CN103247610A - Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses - Google Patents
Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses Download PDFInfo
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- CN103247610A CN103247610A CN2012101391107A CN201210139110A CN103247610A CN 103247610 A CN103247610 A CN 103247610A CN 2012101391107 A CN2012101391107 A CN 2012101391107A CN 201210139110 A CN201210139110 A CN 201210139110A CN 103247610 A CN103247610 A CN 103247610A
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Abstract
A method for manufacturing an optoelectronic apparatus includes attaching bottom surfaces of first and second packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between the first and second POSDs. An opaque molding compound is molded around portions of the first and second POSDs attached to the carrier substrate, so that peripheral surfaces of the first POSD and the second POSD are surrounded by the opaque molding compound, the space between the first and second POSDs is filled with the opaque molding compound, and the first and second POSDs are attached to one another by the opaque molding compound. The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the first and second POSDs are exposed. A window for each of the POSDs is formed during the molding process or thereafter.
Description
Prioity claim
The application states the priority of following U.S. Patent application:
The U.S. Patent application No.13/431 that on March 27th, 2012 submitted to, 466; And
The U.S. Provisional Patent Application No.61/597 that on February 10th, 2012 submitted to, 400.
Technical field involved in the present invention
Various embodiments of the present invention relate generally to opto-electronic device, and for the manufacture of the method for opto-electronic device.
Prior art
Opto-electronic device such as the equipment of optical proximity sensor type can comprise light source and adjacent photosensitive light detector.Such optical proximity sensor can be used to based on produce from light source and from the object reflection and by luminosity and/or the phase place of the detected light of photodetector, come the existence of detected object, the degree of approach of estimating object and/or the motion of detected object.Along with the appearance of the battery-driven portable equipment such as mobile phone, the value of these transducers becomes more important.For example, be used to driving display from the lot of energy of battery of mobile telephone, when mobile phone or other equipment are placed in user's ear limit (all can't see it in any case herein), close display or backlight be valuable.Optical proximity sensor as the example of opto-electronic device is used to this, and during many other use.
As other examples, it is helpful utilizing optical proximity sensor to come the existence of detected object in many other application.These ranges of application comprise: the protective cover of responding on the machine when is opened, and paper has correctly been placed printer, and perhaps operator's hand is positioned near the risk the active machine.Optical proximity sensor also can be used as simple touch or near the switch that touch to activate, and can be implemented in the application such as these: keyboard or have plastic casing equipment (this plastic casing be sealing but allow to penetrate it and in return, sense light by detector from the light of light source).
Because increasing opto-electronic device is being integrated in the product such as mobile phone, therefore, need provide littler more cheap opto-electronic device.Preferably, the manufacturing of optical proximity sensor and other opto-electronic devices should be simple relatively, and high yield should be provided.
Content of the present invention
Figure 1A shows the perspective view of example package light source semiconductor device (PLSSD) 112, and the perspective view of example package photodetector semiconductor device (PLDSD) 132.Figure 1B shows the ground plan of the shown exemplary PLSSD 112 of Figure 1A, and the ground plan of the shown exemplary PLDSD 132 of Figure 1A.If PLSSD 112 comprises integrated circuit, it can alternatively be called as packaged light source integrated circuit (PLSIC) so.Similarly, if PLDSD 132 comprises integrated circuit, it can alternatively be called as encapsulation photodetector integrated circuit (PLDIC) so.Both can more generally be called as packaging optoelectronic semiconductor device (POSD) PLSSD 112 and PLDSD 132.
PLSSD 112 is shown as including the light source tube core 114 that is encapsulated in the printing opacity moulding compound 122.Light source tube core 114 is shown as including a light-emitting component 116, still, can comprise more than one light-emitting component 116.Light-emitting component 116 can be light-emitting diode (LED), organic LED (OLED), block emitting led, surface light emitting LED, vertical cavity surface emitting laser (VCSEL), super-radiance light emitting diode (SLED), laser diode or pixel diode, but, be not limited only to this.Light-emitting component (such as those light-emitting components referred to above) is the example of optoelectronic component.
Printing opacity moulding compound 122 can be, for example, and light penetrating ring epoxy resins (for example, transparent or painted epoxy resin), or other light-transmissive resins or polymer.In certain embodiments, printing opacity moulding compound pigment or other attributes that can have the light that filters out incoherent some wavelength and allow the light of relevant wavelength to pass through simultaneously.
One or more pipe core welding discs 115 and/or the one or more bonding line 120 of light source tube core 114 below tube core 114 is connected to electric contact 118 (can alternatively be called as electric connector).For example, one in the electric contact 118 can provide the contact for the anode of light-emitting component 116, and in the electric contact 118 another can provide the contact for the negative electrode of light-emitting component 116.Light source tube core 114 also can comprise the signal processing circuit of amplifier circuit and/or other types.
PLSSD 112 comprises top surface 124, basal surface 128 and the circumferential surface 126 that extends between top surface 124 and basal surface 128.In this example, the top surface 124 of PLSSD 112 is made of the top surface of (being packaged with light-emitting component 116) printing opacity moulding compound 122, and circumferential surface 126 is made of the four sides of printing opacity moulding compound 122.Basal surface 128 comprises the electric contact 118 of light-emitting component 116, such as Figure 1B the best present.Electric contact 118 can be that for example, conduction convex region, conductive welding disk or conducting sphere still, are not limited only to this.For example, electric contact 118 can be conduction stitch or circuit, and this also is possible.In this example, PLSSD 112 comprises two electric contacts 118 on the basal surface 128.According to an embodiment, PLSSD 112 is smooth no pin package.According to specific embodiment, electric contact 118 constitutes the convex region grid array.
PLDSD 132 is shown as including the photodetector tube core 134 that is encapsulated in the printing opacity moulding compound 142.Photodetector tube core 134 is shown as including a photodetector 136, still, can comprise more than one photodetector 136.Photodetector 136 can be photo-resistor, photovoltaic cell, photodiode, phototransistor or charge-coupled device (CCD), but be not limited only to this, and preferably can be used to produce the light quantity of the detected light of expression and/or the curtage of phase place.Such as those photodetectors referred to above, it also is the example of optoelectronic component.
Printing opacity moulding compound 142 can be, for example, and light penetrating ring epoxy resins (for example, transparent or painted epoxy resin), or other light-transmissive resins or polymer.In certain embodiments, the printing opacity moulding compound can have the light that filters out incoherent some wavelength, and pigment or other attributes that the light of the wavelength that permission is correlated with passes through.The printing opacity moulding compound 142 of PLDSD 132 can be identical with the printing opacity moulding compound 122 of PLSSD 112, perhaps also can be different.
One or more pipe core welding discs 135 and/or the one or more bonding line 140 of photodetector tube core 134 below tube core 134 is connected to electric contact 138 (can alternatively be called as electric connector).For example, one or more in the electric contact 138 can provide the contact for the anode of photodetector 136, and one or more other electric contacts 138 can provide the contact for the negative electrode of photodetector 136.Photodetector tube core 134 also can comprise the signal processing circuit of amplifier circuit, filter circuit and/or other types.
PLDSD 132 comprises top surface 144, basal surface 148 and the circumferential surface 146 that extends between top surface 144 and basal surface 148.In this example, the top surface 144 of PLDSD 132 is made of the top surface of (being packaged with photodetector 136) printing opacity moulding compound 142, and circumferential surface 146 is made of the four sides of printing opacity moulding compound 142.Basal surface 128 comprises the electric contact 138 of photodetector 136, such as Figure 1B the best present.Electric contact 138 can be that for example, conduction convex region, conductive welding disk or conducting sphere still, are not limited only to this.For example, electric contact 138 can be that conduction stitch or circuit also are possible.In this example, PLDSD 112 comprises the hot weld dish 139 of six electric contacts 138 and an exposure at basal surface 148.The pad 139 that exposes can be alternatively, or be the ground plane of PLDSD 132 in addition.According to an embodiment, PLDSD 132 is smooth no pin package.According to specific embodiment, electric contact 138 constitutes the convex region grid array.
With reference now to Fig. 2 A and 2B,, according to one embodiment of the invention, optical proximity sensor equipment 202 comprises PLSSD 112, PLDSD 132 and opacified molded material 212.More specifically, Fig. 2 A is the top perspective of optical proximity sensor equipment 202, and Fig. 2 B is the bottom perspective view of optical proximity sensor equipment 202.As understandable from Fig. 2 A and 2B, opacified molded material 212 surrounds and has encapsulated the circumferential surface 126 of PLSSD 112 and the circumferential surface 146 of PLDSD 132.As understandable from Fig. 2 A, opacified molded material 212 has constituted the opaque light barrier 214 between PLSSD 112 and the PLDSD132, and opaque light barrier 214 has been isolated the light-emitting component 116 of PLSSD 112 and the photodetector 136 of PLDSD 132 optically.In addition, opacified molded material 212 is connected to each other PLSSD 112 and PLDSD 132 physically.In Fig. 2 A, also show the window 222 that above the light-emitting component of PLSSD 112, forms, and the window 242 of the photodetector of PLDSD 132 top formation.Be appreciated that from Fig. 2 B the electric contact 118 of PLSSD 112 and the electric contact 138 of PLDSD 132 expose, so, can be used for being electrically connected to other circuit.Except forming between PLSSD 112 and the PLDSD 132 barrier 214 (it is isolated from each other two semiconductor device optically), opacified molded material 212 also forms barrier around the whole periphery of equipment 202, so that optically that equipment 202 is isolated with near one or more other opto-electronic devices that may be positioned at equipment 202.Although it is simple hole or opening that window 222 and 242 is illustrated as,, also can form more complicated window, such as the window that comprises shutter.Opacified molded material 212 can be, for example, and black or other dark-coloured epoxy resin, or to other resins or the polymer of the only not transmission that generated by PLSSD 112.
Fig. 2 C is another perspective view of optical proximity sensor equipment 202, the figure shows the actual element (earlier in respect of figures 1A and 1B are described) that can't view by opacified molded material 212 of PLSSD 112 and PLDSD 132, but they are shown is the illustrative purpose.Fig. 2 D is the sectional view of the lines D-D in Fig. 2 C of the optical proximity sensor equipment 202 of Fig. 2 A-2C.
Although optical proximity sensor equipment 202 is shown as including with reference to Figure 1A and the described PLSSD 112 of 1B and PLDSD 132,, optical proximity sensor equipment 202 can comprise alternative PLSSD and/or PLDSD, and belongs in the scope of the present invention.Opto-electronic device according to one embodiment of the invention also may comprise more than one PLSSD and/or more than one PLDSD, for example, so that equipment can be used to gesture identification etc.As another example, opto-electronic device according to an embodiment of the invention can comprise with PLDSD 132 being used for of matching mutually and carries out a PLSSD 112 of proximity detection and to be exclusively used in the 2nd PLDSD 132 that surround lighting detects.Several examples of the type of the opto-electronic device that these just can be made according to various embodiments of the present invention.
A useful feature of optical proximity sensor equipment 202 is, PLSSD 112 and PLDSD 132 are connected to each other physically, need not to be exclusively used at least in part the substrate of the connection that provides such (for example, PCB).The advantage of this feature is, it can reduce the total height of the opto-electronic device that produces, volume and weight, and can reduce the cost of making this opto-electronic device and other opto-electronic devices.
Another useful feature of optical proximity sensor equipment 202 is, is used to physically also to be used to provide optically the barrier that the photodetector 136 of the light-emitting component 116 of PLSSD 112 and PLDSD 132 is isolated with PLSSD 112 and PLDSD 132 identical opacified molded material 212 connected to one another.This also can reduce makes this opto-electronic device and required cost and the time quantum of other opto-electronic devices.
Embodiment
Various embodiments of the present invention relate to opto-electronic device, comprise the opto-electronic device of proximity sensor equipment 202, similar optical proximity sensor equipment and other types.Such equipment comprises that by opacified molded material a plurality of packaging optoelectronic semiconductor device connected to one another (POSD) circumferential surface that this opacified molded material package is enclosed POSD also is isolated from each other all the optoelectronic component of POSD optically.In addition, one electric contact of the basal surface of POSD exposes, and so, can be used for being electrically connected to other circuit.Various embodiments of the present invention relate to the opto-electronic device for the manufacture of optical proximity sensor 202, similar optical proximity sensor equipment and other types.Referring now to Fig. 3 A-3D and the such manufacture method of 4A-4B explanation.
Fig. 3 A shows PLSSD 112 and the PLDSD 132 of carrier substrates 302 tops.As mentioned above, PLSSD 112 and PLDSD 132 each circumferential surface that include top surface, basal surface and between top surface and basal surface, extend.Also illustrated as mentioned, each all comprises electric contact at its basal surface PLSSD 112 and PLDSD132.According to an embodiment, before being connected to carrier bottom 302, the POSD of test PLSSD 112 and PLDSD 132 and/or other types.
According to an embodiment, carrier substrates 302 is the adhesive tapes with adhesive surface 304.Carrier substrates 302 can alternatively be film or the paper tinsel with adhesive surface.As following illustrated, because will be at the opacified molded material of mold pressing (212) on every side of the PLSSD 112 that is connected to adhesive tape (or other carrier substrates) and PLDSD 132, therefore, adhesive tape (or other carrier substrates) needs to bear the high temperature of fusing moulding compound, and can not be melted or otherwise be damaged.For example, adhesive tape can be made with polyimides (PI), polyvinyl chloride (PVC), perhaps also can be based on polyolefinic material, still, is not limited only to this.Exemplary Kapton Tape and film by E.I.Du Pont Company make (general headquarters are positioned at the U.S., the Delaware State, Wilmington), with trade mark Kapton
TMSell.Alternatively, carrier substrates 302 can be the removable substrate with certain other types of adhesive surface.Adhesive can be based on the adhesive of silicon, still, is not limited only to this.
The basal surface that Fig. 3 B shows PLSSD and PLDSD is connected to carrier substrates 302, in order to have between PLSSD 112 and PLDSD 132 at interval.Although in Fig. 3 B, only show a pair of PLSSD/PLDSD,, as mentioned above, most possible tens of and potentially hundreds of such to being connected to same carrier substrates 302.For example, N row * M capable (for example, 15 * 20) such to (for example being connected to the identical carrier substrate, adhesive tape), in order to can make N * M equipment (for example, 15 * 20=300 equipment) simultaneously, wherein, N and M are the integer more than or equal to 1 separately, and N and M can be same to each other or different to each other.As described above, alternatively, can comprise plural packaging optoelectronic semiconductor device in each equipment.
Do not correspond to reality so although be not, might carrier substrates 302 there be adhesive surface, under these circumstances, the basal surface of PLSSD 112 and PLDSD 132 can use the adhesive that is sprayed directly on PLSSD112 and PLDSD 132 and/or the carrier substrates 302 to be connected to carrier substrates 302.
Fig. 3 C shows the opacified molded material 212 of mold pressing around some part of the PLSSD 112 that is connected to carrier substrates 302 and PLDSD 132, so that the circumferential surface of PLSSD 112 and PLDSD 132 is surrounded by opacified molded material 212.Fill with opacified molded material 212 at the interval that Fig. 3 C also shows between PLSSD 112 and the PLDSD132, to form light tight barrier 214.Can also understand from Fig. 3 C, PLSSD 112 is connected by opacified molded material 212 each other with PLDSD 132.In with reference to the described embodiment of figure 3C, the top surface of the part of tube core (to wherein having injected moulding compound 212) contact PLDSD 132 is in order to form window 242 above one or more photodetectors of PLDSD 132.Similarly, the top surface of the part of tube core contact PLDSD 132 is in order to form window 222 above one or more light-emitting components of PLSSD 112.Although in Fig. 3 C, only show a pair of PLSSD/PLDSD,, mold pressing as described above is most possibly for the dozens of that is connected to same carrier substrates 302 all and hundreds of such to carrying out simultaneously potentially.The tube core that is used to use opacified molded material 212 to carry out mold pressing can be coated with such as Teflon
TMOr the material of silicon rubber and so on, so that the encapsulate mode structure that produces is removed from tube core more like a cork.Operable mould pressing technology includes but are not limited to: injection-molded, compression molded, transfer moulding and mold are molded.
Fig. 3 D shows to cut at 312 places and wears opacified molded material 212 (312 also can be called as cutting), with with PLSSD 112 and PLDSD 132 and other PLSSD/PLDSD to separating mutually, the opto-electronic device that produces with toilet comprises PLSSD 112 and PLDSD 132 connected to one another and that isolated optically by opacified molded material 212.Such cutting can use saw, blade or laser to carry out, and still, is not limited only to this.According to an embodiment, can so carry out cutting: opacified molded material 212 is cut to be worn, and does not wear carrier substrates 302 and do not cut, shown in Fig. 3 D.Alternatively, can so carry out cutting: opacified molded material 212 and carrier substrates 302 boths are cut to wear.
Fig. 3 E shows and removes carrier substrates 302.This can expose the electric contact 118 (Figure 1B is shown) on the basal surface 128 of PLSSD 112, and exposes electric contact 138 and hot weld dish and/or ground plane 139 (Figure 1B is shown) on the basal surface 148 of PLDSD 132.Can use solvent to remove adhesive or by using vibration etc. to peel off carrier substrates 302 (for example, adhesive tape) simply to remove carrier substrates 302, still, be not limited only to this.In alternative embodiment, before cutting as described above, remove carrier substrates 302.According to an embodiment, before or after cutting, to remove after the carrier substrates but be most likely at, the opto-electronic device (for example, 202) that test produces is in order to can visit electric contact more like a cork at test period.
Can alternatively carry out mold pressing as being appreciated that from Fig. 4 A, so that one or more light-emitting components of PLSSD 112 are covered by opacified molded material 212, and/or one or more photodetectors of PLDSD 132 are covered by opacified molded material 212.After this, remove the part of the opacified molded material that covers one or more light-emitting components, above one or more light-emitting components of PLSSD 112, to form window 222, and/or the part of the opacified molded material of the opacified molded material of the one or more photodetectors of removal covering, above one or more photodetectors of PLDSD 132, to form window 242, as understandable from Fig. 4 B.Removal can be by etching to form window, develop, peel off or certain other technologies are carried out.Replaced the described step with reference to figure 3C, can carry out with reference to figure 4A and the described step of 4B.
Later with reference to figure 3C, the cross section of the optical sensor device that produces can alternatively look like Fig. 2 D or the shown cross section of 4B.By using alternative mold pressing and/or removing moulding compound to form the window of alternative form, other cross sections also are fine.
For the manufacture of the method for the opto-electronic device of (for example so that equipment can be used for gesture identification etc.) that comprise more than one PLSSD and/or more than one PLDSD also in the scope of embodiments of the invention.The similar method of use and method as described above comes the opto-electronic device (comprising at least two packaging optoelectronic semiconductor device (POSD)) of production other types also in the scope of various embodiments of the present invention.
Fig. 5 is the high level flow chart of summarizing according to various embodiments of the present invention for the manufacture of the method for opto-electronic device.For following description, suppose that opto-electronic device comprises first packaging optoelectronic semiconductor device (POSD) and the 2nd POSD.Yet as described above, opto-electronic device can comprise plural POSD.Also as described above, each POSD comprises top surface, basal surface and the circumferential surface that extends between top surface and basal surface.In addition, each POSD comprises by by the packaged one or more optoelectronic components of printing opacity moulding compound.In addition, each POSD comprises electric contact at its basal surface.
With reference to figure 5, in step 502, the basal surface of the first and the 2nd POSD is connected to carrier substrates (for example, having the adhesive tape of adhesive surface), and making has between a POSD and the 2nd POSD at interval.
In step 504, all the opacified molded material of mold pressing on every side partly at first and second POSD that are connected to carrier substrates, so that the circumferential surface of a POSD and the 2nd POSD is surrounded by opacified molded material, fill with opacified molded material at interval between the one POSD and the 2nd POSD, and first and second POSD link together by opacified molded material each other.
In step 506, remove carrier substrates (for example, adhesive tape), so that the electric contact on the basal surface of first and second POSD is exposed.As mentioned above, can still be not limited only to this by using solvent or using vibration to peel off carrier substrates to remove carrier substrates.
In step 508, cut and wear opacified molded material, so that first and second POSD and other POSD are separated mutually, the opto-electronic device that produces with toilet comprises first and second POSD connected to one another and that be isolated from each other optically by opacified molded material.In alternative embodiment, can put upside down the order of step 506 and 508.Also illustrated as mentioned, each just all can comprise plural POSD at manufactured opto-electronic device.
According to specific embodiment, the mold pressing in the execution in step 504 in order to form first window above one or more optoelectronic components of a POSD, forms second window above one or more optoelectronic components of the 2nd POSD.
In a particular embodiment, can be used to produce the opto-electronic device of optical proximity sensor type with reference to figure 5 described methods.In such embodiments, one or more optoelectronic components of a POSD are one or more light-emitting components, and one or more optoelectronic components of the 2nd POSD are one or more photodetectors.In addition, in such embodiments, the mold pressing in can execution in step 504 in order to form first window above one or more light-emitting components of a POSD, forms second window above one or more photodetectors of the 2nd POSD.
Described with reference to figure 4A and 4B as mentioned, the alternatively mold pressing in the execution in step 504 is so that one or more optoelectronic components of a POSD are covered by opacified molded material.In addition, perhaps alternatively, the mold pressing in can execution in step 504 is so that one or more optoelectronic components of the 2nd POSD are covered by opacified molded material.In such embodiments, after step 504 and before step 506, remove at least a portion of the opacified molded material of the one or more optoelectronic components that cover a POSD, above one or more photoelectrons of a POSD, to form window.In addition, perhaps alternatively, remove at least a portion of the opacified molded material of the one or more optoelectronic components that cover the 2nd POSD, above one or more optoelectronic components of the 2nd POSD, to form second window.The opacified molded material of such removal with the action that forms one or more windows can be by etching, develop, peel off or certain other technologies are carried out.
As mentioned above, just also can comprise one or more extra POSD at manufactured opto-electronic device.Correspondingly, step 502 can comprise that also the basal surface with one or more extra POSD is connected to carrier substrates.Step 504 also can be included in the opacified molded material of mold pressing around some part of the one or more extra POSD that is connected to carrier substrates.Step 506 also can comprise the removal carrier substrates, so that the electric contact on the basal surface of one or more extra POSD is exposed.In such embodiments, step 508 can comprise cutting wears opacified molded material so that first, second and one or more extra POSD are separated mutually with other POSD, and the opto-electronic device that produces with toilet comprises first, second and one or more extra POSD connected to one another and that be isolated from each other optically by opacified molded material.
Fig. 6 is the high level flow chart of summarizing according to various embodiments of the present invention that is used for making simultaneously the method for a plurality of opto-electronic devices.Each such opto-electronic device all comprises one group of (that is, two or more) opto-electronic semiconductor module (POSD).
With reference to figure 6, in step 602, the basal surface of organizing POSD is connected to carrier substrates (for example, having the adhesive tape of adhesive surface) more, in order to have between each in each POSD and its one or more adjacent POSD at interval.
In step 604, the opacified molded material of mold pressing around some part of each POSD that is connected to carrier substrates, so that the circumferential surface of each POSD is all surrounded by opacified molded material, interval between among each POSD and its one or more adjacent POSD each all uses opacified molded material to fill, and each among one or more adjacent POSD is connected to each other with it with each POSD by opacified molded material.
In step 606, remove carrier substrates, so that the electric contact on the basal surface of each among the POSD all is exposed.
In step 608, cut and wear opacified molded material so that the opto-electronic device of a plurality of separations to be provided thus, each opto-electronic device all comprises: one group by opacified molded material POSD connected to one another and by opacified molded material the isolated light barrier of other POSD of the optoelectronic component of each POSD formed and that will organize optically and this group.In alternative embodiment, can put upside down step 606 and 608.The additional detail of the step of the step of Fig. 6 and Fig. 5 can be provided from the description that above provides.
Fig. 7 shows the exemplary top view of many group POSD, and each group POSD comprises a packaged light source semiconductor device (PLSSD) 112 and encapsulation photodetectors semiconductor device (PLDSD) 132.The opacified molded material 212 of mold pressing around all the part of each POSD (being connected to carrier substrates 302), so that the circumferential surface of each POSD is all surrounded by opacified molded material 212, interval between among each POSD and the one or more adjacent POSD thereof each all uses opacified molded material 212 to fill, and each among one or more adjacent POSD is connected to each other with it with each POSD by opacified molded material 212.Above the light-emitting component of the POSD of each PLSSD 112 type, form window 222, above the photodetector of the POSD of each PLDSD 132 type, form window 242.
By cutting along horizontal dotted line 702 and vertical dotted line 704, obtain the opto-electronic device of a plurality of separations, each opto-electronic device is one group of POSD all.As mentioned above, such cutting can use saw, blade or laser to carry out, and still, is not limited only to this.Cutting can be carried out before or after removing carrier substrates (for example, 302).Be to remove under the situation about carrying out before the carrier substrates in cutting, can so carry out cutting: opacified molded material 212 is cut to be worn, and does not wear carrier substrates and do not cut.Alternatively, can so carry out cutting: opacified molded material 212 and carrier substrates both are cut to wear.More generally, can POSD be divided into all sub-component or all group of sub-component separately by sawing or another kind of method, to produce final products.
In the example of Fig. 7, the opto-electronic device of each separation all is optical proximity sensor 202, and it comprises by opacified molded material 212 PLSSD 112 connected to one another and PLDSD 132.By the light barrier 214 that opacified molded material 212 constitutes the light-emitting component of PLSSD 112 and the photodetector of PLDSD 132 are isolated optically.As mentioned above, can use technology described herein to make the opto-electronic device of alternative type.
The opto-electronic device of various embodiments of the present invention can be used for various systems, includes but are not limited to: mobile phone, panel computer, personal digital assistant, laptop computer, net book, other handheld apparatus, and non-handheld apparatus.System 800 with reference to figure 8, for example, whether opto-electronic device 802 (for example, optical proximity sensor equipment 202) can be used to control subsystem 806 (for example, touch-screen, display, backlight, virtual roll wheel, virtual keypad, navigation panel etc.) and be activated or forbid.For example, when the object that opto-electronic device can detect such as people's finger approaches, and enables (perhaps forbidding) subsystem 806 based on detection.More specifically, opto-electronic device (for example, optical proximity sensor equipment 202) output can be provided to comparator or processor 804, this comparator or processor 804 can be for example compare output and the threshold value of optical pickocff, in the scope with (or forbidding, the depend on expectation what) subsystem 806 of determining whether object is in and enables.A plurality of threshold values (for example, the digital value of storage) can be used, based on the degree of approach of detected object, more than one may the response can be produced.For example, if object in first degree of approach scope, then can produce first response, if object in second degree of approach scope, then can produce second response.Exemplary response can comprise and starting or stoping, or enable or forbid various systems and/or subsystem.Under opto-electronic device 802 is used for situation that surround lighting detects, the brightness of (for example, display or backlight) that comparator or processor 804 can determine how to adjust subsystem 806.Fig. 8 also shows one or more light-emitting components that driver 801 can drive the packaged light source semiconductor device of opto-electronic device 802 selectively.
Although above described various embodiments of the present invention,, should be appreciated that they are to present as example, and as restriction.Those personnel that are proficient in present technique be it is evident that, under situation without departing from the spirit and scope of the present invention, can carry out various changes to form and details.
Scope of the present invention should not be subjected to any restriction of above-mentioned exemplary embodiment, and only should define according to following claim and their equivalent.
The accompanying drawing summary
Figure 1A shows the perspective view of example package light source semiconductor device (PLSSD), and the perspective view of example package photodetector semiconductor device (PLDSD).
Figure 1B shows the ground plan of the shown exemplary PLSSD of Figure 1A, and the ground plan of the shown exemplary PLDSD of Figure 1A.
Fig. 2 A is the top perspective of optical proximity sensor equipment according to an embodiment of the invention.
Fig. 2 B is the bottom perspective view of the optical proximity sensor equipment of Fig. 2 A.
Fig. 2 C is the further perspective view of the optical proximity sensor equipment of Fig. 2 A and 2B.
Fig. 2 D is the sectional view of the optical proximity sensor equipment of Fig. 2 A-2C.
Fig. 3 A-3E is used to describe the method for the manufacture of optical proximity sensor equipment according to some embodiment of the present invention.
Fig. 4 A and 4B are used to describe the method for the manufacture of optical proximity sensor equipment according to alternative embodiment of the present invention.
Fig. 5 is the high level flow chart of summarizing according to various embodiments of the present invention for the manufacture of the method for opto-electronic device.
Fig. 6 is the high level flow chart of summarizing according to various embodiments of the present invention that is used for making simultaneously the method for a plurality of opto-electronic devices.
Fig. 7 shows according to the many group POSD of how using of various embodiments of the present invention and makes a plurality of opto-electronic devices.
Fig. 8 is the high-level block diagram of system according to an embodiment of the invention.
The reference numerals list of primary clustering in the accompanying drawing
Claims (22)
1. method for the manufacture of the opto-electronic device that comprises the first and second packaging optoelectronic semiconductor device (POSD),
Wherein, each POSD comprises by the packaged one or more optoelectronic components of printing opacity moulding compound,
Wherein, each POSD comprises top surface, basal surface and the circumferential surface that extends between described top surface and described basal surface.
Wherein, each POSD comprises electric contact at its basal surface,
Described method comprises:
(a) the described basal surface with described first and second POSD is connected to carrier substrates, and making has between described first and second POSD at interval;
(b) the opacified molded material of mold pressing around all parts of described first and second POSD that are connected to described carrier substrates, so that:
The described circumferential surface of described first and second POSD is surrounded by described opacified molded material,
Fill with described opacified molded material at described interval between described first and second POSD, and
Described first and second POSD are connected to each other by described opacified molded material; And
(c) remove described carrier substrates, so that the electric contact on the described basal surface of described first and second POSD is exposed.
2. the method for claim 1 is characterized in that:
In step (b), carry out described mold pressing, so that
Above described one or more optoelectronic components of a described POSD, form first window; And
Above described one or more optoelectronic components of described the 2nd POSD, form second window.
3. method as claimed in claim 2 is characterized in that:
Described opto-electronic device comprises optical proximity sensor;
Described one or more optoelectronic components of a described POSD comprise one or more light-emitting components; And
Described one or more optoelectronic components of described the 2nd POSD comprise one or more photodetectors; And
In step (b), carry out described mold pressing, so that
Above described one or more light-emitting components of a described POSD, form described first window; And
Above described one or more photodetectors of described the 2nd POSD, form described second window.
4. the method for claim 1 is characterized in that:
In step (b), carry out described mold pressing, so that:
Described one or more optoelectronic components of a described POSD are covered by described opacified molded material; And/or
Described one or more optoelectronic components of described the 2nd POSD are covered by described opacified molded material; And
Also comprise, in step (b) afterwards and in step (c) before
Remove at least a portion of the described opacified molded material of the described one or more optoelectronic components that cover a described POSD, above described one or more optoelectronic components of a described POSD, to form first window; And/or
Remove at least a portion of the described opacified molded material of the described one or more optoelectronic components that cover described the 2nd POSD, above described one or more optoelectronic components of described the 2nd POSD, to form second window;
Wherein, described removal with form described first window and/or described second window by etching, develop, peel off or certain other technologies are carried out.
5. the method for claim 1 is characterized in that, in step (b) afterwards, and before or after step (c), also comprises:
Cut and wear described opacified molded material, so that described first and second POSD and other POSD are separated mutually, the opto-electronic device that produces with toilet comprises described first and second POSD connected to one another and that be isolated from each other optically by described opacified molded material.
6. the method for claim 1 is characterized in that:
Described carrier substrates comprises the adhesive tape with adhesive surface;
Step (a) comprises that the described basal surface with described first and second POSD is connected to the described adhesive surface of described adhesive tape, so that have between described first and second POSD at interval; And
Step (c) comprises removes described adhesive tape, so that the electric contact on the described basal surface of described first and second POSD is exposed.
7. the method for claim 1 is characterized in that:
Just also comprise one or more extra POSD at manufactured described opto-electronic device;
Step (a) comprises that also the described basal surface with described one or more extra POSD is connected to described carrier substrates;
Step (b) also is included in the described opacified molded material of mold pressing on every side of all the part of the described one or more extra POSD that is connected to described carrier substrates;
Step (c) also comprises removes described carrier substrates, so that the electric contact on the described basal surface of described one or more extra POSD is exposed; And
Also comprise, in step (b) afterwards, and before or after step (c), cut and wear described opacified molded material, so that described first, second and one or more extra POSD are separated mutually with other POSD, so that the opto-electronic device that produces comprises described first, second and one or more extra POSD connected to one another and that be isolated from each other optically by described opacified molded material.
8. opto-electronic device comprises:
The first and second packaging optoelectronic semiconductor device (POSD) comprise separately
The one or more optoelectronic components that encapsulated by the printing opacity moulding compound;
The top surface that is constituted by the top surface of the described printing opacity moulding compound of the one or more optoelectronic components that are packaged with described POSD;
The basal surface of electric contact that comprises described one or more optoelectronic components of described POSD; And
The circumferential surface that between described top surface and basal surface, extends;
Opacified molded material, described opacified molded material package is enclosed the described circumferential surface of described first and second POSD, described one or more optoelectronic components of a described POSD and described one or more optoelectronic components of described the 2nd POSD are isolated optically, and described first and second POSD are connected to each other;
First window that above described one or more optoelectronic components of a described POSD, forms; And
Second window that above described one or more optoelectronic components of described the 2nd POSD, forms;
Wherein, the described electric contact of a described POSD and the described electric contact of described the 2nd POSD expose, and so, can be used for being electrically connected to other circuit.
9. opto-electronic device as claimed in claim 8 is characterized in that:
The described basal surface of each POSD of described electric contact that comprises described one or more optoelectronic components of described POSD comprises: the basal surface of printed circuit pad (PCB) or leadframe, and described one or more optoelectronic components of described POSD are connected to the top surface of described PCB or leadframe.
10. opto-electronic device as claimed in claim 8 is characterized in that, the above electric contact of described basal surface of each POSD is all by selecting in the following group of forming:
The conduction convex region;
Conductive welding disk;
Conducting sphere;
The conduction stitch; And
The conducting wire.
11. opto-electronic device as claimed in claim 8 is characterized in that, each POSD comprises smooth no pin package.
12. opto-electronic device as claimed in claim 8 is characterized in that:
A described POSD comprises the light source semiconductor device of encapsulation;
Described the 2nd POSD comprises the photodetector semiconductor device of encapsulation;
Described one or more optoelectronic components of a described POSD comprise one or more light-emitting components;
Described one or more optoelectronic components of described the 2nd POSD comprise one or more photodetectors;
Above described one or more light-emitting components of a described POSD, form described first window; And
Above described one or more photodetectors of described the 2nd POSD, form described second window.
13. opto-electronic device as claimed in claim 12 is characterized in that, described opto-electronic device is to be used to detect the optical proximity sensor that an object exists in the induction region of optical proximity sensor, approaches and/or move.
14. opto-electronic device as claimed in claim 12 also comprises:
The packaged light source semiconductor device that at least one is extra and/or the encapsulation photodetector semiconductor device that at least one is extra; And
Wherein, described opto-electronic device comprises
Can be used to detect the optical gesture identification sensor of a plurality of different gestures; Or
Optical proximity sensor and ambient light sensor, wherein, described optical proximity sensor can be used to detect existence, the approaching and/or motion of an object in the described induction region of described optical proximity sensor.
15. the method for the manufacture of a plurality of opto-electronic devices, each opto-electronic device all comprises
One group of opto-electronic semiconductor module (POSD), wherein, each POSD comprises
By the packaged one or more optoelectronic components of printing opacity moulding compound;
The top surface that is constituted by the top surface of the described printing opacity moulding compound of the one or more optoelectronic components that are packaged with described POSD;
The basal surface of electric contact that comprises described one or more optoelectronic components of described POSD; And
The circumferential surface that between described top surface and basal surface, extends; And
Wherein, each group POSD comprises at least two POSD,
Described method comprises:
(a) the described basal surface that will organize POSD is connected to carrier substrates more, so that have between each in each POSD and its one or more adjacent POSD at interval;
(b) the opacified molded material of mold pressing around all parts of described each POSD that is connected to described carrier substrates, so that
The described circumferential surface of described each POSD is surrounded by described opacified molded material,
Fill with described opacified molded material at interval between among each POSD and its one or more adjacent POSD each, and
Among one or more adjacent POSD each is connected to each other with it with each POSD by described opacified molded material; And
(c) remove described carrier substrates, so that the electric contact on the described basal surface of described each POSD is exposed.
16. method as claimed in claim 15 is characterized in that, in step (b) afterwards, and before or after step (c), also comprises:
Cut and wear described opacified molded material, so that the opto-electronic device of a plurality of separations to be provided thus, each opto-electronic device all comprises
By described opacified molded material described POSD group connected to one another; And
Light barrier that constituted by described opacified molded material and that other POSD of the optoelectronic component of each POSD of described group and described group are isolated optically.
17. method as claimed in claim 16 is characterized in that, carries out described mold pressing in step (b), in order to form window above described one or more optoelectronic components of each POSD.
18. method as claimed in claim 16 is characterized in that:
In step (b), carry out described mold pressing, so that described one or more optoelectronic components of at least one among the described POSD are covered by described opacified molded material; And
For its one or more optoelectronic components by each POSD that described opacified molded material covered, also comprise, remove at least a portion of the described opacified molded material that covers described one or more optoelectronic components, above described one or more optoelectronic components of described POSD, to form window.
19. a system comprises:
An opto-electronic device comprises
The packaged light source semiconductor device comprises
By the packaged one or more light-emitting components of printing opacity moulding compound;
The top surface that is constituted by the top surface of the described printing opacity moulding compound that is packaged with described one or more light-emitting components;
The basal surface that comprises the electric contact of described one or more light-emitting components; And
The circumferential surface that between described top surface and basal surface, extends;
Encapsulation photodetector semiconductor device comprises
By the packaged one or more photodetectors of printing opacity moulding compound;
The top surface that is constituted by the top surface of the described printing opacity moulding compound that is packaged with described one or more photodetectors;
The basal surface that comprises the electric contact of described one or more photodetectors; And
The circumferential surface that between described top surface and basal surface, extends;
Opacified molded material, described opacified molded material package is enclosed the described circumferential surface of described packaged light source semiconductor device and described encapsulation photodetector semiconductor device, described one or more light-emitting components of described packaged light source semiconductor device and described one or more photodetectors of described encapsulation photodetector semiconductor device are isolated optically, and described packaged light source semiconductor device and described encapsulation photodetector semiconductor device are connected to each other;
First window that above described one or more light-emitting components of described packaged light source semiconductor device, forms; And
Second window that above described one or more photodetectors of described encapsulation photodetector semiconductor device, forms;
Wherein, the described electric contact of the described electric contact of described packaged light source semiconductor device and described encapsulation photodetector semiconductor device exposes, and so, can be used for being electrically connected to other circuit.
20. system as claimed in claim 19 is characterized in that, also comprises:
Drive the driver of one or more light-emitting components of described packaged light source semiconductor device selectively;
For detection of processor and/or the circuit of an object (if any) with respect to the degree of approach of the sub-device of described optical photoconductor; And
To as by as described in processor and/or the detected object of circuit (if any) with respect to as described in the degree of approach of opto-electronic device make the subsystem of response.
21. system as claimed in claim 20 is characterized in that, also comprises:
Printed circuit board (PCB) (PCB);
Wherein, described opto-electronic device, described driver all are connected to described PCB for detection of the processor of the degree of approach of object and/or each in circuit and the described subsystem.
22. system as claimed in claim 19 is characterized in that, also comprises:
The packaged light source semiconductor device that at least one is extra and/or the encapsulation photodetector semiconductor device that at least one is extra; And
Drive the driver of one or more light-emitting components of described one or more packaged light source semiconductor device selectively;
Wherein, described opto-electronic device comprises
Can be used to detect the optical gesture identification sensor of a plurality of different gestures; Or
Optical proximity sensor and ambient light sensor, wherein, described optical proximity sensor can be used to detect existence, the approaching and/or motion of an object in the described induction region of described optical proximity sensor.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261597400P | 2012-02-10 | 2012-02-10 | |
| US61/597,400 | 2012-02-10 | ||
| US13/431,466 US8564012B2 (en) | 2012-02-10 | 2012-03-27 | Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses |
| US13/431,466 | 2012-03-27 |
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| Publication Number | Publication Date |
|---|---|
| CN103247610A true CN103247610A (en) | 2013-08-14 |
| CN103247610B CN103247610B (en) | 2016-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210139110.7A Active CN103247610B (en) | 2012-02-10 | 2012-04-26 | Opto-electronic device and the method manufacturing opto-electronic device |
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