiment will only describe the structure of the top electrode layer 82, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the top electrode layer 82 and the bottom electrode layer 83 may also have a slightly different structure.

Specifically, the top electrode layer 82 includes N heat dissipation pads 821 and a plurality of metal pads 822 surrounding the N heat dissipation pads 821, where N is a positive integer greater than 1. The area of any of the pads 821 is larger than that of any of the pads 822, and the plurality of pads 822 are arranged in a square ring, and the number of pads 822 in any row of the square ring is not less than N. While N in this embodiment is 4, the present invention is not limited thereto.

The number of the heat dissipation pillars 84 is defined as M, and M is a positive integer and less than N. One end of each of the M heat dissipation studs 84 is connected to the N heat dissipation pads 821 of the top electrode layer 82, and the other end of each of the M heat dissipation studs 84 is connected to a plurality of heat dissipation pads (not labeled) of the bottom electrode layer 83. While M in this embodiment is 2, the present invention is not limited thereto. Furthermore, the metal posts 85 surround the M heat dissipation posts 84, one end of the metal posts 85 is connected to the metal pads 822 of the top electrode layer 82, and the other end of the metal posts 85 is connected to the metal pads 831 of the bottom electrode layer 83.

The substrate 1 is mounted on the raised block 8, so that the substrate 1 and the raised block 8 are electrically coupled. The top electrode layer 82 is connected to the lower electrode layer 13 of the substrate 1, and the contour of the top electrode layer 82 is aligned with the contour of the lower electrode layer 13. Further, the heat of the substrate 1 can be dissipated through the heat dissipation pad 821 and the heat dissipation stud 84 of the block 8, and the signal of the substrate 1 can be transmitted through the metal pad 822 and the metal stud 85 of the block 8.

Accordingly, the light source device 100 is mounted on the block 8 through the substrate 1 in the embodiment to change the height of the light emitting unit 21, so as to be suitable for different height requirements. Furthermore, the light source device 100 can effectively improve the heat dissipation efficiency of the substrate 1 by the structural design of the block 8 (e.g., the contour of the top electrode layer 82 is equal to the contour of the bottom electrode layer 13 of the substrate 1).

In addition, although the embodiment is described with reference to the structure of the block 8 shown in fig. 1 to 4, the block 8 can be adjusted according to the design requirement, and is not limited to the above figures. For example, as shown in fig. 8, the block 8 includes an insulating body 81, a top electrode layer 82 and a bottom electrode layer 83 respectively located at two opposite sides of the insulating body 81 and electrically coupled to each other, and a plurality of extension lines 86 formed on the ring side 813, wherein the plurality of extension lines 86 are connected to the top electrode layer 82 and the bottom electrode layer 83. In other words, the metal pad 822 of the top electrode layer 82 is connected to the metal pad (not labeled) of the bottom electrode layer 83 through the plurality of extension lines 86, respectively, so that the pad-up block 8 can replace the metal pillar 85 with the extension lines 86. The profile of the top electrode layer 82 is identical to the profile of the bottom electrode layer 83.

In more detail, as shown in fig. 8, the insulating body 81 is recessed with a plurality of grooves 87 (linearly) extending from the top surface 811 to the bottom surface 812 on the ring side surface 813. The plurality of extension lines 86 are respectively formed in the plurality of trenches 87, and in the present embodiment, one of the metal pads 822 of the top electrode layer 82 extends through the corresponding trench 87 to connect to a metal pad (not labeled) of the bottom electrode layer 83. With the use of the mat-up layer 8 of the present invention, when the mat-up layer 8 is disposed on a circuit board for subsequent assembly, electrical connection can be made by laser welding or Surface Mount Technology (Surface Mount Technology).

[ example two ]

Please refer to fig. 9 to 11, which illustrate a second embodiment of the present invention. The present embodiment is similar to the above embodiments, so the same parts (such as the substrate 1, the electronic component 2, the metal cover 4, and the padding block 8) between the embodiments are not repeated, and the features of the present embodiment different from the above embodiments are roughly described as follows:

as shown in fig. 9 and 10, in the present embodiment, the cover plate 6 and the protective layer 9 are omitted from the light source device 100, the enclosing wall 3 is a recessed groove 31 formed with an opening 411 corresponding to the metal cover 4 (i.e., at least a portion of the driving chip 23 is shielded by the metal cover 4 and the enclosing wall 3), and the enclosing wall 3 may also be formed with a rubber channel and an air vent (not shown) at the annular groove bottom 311. Furthermore, the bottom edge of the disposition groove 31 of the enclosing wall 3 is connected to the opening 411, the enclosing wall 3 is formed with three notches 33 which are arranged at intervals and connected to the disposition groove 31 in a concave manner on the top surface, and the outer surface of the enclosing wall 3 is not formed with any wiring groove, but the invention is not limited thereto.

The light-transmitting member 5 is positioned in the disposition groove 31 and covers the light-emitting unit 21; that is, the light emitted from the light emitting unit 21 can only pass through the light-transmitting member 5 through the opening 411 of the metal cover 4 in this embodiment. Furthermore, the detection loop 71 is formed on (the top surface of) the light-transmitting member 5, and the two transmission lines 72 are formed on (the outer surface of) the enclosing wall 3, and the detection loop 71 is electrically coupled to (the ground pad 121 and the signal pad 122 of) the upper electrode layer 12 through the two transmission lines 72.

Further, the transmission line 72 connected to the signal pad 122 is formed with a signal contact 722 connected to the detection circuit 71, the transmission line 72 connected to the ground pad 121 may be formed with two ground contacts 721, and the signal contact 722 and the two ground contacts 721 are respectively located in the three slots 33. Wherein, the two grounding contacts 721 are selectively connected to the detecting circuit 71; in another aspect, the detection circuit 71 may extend from the signal contact 722 to one of the ground contacts 721 according to design requirements (e.g., impedance matching), for example, in other embodiments not shown, the detection circuit 71 is disposed on two adjacent sides of the light-transmissive element 5 to connect the signal contact 722 and the ground contact 721 adjacent to the signal contact 722.

However, the number of the notches 33 of the surrounding wall 3 can be adjusted and varied according to design requirements. For example, in other embodiments not shown in the present invention, the number of the slots 33 of the surrounding wall 3 may be only two, and the transmission line 72 connected to the grounding pad 121 has only one grounding contact 721, and the signal contact 722 and the grounding contact 721 are respectively located in the two slots 33 of the surrounding wall 3.

In addition, although the light-transmitting member 5 of the present embodiment is described as the disposition groove 31 disposed on the enclosing wall 3, the matching relationship between the light-transmitting member 5 and the enclosing wall 3 can be adjusted and changed according to the design requirement, and is not limited to fig. 9.

[ third example ]

As shown in fig. 12 and 13, the light source device 100 is substantially the same as the second embodiment, except that the enclosing wall 3 omits a configuration groove 31 for carrying the light-transmitting member 5, the enclosing wall 3 is formed with a light-transmitting hole 36 corresponding to the light-emitting unit 21, and the light-transmitting member 5 is disposed inside the enclosing wall 3 and covers the light-transmitting hole 36; that is, the light-transmitting member 5 is located in the accommodating space 32 of the enclosing wall 3, and the light-transmitting member 5 is adhered to the inner surface of the upper cover of the enclosing wall 3 in a reverse adhesion manner. The light source device 100 may be provided with the detection unit 7 as in the above-mentioned embodiment, the transmission line 72 of the detection unit 7 may be formed on the inner side of the enclosing wall 3, or may be formed on the outer side of the enclosing wall 3 as in the above-mentioned embodiment, and the detection circuit 71 of the detection unit 7 may be provided on the top surface or the bottom surface of the light-transmitting member 5. The light source device 100 of the present invention can also omit the detection unit 7 according to design requirements.

[ example four ]

Please refer to fig. 14, which illustrates a fourth embodiment of the present invention. This embodiment is similar to the first to third embodiments, so the same parts (the substrate 1, the electronic component 2, and the pad-up block 8) between the embodiments are not repeated, and the features of this embodiment different from the first to third embodiments are generally described as follows:

in this embodiment, the cover plate 6 and the protection layer 9 are omitted from the light source device 100, and the metal cover 4 is at least partially embedded in the enclosing wall 3, the detecting unit 7 does not include the transmission line 72, and the detecting circuit 71 is formed on the light-transmitting member 5. The detection circuit 71 of the present embodiment is illustrated as being formed along four edges of the top surface of the light-transmitting member 5, but the present invention is not limited thereto.

Specifically, the metal cover 4 includes a ground section 43 and a signal section 44 that are separately disposed from each other, and the area of the ground section 43 is larger than that of the signal section 44. The ground segment 43 and the signal segment 44 are connected to the detection circuit 71 (through two slots 33, respectively), the ground segment 43 is connected to the ground pad 121, and the signal segment 44 is connected to the signal pad 122.

In more detail, the grounding section 43 has a top plate 431 embedded in the enclosing wall 3, a C-shaped portion 432 embedded in the enclosing wall 3, and a grounding arm 433 exposed on the outer surface of the enclosing wall 3. Wherein, the position of the top plate 431 corresponds to the top surface of the enclosing wall 3 and is positioned at one side of the configuration groove 31. The C-shaped portion 432 is connected to the top plate 431 and forms four turning angles along the wall 3, and the C-shaped portion 432 is connected to the detection circuit 71. The grounding arm 433 is connected to the C-shaped portion 432 and located between two ends of the C-shaped portion 432, and a free end 4331 of the grounding arm 433 is connected to the grounding pad 121.

Furthermore, the signal section 44 is located between two ends of the C-shaped portion 432 (or between one end of the C-shaped portion 432 and the grounding arm 433), and the signal section 44 has a connecting portion 441 embedded in the surrounding wall 3 and a signal arm 442 exposed on the outer surface of the surrounding wall 3. The connecting portion 441 is connected to the detection circuit 71 and the signal arm 442, and a free end 4221 of the signal arm 442 is connected to the signal pad 122.

As described above, the metal cover 4 is exposed outside the wall 3 only by the grounding arm 433 and the signal arm 442, and the rest of the metal cover 4 (such as the top plate 431, the C-shaped portion 432, and the connecting portion 441) is embedded in the wall 3, but the invention is not limited thereto.

[ example five ]

Please refer to fig. 15 and 16, which illustrate a fifth embodiment of the present invention. The present embodiment is similar to the first to fourth embodiments, so the same parts (the substrate 1, the electronic component 2, and the pad-up block 8) between the embodiments are not repeated, and the features of the present embodiment different from the first to fourth embodiments are generally described as follows:

in this embodiment, the metal cover 4 is disposed outside the enclosure 3 and covers the enclosure 3. The metal cover 4 includes a main plate 41 and a side plate 42 connected to the periphery of the main plate 41 and having a ring shape, and the main plate 41 is formed with an opening 411 corresponding to the light-transmitting member 5. Furthermore, the main board 41 and the side board 42 of the metal cover 4 cover the outer surface of the enclosing wall 3, so as to prevent the electronic components (not shown) inside the enclosing wall 3 from being interfered by external signals. It should be noted that the outer surface of the side plate 42 of the metal cover 4 is aligned with the four sides of the substrate 1, so as to provide the EMI-resistant light source device 100. In this embodiment, the metal cover 4 is directly disposed on the enclosing wall 3, so that the metal cover 4 is not required to be additionally disposed when the module factory is performing assembly, and the beneficial effect of simplifying subsequent assembly can be achieved. It should be noted that, in other embodiments not shown in the present invention, the metal cover 4 may further be formed with a bending pin, so as to connect to the grounding pad 121 of the substrate 1 through the bending pin.

[ technical effects of embodiments of the present invention ]

In summary, the light source device disclosed in the embodiments of the present invention adopts a structure different from the TO-CAN package, so as TO meet different requirements of various types. Further, the light source device integrates the light emitting unit, the detector, the driving chip and the capacitors, so as to effectively shorten the signal transmission path between the components, and further effectively reduce the inductance value of the light source device. Moreover, the light source device can be embedded in the board body through the driving chip, so that the whole size of the light source device is effectively reduced, and the inductance value of the light source device is further reduced.

The light source device disclosed by the embodiment of the invention is arranged on the heightening block through the substrate so as to change the height of the light-emitting unit, thereby being beneficial to being suitable for different height requirements. Furthermore, the light source device can effectively improve the heat dissipation efficiency of the substrate by the design of the raised block structure of the embodiment (for example, the contour of the top electrode layer is equal to the contour of the lower electrode layer of the substrate).

In the light source device disclosed by the embodiment of the invention, the electronic component (such as the light emitting unit) is arranged on the inner side of the metal cover body (or the metal cover body surrounds the outer side of the electronic component), so that the electronic component can be effectively prevented from being interfered by external signals through the metal cover body, and the electronic component provides more stable operation efficiency.

The light source device disclosed by the embodiment of the invention effectively achieves the effect of protecting the light-transmitting piece through the cover plate by arranging the cover plate on the light-transmitting piece, and the cover plate can also provide a non-transparent detection loop to form, so that the material cost of the detection loop can be greatly reduced.

The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and drawings are included in the scope of the invention.

Claims

1. A light source device, characterized in that the light source device comprises:

the substrate comprises a plate body, an upper electrode layer and a lower electrode layer which are respectively arranged on two opposite sides of the plate body, and the upper electrode layer and the lower electrode layer are electrically coupled with each other;

a light emitting unit mounted on the upper electrode layer;

an enclosure wall arranged on the substrate and surrounding the outer side of the light-emitting unit;

the light-transmitting piece is arranged on the wall and covers the light-emitting unit;

the heightening block comprises an insulating body, and a top electrode layer and a bottom electrode layer which are respectively positioned at two opposite sides of the insulating body, and the top electrode layer and the bottom electrode layer are electrically coupled with each other; and

the cover plate is arranged on the light-transmitting piece and fixed on the enclosing wall, and a through hole corresponding to the light-emitting unit in position is formed in the cover plate;

the top electrode layer is connected to the lower electrode layer so that the substrate is electrically coupled to the raised block, and the top electrode layer has a contour that is aligned with the contour of the lower electrode layer.

2. The light source device according to claim 1, wherein the insulating body comprises a top surface, a bottom surface, and a ring-shaped side surface connected to the top surface and the bottom surface, the top electrode layer is disposed on the top surface, the bottom electrode layer is disposed on the bottom surface, the raising block comprises a plurality of extension lines formed on the ring-shaped side surface, and the plurality of extension lines are connected to the top electrode layer and the bottom electrode layer.

3. The light source device of claim 1, wherein the top electrode layer of the raised block comprises N heat dissipation pads and a plurality of metal pads surrounding the N heat dissipation pads, N is a positive integer greater than 1, and the plurality of metal pads are arranged in a square ring, and the number of metal pads in any row of the square ring is not less than N.

4. The light source device according to claim 3, wherein the raised block comprises M heat-dissipating studs and a plurality of metal studs surrounding the M heat-dissipating studs, M being a positive integer and smaller than N; the M heat dissipation posts and the plurality of metal posts are all embedded in the insulating body, and the top electrode layer and the bottom electrode layer are electrically coupled with each other through the M heat dissipation posts and the plurality of metal posts; the M radiating columns are respectively connected to the N radiating pads, and the plurality of metal columns are respectively connected to the plurality of metal pads.

5. The light source device of claim 3, wherein an area of any one of the heat dissipation pads is larger than an area of any one of the metal pads, and a contour of the bottom electrode layer of the raised block is identical to the contour of the top electrode layer.

6. The light source device according to claim 1, wherein the light source device comprises a driver chip and a detector, the driver chip and the detector are mounted on the upper electrode layer, and the driver chip and the detector are electrically coupled to the light emitting unit through the upper electrode layer, and the light emitting unit and the detector are located on the same side of the driver chip.

7. The light source device of claim 6, wherein the through hole of the cover plate also corresponds to the detector.

8. The light source device of claim 7, wherein the light source device comprises a detection circuit and two transmission lines, the detection circuit is formed on at least one of the transparent member and the cover plate, the two transmission lines are formed on the surrounding wall, and the detection circuit is electrically coupled to the upper electrode layer through the two transmission lines.

9. The light source device according to claim 7, wherein the top electrode layer comprises a grounding pad, the light source device comprises a metal cover fixed to the inner edge of the surrounding wall and connected to the grounding pad, and the metal cover covers at least the driving chip, and the metal cover forms an opening corresponding to the light emitting unit and the detector.

10. The light source device according to claim 1, wherein the light source device comprises a driving chip, the substrate comprises an inner circuit unit embedded in the board, the driving chip is embedded in the board, and the driving chip is electrically coupled to the light emitting unit and the bottom electrode layer through the inner circuit unit.

11. The light source device according to claim 2, wherein the insulating body is recessed with a plurality of grooves extending from the top surface to the bottom surface on the ring side surface, and the plurality of extension lines are respectively formed in the plurality of grooves.