TWM570523U - Holder, optical component and optical module - Google Patents

Abstract

This invention discloses an optical module, including an electrical component and an optical component. The electrical component includes a circuit board and a chip element disposed on the circuit board. The optical component is disposed on the electrical component, and has a holder and an optical element. The holder is provided with at least two conductive layers which are spaced apart and electrical connected to the electrical component. The optical element is disposed on the holder, and is provided with at least one light-transmitting conductive layer. The holder of this disclosure provides an additional path by the conductive layers, which enable the electrical component to detect whether the optical element is dropped from the holder and to perform corresponding protective measures.

Description

Stand, optical component and optical module

The present invention relates to a bracket, a component and a module having the bracket, and particularly to a bracket, an optical component and an optical module having the bracket.

Referring to FIG. 1, a conventional optical module 9 includes a circuit substrate 91, a wafer 92, a bracket 93, and an optical element 94. The wafer 92 is provided on a circuit board 91. The holder 93 is provided on the circuit substrate 91 and surrounds the wafer 92. The optical element 94 is provided on the holder 93. The aforementioned wafer 92 may be a light-emitting wafer or a light-sensing wafer. When a light-emitting wafer is used, the optical element 94 will correspond to the needs in use, and a lens having the effects of condensing, homogenizing, or filtering is used. When using a light sensing chip, it is necessary to consider the light collection effect or the light guide path, and use lenses such as chirps and condenser lenses. The difference of the optical element 94 used greatly affects the performance of the optical module 9.

The existing optical module 9 has been used in various fields, such as a lighting module of a portable electronic device, a light source of an indicator light, or a light sensing module used as a fingerprint reader. Under normal use, the optical module 9 is unavoidably shaken or impacted, which causes the optical element 94 to gradually loosen and even slide out of the bracket 93. However, the existing optical module 9 does not have any design for detecting whether the optical element 94 is detached, and there is a need for improvement.

The technical problem to be solved by the present invention is to provide a bracket for the shortcomings of the prior art, which can allow the circuit in the circuit substrate to detect whether the optical element has fallen off.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a bracket. The bracket is suitable for being disposed on a circuit substrate and supporting an optical element. The bracket is provided with at least two conductive layers separated from each other; wherein the conductive layer is electrically connected to the circuit substrate.

The technical problem to be solved by the present invention is to provide an optical component for the shortcomings of the prior art, which can enable the circuit in the circuit substrate to detect whether the optical element has fallen off.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide an optical component, which includes: a bracket and an optical element. The bracket is provided with at least two conductive layers separated from each other. The optical element is disposed on the bracket, and the optical element is provided with at least one transparent conductive layer electrically connected to the conductive layer.

The technical problem to be solved by the present invention is to provide an optical module for the shortcomings of the prior art, which can enable the circuit in the circuit substrate to detect whether the optical element has fallen off.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an optical module, which includes: an electronic component and an optical component. The electronic component includes a circuit substrate and a chip component. The optical component is disposed on the electronic component and includes a bracket and an optical element. The bracket surrounds the wafer element, and the bracket is provided with at least two conductive layers separated from each other and electrically connected to the electronic component. The optical element is disposed on the bracket, and the optical element is provided with at least one transparent conductive layer electrically connected to the conductive layer.

One of the beneficial effects of the present invention is that the circuit in the electronic component can detect whether the optical element is detached through the conductive layer provided on the bracket, and execute corresponding protection measures.

In order to further understand the features and technical contents of the new model, please refer to the following detailed description and drawings of the new model, however, the drawings provided are only for reference and description, and are not intended to limit the new model.

1‧‧‧Electronic components

11‧‧‧Chip Components

12‧‧‧circuit board

2‧‧‧ Optical components

21‧‧‧ bracket

211‧‧‧ around the wall

212‧‧‧ flange

213‧‧‧Groove

214‧‧‧channel

215‧‧‧accommodation area

22‧‧‧ conductive layer

221‧‧‧ bottom

222‧‧‧Connector

23‧‧‧Optical Elements

24‧‧‧ Transparent conductive layer

241‧‧‧Main section

242‧‧‧Conductive terminal

9‧‧‧ Optical Module

91‧‧‧circuit board

92‧‧‧Chip

93‧‧‧Scaffold

94‧‧‧optical element

FIG. 1 is a schematic cross-sectional view illustrating a conventional optical module.

FIG. 2 is a schematic perspective view illustrating a first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view taken along the line III-III in FIG. 2 to explain the first embodiment.

FIG. 4 is a schematic cross-sectional view illustrating another variation of the first embodiment.

FIG. 5 is a schematic plan view illustrating the optical element of the first embodiment.

FIG. 6 is a schematic plan view illustrating another variation of the optical element of the first embodiment.

FIG. 7 is a schematic cross-sectional view illustrating a second embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view illustrating a third embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view illustrating another variation of the third embodiment.

FIG. 10 is a schematic cross-sectional view illustrating a fourth embodiment of the present invention.

The following is a description of specific embodiments to describe the implementation of the "bracket, optical component, and optical module" disclosed by the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention may be implemented or applied through other different specific embodiments, and various details in this specification may also be based on different viewpoints and applications, and various modifications and changes may be made without departing from the concept of the new model. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

[First embodiment]

Referring to FIG. 2 and FIG. 3, a first embodiment of the present invention provides an optical module including an electronic component 1 and an optical component 2.

The electronic component 1 includes a chip component 11 and a circuit substrate 12. Chip component 11 is disposed on the circuit substrate 12 and driven by a driving circuit (not shown) in the circuit substrate 12, and may be selected from, but not limited to, a light emitting chip or a light sensing chip. The light emitting chip may be, for example, a light emitting diode (LED), a resonant cavity light emitting diode (RCLED), or a vertical cavity laser diode (VCSEL), but is not limited thereto. The light sensing chip is a visible light sensing chip or a non-visible light sensing chip, which may be exemplified by a CCD chip and a CMOS chip, but is not limited thereto. What kind of chip is used can be selected according to actual needs, and is not limited by the disclosure of the new model.

The electronic component 1 can be provided with a detection circuit (not shown), and the detection circuit can be integrated in the wafer element 11 or in the circuit substrate 12, or the detection circuit is the driving circuit itself of the wafer element 11, and is manufactured You can make adjustments as needed without any restrictions.

The optical component 2 is disposed on the electronic component 1 and includes a bracket 21 and an optical element 23. The bracket 21 includes a surrounding wall 211, a flange 212 and two grooves 213. The surrounding wall 211 is substantially in the shape of a cubic column, and is disposed on the circuit substrate 12 around the wafer element 11, and defines a channel 214 around it. The shape of the surrounding wall 211 may be adjusted according to actual needs, and is not limited to a cubic column shape, and may be a cylindrical shape, a polygonal column shape, or the like. The flange 212 is located in the channel 214 and is disposed on the surrounding wall 211 and divides the channel 214 into an upper receiving area 215. The groove 213 is formed by a recess of the wall surface surrounding the wall 211, and is located on two different sides of the surrounding wall 211, and extends upward from the bottom side outside the surrounding wall 211, passes through the top side of the surrounding wall 211, and inward Extends down to the flange 212.

The bracket 21 is provided with two conductive layers 22 separated from each other. The bottom end 221 of each conductive layer 22 is aligned with the bottom side of the support 21 and is electrically connected to the circuit substrate 12, and includes a connection end 222 for contacting the optical element 23. The conductive layer 22 is disposed on one of the outer wall surface, the inner wall surface, and the inside of the bracket 21 without any restrictions, and it depends on the requirements. When the conductive layer 22 is disposed on the outer wall surface or the inner wall surface of the bracket 21, the conductive layer 22 may be coated on the bracket 21 by using an electroless plating method, or a metal sheet may be directly attached to the bracket 21, and the manufacturing method is not limited. The connection end 222 can only be extended It extends to the top side of the surrounding wall 211 and points and contacts the optical element 23. Alternatively, the connecting end 222 may extend to the inner wall surface of the surrounding wall 211 to contact the optical element 23. In the first embodiment, The inner wall surface of the wall 211 is an example.

It is worth mentioning that the conductive layer 22 may be formed in the groove 213 or outside the groove 213, and the end depends on the needs. The arrangement of each conductive layer 22 may be the same or different, and it depends on needs. In the first embodiment, the conductive layer 22 is provided in the groove 213 as an example.

Referring to FIG. 2 and FIG. 4, the optical element 23 is disposed in the accommodating region 215 of the bracket 21, and its shape matches the shape of the accommodating region 215. Therefore, it is rectangular in the first embodiment. The optical element 23 may define a lower surface facing the wafer element 11 and an upper surface facing the outside. The optical element 23 may be selected from, but not limited to, a lens, a lens, and a filter. Examples of the lens include a planar lens, a condensing lens, and a astigmatism lens, but are not limited thereto. Examples of chirp include: dispersion chirp, reflection chirp, and polarized chirp, but are not limited to this. The filter may be, for example, a CPL polarizer, an ND filter, or a UV protective lens, but is not limited thereto. The material of the optical element 23 may be transparent plastic or glass. The transparent plastic may be selected from polymethylmethacrylate (PMMA), polycarbonate (PC), polyetherimide (PEI), cyclic olefin coplymer (COC), or And so on. For convenience of explanation, a flat lens made of glass is used as an example in the first embodiment.

The optical element 23 is provided with a transparent conductive layer 24. The transparent conductive layer 24 extends from one corner adjacent to the optical element 23 to the opposite corner. The transparent conductive layer 24 includes a main body section 241 and two conductive ends 242. The main body segment 241 of the light-transmitting conductive layer 24 is located on the upper surface or the lower surface of the optical element 23. In the first embodiment, the upper surface or the lower surface is used as an example. The shape of the main body section 241 may be an S shape (as shown in FIG. 5) or an elongated shape (as shown in FIG. 6). In the first embodiment, the S shape is taken as an example, but it is not limited thereto. The conducting terminal 242 is electrically connected to the conductive layer 22, and can be located on the same side as the main body section 241 (as shown in FIG. 3) or on the side of the optical element 23 (as shown in FIG. 4), without any Limitation, as long as it can be electrically connected to the connection end 222 of the conductive layer 22, In one embodiment, the upper surface of the optical element 23 is used as an example. The width of the light-transmitting conductive layer 24 may be greater than, less than or equal to the width of the conductive layer 22, and there is no limitation. In the first embodiment, the width of the light-transmitting conductive layer 24 is smaller than the width of the conductive layer 22 as an example.

The light-transmitting conductive layer 24 is made of a light-transmitting and conductive material selected from, but not limited to, metals, indium trioxide-doped tin (In ₂ O ₃ : Sn, ITO), and tin dioxide Fluorine (SnO ₂ : F, FTO), tin dioxide doped antimony (SnO ₂ : Sb, ATO), and zinc oxide doped aluminum (ZnO: Al, AZO). When a metal is used, its thickness needs to be less than 10 nm, and the material can be exemplified by gold, silver, platinum, copper, aluminum, chromium, palladium, and rhodium, but it is not limited thereto. In the first embodiment, indium trioxide doped tin (ITO) is taken as an example.

When the optical element 23 is placed in the accommodating area 215 of the bracket 21, the conductive ends 242 of the light-transmitting conductive layer 24 are electrically connected to the connection ends 222 of the conductive layer 22, respectively, and then electrically connected to the detection circuit through the conductive layer 22. , Which constitutes a protection circuit. By letting the detection circuit detect the resistance or current value in the protection circuit, it can be known whether the conductive layer 22 and the transparent conductive layer 24 are electrically connected. In this way, when the optical element 23 is detached from the bracket 21 and detached, the light-transmitting conductive layer 24 will be detached from the conductive layer 22, that is, an open circuit will occur. At this time, the detection circuit will detect that the protection circuit is open and cut off the drive circuit To stop the operation of the chip element 11 to avoid damage to the chip element 11; or, when the driving circuit of the chip element 11 is used as a detection circuit, as long as the protection circuit is connected in series with the driving circuit, when the transparent conductive layer 24 is detached The conductive layer 22 is disconnected. At this time, the driving circuit is also cut off, and the wafer element 11 is stopped.

Through the above description, the advantages of the first embodiment can be summarized as follows:

1. The circuit in the electronic component 1 can detect whether the optical element 23 is detached through the conductive layer 22 provided on the bracket 21 and perform corresponding protection measures.

2. The circuit in the electronic component 1 can know whether the optical element 23 has fallen off by detecting whether the light-transmitting conductive layer 24 is conducting, and perform corresponding protection measures.

3. The transparent conductive layer 24 is arranged on the upper surface of the optical element 23, and can be used To sense the wear of the optical element 23. When a foreign object rubs on the upper surface of the optical element 23, it will also rub the light-transmitting conductive layer 24 at the same time. In this way, if the optical element 23 encounters excessive friction, it is easy to rub the light-transmitting conductive layer 24 from the optical element 23 In addition, the protection circuit is opened, and the operation of the chip element 11 is stopped.

Fourth, the light-transmitting conductive layer 24 adopts an S-shape, which can ensure that the light-transmitting conductive layer 24 is everywhere on the surface of the optical element 23, such as corners, perimeters, and centers. With this configuration, it can further ensure that When foreign objects are rubbed against the optical element 23, they can also rub against the light-transmitting conductive layer 24, thereby improving the ability to sense the wear condition of the optical element 23.

5. The conductive layer 22 is disposed in the groove 213, which can prevent the conductive layer 22 from being abraded and damaged by a foreign object to cause the protection circuit to be disconnected, thereby stopping the chip element 11 from operating. In other words, by arranging the conductive layer 22 in the groove 213, it can be ensured that the protection circuit is broken because the optical element 23 is detached from the bracket 21 or the transparent conductive layer 24 is damaged.

6. When the conducting end 242 of the light-transmitting conductive layer 24 extends to the side of the optical element 23, this structure can increase the contact area with the conductive layer 22 and ensure effective electrical connection with each other. Therefore, only when the optical element 23 completely disengages from the bracket 21 or almost disengages from the 21 bracket, the transparent conductive layer 24 will not contact the conductive layer 22 and the protection circuit will be opened. In this way, it is possible to avoid that the conductive layer 22 and the light-transmitting conductive layer 24 are staggered and disconnected due to slight shaking, so that the detection circuit may misjudge.

7. Since the width of the conductive layer 22 is greater than the width of the light-transmitting conductive layer 24, it is not easy for the two to be electrically connected when the two are bonded together because of errors during manufacturing.

[Second embodiment]

Referring to FIG. 7, the second embodiment of the present invention is substantially the same as the first embodiment, except that the conducting end 242 of the light-transmitting conductive layer 24 extends to the side of the optical element 23, and the conductive layer 22 is disposed inside the bracket 21. . Since the conductive layer 22 is provided inside the bracket 21, the bracket 21 of the second embodiment is not provided with a groove 213 (see FIG. 2).

The manner in which the conductive layer 22 is provided inside the bracket 21 is based on the materials of the bracket 21 And process adjustments. When the stent 21 is made of a thermoplastic material, the conductive layer 22 can be placed in the mold used to make the stent 21, and then the plastic-coated conductive layer 22 is poured, and further cured to form the stent 21; and when the stent 21 is made of ceramic material In this case, the conductive layer 22 may be placed in the blank first, and then sintered together to embed the conductive layer 22 in the bracket 21. However, the production method can be adjusted according to any conventional method, and is not limited to this.

When the conductive layer 22 is embedded in the bracket 21, the conductive layer 22 can be prevented from being damaged by the friction of foreign objects, which can further ensure that the protection circuit is broken because the optical element 23 is detached from the bracket 21 or the transparent conductive layer 24 is damaged, rather than being damaged. Since the conductive layer 22 itself is damaged.

In this way, in addition to the advantages of the first embodiment, the second embodiment can further ensure the accuracy of detecting whether the optical element 23 is detached from the bracket 21 or excessively worn by embedding the conductive layer 22 in the bracket 21.

[Third embodiment]

Referring to FIG. 8, the third embodiment of the present invention is substantially the same as the first embodiment, except that the transparent conductive layer 24 is disposed on the lower surface of the optical element 23. Since the connection end 222 of the conductive layer 22 extends to the lower surface of the adjacent optical element 23, it can be electrically connected to the light-transmitting conductive layer 24.

Referring to FIG. 9, another variation of the third embodiment is that the conductive layer 22 is disposed on the inner wall surface of the bracket 21. The bottom end 221 of the conductive layer is also electrically connected to the circuit substrate 12, and the connection end 222 extends to the upper side of the flange 212 of the bracket 21. In this way, the light-transmitting conductive layer 24 can also adhere to the conductive layer 22 and be electrically connected.

As such, the third embodiment has the same advantages as the first embodiment except that the abrasion of the optical element 23 cannot be sensed. Manufacturers can choose according to actual needs. For example, when the optical module used does not want to have the function of sensing the wear condition of the optical element 23, the solution of this embodiment can be adopted. Therefore, the third embodiment provides another technical solution, so that the manufacturer can adjust according to actual needs.

[Fourth embodiment]

Referring to FIG. 10, the fourth embodiment of the present invention is substantially the same as the third embodiment, except that the conducting end 242 of the light-transmitting conductive layer 24 extends to the side of the optical element 23, and the conductive layer 22 is disposed inside the bracket 21. . The arrangement of the conductive layer 22 is the same as that of the second embodiment, and details are not described herein.

Thus, in addition to the advantages of the third embodiment, the fourth embodiment can further ensure the accuracy of detecting whether the optical element 23 is detached from the bracket 21 or excessively worn by embedding the conductive layer 22 in the bracket 21.

In summary, the conductive layer 22 provided on the bracket 21 allows the circuit in the circuit substrate 12 to detect whether the optical element 23 has fallen off the bracket 21 and perform corresponding protection measures. Therefore, the purpose of a new type of cost is indeed achieved.

The contents disclosed above are only the preferred and feasible embodiments of the new model, and therefore do not limit the scope of the patent application for the new model. Therefore, any equivalent technical changes made using the description and drawings of the new model are included in the new model application Within the scope of the patent.

Claims (10)

A bracket is suitable for being disposed on a circuit substrate and supporting an optical element. The bracket is provided with at least two conductive layers separated from each other; wherein the conductive layer is electrically connected to the circuit substrate. The stent according to claim 1, wherein the conductive layer is provided on one of an outer wall surface, an inner wall surface, and an inner portion of the stent. The bracket according to claim 1, wherein the bracket includes at least two grooves, and each of the conductive layers is disposed in the corresponding groove. An optical component includes: a support provided with at least two conductive layers separated from each other; and an optical element provided on the support, and the optical component is provided with at least one electrical connection with the conductive layer. Sexually connected transparent conductive layer. The optical component according to claim 4, wherein the transparent conductive layer is disposed on one of an upper surface and a lower surface of the optical element, and the transparent conductive layer includes two disposed on both sides of the optical element The conductive end of the side; the conductive layer is disposed on one of the outer wall surface, the inner wall surface, and the inside of the bracket; the conductive layer includes a connection end that extends to the inside of the support The wall surface is electrically connected to the conducting terminal; wherein, when the optical element is released from the bracket, the transparent conductive layer and the conductive layer are not electrically connected. The optical component according to claim 4, wherein the bracket includes at least two grooves, and each of the conductive layers is disposed in the corresponding groove; the optical element is rectangular, and the light transmitting The conductive layer extends from a corner adjacent to the optical element to a corner adjacent to the optical element; the light-transmitting conductive layer is one of an S-shape and an elongated shape. An optical module includes: an electronic component including a circuit substrate and a chip component; and an optical component disposed on the electronic component and including a bracket and an optical component, the bracket surrounding the component A chip element, and the bracket is provided with at least two conductive layers separated from each other and electrically connected to the electronic component, the optical element is disposed on the bracket, and at least one and the optical element are disposed on the optical element. The conductive layer is a light-transmitting conductive layer electrically connected. The optical module according to claim 7, wherein the transparent conductive layer is disposed on one of the upper surface and the lower surface of the optical element, and the transparent conductive layer includes two The conductive end of the side; the conductive layer is disposed on one of the outer wall surface, the inner wall surface, and the inside of the bracket; the conductive layer includes a connection end, and the connection end extends to the The inner wall surface is electrically connected to the conducting terminal; wherein, when the optical element is released from the bracket, the transparent conductive layer and the conductive layer are not electrically connected. The optical module according to claim 7, wherein the bracket includes at least two grooves, and each of the conductive layers is disposed in the corresponding groove; the optical element is rectangular, and the transparent element The photoconductive layer extends from a corner adjacent to the optical element to a corner opposite to the optical element; the light-transmitting conductive layer is one of an S-shape and an elongated shape; the width of the conductive layer is greater than the width of the transparent conductive layer . The optical module according to claim 7, wherein a width of the conductive layer is larger than a width of the transparent conductive layer.