CN203823501U - LED luminous device - Google Patents

LED luminous device Download PDF

Info

Publication number
CN203823501U
CN203823501U CN201420161276.3U CN201420161276U CN203823501U CN 203823501 U CN203823501 U CN 203823501U CN 201420161276 U CN201420161276 U CN 201420161276U CN 203823501 U CN203823501 U CN 203823501U
Authority
CN
China
Prior art keywords
led
substrate
circuit
light
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420161276.3U
Other languages
Chinese (zh)
Inventor
黄建中
吴志明
陈逸勋
郑宇翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BRIGHTEK OPTOELECTRONIC SHENZHEN CO Ltd
Brightek Optoelectronic Co Ltd
Original Assignee
BRIGHTEK OPTOELECTRONIC SHENZHEN CO Ltd
Brightek Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BRIGHTEK OPTOELECTRONIC SHENZHEN CO Ltd, Brightek Optoelectronic Co Ltd filed Critical BRIGHTEK OPTOELECTRONIC SHENZHEN CO Ltd
Priority to CN201420161276.3U priority Critical patent/CN203823501U/en
Application granted granted Critical
Publication of CN203823501U publication Critical patent/CN203823501U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

An LED luminous device comprises a substrate as well as a circuit layer, a partition wall, an LED drive assembly, a light-transmitting packaging body, a light-reflecting packaging body and two electrodes which are located on the substrate, wherein the two electrodes are electrically connected to the circuit layer; the circuit layer defines an LED circuit and an electronic element circuit through partition of the partition wall; the LED drive assembly is arranged on the electronic element circuit, the light-reflecting packaging body is formed on the electronic element circuit, and the LED drive assembly is covered with the light-reflecting packaging body; and the end surface, far away from the substrate, of the partition wall is covered with the light-reflecting packaging body, and a light-reflecting surface with larger than 85% of reflectivity for light with the wavelength ranging from 400 nm to 500 nm is formed, so that the overall luminous efficiency of the LED luminous device is effectively improved.

Description

LED light-emitting device
Technical field
The utility model relates to a kind of light-emitting device, and particularly relates to and a kind ofly can directly drive luminous LED light-emitting device with alternating electromotive force.
Background technology
In recent years, the application of light emitting diode (LED) was extensive gradually, and along with the continuous lifting of technical field, had developed the High Power LED of high illumination briliancy at present, and it is enough to replace traditional lighting source.
But the structure design of conventional LED light-emitting device, has light-absorbing thing at the block in LED chip outside and occurs, and makes the overall light efficiency of conventional LED light-emitting device be difficult to be raised further.
So the improving of the above-mentioned defect of inventor's thoughts, is that spy concentrates on studies and coordinates the utilization of scientific principle, finally propose a kind of reasonable in design and effectively improve the utility model of above-mentioned defect.
Utility model content
The purpose of this utility model is to provide a kind of LED light-emitting device, and it can make LED light-emitting device have preferably light efficiency.
The utility model provides a kind of LED light-emitting device, and this LED light-emitting device comprises: a substrate, and described substrate has a positive and back side that is positioned at opposition side; One circuit layer, described circuit layer is arranged at the front of described substrate, and described circuit layer includes a LED circuit and an electronic element circuit, and described LED circuit and described electronic element circuit are electrically connected to each other; One intercepts wall, described obstruct wall is arranged at the positive of described substrate and includes one first two second of being connected around wall around wall and with described first around wall, described second is positioned at the described first two opposite sides around wall around wall, and described LED circuit is revealed in the described first region surrounding around wall, and described electronic element circuit is positioned at described first outside wall and is revealed in described second around wall and the described first region jointly surrounding around wall; The naked crystalline substance of multiple LED, the naked crystalline substance of described LED is installed on described LED circuit, to be electrically connected at described circuit layer; The naked crystalline substance of multiple LED, the naked crystalline substance of described LED is installed on described LED circuit, to be electrically connected at described circuit layer; One light transmission package, described light transmission package is arranged in the described first region jointly surrounding around wall and described substrate and in described light transmission package, is coated with the naked crystalline substance of described LED; One reflective packaging body, described reflective packaging body is arranged at described first in wall, the described second region jointly surrounding around wall and described substrate, and described reflective packaging body covers the end face away from the described obstruct wall of described substrate, and described LED driving element is embedded in described reflective packaging body, and described reflective packaging body has a reflecting surface away from described substrate, the light that described reflecting surface is 400nm to 500nm with respect to wavelength has the reflectivity that is greater than 85%; And two electrodes, described electrode is arranged on described substrate and is electrically connected at described circuit layer, described electrode is in order to be electrically connected at an AC power, make transmission and the conversion via described circuit layer and described LED driving element of alternating electromotive force that described AC power provides, and can make the naked trichite light of described LED.
Further, described LED light-emitting device further has two LED testing cushion that are electrically connected at described LED circuit, and described LED testing cushion is used for a detection electric current described LED circuit of flowing through, to detect individually the naked crystalline substance of LED on described LED circuit.
Further, described circuit layer, described LED testing cushion and described electrode are all positioned at the front of described substrate, and the LED circuit of described circuit layer and described LED testing cushion are integrated the structure of extension.
Further, described LED light-emitting device further includes two subtest pads, and described subtest pad is positioned at the back side of described substrate and is electrically connected at respectively described LED testing cushion.
Further, described LED light-emitting device further includes two connection gaskets and two auxiliary electrodes, described connection gasket is positioned at the front of described substrate, described auxiliary electrode is positioned at the back side of described substrate and is electrically connected at respectively described connection gasket, described connection gasket is compartment of terrain with described electrode respectively and arranges, and described electrode can be via being electrically connected with described auxiliary electrode respectively with the electric connection of described connection gasket.
Further, described first has an axis perpendicular to described front around wall definition, and described first is the structure with respect to described axis symmetry around wall and described second around wall.
Further, described substrate is square, and described second is arranged at respectively two relative corner portions of described substrate around wall, and described electrode is arranged at two other relative corner portions of described substrate.
Further, described reflective packaging body is non-conductive colloid.
Further, the reflectivity that the light that described reflecting surface is 400nm to 500nm with respect to wavelength has is further defined to more than 90%.
Further, described LED driving element is further defined to naked crystalline form.
In sum, LED light-emitting device provided by the utility model, it can directly drive under luminous prerequisite with alternating electromotive force, by be formed with obstruct wall between described electronic component and the naked crystalline substance of LED, use the isolation naked crystalline substance of LED and electronic component, and then the heat reducing is between the two disturbed and electromagnetic interference.Moreover, cover the obstruct wall end face away from substrate by reflective packaging body, and form and there is with respect to the light of wavelength 400nm to 500nm the reflecting surface that is greater than 85% reflectivity, and then effectively promote the overall light efficiency of LED light-emitting device.
For further understanding feature of the present utility model and technology contents, refer to following about detailed description of the present utility model and accompanying drawing, but appended graphic reference and the explanation use of only providing is not used for claim scope of the present utility model to do any restriction.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the utility model LED light-emitting device.
Fig. 2 A is the decomposing schematic representation of Fig. 1.
Fig. 2 B is the decomposing schematic representation at another visual angle of Fig. 1.
Fig. 3 is the schematic perspective view of the utility model load bearing seat.
To be the utility model make to detect only the circulate schematic diagram of LED circuit of electric current by LED testing cushion to Fig. 4.
Fig. 5 is that the utility model makes another detect the schematic diagram of current flowing LED circuit and electronic element circuit by electrode.
Fig. 6 is the reflectivity schematic diagram of the reflecting surface of the utility model LED light-emitting device.
Fig. 7 is the schematic diagram that the electrode of the utility model LED light-emitting device connects AC power.
Fig. 8 is the schematic diagram of the auxiliary electrode linkage function heat sink of the utility model LED light-emitting device.
[symbol description]
100LED light-emitting device
10 load bearing seats
1 substrate
11 fronts
12 back sides
2 circuit layers
21LED circuit
22 electronic element circuits
3LED testing cushion
4 subtest pads
5 electrodes
6 auxiliary electrodes
7 connection gaskets
8 intercept wall
81 first around wall
82 second around wall
The naked crystalline substance of 20LED
30 electronic components
301LED driving element
302 rectifier cells
303 power components
40 light transmission package
50 reflective packaging bodies
501 reflectings surface
200 checkout equipments
300 AC powers
400 function heat sinks
I detects electric current
Another detects electric current I '
C axis
Detailed description of the invention
Refer to Fig. 1, it is an embodiment of the present utility model, and what need first illustrate is, the correlated measure that the present embodiment correspondence pattern is mentioned and shape, only in order to specifically describe embodiment of the present utility model, so that understand its content, but not in order to limit to claim scope of the present utility model.
Refer to shown in Fig. 2 A, Fig. 2 B and Fig. 3, the present embodiment is a kind of LED light-emitting device 100, comprises naked brilliant 20, the multiple electronic component 30 of a load bearing seat 10, multiple LED, a light transmission package 40 and a reflective packaging body 50.Wherein, above-mentioned LED naked brilliant 20 is all installed on load bearing seat 10 with electronic component 30, and light transmission package 40 is located at load bearing seat 10 and by naked LED brilliant 20 in the inner embedding, and described reflective packaging body 50 is located at load bearing seat 10 and by the inner embedding electronic component 30.
Below first load bearing seat 10 structures with LED light-emitting device 100 are described, and in the process of constructing in explanation load bearing seat 10, introduce other elements of ground LED light-emitting device 100 in good time.
Described load bearing seat 10 has a substrate 1, a circuit layer 2, two LED testing cushion 3, two subtest pads 4, two electrodes 5, two auxiliary electrodes 6, two connection gaskets 7 and intercept wall 8.Wherein, described substrate 1 is roughly square on (as: rectangle or square) and has one positive 11 and one back side 12 that is positioned at opposition side, the thickness of foregoing circuit layer 2, LED testing cushion 3, electrode 5 and connection gasket 7 is roughly the same and be all positioned at the front 11 of substrate 1, and the thickness of above-mentioned subtest pad 4 and auxiliary electrode 6 is also roughly the same and be all positioned at the back side 12 of substrate 1.
Described circuit layer 2 includes a LED circuit 21 and an electronic element circuit 22, and LED circuit 21 is electrically connected to each other with electronic element circuit 22.Wherein, electronic element circuit 22 can be divided into two blocks, and two blocks of electronic element circuit 22 are positioned at the two opposite sides of LED circuit 21.Say further, two blocks of electronic element circuit 22 are roughly arranged in respectively two corners (as substrate 1 corner, left side and the corner, right side of Fig. 2 A) on substrate 1 diagonal.
The material of described obstruct wall 8 is preferably ceramic material, intercepts wall 8 and is arranged at the front 11 of substrate 1 and is positioned on partial circuit layer 2.And circuit layer 2 on substrate 1 front 11 is equivalent to separate and roughly define described LED circuit 21 and electronic element circuit 22 through intercepting wall 8.
In more detail, described obstruct wall 8 includes one and roughly rounded first is connected in first around two second of wall 81 around wall 242 around wall 81 and one in the present embodiment.Wherein, first is roughly positioned at positive 11 middle section around wall 81, two second around wall 82 respectively along two relative corner portions settings (11 left corner portions and right-hand corner portions as positive in the substrate 1 in Fig. 3) in substrate 1 front 11.Moreover the first circle centre position around wall 81 definition has the axis C in vertical substrate 1 front 11, and first around wall 81 with above-mentioned two second around wall 82 for being roughly symmetrical in the structure of axis C.
From Fig. 3, first around wall 81 and two second three regions that surrounded around wall 82.Wherein, LED circuit 21 is roughly revealed in the first region surrounding around wall 81, and electronic element circuit 22 is positioned at first outside wall 81, and two blocks of electronic element circuit 22 are revealed in respectively two second two regions that jointly surround around wall 81 around wall 82 and first.
Moreover, the espespecially naked crystalline substance of direct-current LED of the naked brilliant 20(of described LED) be installed in LED circuit 21, use and be electrically connected at foregoing circuit layer 2, and described LED naked brilliant 20 can be that the LED of two kinds of different lighting kenels is naked brilliant 20, but be not limited to this in the time of practical application.
Described light transmission package 40 can be made by silicones (silicone) or epoxy resin (epoxy resin), say further, light transmission package 40 can be a kind of simple transparent colloid or in be mixed with the fluorescent colloid of fluorescent material, but the present embodiment is not as limit.And, light transmission package 40 be filled at intercept wall 8 first around within wall 81 and positive 11 regions that jointly surround of substrate 1, use making the LED naked brilliant 20 can be packaged by light transmission package 20.Change angle, light transmission package 40 be limited in first around 81, wall around encapsulation within the scope of, be effectively controlled with the encapsulation scope and the filler amount that make light transmission package 40.
And described electronic component 30 is divided into two groups in the present embodiment, and these two groups of electronic components 30 are installed in respectively two blocks of electronic element circuit 22, use and are electrically connected at circuit layer 2.Wherein, above-mentioned LED naked brilliant 20 can be to cover the modes such as crystalline substance (flip chip), reflow (reflow), ultrasonic (ultrasonic), surface mounting technology (SMT) or routing (wire bonding) with the mode that electronic component 30 is installed in circuit layer 2, is not limited at this.
Wherein, described electronic component 30 is to include the LED driving element 301, rectifier cell 302(of two groups as bridge rectifier in the present embodiment) and power component 303 be example, but in the time of practical application, the component kind that electronic component 30 comprises and quantity can be adjusted according to designer's demand, are not limited to this.For instance, in a unshowned embodiment, described electronic component 30 also can include linear element and non-linear element simultaneously.A bit, the electronic component 30 of the present embodiment indication is light-emitting component (that is, get rid of LED chip or the naked crystalline substance of LED) not for additional disclosure.
In the time that described LED naked brilliant 20 adopts two kinds of different lighting kenels, it can be electrically connected at respectively LED driving element 301, rectifier cell 302 and the power component 303 of described two groups.Moreover described electronic component 30(is as LED driving element 301, rectifier cell 302 and the power component 303 of two groups) aspect can be naked crystalline substance (die) structure or the structure that has encapsulated (packaged), do not limited in the present embodiment.
By this, LED driving element 301, rectifier cell 302 and the power component 303 of described two groups can be respectively in order to drive the LED naked brilliant 20 of above-mentioned two kinds of different lighting kenels, use the luminous ratio of the LED naked brilliant 20 that adjusts above-mentioned two kinds of different lighting kenels, and then reach the effect of mixed light.
Supplementary notes a bit, due to after load bearing seat 10 installs LED naked brilliant 20, LED naked brilliant 20 will be positioned at same plane (as: front 11 of substrate 1) with electronic component 30, and therefore, the interference problem between described LED naked brilliant 20 and electronic component 30 must cautiously be considered.In view of this, the obstruct wall 8 that the present embodiment forms on substrate 1 front 11 of load bearing seat 10, can isolate LED naked brilliant 20 and electronic component 30 effectively, and then the heat reducing is between the two disturbed and electromagnetic interference.
Described two LED testing cushion 3 lay respectively at first in wall 81 and two second two regions that surround around wall 82, two LED testing cushion 3 and the LED circuit 21 of circuit layer 2 are integrated the structure of extension, that is, two LED testing cushion 3 are electrically connected at LED circuit 21, and make the detection electric current I that described two LED testing cushion 3 can provide for checkout equipment 200 circulate LED circuit 21(as Fig. 4), and then detect individually the LED naked brilliant 20 on LED circuit 21.
Described two subtest pads 4 are located at the back side 12 of substrate 1 and are electrically connected at respectively two LED testing cushion 3, say further, the position that two subtest pads 4 are located at substrate 1 is roughly positioned at the opposition side of two LED testing cushion 3, use and between corresponding LED testing cushion 3 and subtest pad 4, form the perforation (not indicating) that runs through substrate 1 positive 11 and the back side 12, and in described perforation filling conductive material (do not indicate) so that subtest pad 4 can by the conductive material in perforation, LED testing cushion 3 corresponding with it be reached electric connection.By this, the detection electric current I that described two subtest pads 4 also can provide for the checkout equipment 200 LED circuit 21 that only circulates, and then detect individually the LED naked brilliant 20 on LED circuit 21.
Described two electrodes 5 are positioned at and intercept outside wall 8, and these two electrodes 5 are arranged at substrate 1 and are different from above-mentioned two second another two the relative corner portions around wall 82 (11 top corner portions and lower corners positions as positive in the substrate 1 in Fig. 3).
Moreover, described two electrodes 5 are electrically connected at respectively two blocks of above-mentioned electronic element circuit 22, use another that make that two electrodes 5 can provide for checkout equipment 200 and detect electric current I ' the described LED circuit 21 that circulates with electronic element circuit 22(as Fig. 5), use electronic component 30(on the LED simultaneously detecting on above-mentioned LED circuit 21 naked brilliant 20 and electronic element circuit 22 as LED driving element 301, rectifier cell 302 and power component 303).
Described two connection gaskets 7 are located at the front 11 of substrate 1 and lay respectively at first in wall 81 and two second two regions that surround around wall 82, and these two connection gaskets 7 are electrically connected at respectively above-mentioned two auxiliary electrodes 6, say further, the position that two connection gaskets 7 are located at substrate 1 is roughly positioned at the opposition side of two auxiliary electrodes 6, use and between corresponding connection gasket 7 and auxiliary electrode 6, form the perforation (not indicating) that runs through substrate 1 positive 11 and the back side 12, and in described perforation filling conductive material (do not indicate), so that connection gasket 7 can by the conductive material in perforation, auxiliary electrode corresponding with it 6 be reached electric connection.
Moreover, described two connection gaskets 7 are respectively adjacent in two electrode 5(as Fig. 2 A), and the electrode 5 that each connection gasket 7 is adjacent with it is set in distance, use and make two connection gaskets 7 can optionally be electrically connected at respectively above-mentioned two electrodes 5 via routing, and then be electrically connected at respectively two auxiliary electrodes 6 by two connection gaskets 7.That is to say, in the time that needs use auxiliary electrode 6, just must be electrically connected electrode adjacent one another are 5 and connection gasket 7 via routing.
Described reflective packaging body 50 is preferably non-conductive colloid, reflective packaging body 50 be mainly formed at substrate 1 positive 11 and intercept wall 8 first around within wall 81 and two second two regions that jointly surround around wall 82, and described reflective packaging body 50 is intactly covered on the end face (as obstruct wall 8 end faces in Fig. 1) of obstruct wall 8 away from substrate 1.
In more detail, described reflective packaging body 50 has a reflecting surface 501 away from substrate 1, and the light that above-mentioned reflecting surface 501 is 400nm to 500nm with respect to wavelength has the reflectivity (being preferably more than 90%) that is greater than 85%.That is reflective packaging body 50 can use the material of arbitrary Curves representative as shown in Figure 6, or says, the arbitrary curve shown in Fig. 6 represents the reflectivity of above-mentioned reflecting surface 501.
And under the depression angle of LED light-emitting device 100 (visual angle of similar Fig. 1), intercepting wall 8 is covered by the reflective surface 501 of reflective packaging body 50 completely away from the end face of substrate 1, so cannot see obstruct wall 8 end faces away from substrate 1.By this, the reflective surface 501 of reflective packaging body 50 can, in order to light is reflected effectively, to avoid producing light-absorbing thing away from obstruct wall 8 end faces of substrate 1, and then promote the light efficiency of described LED light-emitting device 100 entirety.
Moreover, due to substrate 1, first around wall 81, with two second two regions that jointly surround around wall 82 in be filled with reflective packaging body 50, in the time that above-mentioned LED driving element 251, rectifier cell 252 and power component 253 are the structure of naked crystalline substance, described reflective packaging body 50 still can reach integral packaging LED driving element 251, rectifier cell 252 and power component 253 effect in the inner simultaneously, uses and reduces significantly the required packaging cost expending while producing LED light-emitting device 100.Again, because reflective packaging body 50 is non-conductive colloid, thereby make reflective packaging body 50 can possess the function that has isolated circuit, and then avoid LED light-emitting device 100 to have the thing of arcing to occur.
A bit, reflective packaging body 50, except obstruct wall 8 end faces that cover away from substrate 1, also can cover the outer surface (figure slightly) that intercepts wall 8 to additional disclosure in the lump, specifically implements aspect and is not limited at this.
Be more than the structure explanation of LED light-emitting device 100, above-mentioned LED light-emitting device 100 is a complete product, and it can ground connection be employed or other devices of arranging in pairs or groups use, possible applicable cases state as follows bright it.
Refer to Fig. 7, two electrodes 5 of described load bearing seat 10 can be in order to be electrically connected at an AC power 300(as commercial power socket), make alternating electromotive force that AC power 300 provides via circuit layer 2 and electronic component 30(as LED driving element 301, rectifier cell 302 and power component 303), and make LED on circuit layer 2 naked brilliant 20 luminous and can be used.
After adjacent electrode 5 and connection gasket 7 are connected to each other via routing, the function that described two auxiliary electrodes 6 possess is as above-mentioned electrode 5, that is, two auxiliary electrodes 6 can provide for checkout equipment 200 another detect electric current I ' circulation LED circuit 21 do not show with electronic element circuit 22(figure), and then the LED naked brilliant 20 simultaneously detecting on described LED circuit 21 is for example LED driving element 301, rectifier cell 302 and power component 303 with the electronic component 30(on electronic element circuit 22).
Moreover, two auxiliary electrodes 6 of load bearing seat 10 also can be in order to be electrically connected at AC power 300(as commercial power socket), make alternating electromotive force that AC power 300 provides via connection gasket 7, electrode 5, circuit layer 2 and electronic component 30(as LED driving element 301, rectifier cell 302 and power component 303), and then make LED naked brilliant 20 luminous and can be used.
In addition, described LED light-emitting device 100 also can be electrically connected at other devices by two auxiliary electrodes 6, and then has more polynary operational mode.For instance, refer to Fig. 8 and please consider in light of actual conditions shown in Fig. 2 A and Fig. 2 B in good time, the LED light-emitting device 100 of the present embodiment can be fixed on a function heat sink 400 and by two auxiliary electrodes 6 and be electrically connected at function heat sink 400.
Wherein, above-mentioned functions heat sink 400 has light modulation or other and can use naked brilliant 20 the function of LED of LED light-emitting device 100, uses LED light-emitting device 100 can flexibly be used according to different demands.In addition, the mounting means between described LED light-emitting device 100 and its phase adaptation arrangement (as: function heat sink 400), it can be to be directly welded and fixed or other are implemented as modes such as screw lock, buckle, gluings, is not limited at this.
Additional disclosure a bit, the substrate 1 of the present embodiment load bearing seat 10 is preferably and adopts ceramic substrate and non-metal board, and its reason is: use metallic plate and be unfavorable for circuit layer 2, LED testing cushion 3, subtest pad 4, electrode 5, auxiliary electrode 6 and connection gasket 7 to be formed on the surface of metallic plate.But in the time of practical application, the material of substrate 1 is not limited to this.Moreover circuit layer 2, LED testing cushion 3, subtest pad 4, electrode 5, auxiliary electrode 6 and connection gasket 7 are to be formed by the etching of the metal level on substrate 1 (as: copper foil layer) institute in the present embodiment, but are not limited to this.
[the possible effect of the utility model embodiment]
In sum, the LED light-emitting device that the utility model embodiment provides, it can directly drive under luminous prerequisite with alternating electromotive force, between electronic component and the naked crystalline substance of LED, be formed with obstruct wall, use the isolation naked crystalline substance of LED and electronic component, and then the heat reducing is between the two disturbed and electromagnetic interference.Moreover, cover the obstruct wall end face away from substrate by reflective packaging body, use formation and there is with respect to the light of wavelength 400nm to 500nm the reflecting surface that is greater than 85% reflectivity, and then effectively promote the overall light efficiency of LED light-emitting device.
Again, described load bearing seat, by being formed with LED testing cushion, for detecting current flowing LED circuit, and then detects the naked crystalline substance of LED on LED circuit individually.That is to say, after the naked crystalline substance of LED and electronic component are installed circuit layer, can more clearly differentiate defect is by the naked crystalline substance of LED or electronic component is caused.Moreover the load bearing seat of described LED light-emitting device makes checkout equipment detect individually the naked crystalline substance of LED via the back side of load bearing seat by being formed with subtest pad, using.
The foregoing is only preferred possible embodiments of the present utility model, it is not in order to limit to the scope of the claims of the present utility model, and all equalizations of doing according to the utility model claim change and modify, and all should belong to covering scope of the present utility model.

Claims (10)

1. a LED light-emitting device, is characterized in that, described LED light-emitting device comprises:
One substrate, described substrate has a positive and back side that is positioned at opposition side;
One circuit layer, described circuit layer is arranged at the front of described substrate, and described circuit layer includes a LED circuit and an electronic element circuit, and described LED circuit and described electronic element circuit are electrically connected to each other;
One intercepts wall, described obstruct wall is arranged at the positive of described substrate and includes one first two second of being connected around wall around wall and with described first around wall, described second is positioned at the described first two opposite sides around wall around wall, and described LED circuit is revealed in the described first region surrounding around wall, and described electronic element circuit is positioned at described first outside wall and is revealed in described second around wall and the described first region jointly surrounding around wall;
The naked crystalline substance of multiple LED, the naked crystalline substance of described LED is installed on described LED circuit, to be electrically connected at described circuit layer;
One LED driving element, described LED driving element is installed on described electronic element circuit, to be electrically connected at described circuit layer;
One light transmission package, described light transmission package is arranged in the described first region jointly surrounding around wall and described substrate and in described light transmission package, is coated with the naked crystalline substance of described LED;
One reflective packaging body, described reflective packaging body is arranged at described first in wall, the described second region jointly surrounding around wall and described substrate, and described reflective packaging body covers the end face away from the described obstruct wall of described substrate, and described LED driving element is embedded in described reflective packaging body, and described reflective packaging body has a reflecting surface away from described substrate, the light that described reflecting surface is 400nm to 500nm with respect to wavelength has the reflectivity that is greater than 85%; And
Two electrodes, described electrode is arranged on described substrate and is electrically connected at described circuit layer, described electrode is in order to be electrically connected at an AC power, make transmission and the conversion via described circuit layer and described LED driving element of alternating electromotive force that described AC power provides, and can make the naked trichite light of described LED.
2. LED light-emitting device according to claim 1, it is characterized in that, described LED light-emitting device further has two LED testing cushion that are electrically connected at described LED circuit, and described LED testing cushion is used for a detection electric current described LED circuit of flowing through, to detect individually the naked crystalline substance of LED on described LED circuit.
3. LED light-emitting device according to claim 2, is characterized in that, described circuit layer, described LED testing cushion and described electrode are all positioned at the front of described substrate, and the LED circuit of described circuit layer and described LED testing cushion are integrated the structure of extension.
4. LED light-emitting device according to claim 2, is characterized in that, described LED light-emitting device further includes two subtest pads, and described subtest pad is positioned at the back side of described substrate and is electrically connected at respectively described LED testing cushion.
5. LED light-emitting device according to claim 2, it is characterized in that, described LED light-emitting device further includes two connection gaskets and two auxiliary electrodes, described connection gasket is positioned at the front of described substrate, described auxiliary electrode is positioned at the back side of described substrate and is electrically connected at respectively described connection gasket, described connection gasket is compartment of terrain with described electrode respectively and arranges, and described electrode can be via being electrically connected with described auxiliary electrode respectively with the electric connection of described connection gasket.
6. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, described first has an axis perpendicular to described front around wall definition, and described first is the structure with respect to described axis symmetry around wall and described second around wall.
7. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, described substrate is square, and described second is arranged at respectively two relative corner portions of described substrate around wall, and described electrode is arranged at two other relative corner portions of described substrate.
8. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, described reflective packaging body is non-conductive colloid.
9. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, the reflectivity that the light that described reflecting surface is 400nm to 500nm with respect to wavelength has is further defined to more than 90%.
10. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, described LED driving element is further defined to naked crystalline form.
CN201420161276.3U 2014-04-03 2014-04-03 LED luminous device Expired - Fee Related CN203823501U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420161276.3U CN203823501U (en) 2014-04-03 2014-04-03 LED luminous device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420161276.3U CN203823501U (en) 2014-04-03 2014-04-03 LED luminous device

Publications (1)

Publication Number Publication Date
CN203823501U true CN203823501U (en) 2014-09-10

Family

ID=51479000

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420161276.3U Expired - Fee Related CN203823501U (en) 2014-04-03 2014-04-03 LED luminous device

Country Status (1)

Country Link
CN (1) CN203823501U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106252343A (en) * 2016-07-27 2016-12-21 佛山市国星光电股份有限公司 A kind of optoelectronic integration COB light source and preparation method thereof
CN107923605A (en) * 2015-08-13 2018-04-17 周星工程股份有限公司 Lighting device
CN110829170A (en) * 2018-08-08 2020-02-21 光宝光电(常州)有限公司 Light source device
CN111520690A (en) * 2019-02-01 2020-08-11 光宝光电(常州)有限公司 Light source device
CN111987082A (en) * 2019-05-21 2020-11-24 光宝光电(常州)有限公司 LED packaging structure
US10895374B2 (en) 2018-08-08 2021-01-19 Lite-On Opto Technology (Changzhou) Co., Ltd. Light source device
US11588074B2 (en) 2019-02-01 2023-02-21 Lite-On Opto Technology (Changzhou) Co., Ltd. Light source device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107923605A (en) * 2015-08-13 2018-04-17 周星工程股份有限公司 Lighting device
US10760747B2 (en) 2015-08-13 2020-09-01 Jusung Engineering Co., Ltd. Lighting apparatus
CN106252343A (en) * 2016-07-27 2016-12-21 佛山市国星光电股份有限公司 A kind of optoelectronic integration COB light source and preparation method thereof
CN110829170A (en) * 2018-08-08 2020-02-21 光宝光电(常州)有限公司 Light source device
US10895374B2 (en) 2018-08-08 2021-01-19 Lite-On Opto Technology (Changzhou) Co., Ltd. Light source device
CN110829170B (en) * 2018-08-08 2021-06-04 光宝光电(常州)有限公司 Light source device
CN111520690A (en) * 2019-02-01 2020-08-11 光宝光电(常州)有限公司 Light source device
US11588074B2 (en) 2019-02-01 2023-02-21 Lite-On Opto Technology (Changzhou) Co., Ltd. Light source device
CN111987082A (en) * 2019-05-21 2020-11-24 光宝光电(常州)有限公司 LED packaging structure
CN111987082B (en) * 2019-05-21 2022-07-26 光宝光电(常州)有限公司 LED packaging structure

Similar Documents

Publication Publication Date Title
CN203823501U (en) LED luminous device
US10950759B2 (en) LED module
CN105023987B (en) LED load bearing seats and its manufacture method
CN102543987A (en) Solid-state light-emitting component
US9366421B2 (en) LED base module and LED lighting device
CN103456727A (en) Multi-chip packaging structure
EP2341536A2 (en) Lighting apparatus
JP2015037196A (en) Led light-emitting device
CN104425478A (en) Multi-chip packaging structure
CN103915418B (en) Semiconductor package and fabrication method thereof
CN103000794B (en) LED package structure
CN104377195A (en) LED light-emitting device
CN104658983B (en) LED load bearing seat modules
KR101049490B1 (en) Light emitting device chip, light emitting device package comprising the same, and backlight module comprising the same
CN104835896B (en) LED light emission device and its load bearing seat
CN105098043B (en) Light-emitting device composite base plate and the LED module with the light-emitting device composite base plate
CN209297284U (en) Quantum True Random Number Generator encapsulates chip
CN104124320B (en) Light emitting diode
CN104979454B (en) LED light emission device and LED lamp
CN203826381U (en) LED light emitting device
CN209515664U (en) A kind of package assembling based on four metal-oxide-semiconductor chips
CN102829369A (en) Light-emitting diode light bar and manufacturing method thereof
CN104976526A (en) LED light emitting device and lamp with LED light emitting device
JP3162764U (en) LED light source module
CN102086996B (en) LED (Light emitting Diode) on-edge backlight

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140910

CF01 Termination of patent right due to non-payment of annual fee