CN208861969U - Support, optical assembly and optical module - Google Patents
Support, optical assembly and optical module Download PDFInfo
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- CN208861969U CN208861969U CN201820941064.5U CN201820941064U CN208861969U CN 208861969 U CN208861969 U CN 208861969U CN 201820941064 U CN201820941064 U CN 201820941064U CN 208861969 U CN208861969 U CN 208861969U
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- conductive layer
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- bracket
- light transmission
- optical
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- 230000003287 optical effect Effects 0.000 title claims abstract description 123
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 8
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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Abstract
The utility model discloses a support, optical assembly and optical module. The optical module comprises an electronic component and an optical component. The electronic assembly comprises a circuit substrate and a chip element arranged on the circuit substrate. The optical assembly is arranged on the electronic assembly and comprises a bracket and an optical element. The bracket surrounds the chip element and is provided with at least two conductive layers which are separated from each other and electrically connected with the electronic component. The optical element is arranged on the bracket, and at least one light-transmitting conducting layer electrically connected with the conducting layer is arranged on the optical element. The utility model provides a support provides a route in addition through the conducting layer that sets up to whether the circuit in the let electronic component can listen optical element and drop from the support, and carry out corresponding safeguard measure.
Description
Technical field
The utility model relates to a kind of bracket and the standoff component of tool and modules, more particularly to a kind of bracket and have
The optical module and optical module of bracket.
Background technique
Refering to fig. 1, a kind of existing optical module 9 comprising a circuit substrate 91, a chip 92, a bracket 93 and
One optical element 94.The chip 92 is arranged in circuit substrate 91.Bracket 93 is arranged in circuit substrate 91, and surrounds chip 92.Light
Element 94 is learned to be arranged in bracket 93.Luminescent wafer or light sensing chip can be used in chip 92 above-mentioned.When using luminescent wafer,
Optical element 94 can be corresponded to using upper needs, and using has optically focused, even light, or the eyeglass of optical filtering and other effects.And works as and adopt
It when with light sensing wafer, then needs to be contemplated light and collects effect or light guide path, and use prism, collector lens
Equal eyeglasses.The difference of used optical element 94, the performance for influencing optical module 9 are very huge.
Existing optical module 9 has applied in a variety of different fields, such as the illumination of portable electronic equipment
The light source of module, indicator light, or it is used as the optical sensing module of fingerprint identifier.Under normal use, optical module 9
It is inevitably shaken or is collided, and cause optical element 94 gradually to loosen, or even slide out bracket 93.However, existing light
Module 9 is learned without any design for being used to sense optical element 94 and whether falling off, there are improved needs.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of bracket, energy in view of the deficiencies of the prior art
The circuit detecting optical element in circuit substrate is allowed whether to fall off.
In order to solve the above technical problems, wherein a technical solution is to provide a kind of used by the utility model
Frame.The bracket is suitble to be set on a circuit substrate and supports an optical element.The branch is provided at least two and divides each other
From conductive layer；Wherein, the conductive layer is electrically connected to the circuit substrate.
Further, its in outside wall surface, inner wall and the internal three of the bracket is arranged in the conductive layer
In one.
Further, the bracket includes at least two grooves, each described conductive layer is arranged in corresponding institute
It states in groove.
The technical problem to be solved by the utility model is to, a kind of optical module is provided in view of the deficiencies of the prior art,
Whether it can allow the circuit detecting optical element in circuit substrate to fall off.
In order to solve the above technical problems, an other technical solution used by the utility model is to provide a kind of light
Learn component comprising: a bracket and an optical element.The branch is provided at least two conductive layers being separated from each other.It is described
Optical element setting is in the bracket, and the optical element is equipped with the light transmission that at least one is electrically connected with the conductive layer and leads
Electric layer.
Further, wherein the one of the upper surface and lower surface of the optical element is arranged in the light transmission conductive layer
It is a, and the light transmission conductive layer includes two conduction terminals that optical element two sides are arranged in；The conductive layer is arranged in the branch
One of them in the outside wall surface of frame, inner wall and internal three；The conductive layer includes a connecting pin, and the connecting pin is prolonged
It extends to the inner wall of the bracket and is electrically connected with the conduction terminal；Wherein, when the optical element is from the carriage disengagement,
The light transmission conductive layer is not electrically connected with the conductive layer.
Further, the bracket includes at least two grooves, each described conductive layer is arranged in corresponding institute
It states in groove；The optical element is in rectangle, and one jiao of the light transmission conductive layer from the neighbouring optical element extends to neighbouring
It is diagonal；The light transmission conductive layer is S-shaped and strip one of them.
The technical problem to be solved by the utility model is to, a kind of optical module is provided in view of the deficiencies of the prior art,
Whether it can allow the circuit detecting optical element in circuit substrate to fall off.
In order to solve the above technical problems, other yet another aspect used by the utility model is to provide one kind
Optical module comprising: an electronic building brick and an optical module.The electronic building brick includes a circuit substrate and a chip
Element.The optical module is arranged in the electronic building brick, and including a bracket and an optical element.The bracket surrounds institute
Chip element is stated, and the branch is provided at least two conductive layers for being separated from each other and being electrically connected with the electronic building brick.Institute
Optical element setting is stated in the bracket, and the optical element is equipped at least one light transmission being electrically connected with the conductive layer
Conductive layer.
Further, wherein the one of the upper surface and lower surface of the optical element is arranged in the light transmission conductive layer
It is a, and the light transmission conductive layer includes two conduction terminals that optical element two sides are arranged in；The conductive layer is arranged in the branch
One of them in the outside wall surface of frame, inner wall and internal three；The conductive layer includes a connecting pin, and the connecting pin is prolonged
It extends to the inner wall of the bracket and is electrically connected with the conduction terminal；Wherein, when the optical element is from the carriage disengagement,
The light transmission conductive layer is not electrically connected with the conductive layer.
Further, the bracket includes at least two grooves, each described conductive layer is arranged in corresponding institute
It states in groove；The optical element is in rectangle, and one jiao of the light transmission conductive layer from the neighbouring optical element extends to neighbouring
It is diagonal；The light transmission conductive layer is S-shaped and strip one of them；The width of the conductive layer is greater than the light transmitting electro-conductive
The width of layer.
Further, the width of the conductive layer is greater than the width of the light transmission conductive layer.
A wherein beneficial effect of the utility model is, the circuit in electronic building brick can be by the conduction that is arranged on bracket
Layer detects whether optical element falls off, and executes corresponding safeguard measure.
For the enabled feature and technology contents for being further understood that the utility model, please refer to below in connection with the utility model
Detailed description and accompanying drawings, however provided attached drawing is merely provided for reference and description, is not used to add the utility model
With limitation.
Detailed description of the invention
Fig. 1 is schematic cross-sectional view, illustrates existing optical module.
Fig. 2 is stereoscopic schematic diagram, illustrates the utility model first embodiment.
Fig. 3 is the diagrammatic cross-section of the III-III section of Fig. 2, illustrates first embodiment.
Fig. 4 is diagrammatic cross-section, illustrates another variation aspect of first embodiment.
Fig. 5 is schematic top plan view, illustrates the optical element of first embodiment.
Fig. 6 is schematic top plan view, illustrates another variation aspect of the optical element of first embodiment.
Fig. 7 is diagrammatic cross-section, illustrates the utility model second embodiment.
Fig. 8 is diagrammatic cross-section, illustrates the utility model 3rd embodiment.
Fig. 9 is diagrammatic cross-section, illustrates another variation aspect of 3rd embodiment.
Figure 10 is diagrammatic cross-section, illustrates the utility model fourth embodiment.
Specific embodiment
It is to illustrate related " bracket, optical module and light disclosed in the utility model by specific specific example below
The advantages of embodiment of module ", those skilled in the art can understand the utility model by content disclosed in this specification
With effect.The utility model can be implemented or be applied by other different specific embodiments, and the items in this specification are thin
Section may be based on different viewpoints and application, carry out various modifications and changes under the design for not departing from the utility model.In addition, this
The attached drawing of utility model is only simple schematically illustrate, not according to the description of actual size, states in advance.The following embodiments and the accompanying drawings will
The relevant technologies content of the utility model is further described, but disclosure of that is not to limit the utility model
Protection scope.
[first embodiment]
Refering to Fig. 2 and Fig. 3, the utility model first embodiment provides a kind of optical module comprising: an electronic building brick 1
An and optical module 2.
Electronic building brick 1 includes a chip element 11 and a circuit substrate 12.Chip element 11 is arranged in circuit substrate 12,
And operated by the driving circuit (not shown) in circuit substrate 12 to drive, it may be selected from but not limited to luminescent wafer or light sensing be brilliant
Piece.Luminescent wafer can enumerate such as: two pole of light emitting diode (LED), resonator light emitting diode (RCLED) or vertical cavity laser
It manages (VCSEL), but it is not limited to this.Light sensing chip uses visible light sensing wafer or non-visible light sensing wafer, can example
Lift such as: CCD chip, CMOS wafer, but it is not limited to this.Used chip is why, can according to it is actual needs and from
Row is selected, and is not limitation with person disclosed in the utility model.
A detection circuit (not shown) is set in 1 energy of electronic building brick, and detection circuit can be whole and in chip element 11, or
Person is arranged in circuit substrate 12, or, detection circuit is exactly the driving circuit of chip element 11 itself, and producer can be according to
According to needing to be adjusted, there is no any restrictions.
Optical module 2 is arranged in electronic building brick 1, and including a bracket 21 and an optical element 23.Bracket 21 includes one
Surrounding wall 211, a flange 212 and two grooves 213.Surrounding wall 211 is generally in cube cylindricality, and is existed around the setting of chip element 11
Circuit substrate 12, and surround and define a channel 214.The shape of surrounding wall 211 can be adjusted according to actual needs, and
It is not limited with a cube cylindricality, can also is cylindrical, polygonal cylindricality etc..Flange 212 in channel 214 and are disposed around wall
211, and channel 214 is separated out an accommodating area 215 being located above.Groove 213 is the institute's shape that is recessed by the wall surface of surrounding wall 211
At, and position is upwardly extended in the neither ipsilateral of surrounding wall 211, and from the bottom side outside surrounding wall 211 respectively, passes through surrounding wall
211 top side, and flange 212 is inwardly extended to still further below.
Bracket 21 is equipped with two conductive layers 22 being separated from each other.It is cut with 21 bottom side of bracket the bottom end 221 of each conductive layer 22
Connecting pin 222 that is neat and being electrically connected to circuit substrate 12, and be used to contact with optical element 23 including one.Conductive layer 22 is arranged
One of them in the outside wall surface of bracket 21, inner wall and internal three, there is no any restrictions, hold depending on demand.
When the outside wall surface or inner wall of bracket 21 is arranged in conductive layer 22, conductive layer 22 can be used electroless plating method and be coated on bracket
21, sheet metal can also be directly attached to bracket 21, and there is no certain limitations for manufacturing method.Connecting pin 222 can only extend
To surrounding wall 211 top side and be directed toward and contact optical element 23, or, connecting pin 222 can extend to surrounding wall 211
Inner wall is with contact optical element 23, is to extend to the inner wall of surrounding wall 211 as example in the present first embodiment.
It is noted that conductive layer 22 can be formed in groove 213, or be formed in outside groove 213, end view is needed
Depending on wanting.Each 22 set-up mode of conductive layer may be the same or different, and also depend on the needs.In this first embodiment
In, conductive layer 22 is to be arranged in groove 213 as example.
Refering to Fig. 2 and Fig. 4, optical element 23 is arranged in the accommodating area 215 of bracket 21, shape and accommodating area 215
Shape matches, therefore is in rectangle in the present first embodiment.Optical element 23 can define towards under chip element 11
Surface, and towards extraneous upper surface.Optical element 23 may be selected from but not limited to: lens, prism, filter.Lens can enumerate
Such as: planar lenses, light-focusing type lens, astigmatism type lens, but it is not limited to this.Prism can enumerate such as: dispersing prism, reflection rib
Mirror, ahrens prism, but not limited to this.Filter can enumerate such as: CPL polariscope, ND dim light mirror, UV protective glass, but not limited to this.Light
Transparent plastic or glass can be used in the material for learning element 23.Aforementioned transparent plastics can be selected from polyacids methyl esters
(Polymethylmethacrylate, PMMA), polycarbonate (Polycarbonate, PC), polyetherimide
(Polyetherimide, PEI), cyclic olefine copolymer (Cyclo olefin coplymer, COC) or its etc. mixing.For
It is using planar lens made of glass as example in the present first embodiment convenient for explanation.
Optical element 23 is equipped with a light transmission conductive layer 24.Light transmission conductive layer 24 is extended to from one jiao of adjacent optical element 23
It is diagonal adjacent to it.Light transmission conductive layer 24 includes a main paragraph 241 and two conduction terminals 242.The main paragraph 241 of light transmission conductive layer 24
Position is in upper surface in the first embodiment using position as example in the upper surface or lower surface of optical element 23.Main paragraph 241
Shape can be S-shaped (as shown in Figure 5) or strip (as shown in Figure 6), be using S-shaped as example, but not in first embodiment
As limit.Conduction terminal 242 and conductive layer 22 are electrically connected, and can be situated in one side identical with main paragraph 241 (such as Fig. 3 institute
Show) or position in the side (as shown in Figure 4) of optical element 23, there is no any restrictions, as long as can be with the company of conductive layer 22
It connects end 222 to be electrically connected, is in the upper surface of optical element 23 in the first embodiment using position as example.Light transmission conductive layer
24 width can be greater than, less than or equal to the width of conductive layer 22, and there is no any restrictions, in the first embodiment, be with
The width that the width of light transmission conductive layer 24 is less than conductive layer 22 is example.
Light transmission conductive layer 24 is using light transmission and conductive material is made, and material is selected from but not limited to: metal, three
Aoxidize two indium doping tin (In2O3: Sn, ITO), stannic oxide adulterate fluorine (SnO2: F, FTO), stannic oxide antimony dopant (SnO2:
Sb, ATO) and Zinc oxide doped aluminium (ZnO:Al, AZO).When using metal, thickness need to be lower than 10nm, and material can enumerate
Such as gold, silver, platinum, copper, aluminium, chromium, palladium, rhodium, but it is not limited to this.It in the present first embodiment, is with indium sesquioxide doped tin
It (ITO) is example.
When optical element 23 is placed on the accommodating area 215 of bracket 21, the conduction terminal 242 of light transmission conductive layer 24 will be distinguished
It is electrically connected with the connecting pin 222 of conductive layer 22, then detection circuit is electrically connected to by conductive layer 22, that is, constitute a protection electricity
Road.By allowing detection circuit detection to protect resistance or current value in circuit, i.e., knowable conductive layer 22 and light transmission conductive layer 24
Between whether keep being electrically connected.In this way, when optical element 23 is loosened from bracket 21 and is detached from, light transmission conductive layer 24 will one
With conductive layer 22 is detached from, that is, open circuit is presented, detection circuit detects protection circuit in open circuit and cuts off driving circuit at this time
Running, stop the operation of chip element 11, it is impaired to avoid chip element 11；Or when by the driving of chip element 11
When circuit is as detection circuit, if will protection circuit connect with driving circuit, when light transmission conductive layer 24 disengaging conductive layer 22 and
In open circuit, driving circuit can be equally cut off at this time, and then makes chip element 11 out of service.
By above description, the advantages of this first embodiment, can be summarized as follows:
One, whether the circuit in electronic building brick 1 can detect optical element 23 by the conductive layer 22 being arranged on bracket 21
It falls off, and executes corresponding safeguard measure.
Two, the circuit in electronic building brick 1 can be by detecting whether light transmission conductive layer 24 is connected, i.e., knowable optical element
Whether 23 fall off, and executes corresponding safeguard measure.
Three, light transmission conductive layer 24 is configured in the upper surface of optical element 23, can be used to sense the mill of optical element 23
Damage situation.When foreign object friction is to the upper surface of optical element 23, will rub simultaneously to light transmission conductive layer 24, in this way, if light
Learn element 23 suffer from excessive friction, be easy for abrading light transmission conductive layer 24 from optical element 23, make protect circuit be in
Existing open circuit, and then stop the running of chip element 11.
Four, light transmission conductive layer 24 uses S-shaped, relatively can ensure that everywhere in 23 surface of optical element there is light transmission conductive layer 24,
Such as: corner, periphery, center position, in this way, can further ensure that by such configuration when foreign object friction to optical element
It can be also rubbed while 23 to light transmission conductive layer 24, improve the ability of sensing 23 abrasion condition of optical element.
Five, conductive layer 22 is arranged in groove 213, can be avoided conductive layer 22 and is damaged by foreign object friction and make protection electricity
Road makes chip element 11 out of service in open circuit.In other words, by being arranged conductive layer 22 in groove 213, it can ensure that guarantor
Protection circuit is that bracket 21 or the damage of light transmission conductive layer 24 are detached from due to optical element 23 in open circuit.
Six, when the conduction terminal 242 of light transmission conductive layer 24 extends to the side of optical element 23, this structure can increase and lead
The contact area of electric layer 22, it is ensured that be effectively electrically connected to each other.Therefore, only when optical element 23 completely disengages bracket 21
Or when being almost detached from 21 bracket, light transmission conductive layer 24 will not just contact with conductive layer 22 and allow protection circuit that open circuit is presented.In this way,
Detection circuit can be made to judge by accident to avoid because shaking slightly causes conductive layer 22 and light transmission conductive layer 24 to be staggered in open circuit.
Seven, it because the width of conductive layer 22 is greater than the width of light transmission conductive layer 24, is not easy when the two fits because when manufacturing
The error given birth to and can not be electrically connected.
[second embodiment]
Refering to Fig. 7, the utility model second embodiment is substantially identical with the first embodiment, and difference is only that light transmitting electro-conductive
The conduction terminal 242 of layer 24 extends to the side of optical element 23, and the inside of bracket 21 is arranged in conductive layer 22.Because of conductive layer
22 be the inside that bracket 21 is arranged in, so the bracket 21 of second embodiment is not provided with groove 213 (see Fig. 2).
The mode inside bracket 21 is arranged in conductive layer 22, is that the materials of foundation bracket 21 and processing procedure match adjustment.When
Bracket 21 uses hot plastic material, and first conductive layer 22 can be placed in the mold for making bracket 21, plastics are then perfused
Coated with conductive layer 22, and further solidified forming is bracket 21；And when bracket 21 is using ceramic material, then it will can first lead
Electric layer 22 is placed in embryo material, and then common sintering, is embedded in conductive layer 22 in bracket 21.However production method can foundation
Any known engineering method is adjusted, and is not limited thereto.
When conductive layer 22 is embedded in inside bracket 21, more it is avoided that conductive layer 22 is rubbed by foreign object and damaged, it can be more into one
Step ensures to protect circuit to be to damage since optical element 23 is detached from bracket 21 or light transmission conductive layer 24 in open circuit, rather than due to leading
Electric layer 22 itself is impaired.
In this way, this second embodiment is other than having the advantages of first embodiment, by the way that conductive layer 22 is embedded in bracket
In 21, additionally it is possible to further ensure to detect whether optical element 23 is detached from bracket 21 or over worn accuracy.
[3rd embodiment]
Refering to Fig. 8, the utility model 3rd embodiment is substantially identical with the first embodiment, and difference is only that light transmitting electro-conductive
Layer 24 is the lower surface that optical element 23 is arranged in.Because the connecting pin 222 of conductive layer 22 extends into adjacent optical element 23
Lower surface, therefore can be electrically connected with light transmission conductive layer 24.
Refering to Fig. 9, another variation aspect of 3rd embodiment, is the inner wall that bracket 21 is arranged in conductive layer 22.It is conductive
The bottom end 221 of layer is equally electrically connected to circuit substrate 12, and connecting pin 222 is 212 upside of flange for extending to bracket 21.It is logical
This mode is crossed, light transmission conductive layer 24 can be equally affixed with conductive layer 22 merges electric connection.
In this way, this third embodiment has first embodiment other than it cannot sense the abrasion condition of optical element 23
Same advantage.Producer can select according to actually demand, and such as optical module used is not intended to possess sensing optics
When the function of 23 abrasion condition of element, that is, the scheme of the present embodiment can be used.Therefore, 3rd embodiment provides another technical side
Producer can be adjusted according to actual demand for case.
[fourth embodiment]
Refering to fig. 10, the utility model fourth embodiment, substantially identical as 3rd embodiment, difference is only that light transmitting electro-conductive
The conduction terminal 242 of layer 24 extends to the side of optical element 23, and the inside of bracket 21 is arranged in conductive layer 22.Conductive layer 22
Set-up mode, identical as second embodiment, it will not be described here.
In this way, this fourth embodiment is other than having the advantages of 3rd embodiment, by the way that conductive layer 22 is embedded in bracket
In 21, additionally it is possible to further ensure to detect whether optical element 23 is detached from bracket 21 or over worn accuracy.
In conclusion the conductive layer 22 being arranged on bracket 21 can allow the circuit detecting optical element 23 in circuit substrate 12 to be
It is no to fall off from bracket 21, and execute corresponding safeguard measure.Therefore, reach the purpose of this utility model really.
Content disclosed above is only the preferred possible embodiments of the utility model, not thereby limits to the utility model
Claims protection scope, so all equivalence techniques for being done with the utility model specification and accompanying drawing content become
Change, is both contained in the protection scope of claims of the utility model.
Claims (10)
1. a kind of bracket is suitble to be set on a circuit substrate and supports an optical element, which is characterized in that the branch is provided with
At least two conductive layers being separated from each other；Wherein, the conductive layer is electrically connected to the circuit substrate.
2. bracket according to claim 1, which is characterized in that the outside wall surface, interior of the bracket is arranged in the conductive layer
On one in wall surface and internal three.
3. bracket according to claim 1, which is characterized in that the bracket includes at least two grooves, described in each
Conductive layer is arranged in the corresponding groove.
4. a kind of optical module, which is characterized in that the optical module includes:
One bracket is equipped at least two conductive layers being separated from each other；And
One optical element is arranged on the bracket, and the optical element is equipped at least one and conductive layer electricity
Property connection light transmission conductive layer.
5. optical module according to claim 4, which is characterized in that the light transmission conductive layer is arranged in the optical element
Upper surface and lower surface in one on, and the light transmission conductive layer include two be arranged in the optical element two sides
Conduction terminal；The conductive layer is arranged on one in outside wall surface, inner wall and the internal three of the bracket；It is described to lead
Electric layer includes a connecting pin, and the connecting pin extends to the inner wall of the bracket and is electrically connected with the conduction terminal；Wherein,
When the optical element is from the carriage disengagement, the light transmission conductive layer is not electrically connected with the conductive layer.
6. optical module according to claim 4, which is characterized in that the bracket includes at least two grooves, each
The conductive layer is arranged in the corresponding groove；The optical element is in rectangle, and the light transmission conductive layer is from adjacent to institute
One jiao for stating optical element extends to the diagonal of the neighbouring optical element；The light transmission conductive layer is S-shaped and strip in
One.
7. a kind of optical module, which is characterized in that the optical module includes:
One electronic building brick a comprising circuit substrate and a chip element；And
One optical module is arranged on the electronic building brick, and including a bracket and an optical element, the bracket is surrounded
The chip element, and the branch is provided at least two conductive layers for being separated from each other and being electrically connected with the electronic building brick,
The optical element is arranged on the bracket, and the optical element is equipped at least one and is electrically connected with the conductive layer
Light transmission conductive layer.
8. optical module according to claim 7, which is characterized in that the light transmission conductive layer is arranged in the optical element
Upper surface and lower surface in one on, and the light transmission conductive layer include two be arranged in the optical element two sides
Conduction terminal；The conductive layer is arranged on one in outside wall surface, inner wall and the internal three of the bracket；It is described to lead
Electric layer includes a connecting pin, and the connecting pin extends to the inner wall of the bracket and is electrically connected with the conduction terminal；Wherein,
When the optical element is from the carriage disengagement, the light transmission conductive layer is not electrically connected with the conductive layer.
9. optical module according to claim 7, which is characterized in that the bracket includes at least two grooves, each
The conductive layer is arranged in the corresponding groove；The optical element is in rectangle, and the light transmission conductive layer is from adjacent to institute
One jiao for stating optical element extends to the diagonal of the neighbouring optical element；The light transmission conductive layer is S-shaped and strip in
One；The width of the conductive layer is greater than the width of the light transmission conductive layer.
10. optical module according to claim 7, which is characterized in that the width of the conductive layer, which is greater than the light transmission, leads
The width of electric layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107207799 | 2018-06-11 | ||
| TW107207799U TWM570523U (en) | 2018-06-11 | 2018-06-11 | Holder, optical component and optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208861969U true CN208861969U (en) | 2019-05-14 |
Family
ID=65035479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820941064.5U Active CN208861969U (en) | 2018-06-11 | 2018-06-19 | Support, optical assembly and optical module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208861969U (en) |
| TW (1) | TWM570523U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110581111A (en) * | 2018-06-11 | 2019-12-17 | 海华科技股份有限公司 | support, optical assembly and optical module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524881B (en) * | 2019-02-01 | 2022-07-05 | 光宝光电(常州)有限公司 | Light source device |
-
2018
- 2018-06-11 TW TW107207799U patent/TWM570523U/en unknown
- 2018-06-19 CN CN201820941064.5U patent/CN208861969U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110581111A (en) * | 2018-06-11 | 2019-12-17 | 海华科技股份有限公司 | support, optical assembly and optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM570523U (en) | 2018-11-21 |
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