CN104976526A - LED light emitting device and lamp with LED light emitting device - Google Patents
LED light emitting device and lamp with LED light emitting device Download PDFInfo
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- CN104976526A CN104976526A CN201410133822.7A CN201410133822A CN104976526A CN 104976526 A CN104976526 A CN 104976526A CN 201410133822 A CN201410133822 A CN 201410133822A CN 104976526 A CN104976526 A CN 104976526A
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- led
- partition wall
- packaging body
- resistance partition
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
Abstract
The invention provides an LED light emitting device and a lamp with the LED light emitting device. The LED light emitting device comprises a circuit board, and an inner barrier wall, an outer barrier wall, an LED bare chip, a plurality of electronic elements, a first encapsulating body and a second encapsulating body, which are arranged on the circuit board, wherein the LED bare chip is arranged in the inner barrier wall and electrically connected with the circuit board, and the electronic elements are arranged between the inner barrier wall and the outer barrier wall and electrically connected with the circuit board; the inner barrier wall is internally filled with the first encapsulating body, and part of the first encapsulating body projects out of the inner barrier wall; the second encapsulating body fills the part between the inner barrier wall and the outer barrier wall; the circuit board is used for electrical connection with an alternating current power supply, so that alternating current electricity provided by the alternating current power supply is transmitted and converted with the electronic elements through the circuit board, and the LED bare chip is enabled to emit light.
Description
Technical field
The present invention relates to a kind of light-emitting device, and in particular to a kind of can with the LED light emission device of alternating electromotive force Direct driver luminescence.
Background technology
In recent years, the application of light emitting diode (LED) was extensive gradually, and along with the continuous lifting of technical field, developed the High Power LED of high illumination briliancy at present, it is enough to replace traditional lighting source.
Moreover, present invention applicant previously to have proposed a kind of can with the LED light emission device of alternating electromotive force Direct driver luminescence (as: TaiWan, China invents M472157 patent), it can directly apply to mains system, namely without the need to additionally installing AC-DC converter again, therefore can reduce production cost and expanding range of application.
But, it's a pity, now with the LED light emission device of alternating electromotive force Direct driver luminescence, its assembling convenience not considered when designing for this type of, thus making LED light emission device also have the space of improvement further to exist.
So improving of the above-mentioned defect of the present inventor's thoughts is that spy concentrates on studies and coordinates the utilization of scientific principle, finally propose a kind of reasonable in design and effectively improve the present invention of above-mentioned defect.
Summary of the invention
The embodiment of the present invention is the light fixture providing a kind of LED light emission device and have this LED light emission device, and it with under the prerequisite of alternating electromotive force Direct driver luminescence, can promote assembling convenience effectively.
The embodiment of the present invention provides a kind of LED light emission device, comprise: a circuit board, this circuit board has a substrate and a circuit layer, this substrate has the first surface and a second surface that are positioned at opposition side, this circuit layer is arranged on the first surface of this substrate, and this circuit layer has a LED circuit, an electronic element circuit and two electrodes, this electronic element circuit and this LED circuit are electrically connected, and these two electrodes and this electronic element circuit are electrically connected; One internal resistance partition wall, this internal resistance partition wall is rounded and be arranged on this circuit board, and this internal resistance partition wall and this circuit board jointly surround and define accommodation space in, and this LED circuit is revealed in this interior accommodation space at least in part; One extrernal resistance partition wall, this extrernal resistance partition wall is arranged on this circuit board, this extrernal resistance partition wall is positioned at outside this internal resistance partition wall, and this extrernal resistance partition wall, this internal resistance partition wall and this circuit board jointly surround and define an outer accommodation space, this electronic element circuit is revealed in this outer accommodation space at least in part, and these two electrodes are revealed in outside this extrernal resistance partition wall at least in part; The naked crystalline substance of at least one LED, the naked crystalline substance of described LED is arranged in this accommodation space and is installed on this LED circuit; Multiple electronic component, this electronic component is arranged in this outer accommodation space and is installed on this electronic element circuit, and these electronic components comprise a LED driving element; One first packaging body, this first packaging body is printing opacity shape and includes the connected encapsulation block of one and a location block, this encapsulation block is formed in this interior accommodation space and by naked for this LED crystalline substance and is coated in encapsulation block, and this location block stretches out this interior accommodation space towards the direction away from this substrate from this encapsulation block; And one second packaging body, this second packaging body to be formed in this outer accommodation space and to be coated in the second packaging body by these electronic components, and the height that this second packaging body corresponds to this first surface is less than the height that this first packaging body corresponds to this first surface; Wherein, these two electrodes are in order to be electrically connected with an AC power, and the alternating electromotive force that this AC power is provided via the transmission of this circuit layer and these electronic components and conversion, and can make the naked trichite light of this LED.
The embodiment of the present invention provides a kind of light fixture in addition, comprising: this LED light emission device as above; And a light-guide device, one end of this light-guide device is formed with an opening, this opening is the shape geometrically can passed for this location block, this light-guide device is located on the location block of this first packaging body via this opening sleeve, and this opening is connected to this location block around ground, this location block is made to be positioned at the coated space of this light-guide device completely.
In sum, the LED light emission device that the embodiment of the present invention provides and there is the light fixture of this LED light emission device, it can with under the prerequisite of alternating electromotive force Direct driver luminescence, by being formed with the location block stretching out interior accommodation space, so that make LED light emission device can fast and firmly with light-guide device mutually group connect, and then promote the surcharge of LED light emission device and promote the light extraction efficiency of light fixture entirety.
Further understand feature of the present invention and technology contents for enable, refer to following detailed description for the present invention and accompanying drawing, but these illustrate and accompanying drawing is only used for the present invention is described, but not any restriction is done to right of the present invention.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of LED light emission device of the present invention.
Fig. 2 is the decomposing schematic representation of Fig. 1.
Fig. 3 is the cross-sectional schematic of LED light emission device in Fig. 2.
Fig. 4 is the decomposing schematic representation of LED light emission device in Fig. 2.
Fig. 5 is another decomposing schematic representation of Fig. 2.
Fig. 6 is the another decomposing schematic representation of Fig. 2.
Fig. 7 is the reflectivity schematic diagram of the reflecting surface of LED light emission device of the present invention.
Fig. 8 is the luminous schematic diagram that LED light emission device of the present invention connects AC power.
Fig. 9 is the partial circuit schematic diagram of Fig. 8.
Figure 10 is the schematic diagram of light fixture of the present invention.
Figure 11 is the schematic diagram of another form of light fixture of the present invention.
[symbol description]
100 LED light emission device
1 circuit board
11 substrates
111 first surfaces
112 second surfaces
12 circuit layers
121 LED circuits
122 electronic element circuits
123 electrodes
2 internal resistance partition walls
Accommodation space in 21
3 extrernal resistance partition walls
31 outer accommodation spaces
The naked crystalline substance of 4 LED (as: the naked crystalline substance of direct-current LED)
5 electronic components
51 LED driving elements
52 rectifier cells
53 power components
54 voltage straining elements
6 first packaging bodies
61 encapsulation blocks
62 location blocks
621 exiting surfaces
7 second packaging bodies
71 reflectings surface
200 light-guide devices (as: reflector)
201 light guide body
202 locating rings
203,203 ' opening
300 AC powers
Detailed description of the invention
Refer to Fig. 1, it is one embodiment of the invention, and what need first illustrate is, correlated measure mentioned by the diagram that the present embodiment is corresponding and quantity, only in order to specifically describe embodiments of the present invention, so that understand its content, and be not used to limit to right of the present invention.
Refer to shown in Fig. 1 and Fig. 2, the present embodiment is a kind of light fixture, comprises a LED light emission device 100 and is installed on the light-guide device 200 in above-mentioned LED light emission device 100.Described LED light emission device 100, comprises a circuit board 1, is arranged at an internal resistance partition wall 2 on circuit board 1 and an extrernal resistance partition wall 3, arranges the naked brilliant 4(of multiple LED on the circuit card 1 as direct-current LED naked brilliant 4) with multiple electronic component 5, be arranged at circuit board 1 and internal resistance partition wall 2 one first packaging body 6 in the space that surrounds and one second packaging body 7 that is arranged at outside internal resistance partition wall 2.The present embodiment, in the following possible enforcement structure that each element of LED light emission device 100 is first described, then introduces the relation that is connected to each other between each element more in good time.
As Fig. 3 to Fig. 6, described circuit board 1 includes substrate 11 and a circuit layer 12, and aforesaid substrate 11 is roughly square (as: rectangle or square) and have first surface 111 and the second surface 112 being positioned at opposition side.Wherein, described substrate 11 can be metal substrate and insulated substrate, when adopting metal substrate, also comprising a dielectric layer (figure slightly) and being arranged between metal substrate and circuit layer 12, dielectric layer is covered on the plate face of metal substrate, and dielectric layer edge roughly trims with metal substrate edge.Metal substrate can be aluminium base or copper base, not as limit.Insulated substrate can be ceramic substrate or resin plate.And in the present embodiment, substrate 11 is for insulated substrate.
Described circuit layer 12 is arranged on the first surface 111 of substrate 11, and circuit layer 12 has LED circuit 121, electronic element circuit 122 and two electrodes 123, above-mentioned electronic element circuit 122 is electrically connected with LED circuit 121, and two electrodes 123 are then electrically connected with electronic element circuit 122.It should be noted that, about the mode be electrically connected can be implemented by modes such as routings, do not limited at this.
The material of described internal resistance partition wall 2 is preferably ceramic material, but is not limited to this.Internal resistance partition wall 2 is roughly rounded and to be fixedly arranged on the substantial middle position of circuit board 1 (being namely positioned at the first surface 111 of substrate 11 with on partial circuit layer 12).Wherein, apical margin to the distance (being equivalent to the height of internal resistance partition wall 2) of the first surface 111 of substrate 11 away from the internal resistance partition wall 2 of substrate 11 is greater than the distance (be equivalent to the LED naked height of brilliant 4) of the naked apical margin of brilliant 4 of any one LED to the first surface 111 of substrate 11.
Moreover described internal resistance partition wall 2 and circuit board 1 jointly surround and define accommodation space 21 in, and above-mentioned LED circuit 121 is revealed in interior accommodation space 21 at least in part, puts use that is brilliant and routing with for naked brilliant 4 conducts of LED.
The material of described extrernal resistance partition wall 3 is preferably ceramic material, but is not limited to this.Extrernal resistance partition wall 3 is also roughly rounded and to be arranged on circuit board 1 (being namely positioned at the first surface 111 of substrate 11 with on partial circuit layer 12), and extrernal resistance partition wall 3 is positioned at outside internal resistance partition wall 2, and the center of circle of extrernal resistance partition wall 3 is overlapped in the center of circle of internal resistance partition wall 2.Wherein, the distance (be equivalent to the height of electronic component 5) of apical margin to the first surface 111 of substrate 11 of any one electronic component 5 is greater than away from apical margin to the distance (being equivalent to the height of extrernal resistance partition wall 3) of the first surface 111 of substrate 11 of the extrernal resistance partition wall 3 of substrate 11.And in the present embodiment, the height of described extrernal resistance partition wall 3 is substantially equal to the height of internal resistance partition wall 2, but be not limited to this during practical application.
Moreover described extrernal resistance partition wall 3, internal resistance partition wall 2 and circuit board 1 jointly surround and define one roughly in circular outer accommodation space 31, and described electronic element circuit 122 is revealed in outer accommodation space 31 at least in part, in order to the use of electronic component 5 installation; And above-mentioned two electrodes 123 are revealed in outside extrernal resistance partition wall 3 at least in part, by the use connected for external power source.
In more detail, described two electrodes 123 are positioned at extrernal resistance partition wall 3 position, both sides contrary in the radial direction, and the position at described two electrode 123 places is roughly positioned at two relative corners of substrate 11.And described two electrodes 123 in order to an AC power 300(as Fig. 8) be electrically connected, the alternating electromotive force that AC power 300 is provided is via the transmission of circuit layer 12 and these electronic components 5 and conversion, and it is naked brilliant 4 luminous to make to be arranged at LED on LED circuit 121.
Described LED naked brilliant 4 is arranged in interior accommodation space 21, and LED naked brilliant 4 is electrically connected with the LED circuit 121 of circuit layer 12.Wherein, above-mentioned LED naked brilliant 4 is the naked crystalline substance of LED of two kinds of different lighting kenels in the present embodiment, but when practical application, the naked lighting kenel of brilliant 4 of LED is not limited to this.
Described electronic component 5 be preferably naked crystalline form and roughly in circular ground spread configuration in outer accommodation space 31, and the electronic element circuit 122 of electronic component 5 and circuit layer 12 is electrically connected.Say further, the present embodiment, by electronic component 5 is arranged at LED naked brilliant 4 around in the mode of circular row, to make the arrangement of electronic component 5 more intensive, and then enables the size of substrate 11 reduce.
Moreover, described electronic component 5 is divided into two groups in the present embodiment, and often organize electronic component 5 to include LED driving element 51, rectifier cell 52(as bridge rectifier), power component 53 and voltage straining element 54, but when practical application, the component kind that electronic component 5 comprises and quantity can be adjusted according to designer's demand, are not limited thereto.For example, in a unshowned embodiment, described electronic component 5 also can include linear element and non-linear element simultaneously.More additionally, light-emitting component (such as: LED chip or the naked crystalline substance of LED) got rid of by the electronic component 5 of the present embodiment indication.
By this, when above-mentioned LED naked brilliant 4 adopts two kinds of different lighting kenels, the LED naked brilliant 4 of these two kinds of different lighting kenels can be electrically connected at respectively described two groups LED driving element 51, rectifier cell 52, power component 53 and voltage straining element 54.The LED driving element 51 of described two groups, rectifier cell 52, power component 53 and voltage straining element 54 then can respectively in order to drive the LED of above-mentioned two kinds of different lighting kenels naked brilliant 4, so that the luminous ratio of the LED adjusting above-mentioned two kinds of different lighting kenels naked brilliant 4, and then reach the effect of mixed light.
Supplementary notes a bit, the mode that above-mentioned LED naked brilliant 4 and electronic component 5 are installed in circuit layer 12 can be cover the modes such as crystalline substance (flip chip), reflow (reflow), ultrasonic (ultrasonic), surface mounting technology (SMT) or routing (wire bonding), is not limited at this.
In more detail, described voltage straining element 54 is in being electrically connected at LED naked brilliant 4 and rectifier cell 52(in parallel as shown in Figure 9), when the AC power 300 that LED light emission device 100 connects break down (as: switch surging, electrostatic or thunderbolt impact) cause the circuit of LED light emission device 100 voltage raise time, the voltage that voltage straining element 54 bears also can increase, when the voltage that voltage straining element 54 bears is greater than a charge threshold level (also can be referred to as breakdown voltage value), voltage straining element 54 forms a substantial short circuit paths.
That is, the electric current major part that unexpected boosted voltage produces because of AC power 300 fault understands the short circuit paths and ground connection of leading that be formed via voltage straining element 54.By this, unexpected boosted voltage produces because of AC power 300 fault electric current can be reduced to the naked injury of brilliant 4 of LED.
Moreover described voltage straining element 54 can be the element such as metal oxide piezo-resistance (MOV, Metal Oxide Varistor) or Transient Voltage Suppressor (TVS, Transient VoltageSuppressor).Change an angle, described voltage straining element 54 is bilateral element as shown in Figure 9.
Described first packaging body 6 is printing opacity shape and can made by silicones (silicone) or epoxy resin (epoxy resin), furthermore, described first packaging body 6 can be a kind of simple transparent colloid or in be mixed with the fluorescent colloid of fluorescent material, but the present embodiment is not as limit.
Moreover, the encapsulation block 61 and one that first packaging body 6 includes one connected locates block 62(as Fig. 3), wherein, encapsulation block 61 is filled at internal resistance partition wall 2 and circuit board 1 institute jointly among accommodation space 21 in defining, to make LED naked brilliant 4 can packaged by the encapsulation block 61 of the first packaging body 6 (namely LED naked brilliant 4 is coated within the encapsulation block 61 of the first packaging body 6).And described location block 62 towards away from substrate 11 direction (as in Fig. 3 upwards) from encapsulation block 61 top stretch out interior accommodation space 21, and locate block 62 in the present embodiment roughly in cylindric, the diameter of location block 62 is greater than the internal diameter of internal resistance partition wall 2 and is less than the external diameter of internal resistance partition wall 2, but location of the present invention block 62 is not limited with size in the shape.
Described second packaging body 7 is preferably non-conductive colloid, second packaging body 7 is mainly filled among the outer accommodation space 31 that circuit board 1, internal resistance partition wall 2 and extrernal resistance partition wall 3 surround jointly, to make the second packaging body 7 by the inner coated for these electronic components 5, that is, the electronic component 5 of naked crystalline form can packaged by the second packaging body 7.And the height that described second packaging body 7 corresponds to the first surface 111 of substrate 11 is less than the height that the first packaging body 6 corresponds to the first surface 111 of substrate 11.
By this, by the second packaging body 7 by electronic component 5 simultaneously integral packaging in the inner, the required packaging cost expended during to reduce production LED light emission device 100 significantly.And because the second packaging body 7 is non-conductive colloid, thus make the second packaging body 7 can have the function of isolated circuit, and then avoid LED light emission device 100 to have the situation of arcing to occur.
For the surface (end face as the location block 62 of the first packaging body 6 in Fig. 1) of the location block 62 of the first packaging body 6 away from substrate 11 and the surface (end face as the second packaging body 7 in Fig. 1) of the second packaging body 7, both are in the present embodiment all in plane and be parallel to the first surface 111 of substrate 11, but not as limit.
In more detail, described first packaging body 6 has namely one to locate block 62 end face away from the exiting surface 621(of substrate 11)), and the second packaging body 7 has one away from the reflecting surface 71 of substrate 11.Wherein, above-mentioned reflecting surface 71 has the reflectivity (being preferably more than 90%) being greater than 85% relative to the light that wavelength is 400nm to 500nm.That is, the second packaging body 7 can use the material of arbitrary Curves representative as shown in Figure 7, or says, namely the arbitrary curve shown in Fig. 7 represents the reflectivity of above-mentioned reflecting surface 71.
Moreover described reflecting surface 71 covers on the apical margin away from the internal resistance partition wall 2 of substrate 11, and reflecting surface 71 is roughly vertically connected with the location block 62 of the first packaging body 6, and reflecting surface 71 and exiting surface 621 are formed with difference in height.And under the depression angle of LED light emission device 100, away from the apical margin of the internal resistance partition wall 2 of substrate 11 cover by the reflecting surface 71 of the second packaging body 7, so cannot be in sight.By this, the reflecting surface 71 of the second packaging body 7 in order to effectively to be reflected by light, to avoid the apical margin of the internal resistance partition wall 2 away from substrate 11 to produce light-absorbing situation, and then can promote the light efficiency of described LED light emission device 100 entirety.
More additionally, the second packaging body 7 is except the apical margin covered away from the internal resistance partition wall 2 of substrate 11, and also can cover apical margin and the outer surface (scheming slightly) of extrernal resistance partition wall 3 in the lump, detailed description of the invention is not limited at this.
Be more than the structure explanation of LED light emission device 100, above-mentioned LED light emission device 100 is a complete product, and it can be grounded application (as Fig. 8) or collocation light-guide device 200 uses, and possible applicable cases is as following illustrated.
Refer to shown in Fig. 1 and Fig. 2, inventing described light-guide device 200 is for a reflector 200 in the present embodiment, but also can be the light-guide device (as: lens) of other types.Described reflector 200 has light guide body 201 and a locating ring 202, the external form of above-mentioned light guide body 201 is roughly in hollow structure wide at the top and narrow at the bottom, and described locating ring 202 is integrally connected in the narrower bottom edge of light guide body 201, that is, the two ends of reflector 200 are respectively formed with a roughly rounded and opening 203,203 ' that size is different.Wherein, opening 203 ' is positioned at the top edge of light guide body 201, and opening 203 is positioned at the bottom edge of locating ring 202, and opening 203 ' is greater than opening 203.
In more detail, the smaller opening 203 be positioned on locating ring 202 is adjacent to the second packaging body 7 of LED light emission device 100, the center of circle of above-mentioned less opening 203 corresponds to the center of circle of internal resistance partition wall 2, and this opening 203 is the shape geometrically can passed for location block 62.Moreover, described light-guide device 200 is sheathed on the location block 62 of the first packaging body 6 via opening 203, and the opening 203 on locating ring 202 is roughly connected to location block 62 around ground, locating ring 202 is made to be embedded on the block 62 of location, make location block 62 be positioned at the coated space of light-guide device 200 completely, and then reach the effect promoting the overall light extraction efficiency of light fixture.It should be noted that, above-mentioned " roughly abutting around ground " refers to that the opening 203 on locating ring 202 directly can be connected to location block 62, or the opening on locating ring 202 203 leaves a little gap with location block 62, so that locating ring 202 is sheathed on the block 62 of location.
In addition, though the LED light emission device 100 of the present embodiment is for above-mentioned illustrated external form, when practical application, designer also can be changed the external form of LED light emission device 100 according to its demand.For example, LED light emission device 100 also can be designed to external form as shown in figure 11.
[the possible effect of the embodiment of the present invention]
In sum, the LED light emission device that the embodiment of the present invention provides, it can with under the prerequisite of alternating electromotive force Direct driver luminescence, by being formed with the location block stretching out interior accommodation space, so that make LED light emission device can fast and firmly with light-guide device mutually group connect, and then promote the surcharge of LED light emission device and promote the light extraction efficiency of light fixture entirety.And by being provided with voltage straining element in the second packaging body, effectively to avoid causing the naked crystalline substance of the LED in LED light emission device to damage because of the voltage exceeded the quata.
Moreover, described LED light emission device by by electronic component circular ground spread configuration outside accommodation space, the size that substrate uses can be reduced further; Further, via forming circular the second packaging body, in order to make the end face of LED light emission device can reflection ray effectively, and then the opening size of the guide-lighting accessory be installed in LED light emission device be made can to have larger Application Range.
In addition, formed by the second packaging body, relative to the light of wavelength 400nm to 500nm, there is the reflecting surface being greater than 85% reflectivity, and then effectively promote the overall light efficiency of LED light emission device.
The foregoing is only preferred possible embodiments of the present invention, it is also not used to limit to the scope of the claims of the present invention, and every equalization done according to the present patent application the scope of the claims changes and modifies, and all should belong to covering scope of the present invention.
Claims (10)
1. a LED light emission device, is characterized in that, described LED light emission device comprises:
One circuit board, described circuit board has a substrate and a circuit layer, described substrate has the first surface and a second surface that are positioned at opposition side, described circuit layer is arranged on the first surface of described substrate, and described circuit layer has a LED circuit, an electronic element circuit and two electrodes, described electronic element circuit and described LED circuit are electrically connected, and described two electrodes and described electronic element circuit are electrically connected;
One internal resistance partition wall, described internal resistance partition wall is rounded and be arranged on described circuit board, and described internal resistance partition wall and described circuit board jointly surround and define accommodation space in, and described LED circuit is revealed in described interior accommodation space at least in part;
One extrernal resistance partition wall, described extrernal resistance partition wall is arranged on described circuit board, described extrernal resistance partition wall is positioned at the outside of described internal resistance partition wall, and described extrernal resistance partition wall, described internal resistance partition wall and described circuit board jointly surround and define an outer accommodation space, described electronic element circuit is revealed in described outer accommodation space at least in part, and described two electrodes are revealed in outside described extrernal resistance partition wall at least in part;
The naked crystalline substance of at least one LED, the naked crystalline substance of described LED is arranged in described accommodation space and is installed on described LED circuit;
Multiple electronic component, described electronic component is arranged in described outer accommodation space and is installed on described electronic element circuit, and described electronic component comprises a LED driving element;
One first packaging body, described first packaging body is printing opacity shape and includes the connected encapsulation block of one and a location block, described encapsulation block to be formed in described interior accommodation space and to be coated in described encapsulation block by naked for described LED crystalline substance, and described location block stretches out described interior accommodation space towards the direction away from described substrate from described encapsulation block; And
One second packaging body, described second packaging body to be formed in described outer accommodation space and to be coated in described second packaging body by described electronic component, and the height that described second packaging body corresponds to described first surface is less than the height that described first packaging body corresponds to described first surface;
Wherein, described two electrodes are in order to be electrically connected with an AC power, and the alternating electromotive force that described AC power is provided via the transmission of described circuit layer and described electronic component and conversion, and can make the naked trichite light of described LED.
2. LED light emission device according to claim 1, is characterized in that, the described location block of described first packaging body is cylindric, and the diameter of described location block is greater than the internal diameter of described internal resistance partition wall.
3. LED light emission device according to claim 2, is characterized in that, described second packaging body has one away from the reflecting surface of described circuit board, and described reflecting surface has relative to the light that wavelength is 400nm to 500nm the reflectivity being greater than 85%.
4. LED light emission device according to claim 1, is characterized in that, described second packaging body is non-conductive colloid.
5. LED light emission device according to claim 1, it is characterized in that, described extrernal resistance partition wall is rounded, and the center of circle of described extrernal resistance partition wall is overlapping with the center of circle of described internal resistance partition wall, and described outer accommodation space is circular, described electronic component is that circular ground spread configuration is in described outer accommodation space.
6. LED light emission device according to claim 5, is characterized in that, the apical margin of described internal resistance partition wall to the distance of the first surface of described substrate equals the distance of apical margin to the first surface of described substrate of described extrernal resistance partition wall.
7. LED light emission device according to any one of claim 1 to 6, it is characterized in that, the naked crystalline substance of described LED is further defined to the naked crystalline substance of a direct-current LED, and described electronic component includes a rectifier cell and a voltage straining element, and described voltage straining element is electric connection in parallel with described rectifier cell and with the naked crystalline substance of described direct-current LED respectively; When the voltage that described voltage straining element bears is greater than a charge threshold level, described voltage straining element forms a short circuit paths.
8. LED light emission device according to claim 7, is characterized in that, described voltage straining element is metal oxide piezo-resistance or Transient Voltage Suppressor.
9. a light fixture, is characterized in that, described light fixture comprises:
LED light emission device according to claim 1; And
One light-guide device, one end of described light-guide device is formed with an opening, described opening is the shape geometrically can passed for described location block, described light-guide device is located on the described location block of described first packaging body via described opening sleeve, and described opening is connected to described location block around ground, described location block is made fully to be positioned at the coated space of described light-guide device.
10. light fixture according to claim 9, is characterized in that, described light-guide device has a light guide body and the locating ring being connected to described light guide body, and described locating ring is formed with described opening, and described locating ring is embedded in described location block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410133822.7A CN104976526A (en) | 2014-04-03 | 2014-04-03 | LED light emitting device and lamp with LED light emitting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410133822.7A CN104976526A (en) | 2014-04-03 | 2014-04-03 | LED light emitting device and lamp with LED light emitting device |
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| CN104976526A true CN104976526A (en) | 2015-10-14 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106252343A (en) * | 2016-07-27 | 2016-12-21 | 佛山市国星光电股份有限公司 | A kind of optoelectronic integration COB light source and preparation method thereof |
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| CN103296178A (en) * | 2012-07-02 | 2013-09-11 | 弘凯光电(深圳)有限公司 | Light emitting diode assembly and packaging method thereof |
| CN102938957A (en) * | 2012-11-20 | 2013-02-20 | 宁波市镇海华泰电器厂 | Surge voltage resistant pulse-type driving power supply for LED lamp |
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| CN106252343A (en) * | 2016-07-27 | 2016-12-21 | 佛山市国星光电股份有限公司 | A kind of optoelectronic integration COB light source and preparation method thereof |
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