CN104835896B - LED light emission device and its load bearing seat - Google Patents
LED light emission device and its load bearing seat Download PDFInfo
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- CN104835896B CN104835896B CN201410045264.9A CN201410045264A CN104835896B CN 104835896 B CN104835896 B CN 104835896B CN 201410045264 A CN201410045264 A CN 201410045264A CN 104835896 B CN104835896 B CN 104835896B
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Abstract
A kind of LED light emission device and its load bearing seat, the LED light emission device include substrate, the circuit layer on substrate, two LED testing cushions and two electrodes and the LED chip and LED driving elements that are installed on circuit layer.The LED chip on circuit layer can be detected separately in two LED testing cushions for a detection electric current.Two electrodes can detect LED chip and LED driving elements simultaneously for another detection electric current, and two electrodes can be used for being electrically connected to an external drive power supply, the electric power that external drive power supply is provided is set LED chip is lighted via circuit layer and LED driving elements.Thereby, the present invention is after LED chip is installed in the circuit layer of substrate, moreover it is possible to effectively detected for LED chip.
Description
Technical field
The present invention relates to a kind of light-emitting device, and more particularly to a kind of LED light emission device and its load bearing seat.
Background technology
In recent years, light emitting diode（LED）Application gradually extensively, and with the continuous lifting of technical field, mesh
Before have been developed that the High Power LED of high illumination briliancy, it is enough to replace traditional lighting source.
However, the tectonic sieving due to commonly using LED light emission device, circuit layer is installed in its LED chip and electronic component
Afterwards, LED chip and electronic component can only be just detected simultaneously, when defect occurs in this testing result, will be unable to differentiate scarce really
It is as caused by LED chip or electronic component to fall into.
Then, the present inventor's thoughts drawbacks described above improves, and is the special utilization for concentrating on studies and coordinating scientific principle, carries finally
Go out the present invention that is a kind of reasonable in design and being effectively improved drawbacks described above.
The content of the invention
It is an object of the invention to provide a kind of LED light emission device and its load bearing seat, it can be detected separately installed in electricity
LED chip on the floor of road.
The present invention provides a kind of LED light emission device, including：One substrate；One circuit layer, it is on the substrate, the circuit
Layer includes a LED crystal bonding areas and an electronic component crystal bonding area, and the LED crystal bonding areas and the electronic component crystal bonding area are electrical each other
Connection；One LED chip, it is installed in the LED crystal bonding areas, to be electrically connected at the circuit layer；One LED driving elements, it is installed
In the electronic component crystal bonding area, to be electrically connected at the circuit layer；Two LED testing cushions, it is electrically connected at the LED die bonds
Area, and two LED testing cushions can be for the detection current flowing LED crystal bonding areas, to be detected separately on the LED crystal bonding areas
LED chip；And two electrodes, it is electrically connected at the electronic component crystal bonding area, and two electrodes can be for another detection electricity
Stream circulation LED crystal bonding areas and the electronic component crystal bonding area, to detect the LED chip and the electronics on the LED crystal bonding areas simultaneously
LED driving elements on element crystal bonding area, and two electrodes can be used for being electrically connected to an external drive power supply, make this outer
The electric power that portion's driving power supply is provided makes the LED chip light via the circuit layer and the LED driving elements.
The present invention provides a kind of load bearing seat of LED light emission device again, including：One substrate；One circuit layer, it is located at the substrate
On, the circuit layer includes a LED crystal bonding areas and an electronic component crystal bonding area, and the LED crystal bonding areas and the electronic component die bond
Area is electrically connected to each other；Two LED testing cushions, it is electrically connected at the LED crystal bonding areas, and two LED testing cushions can be for one
Detection electric current only circulates the LED crystal bonding areas；And two electrodes, it is electrically connected at the electronic component crystal bonding area, and this two
Electrode can be for another detection current flowing LED crystal bonding areas and the electronic component crystal bonding area.
In summary, LED light emission device provided by the present invention and its load bearing seat, its by being formed with LED testing cushions, with
For detecting current flowing LED crystal bonding areas, and then the LED chip being detected separately on LED crystal bonding areas.That is, in LED chip
After installing circuit layer with electronic component, it is as caused by LED chip or electronic component that can more clearly differentiate defect.
For that can be further understood that the feature and technology contents of the present invention, please refer to the following detailed descriptions related to the present invention
With accompanying drawing, but institute's accompanying drawings only provide with reference to and explanation use, not for making any to scope of the presently claimed invention
Limitation.
Brief description of the drawings
Fig. 1 is the schematic perspective view of LED light emission device of the present invention.
Fig. 2 is Fig. 1 decomposing schematic representation.
Fig. 3 is the decomposing schematic representation at another visual angles of Fig. 1.
Fig. 4 makes detection electric current only circulate the schematic diagrames of LED crystal bonding areas for the present invention by LED testing cushions.
Fig. 5 makes the schematic diagram of another detection current flowing LED crystal bonding areas by electrode for the present invention.
Fig. 6 connects the schematic diagram of external drive power supply for the electrode of LED light emission device of the present invention.
Fig. 7 is the schematic diagram of the auxiliary electrode linkage function heat sink of LED light emission device of the present invention.
【Symbol description】
100 LED light emission devices
10 load bearing seats
1 substrate
11 fronts
12 back sides
2 circuit layers
21 LED crystal bonding areas
22 electronic component crystal bonding areas
3 LED testing cushions
4 subtest pads
5 electrodes
6 auxiliary electrodes
7 connection gaskets
20 LED chips
30 electronic components
301 LED driving elements
302 rectifier cells
303 power components
40 barrier walls
50 packaging bodies
200 detection devices
300 external drive power supplys
400 function heat sinks
I detects electric current
Another detection electric currents of I '
Embodiment
Referring to Fig. 1, it is one embodiment of the invention, need to first it illustrate, mentioned by the present embodiment correspondence pattern
Correlated measure and shape, only to specifically describe embodiments of the present invention, in order to understand its content, and are not used to limitation
Scope of the presently claimed invention.
Such as Fig. 2 and Fig. 3, the present embodiment is a kind of LED light emission device 100, including a load bearing seat 10, multiple LED chips 20,
Multiple electronic components 30, one obstruct the packaging body 50 of wall 40 and one.Wherein, above-mentioned LED chip 20 is assembled on electronic component 30
On load bearing seat 10, barrier wall 40 is on load bearing seat 10 and separates LED chip 20 and electronic component 30, and packaging body 50 is filled at
It is in the space that barrier wall 40 is surrounded with load bearing seat 10, LED chip 20 and electronic component 30 is embedding in the inner.
The main shaft as explanation will be constructed using the load bearing seat 10 of LED light emission device 100 below, and in the explanation structure of load bearing seat 10
During making, the other elements of ground LED light emission device 100 are introduced in good time.
The load bearing seat 10 have a substrate 1, a circuit layer 2, two LED testing cushions 3, two subtest pads 4, two
Electrode 5, two auxiliary electrodes 6 and two connection gaskets 7.Wherein, the substrate 1 is substantially square（Such as：Rectangle or square）
And with positioned at a front 11 of opposite side and a back side 12, foregoing circuit layer 2, LED testing cushions 3, electrode 5 and connection gasket 7
Thickness is roughly the same and is all located at the front 11 of substrate 1, and the thickness of above-mentioned subtest pad 4 and auxiliary electrode is also roughly the same
And all it is located at the back side 12 of substrate 1.
The circuit layer 2 includes a LED crystal bonding areas 21 and an electronic component crystal bonding area 22, and LED crystal bonding areas 21 and electricity
Subcomponent crystal bonding area 22 is electrically connected to each other.Wherein, electronic component crystal bonding area 22 can divide into two blocks, and electronic component
Two blocks of crystal bonding area 22 are located at the two opposite sides of LED crystal bonding areas 21.Further say, two of electronic component crystal bonding area 22
Block is located substantially at two corners on the diagonal of substrate 1 respectively（Such as the left side corner of substrate 1 in Fig. 2 and right side corner）.
Furthermore, the LED chip 20 is installed in LED crystal bonding areas 21, uses and is electrically connected at foregoing circuit layer 2.And it is described
30 points of electronic component is two groups, and two groups of electronic components 30 are installed in two blocks of electronic component crystal bonding area 22 respectively,
Use and be electrically connected at circuit layer 2.Wherein, the mode that above-mentioned LED chip 20 is installed in circuit layer 2 with electronic component 30 can be
Flip（flip chip）, reflow（reflow）, ultrasonic（ultrasonic）, surface mounting technology（SMT）Or routing（wire
bonding）Etc. mode, it is not any limitation as herein.
Wherein, the electronic component 30 be in the present embodiment with include two groups of LED driving elements 301, rectification member
Part 302（Such as：Bridge rectifier）And exemplified by power component 303, but when practical application, the element that electronic component 30 is included
Species can be adjusted with quantity according to designer's demand, it is not limited to this.For example, in a unshowned embodiment
In, the electronic component 30 can also include linear element and non-linear element simultaneously.
The LED chip 20 of form in addition, the LED chip 20 can light for two kinds of differences, and above two is different
The LED driving elements 301 in described two groups, rectifier cell 302 and power is electrically connected in the LED chip 20 of luminous form
Element 303.Furthermore, the aspect of the LED chip 20 can be bare crystalline（die）Construct or encapsulated（packaged）Structure
Make, be not any limitation as in the present embodiment.
Thereby, described two groups of LED driving elements 301, rectifier cell 302 and power component 303 can be respectively to drive
The LED chip 20 of the luminous form of above two difference, use the luminous form of adjustment above two difference LED chip 20 it is luminous
Ratio, and then reach the effect of mixed light.
The LED crystal bonding areas 21 of described two LED testing cushions 3 and circuit layer 2 are integrated the construction of extension, that is, two LED
Testing cushion 3 is electrically connected at LED crystal bonding areas 21, and enable that described two LED testing cushions 3 supply that detection device 200 provided one
Detect electric current I circulation LED crystal bonding areas 21（Such as Fig. 4）, and then the LED chip 20 being detected separately on LED crystal bonding areas 21.
Described two subtest pads 4 are electrically connected in two LED testing cushions 3, are further said, two auxiliary are surveyed
Examination pad 4 is located substantially at the opposite sides of two LED testing cushions 3 located at the position of substrate 1, use corresponding LED testing cushions 3 with
The perforation through the front of substrate 1 11 and the back side 12 is formed between subtest pad 4（Do not indicate）, and fill and lead in the perforation
Electric material（Do not indicate）, so that subtest pad 4 can by the conductive material in perforation with the LED testing cushions 3 corresponding to it
Reach electric connection.Thereby, the detection electric current I that described two subtest pads 4 can also be provided for detection device 200 only circulates
LED crystal bonding areas 21, and then the LED chip 20 being detected separately on LED crystal bonding areas 21.
Two blocks in above-mentioned electronic component crystal bonding area 22 are electrically connected in described two electrodes 5, and using makes two
Another detection electric current I ' circulation LED crystal bonding areas 21 and electronic component crystal bonding area 22 that electrode 5 can be provided for detection device 200
（Such as Fig. 5）, use while detecting the LED chip 20 on above-mentioned LED crystal bonding areas 21 and the electronics on electronic component crystal bonding area 22
Element 30（Such as：LED driving elements 301, rectifier cell 302 and power component 303）.
Furthermore, two electrodes 5 of the load bearing seat 10 can be used for being electrically connected to an external drive power supply 300（Such as：Civil power
Socket）, the electric power that external drive power supply 300 is provided（Such as：Alternating electromotive force）Via circuit layer 2 and electronic component 30（Such as：
LED driving elements 301, rectifier cell 302 and power component 303）, and make the LED chip 20 on circuit layer 2 luminous and energy quilt
With.
Described two connection gaskets 7 are electrically connected in two auxiliary electrodes 6, are further said, two connection gaskets 7 are located at
The position of substrate 1 is located substantially at the opposite side of two auxiliary electrodes 6, uses between corresponding connection gasket 7 and auxiliary electrode 6
Form the perforation in the front 11 and 12, the back side through substrate 1（Do not indicate）, and fill conductive material in the perforation（Do not mark
Show）, so that connection gasket 7 can reach electric connection by the conductive material in perforation with the auxiliary electrode 6 corresponding to it.
Furthermore, described two connection gaskets 7 are respectively adjacent in two electrodes 5, and the electrode adjacent with it of each connection gasket 7
5 are set in distance, and using enables two electrodes 5 to be selectively connected to above-mentioned two connection gasket 7 via routing respectively, and then
It is electrically connected by two connection gaskets 7 in two auxiliary electrodes 6.That is, when needing to use auxiliary electrode 6,
Adjacent electrode 5 and connection gasket 7 just must be connected via routing.
Thereby, after adjacent electrode 5 and connection gasket 7 are connected to each other via routing, described two auxiliary electrodes 6
Another detection electric current I ' circulation LED crystal bonding areas 21 and the electronic component crystal bonding area 22 that can be provided for detection device 200（Figure is not
Show）, and then the LED chip 20 on the LED crystal bonding areas 21 and the electronic component 30 on electronic component crystal bonding area 22 are detected simultaneously
（Such as：LED driving elements 301, rectifier cell 302 and power component 303）.
Furthermore, two auxiliary electrodes 6 of load bearing seat 10 can also be used for being electrically connected to external drive power supply 300（Such as：Civil power
Socket）, the electric power that external drive power supply 300 is provided（Such as：Alternating electromotive force）Via connection gasket 7, electrode 5, circuit layer 2 and
Electronic component 30（Such as：LED driving elements 301, rectifier cell 302 and power component 303）, and then make LED chip 20 luminous and
It can be employed.
In addition, the LED light emission device 100 also can be electrically connected at other devices by two auxiliary electrodes 6, and then
With more polynary operational mode.For example, refer to Fig. 7 and please consider in light of actual conditions in good time shown in Fig. 2 and Fig. 3, the LED of the present embodiment
Light-emitting device 100 can be fixed on a function heat sink 400 and be electrically connected at function heat sink 400 by two auxiliary electrodes 6.
Wherein, above-mentioned functions heat sink 400 have light modulation or other can with LED light emission device 100 LED chip 20
Function, using enables LED light emission device 100 flexibly to be used according to different demands.In addition, the LED light emission device
100 with its phase adaptation arrangement（Such as：Function heat sink 400）Between mounting means, it can be directly welded and fixed or it
He implements such as screw lock, buckle, gluing mode, is not any limitation as herein.
It should be noted that, after the installation LED chip 20 of load bearing seat 10, LED chip 20 will be located at electronic component 30
Same plane（Such as：The front 11 of substrate 1）, therefore, the interference problem between the LED chip 20 and electronic component 30 must be prudent
Ground is considered.In view of this, the present embodiment is formed with barrier wall 40 on the front 11 of substrate 1 of load bearing seat 10, uses isolation LED
Chip 20 and electronic component 30, and then reduce heat interference and electromagnetic interference between the two.
More additionally, the substrate 1 of the present embodiment load bearing seat 10 is preferably non-metal board using ceramic substrate, and it is former
Because being：Using metallic plate be unfavorable for by circuit layer 2, LED testing cushions 3, subtest pad 4, electrode 5, auxiliary electrode 6 and
Connection gasket 7 is formed on the surface of metallic plate.But when practical application, the material of substrate 1 is not limited thereto.
[the possibility effect of the embodiment of the present invention]
In summary, the LED light emission device that the embodiment of the present invention is provided, its load bearing seat by being formed with LED testing cushions,
For detecting current flowing LED crystal bonding areas, and then the LED chip being detected separately on LED crystal bonding areas.That is, in LED core
Piece is installed with electronic component after circuit layer, and it is as caused by LED chip or electronic component that can more clearly differentiate defect.
Furthermore, the load bearing seat of the LED light emission device is by being formed with subtest pad, and using enables detection device via load bearing seat
LED chip is detected separately in the back side.
In addition, the load bearing seat of the LED light emission device is by being formed with connection gasket and auxiliary electrode, using enables designer
Depending on demand optionally through its adjacent connection gasket of routing connection electrode, and then electrode and corresponding auxiliary electricity can be reached
The effect that pole is electrically connected to each other.
The preferred possible embodiments of the present invention are the foregoing is only, it is simultaneously not used to limitation the scope of the claims of the invention, all
The equivalent changes and modifications done according to scope of the present invention patent, should all belong to the covering scope of the present invention.
Claims (10)
1. a kind of LED light emission device, it is characterised in that the LED light emission device includes：
One substrate；
One circuit layer, the circuit layer is arranged on the substrate, and the circuit layer includes a LED crystal bonding areas and electronics member
Part crystal bonding area, and the LED crystal bonding areas are electrically connected to each other with the electronic component crystal bonding area；
One LED chip, the LED chip is installed in the LED crystal bonding areas, to be electrically connected at the circuit layer；
One LED driving elements, the LED driving elements are installed in the electronic component crystal bonding area, to be electrically connected at the electricity
Road floor；
Two LED testing cushions, are electrically connected at the LED crystal bonding areas, and the LED testing cushions can be for a detection current flowing institute
LED crystal bonding areas are stated, so that the LED chip on the LED crystal bonding areas is detected separately；And
Two electrodes, are electrically connected at the electronic component crystal bonding area, and the electrode can be for described in another detection current flowing
LED crystal bonding areas and the electronic component crystal bonding area, to detect the LED chip on the LED crystal bonding areas and electronics member simultaneously
LED driving elements on part crystal bonding area, and the electrode can be used for being electrically connected to an external drive power supply, make the outside
The electric power that driving power supply is provided makes the LED chip light via the circuit layer and the LED driving elements.
2. LED light emission device according to claim 1, it is characterised in that the substrate has a front and a back side, and
And the circuit layer, the LED testing cushions and the electrode are respectively positioned on the front of the substrate, the LED die bonds of the circuit layer
Area is integrated the construction of extension with the LED testing cushions.
3. LED light emission device according to claim 1, it is characterised in that the electronic component crystal bonding area can divide into two
Individual block, and the electronic component crystal bonding area two blocks be located at the LED crystal bonding areas two opposite sides.
4. LED light emission device according to claim 3, it is characterised in that the substrate is square, and electronics member
Two corners of two blocks of part crystal bonding area respectively on the diagonal of the substrate.
5. the LED light emission device according to any one of claim 2 to 4, it is characterised in that the LED light emission device is entered
One step includes two subtest pads, and the subtest pad is located at the back side of the substrate and is electrically connected in described
LED testing cushions.
6. the LED light emission device according to any one of claim 2 to 4, it is characterised in that the LED light emission device is entered
One step includes two connection gaskets and two auxiliary electrodes, and the connection gasket is located at the front of the substrate, the auxiliary electrode
Positioned at the back side of the substrate and it is electrically connected in the connection gasket, the connection gasket is in respectively compartment of terrain with the electrode
Set, and the electrode can be electrically connected in the auxiliary electrode via being connected with the connection gasket.
7. a kind of load bearing seat of LED light emission device, it is characterised in that the load bearing seat of the LED light emission device includes：
One substrate；
One circuit layer, the circuit layer is arranged on the substrate, and the circuit layer includes a LED crystal bonding areas and electronics member
Part crystal bonding area, and the LED crystal bonding areas are electrically connected to each other with the electronic component crystal bonding area；
Two LED testing cushions, are electrically connected at the LED crystal bonding areas, and the LED testing cushions can only circulate for a detection electric current
The LED crystal bonding areas；And
Two electrodes, are electrically connected at the electronic component crystal bonding area, and the electrode can be for described in another detection current flowing
LED crystal bonding areas and the electronic component crystal bonding area.
8. the load bearing seat of LED light emission device according to claim 7, it is characterised in that the substrate have a front with
One back side, and the circuit layer, the LED testing cushions and the electrode are respectively positioned on the front of the substrate, the circuit layer
LED crystal bonding areas and the LED testing cushions be integrated the construction of extension.
9. the load bearing seat of LED light emission device according to claim 8, it is characterised in that the carrying of the LED light emission device
Seat further comprise there are two subtest pads, the subtest pad be located at the substrate the back side and be electrically connected in
The LED testing cushions.
10. the load bearing seat of LED light emission device according to claim 8, it is characterised in that the LED light emission device is held
Carry seat and further comprise thering is two connection gaskets and two auxiliary electrodes, the connection gasket is located at the front of the substrate, described auxiliary
Electrode is helped to be located at the back side of the substrate and be electrically connected in the connection gasket, the connection gasket is in respectively with the electrode
It is positioned apart from, and the electrode can be electrically connected in the auxiliary electrode via being connected with the connection gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410045264.9A CN104835896B (en) | 2014-02-07 | 2014-02-07 | LED light emission device and its load bearing seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410045264.9A CN104835896B (en) | 2014-02-07 | 2014-02-07 | LED light emission device and its load bearing seat |
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| Publication Number | Publication Date |
|---|---|
| CN104835896A CN104835896A (en) | 2015-08-12 |
| CN104835896B true CN104835896B (en) | 2017-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410045264.9A Active CN104835896B (en) | 2014-02-07 | 2014-02-07 | LED light emission device and its load bearing seat |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108732515B (en) * | 2018-05-22 | 2020-10-30 | 安徽捷迅光电技术有限公司 | Infrared lamp aging test tool |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM395914U (en) * | 2010-07-28 | 2011-01-01 | Brightek Optoelectronic Co Ltd | LED packaging structure |
| CN102208518A (en) * | 2010-04-20 | 2011-10-05 | 蒋伟东 | Integrated patch unit |
| CN103456727A (en) * | 2012-06-04 | 2013-12-18 | 弘凯光电股份有限公司 | Multi-chip packaging structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7842960B2 (en) * | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
-
2014
- 2014-02-07 CN CN201410045264.9A patent/CN104835896B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102208518A (en) * | 2010-04-20 | 2011-10-05 | 蒋伟东 | Integrated patch unit |
| TWM395914U (en) * | 2010-07-28 | 2011-01-01 | Brightek Optoelectronic Co Ltd | LED packaging structure |
| CN103456727A (en) * | 2012-06-04 | 2013-12-18 | 弘凯光电股份有限公司 | Multi-chip packaging structure |
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